BU22210MUV [ROHM]
BU22210MUV搭载了10ch的10bit R-2R型D/A 转换器。小型且通道数多，适合电压调整部位较多的应用。输入采用基于DI、CLK、CSB端子的串行数据传输方式，还配备了可进行级联连接的DO端子。通过零起点偏压功能，还可将接通电源时的D/A转换器输出固定为Low，减少误动作对策零部件。工作电源电压范围为2.7V~5.5V，可灵活适应规格变更。;
| 型号： | BU22210MUV |
| 厂家： | 
ROHM |
| 描述： | BU22210MUV搭载了10ch的10bit R-2R型D/A 转换器。小型且通道数多，适合电压调整部位较多的应用。输入采用基于DI、CLK、CSB端子的串行数据传输方式，还配备了可进行级联连接的DO端子。通过零起点偏压功能，还可将接通电源时的D/A转换器输出固定为Low，减少误动作对策零部件。工作电源电压范围为2.7V~5.5V，可灵活适应规格变更。 数据传输 转换器 |
| 文件： | 总22页 (文件大小：1946K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
10 channel in QFN Small Package
10 bit D/A Converters
BU22210MUV
General Description
Key Specifications
BU22210MUV includes 10 channels D/A converters
which is high performance 10bit R-2R-type. It is most
suitable for applications which have many adjustment
items, because it is small size and has many D/A
converter channels.
Input is serial data transfer system with the DI, CLK and
CSB terminal, and output is DO terminal enabling a
cascade connection.
Operating Supply Voltage Range:
Current Consumption:
2.7V to 5.5V
1.2mA(Typ)
±0.5LSB
Differential Non Linearity Error:
Integral Non Linearity Error:
Output Current Capability:
Data Transfer Frequency:
±2.0LSB
±1.0mA
10MHz(Max)
-20°C to +85°C
Operating Temperature Range:
A built-in Initial-Zero-Hold function ensures that the
output voltage of all channels are Low during power up,
so that it is able to reduce parts for measure against
malfunction. And wide supply voltage range from 2.7V -
5.5V has flexibility to specification change.
Package
W(Typ) x D(Typ) x H(Max)
3.00mm x 3.00mm x 1.00mm
VQFN016V3030
Features
Built-in 10-channel 10bit D/A converters.
Built-in Rail-to-rail output buffer.
3-wire serial interface (16 bit data).
Cascade Connection is available.
Built-in Initial-Zero-Hold function.
QFN Small package (0.5mm pitch).
Applications
The various types of consumer (ex. Printer, DSC and
more).
Typical Application Circuit
Examples of the application circuit diagram
AO1
AO2
AO3
AO4
AO5
AO6
AO7
AO8
AO9
AO10
DAC
DAC
DAC
DAC
CLK
3-wire serial
interface
DI
I/F
CSB
DO
.
DAC
DAC
Logic
POR
DAC
DAC
DAC
DAC
VCC
GND
.
0.1μF
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BU22210MUV
Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications...........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Pin Configuration ............................................................................................................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................3
Absolute Maximum Ratings ............................................................................................................................................................4
Thermal Resistance........................................................................................................................................................................4
Recommended Operating Conditions.............................................................................................................................................5
Electrical Characteristics.................................................................................................................................................................5
Typical Performance Curves...........................................................................................................................................................6
Figure 1. Supply Current vs Supply Voltage................................................................................................................................6
Figure 2. Supply Current vs Temperature....................................................................................................................................6
Figure 3. Supply Current vs Supply Voltage................................................................................................................................6
Figure 4. Supply Current vs Temperature....................................................................................................................................6
Figure 5. DNL vs Digital Input Code............................................................................................................................................7
Figure 6. INL vs Digital Input Code..............................................................................................................................................7
Figure 7. Max absolute value of DNL vs Supply Voltage.............................................................................................................7
Figure 8. Max absolute value of INL vs Supply Voltage ..............................................................................................................7
Figure 9. Max absolute value of DNL vs Temperature.................................................................................................................8
Figure 10. Max absolute value of INL vs Temperature ................................................................................................................8
Timing Chart ...................................................................................................................................................................................9
Communication Format.................................................................................................................................................................10
Register Map ................................................................................................................................................................................10
Cascade Connection ....................................................................................................................................................................12
Power supply power-up sequence................................................................................................................................................13
I/O Equivalent Circuits ..................................................................................................................................................................14
Operational Notes.........................................................................................................................................................................15
Ordering Information.....................................................................................................................................................................17
Marking Diagrams.........................................................................................................................................................................17
Physical Dimension, Tape and Reel Information...........................................................................................................................18
Revision History............................................................................................................................................................................19
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BU22210MUV
Pin Configuration
TOP VIEW
(Pads not visible)
13
14
15
16
8
7
6
5
Pin Descriptions
Pin No.
Pin Name
AO10
GND
VCC
AO1
AO2
AO3
AO4
AO5
DO
Function
1
2
Analog output ch10
Ground
3
Power Supply(Note 1)
Analog output ch1
Analog output ch2
Analog output ch3
Analog output ch4
Analog output ch5
4
5
6
7
8
9
Serial output (DO outputs DI signal with 16 clock cycle delay)
Serial clock input
10
11
12
13
14
15
16
CLK
DI
Serial data input
CSB
AO6
AO7
AO8
AO9
Chip select input
Analog output ch6
Analog output ch7
Analog output ch8
Analog output ch9
(Note 1) Please implement the bypass condenser near ICs.
Block Diagram
DAC
DAC
DAC
DAC
AO1
AO2
AO3
AO4
AO5
AO6
AO7
AO8
AO9
AO10
CLK
DI
I/F
CSB
DO
.
DAC
DAC
Logic
POR
DAC
DAC
DAC
DAC
VCC
GND
.
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BU22210MUV
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
VCC
Rating
+7
Unit
V
Power Supply Voltage
-0.3 to +(VCC +0.3) or +7
Whichever is less
Terminal Voltage
VIN
V
Storage Temperature Range
Tstg
-40 to +125
°C
°C
Maximum Junction Temperature
Tjmax
125
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the
maximum junction temperature rating.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
VQFN016V3030
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
189.0
23
57.5
10
°C/W
°C/W
ΨJT
(Note 2)Based on JESD51-2A(Still-Air).
(Note 3)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 5)Using a PCB board based on JESD51-5, 7.
Thermal Via(Note 6)
Layer Number of
Material
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Measurement Board
Pitch
Diameter
4 Layers
FR-4
1.20mm
Φ0.30mm
Top
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
70μm
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
(Note 6) This thermal via connects with the copper pattern of all layers.
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BU22210MUV
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Source Voltage
VCC
VIN
2.7
0
-
5.5
VCC
V
V
Terminal Input Voltage Range(Note 7)
Analog Output Current(Note 8)
Serial Clock Frequency(Note 9)
Load Capacitance Limit(Note 8)
-
-
IOUT
fCLK
CL
-1.0
-
+1.0
10.0
1500
+85
mA
MHz
pF
1.0
-
-
Operating Temperature
Topr
-20
+25
°C
(Note 7) CLK, DI, CSB.
(Note 8) AO1, AO2, AO3, AO4, AO5, AO6, AO7, AO8, AO9, AO10.
(Note 9) CLK.
Electrical Characteristics (Unless otherwise specified VCC=3.0V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
<Current Consumption>
Current Consumption
Power Down Current
<Logic Interface>
ICC
IPD
-
-
1.2
2
2.5
10
mA
µA
Logic input : GND or VCC
Power Down mode
GND
GND
2.1
-
-
-
-
-
-
-
-
0.6
0.8
V
V
VCC=2.7V to 3.6V
VCC=4.5V to 5.5V
VCC=2.7V to 3.6V
VCC=4.5V to 5.5V
L input Voltage
H input Voltage
VIL
VIH
VCC
V
2.4
VCC
V
Input Current
IIN
VOL
VOH
IOL
-10
+10
µA
V
Low output Voltage
High output Voltage
Output Load Current
<Buffer Amplifier>
GND
0.8*VCC
-1.0
0.2*VCC
VCC
ISINK=1mA
V
ISOURCE=1mA
+1.0
mA
VZS1
VZS2
VFS1
VFS2
GND
GND
-
-
-
-
0.1
0.3
V
V
V
V
000h setting, no load
Output Zero Scale Voltage
Output Full Scale Voltage
000h setting, ISINK=1.0mA
3FFh setting, no load
VCC-0.1
VCC-0.3
VCC
VCC
3FFh setting, ISOURCE =1.0mA
<D/A Converter Precision>
Differential Non Linearity Error
Integral Non Linearity Error
DNL
INL
-0.5
-2.0
-
-
+0.5
+2.0
LSB
LSB
Input code 008h to 3F7h
Input code 008h to 3F7h
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BU22210MUV
Typical Performance Curves
3
2
1
0
3
2
1
0
2
3
4
5
6
-40
-20
0
20
40
60
80
100
SupplyVoltage : VCC [V]
Temperature : Ta [℃]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Temperature
(“Active Current Consumption”, VCC=3.0V, Code=200h)
(“Active Current Consumption”, Ta=25℃,Code=200h)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
2
3
4
5
6
-40
-20
0
20
40
60
80
100
SupplyCurrent : ISD [μA]
Temperature : Ta [℃]
Figure 3. Supply Current vs Supply Voltage
Figure 4. Supply Current vs Temperature
(“Power-down Current”, VCC=3.0V)
(“Power-down Current”, Ta=25℃)
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BU22210MUV
Typical Performance Curves - continued
0.5
0.4
2.0
1.5
0.3
1.0
0.2
0.5
0.1
0.0
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.5
-1.0
-1.5
-2.0
0
128 256 384 512 640 768 896 1024
Digital Input Code [Dec]
0
128 256 384 512 640 768 896 1024
Digital Input Code [Dec]
Figure 5. DNL vs Digital Input Code
Figure 6. INL vs Digital Input Code
(“Differential Nonlinearity Error”, VCC=3.0V,Ta=25℃)
(“Integral Nonlinearity Error ”, VCC=3.0V,Ta=25℃)
0.5
0.4
0.3
0.2
0.1
0.0
2.0
1.5
1.0
0.5
0.0
2
3
4
5
6
2
3
4
5
6
SupplyVoltage : VCC [V]
SupplyVoltage : VCC [V]
Figure 7. Max absolute value of DNL vs Supply Voltage
Figure 8. Max absolute value of INL vs Supply Voltage
(“Differential Nonlinearity Error”, Ta=25℃)
(“Integral Nonlinearity Error”, Ta=25℃)
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BU22210MUV
Typical Performance Curves - continued
0.5
0.4
0.3
0.2
0.1
0.0
2.0
1.5
1.0
0.5
0.0
-40 -20
0
20
40
60
80 100
-40 -20
0
20
40
60
80 100
Temperature : Ta [℃]
Temperature : Ta [℃]
Figure 9. Max absolute value of DNL vs Temperature
Figure 10. Max absolute value of INL vs Temperature
(“Differential Nonlinearity Error”, VCC=3.0V)
(“Integral Nonlinearity Error”, VCC=3.0V)
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BU22210MUV
Timing Chart
(Unless otherwise specified VCC=3.0V, RL=OPEN, CL=0pF, Ta=25°C)
Limit
Typ
Parameter
Symbol
Unit
Conditions
Min
50
50
20
40
50
50
50
Max
tCLK_L
tCLK_H
tS_DI
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
ns
CLK L Level Period
CLK H Level Period
DI Setup Time
tH_DI
DI Hold Time
CSB Setup Time
CSB Hold Time
CSB H Level Period
tS_CSB
tH_CSB
tCSB_H
VIH
VIL
VIH
VIL
VIH
CSB
tH_CSB
tCSB_H
tH_CSB
tCLK_H
tCLK_L
tS_CSB
tH_CSB
tS_CSB
tH_CSB
VIH
VIH
VIH
CLK
DI
VIL
VIL
VIL
VIL
VIL
VIL
VIL
VIL
tS_DI
tH_DI
VIH
VIL
VIH
VIL
Figure 11. Timing chart
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BU22210MUV
Communication Format
The Serial Control Interface is 3-wire serial interface 1) CSB, 2) CLK and 3) DI.
Every command is composed of 16 bits data sent through DI line (MSB first).
DI data is read every rising edge of the CLK while CSB is LOW.
Last 16 bits of data are latched when CSB goes HIGH.
The DO outputs the data of the most significant bit at a falling edge of CLK after 16 clocks delay.
CSB
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
CLK
DI
MSB
LSB
A3 A2 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DO
A3
Figure 12. Communication Format
Register Map (Note 10)
Register
Address
Register Name
R/W D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0x1
CH1 D/A
CH2 D/A
CH3 D/A
CH4 D/A
CH5 D/A
CH6 D/A
CH7 D/A
CH8 D/A
CH9 D/A
CH10 D/A
PD ENABLE
W
W
W
W
W
W
W
W
W
W
CH1 D/A DATA[9:0]
CH2 D/A DATA[9:0]
CH3 D/A DATA[9:0]
CH4 D/A DATA[9:0]
CH5 D/A DATA[9:0]
CH6 D/A DATA[9:0]
CH7 D/A DATA[9:0]
CH8 D/A DATA[9:0]
CH9 D/A DATA[9:0]
CH10 D/A DATA[9:0]
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x2
0x3
0x4
0x5
0x6
0x7
0x8
0x9
0xA
0xB
W
0
0
POWER DOWN ENABLE[9:0]
(Note 10) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.
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BU22210MUV
( 0x1 to 0xA ) CHx D/A
Fields
Function
CH1 D/A DATA [9:0]
CH2 D/A DATA [9:0]
CH3 D/A DATA [9:0]
CH4 D/A DATA [9:0]
CH5 D/A DATA [9:0]
CH6 D/A DATA [9:0]
CH7 D/A DATA [9:0]
CH8 D/A DATA [9:0]
CH9 D/A DATA [9:0]
CH10 D/A DATA [9:0]
D/A Code Setting of AO1
D/A Code Setting of AO2
D/A Code Setting of AO3
D/A Code Setting of AO4
D/A Code Setting of AO5
D/A Code Setting of AO6
D/A Code Setting of AO7
D/A Code Setting of AO8
D/A Code Setting of AO9
D/A Code Setting of AO10
0x000 : Vcc / 1024 x 0
0x001 : Vcc / 1024 x 1
:
D/A Code Setting of each channel
0x3FE : Vcc / 1024 x 1022
0x3FF : Vcc / 1024 x 1023
default value 0x000
( 0xB ) PD ENABLE
Fields
Function
Turn a selected channel off.
[0]:CH1, [1]:CH2, [2]:CH3, [3]:CH4, [4]:CH5,
[5]:CH6, [6]:CH7, [7]:CH8, [8]:CH9, [9]:CH10
0 : Active
POWER DOWN ENABLE [9:0]
1 : Power Down
default value 0x000
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BU22210MUV
Cascade Connection
This IC can control multiple BU22210MUVs with one serial interface line by connecting a DO pin to the data input pin (DI) of
the next IC. The example of three BU22210MUVs cascade connection is shown in Figure 13, and the communication
format in Figure 14.
CLK and CSB are commonly connected to all ICs. And about data line, connect the DO of #1 to the DI of #2, and connect
the DO of #2 to the DI of #3.
Regarding command, make CSB Low, and send 16bit x 3 data from the data for #3, then make CSB High.
CLK
DI
CLK
DI
CLK
DI
MCU
DO
DO
DO
CSB
CSB
CSB
BU22210MUV(#1)
BU22210MUV(#2)
BU22210MUV(#3)
Figure 13. Example configuration of three BU22210MUVs cascade connection
BU22210MUV(#1)
The data retrieved by #1
CSB
1
16 17
32 33
48
CLK
DI
Dn[47]~Dn[32]
Dn[31]~Dn[16]
Dn[47]~Dn[32]
Dn[15]~Dn[0]
Dn[31]~Dn[16]
Dn[15]
Dn[31]
Dn[47]
Dn-1[15]~Dn-1[0]
DO
BU22210MUV(#2)
The data retrieved by #2
CSB
1
16 17
32 33
48
CLK
DI
Dn-1[15]~Dn-1[0]
Dn-1[31]~Dn-1[16]
Dn[47]~Dn[32]
Dn[31]~Dn[16]
Dn[47]~Dn[32]
Dn-1[15]~Dn-1[0]
DO
BU22210MUV(#3)
The data retrieved by #3
CSB
1
16 17
32 33
48
CLK
DI
Dn-1[31]~Dn-1[16]
Dn-1[47]~Dn-1[32]
Dn-1[15]~Dn-1[0]
Dn-1[31]~Dn-1[16]
Dn[47]~Dn[32]
Dn-1[15]~Dn-1[0]
DO
Figure 14. Communication Format of three BU22210MUVs cascade connection
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BU22210MUV
Power supply power-up sequence (Unless otherwise specified VCC=3.0V, Ta=25°C)
tPSL
VCC(Min)
tPSC
VCC(Min)
tPSC
VCC(Min)
VCC
0.4V
0.4V
0.4V
Command Acceptable
Conditions
Undefined Behavior
Command Acceptable
Undefined Behavior
Parameter
Symbol
Min
Typ
Max
Unit
Command input wait time after power-up
Power-off time
tPSC
tPSL
100
1
-
-
-
-
µs
ms
Command input is available “tPSC“ after VCC is supplied.
When VCC is below a recommended operating voltage range, the IC becomes undefined behavior state. In such case,
power off, and power up again.
VCC voltage should keep being less than 0.4V for more than tPSL, before supplying power to VCC.
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I/O Equivalent Circuits
Pin Name
Equivalent Circuit Diagram
VCC
Pin Name
Equivalent Circuit Diagram
VCC
CLK
DI
CSB
DO
VCC
VCC
AO1
AO2
AO3
AO4
AO5
AO6
AO7
AO8
AO9
AO10
VCC
VCC
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TSZ22111 • 15 • 001
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31.Mar.2017 Rev.001
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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Operational Notes – continued
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ22111 • 15 • 001
BU22210MUV
Ordering Information
B U 2 2 2 1 0 M U V -
E 2
Part Number
Package
MUV: VQFN016V3030
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN016V3030(TOP VIEW)
U
2
2
1
2
0
Part Number Marking
LOT Number
1PIN MARK
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17/19
TSZ22111 • 15 • 001
BU22210MUV
Physical Dimension, Tape and Reel Information
Package Name
VQFN016V3030
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31.Mar.2017 Rev.001
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Revision History
Date
Revision
001
Changes
31.Mar.2017
New Release
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TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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