BU24036MWV [ROHM]
BU24036MWV可实现步进电机的µ-step驱动，可构建高精度、低噪音的镜头驱动系统。&在LSI 内部进行micro;-step驱动的控制，因此可降低微控制器的负载。另外，内置DC电机、音圈电机用驱动器，支持各种功能的镜头。;
| 型号： | BU24036MWV |
| 厂家： | 
ROHM |
| 描述： | BU24036MWV可实现步进电机的µ-step驱动，可构建高精度、低噪音的镜头驱动系统。&在LSI 内部进行micro;-step驱动的控制，因此可降低微控制器的负载。另外，内置DC电机、音圈电机用驱动器，支持各种功能的镜头。 电机 驱动 控制器 微控制器 驱动器 |
| 文件： | 总27页 (文件大小：2055K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
System Lens Drivers
µ-step System Lens Driver
for Digital Still Cameras
BU24036MWV
General Description
Key Specifications
BU24036MWV is a system Lens Driver which is capable
of µ-step driving and possible to configure a high
precision and low noise lens driver system. This device
performs µ-step driving control internally and can reduce
a load of CPU. This device also has drivers for DC motor
and voice coil motor, and is utilizable for multifunctional
lens.
I/O Power Supply Voltage:
Digital Power Supply Voltage:
Driver Power Supply Voltage:
Input/Output Current (1ch to 4ch,6ch):
500 mA (Max)
Input/Output Current (5ch):
Clock Operating Frequency:
ON-Resistance (1ch, 2ch):
ON-Resistance (3ch, 4ch):
ON-Resistance (5ch,6ch):
1.62 V to 3.6 V
2.7 V to 3.6 V
2.7 V to 5.5 V
600 mA (Max)
1 MHz to 28 MHz
2.0 Ω (Typ)
1.5 Ω (Typ)
1.0 Ω (Typ)
Features
Built-in 6 Channel Drivers
Operating Temperature Range: -20 °C to +85 °C
1ch to 4ch: Voltage Control Type H-Bridge
(for 2 STM Systems)
Package
W (Typ) x D (Typ) x H (Max)
5.00 mm x 5.00 mm x 1.00 mm
5ch: Voltage/Current Control Type H-Bridge
6ch: Current Control Type H-Bridge
Built-in 2 Channel PI Driver Circuits
Built-in 1 Channel Waveform Shaping Circuit
Built-in FLL Digital Servo Circuit
Built-in PLL Circuit
UQFN040V5050
Built-in STM Control Circuit: Autonomous Control
(cache, Acceleration/deceleration Mode), Clock IN
Control
Applications
Digital Still Camera
Typical Application Circuit
Photo Interrupter
DVDDIO
DVDD
VDDAMP
MVCC12
MVCC34
VDDAMP
MVCC12
MVCC34
DVDD
DVDDIO
DVSS
MGND56
MGND12
MGND34
VDDAMP
SENSE5
RNF5
OUT1A
1ch
OUT5A
5ch
Driver
Logic
OUT1B
OUT2A
OUT2B
OUT3A
OUT3B
OUT4A
OUT4B
Driver
M
OUT5B
2ch
Driver
VDDAMP
SENSE6
RNF6
3ch
Driver
M
OUT6A
6ch
Driver
OUT6B
4ch
Driver
Main Host
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
.
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Contents
General Description ................................................................................................................................................................1
Features.................................................................................................................................................................................1
Applications............................................................................................................................................................................1
Key Specifications...................................................................................................................................................................1
Package.................................................................................................................................................................................1
Typical Application Circuit........................................................................................................................................................1
Contents.................................................................................................................................................................................2
Pin Configuration ....................................................................................................................................................................3
Pin Description........................................................................................................................................................................4
Block Diagram ........................................................................................................................................................................5
Description of Blocks...............................................................................................................................................................6
Absolute Maximum Ratings.....................................................................................................................................................9
Recommended Operating Conditions ......................................................................................................................................9
Electrical Characteristics .......................................................................................................................................................10
Typical Performance Curves.................................................................................................................................................. 11
Timing Chart.........................................................................................................................................................................15
Serial interface......................................................................................................................................................................16
Register Map........................................................................................................................................................................16
Application Example..............................................................................................................................................................17
I/O Equivalence Circuit..........................................................................................................................................................18
Operational Notes.................................................................................................................................................................20
Ordering Information.............................................................................................................................................................22
Marking Diagram...................................................................................................................................................................22
Physical Dimension and Packing Information.........................................................................................................................23
Revision History....................................................................................................................................................................24
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Pin Configuration
(Top view)
35
36
40
37
39
34
32
33
31
38
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
TEST
SI
OUT4B
OUT1A
MGND34
MVCC12
OUT4A
OUT3B
MVCC34
OUT3A
SDATA
OUT1B
OUT2A
MGND12
OUT2B
PIOUT1
PIOUT2
EXP-PAD
9
22
21
CSB
10
SCLK
VDDAMP
15
18
20
11
13 14
16
12
17
19
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Pin Description
Pin
Name
Pin
Name
Power
Supply
Power
Supply
Function
Function
Pin No.
Pin No.
22
Waveform shaping
input
1
2
3
4
5
6
7
8
9
SI
DVDD
CSB
DVDDIO CSB logic input
OUT1A
MVCC12
OUT1B
OUT2A
MGND12
OUT2B
PIOUT1
PIOUT2
MVCC12 1ch driver A output
23
SDATA DVDDIO SDATA logic input
1ch, 2ch
driver power supply
-
24
OUT3A MVCC34 3ch driver A output
3ch, 4ch
MVCC12 1ch driver B output
MVCC12 2ch driver A output
25
MVCC34
-
driver power supply
26
OUT3B MVCC34 3ch driver B output
1ch, 2ch
driver ground
-
27
OUT4A MVCC34 4ch driver A output
3ch, 4ch
MVCC12 2ch driver B output
28
MGND34
-
driver ground
OUT4B MVCC34 4ch driver B output
DVDD
PI driving output 1
29
VDDAMP PI driving output 2
5ch, 6ch
30
TEST
DVDDIO TEST logic input
STATE21
logic input/output
10
VDDAMP
-
power supply of
driver control
31
STATE21 DVDDIO
Negative input for
5ch current driver
11
12
13
14
15
16
17
18
19
20
21
SENSE5 VDDAMP
32
33
34
35
36
37
38
39
40
-
FCLK
DVDDIO FCLK logic input
STATE22
OUT5A
RNF5
RNF5
5ch driver A output
STATE22 DVDDIO
STATE12 DVDDIO
logic output
STATE12
5ch driver
power supply
-
logic output
Waveform shaping
output
OUT5B
MGND56
OUT6A
RNF6
RNF5
-
5ch driver B output
SO
INA
DVDDIO
5ch,6ch
driver ground
DVDDIO INA logic input
DVDDIO INB logic input
RNF6
-
6ch driver A output
INB
6ch driver
power supply
DVDDIO
DVSS
DVDD
EXP-PAD
-
-
-
-
I/O power supply
Ground
OUT6B
RNF6
6ch driver B output
Negative input for
6ch current driver
STATE11
SENSE6 VDDAMP
STATE11 DVDDIO
Digital power supply
Left electrically open
or short to ground.
logic input/output
SCLK
DVDDIO SCLK logic input
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Block Diagram
DVDD
VDDAMP
DVDD
MVCC12
MVCC12
DVDD
DVDD
DVDD
TSD
DVDDIO
OUT1A
OUT1B
PRE-
DRIVER
POR
DVSS
MGND12
Speed control
Logic
Analog Feed-Back
MVCC12
VDDAMP
MVCC12
SENSE5
RNF5
DVDD
-
+
OUT2A
OUT2B
PRE-
DRIVER
DAC5
RNF5
OUT5A
OUT5B
PRE-
DRIVER
MGND12
Analog Feed-Back
MGND56
MVCC34
MVCC34
Logic
OUT3A
OUT3B
PRE-
DRIVER
SENSE6
RNF6
VDDAMP
DVDD
DAC6
-
+
MGND34
OUT6A
OUT6B
Analog Feed-Back
MVCC34
MVCC34
MGND56
OUT4A
OUT4B
PRE-
DRIVER
MGND34
Analog Feed-Back
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Description of Blocks
Stepping Motor Driver (1ch to 4ch Driver)
Built-in PWM type stepping motor drivers.
Maximum 2 stepping motors can be driven independently.
Built-in D-class type voltage feedback circuit.
3ch/4ch drivers can also drive DC motor or voice coil motor individually.
(1) Control
Both Clock IN and Autonomous control are possible.
(a)Clock IN Control
Set the registers for the stepping motor control.
Stepping motor rotates in synchronization with clock input to the STATE11 pin and/or the STATE21 pin.
Mode of stepping motor control is selectable from μ-step, 1-2 phase excitation and 2 phase excitation. And the number
of edge for electrical angle cycle is selectable from 4, 8, 32, 64, 128, 256, 512 or 1024.
CSB
ON/OFF
Direction
Torque
SCLK
SDATA
H.B.
H.B.
STM
3
SIF
PWM
Generation
Logic
SIN wave
Generation
Logic
STM
Control
Logic
Host
（Speed・amount）
STATE11
STATE21
(b)Autonomous Control
Stepping motor rotates by setting the registers to drive the stepping motor.
Mode of stepping motor control is selectable from μ-step (1024 portion), 1-2 phase excitation and 2 phase excitation.
ON/OFF
Direction
CSB
Speed
SCLK
Torque
H.B.
H.B.
STM
3
SDATA
SIF
amount
PWM
Generation
Logic
SIN wave
Generation
Logic
STM
Control
Logic
Host
STATE11
STATE21
MO
STATE12
STATE22
BUSY
Cache Mode
Built-in Cache register enables to set next operation commands during motor operation, and continuous operation is
possible. It is possible to output from the STATE11, the STATE21, the STATE12 and the STATE22 pins the status
information which is selectable from operation command status(ACT), cache register status(BUSY), motor rotation
position(MO) or excitation status(MO&EN) in synchronization with motor operation.
Acceleration/deceleration Mode
Acceleration, constant and deceleration operation can be processed in a batch by setting rotation commands together
before motor operation.
It is possible to output from the STATE11, the STATE21, the STATE12 and the STATE22 pins the status information
which is selectable from operation command status(ACT), acceleration/deceleration status(BUSY), motor rotation
position(MO) or excitation status(MO&EN) in synchronization with motor operation.
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Description of Blocks – continued
Voltage/Current Driver (5ch Driver)
Built-in PWM type voltage/constant current selectable driver.
Built-in digital FLL speed control logic for voltage driver.
(1) Control
(a)Register Control
■Voltage Driver (speed control = OFF)
PWM driving by setting the registers for PWM duty ratio, direction and ON/OFF.
CSB
PWMduty
SCLK
PWM
Direction
Host
M
H.B.
3
SDATA
Generation
Logic
ON/OFF
SIF
■Voltage Driver (speed control = ON)
Speed control driving by setting the registers for target speed value, PI filter value, direction and ON/OFF. Motor speed
is detected from photo-interrupter signal and rotation speed is adjusted by comparing the target speed with the motor
speed.
Target speed
CSB
PI filter
SCLK
PWM
Generation
Logic
DCM
Speed Control
Logic
DCM
PI
H.B.
Direction
ON/OFF
SDATA
3
SIF
Host
PI Dr
Comp
■Current Driver
Constant current driving by setting the registers for output current value, direction and ON/OFF.
CSB
Current value
SCLK
Direction
3
SDATA
Current control
DAC
ON/OFF
C.C.
Control
Logic
SIF
VCM
Host
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Description of Blocks – continued
(b)External Pin Control
■Voltage Driver (speed control = OFF)
PWM driving by setting the registers for PWM duty ratio, and the INA and INB pins for direction and ON/OFF. (This is not
applicable when speed control is ON.)
CSB
SCLK
PWMduty
3
SDATA
SIF
PWM
Generation
Logic
M
H.B.
Host
Direction, ON/OFF
Direction, ON/OFF
INA
INB
■Current Driver
Constant current driving by setting the registers for output current value, and the INA and INB pins for direction and
ON/OFF.
CSB
SCLK
Current value
3
SDATA
Current control
SIF
C.C.
VCM
DAC
Control
Logic
Host
INA
INB
Direction, ON/OFF
Direction, ON/OFF
Current Driver (6ch Driver)
Built-in constant current driver.
A voltage at the RNF6 pin and an external resistor (RRNF) value determine output current value. An internal
high-precision amplifier (CMOS gate input) controls constant current. If any resistance component exists in wirings for
the RNF6 pin and the external resistor (RRNF), that might reduce accuracy and pay attention about wiring.
(1) Control
(a)Register Control
Constant current driving by setting the registers for output current value, direction and ON/OFF.
CSB
Current value
SCLK
Direction
3
SDATA
Current control
DAC
ON/OFF
C.C.
Control
Logic
SIF
VCM
Host
(b)External Pin Control
Constant current driving by setting the registers for output current value, and the INA and INB pins for direction and
ON/OFF.
CSB
SCLK
Current value
3
SDATA
Current control
DAC
SIF
C.C.
VCM
Control
Logic
Host
INA
INB
Direction, ON/OFF
Direction, ON/OFF
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Absolute Maximum Ratings (Ta=25 °C)
Parameter
Symbol
Rating
Unit
Remark
DVDDIO
DVDD
-0.3 to +4.5
-0.3 to +4.5
V
V
Supply Voltage
MVCC12, MVCC34,
VDDAMP
MVCC
VIN
-0.3 to +7.0
V
V
Input Voltage
-0.3 to supply voltage+0.3
500
600
mA MVCC12, MVCC34, RNF6
mA RNF5
Input / Output Current (Note 1)
IIN
50
mA PIOUT1
150
mA PIOUT2
Maximum Junction Temperature
Storage Temperature Range
Power Dissipation(Note 2)
Tjmax
Tstg
Pd
125
°C
°C
W
-55 to +125
2.60
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1): Must not exceed Pd.
(Note 2): When use at Ta=25 °C or more, derate 26 mW per 1 °C
(At mounting 74.2 mm x 74.2 mm x 1.6 mm, 4 layer board, Cu foil for heat dissipation on surface 6.28mm2)
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Remark
I/O Power Supply Voltage
DVDDIO
DVDD
1.62
2.7
3.0
3.0
3.6
3.6
V
V
Digital Power Supply Voltage
DVDD≤MVCC
MVCC12, MVCC34,
VDDAMP
Driver Power Supply Voltage
MVCC
2.7
5.0
5.5
V
Clock Operating Frequency
Operating Temperature
fFCLK
Topr
1
-
28
MHz Reference clock
-20
+25
+85
°C
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Electrical Characteristics
(Unless otherwise specified Ta=25 °C, DVDDIO=DVDD=3.0 V, MVCC12=MVCC34=VDDAMP=5.0 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
<Current Consumption>
DVDDIO power supply
CMD_RS=0
DVDD power supply
CMD_RS=0
MVCC power supply
CMD_RS=0
ISSDO
ISSD
-
-
-
0
50
0
10
95
10
µA
µA
µA
Quiescent Current
Operational Current
ISSM
DVDDIO power supply
CMD_RS=STB=CLK_EN=1
fFCLK = 24 MHz
CLK_DIV setting: 0h
No load
DVDD power supply
CMD_RS=STB=CLK_EN=1
fFCLK = 24 MHz
IDDDO
-
-
0.1
6
1
mA
mA
IDDD
10
CLK_DIV setting: 0h
No load
<Logic Block>
0.3 x
DVDDIO
Low-Level Input Voltage
VIL
VIH
DVSS
-
-
V
V
0.7 x
DVDDIO
High-Level Input Voltage
DVDDIO
Low-Level Input Current
High-Level Input Current
IIL
0
-
-
10
10
µA
µA
VIL=DVSS
IIH
0
VIH=DVDDIO
0.2 x
DVDDIO
Low-Level Output Voltage
High-Level Output Voltage
VOL
VOH
DVSS
-
-
V
V
IOL = 1.0 mA
IOH = 1.0 mA
0.8 x
DVDDIO
DVDDIO
<PI Driver Circuit>
Output Voltage
VPIO
-
0.15
1.5
0.5
V
V
IIH = 30 mA
<Waveform Shaping Circuit>
Waveform_Vthh,
Waveform_Vthl setting: 20h
Detection Voltage
VTH
1.4
1.6
<Voltage Driver Block 1ch-4ch>
IO = ±100 mA (sum of high
and low sides, 1ch, 2ch driver)
IO = ±100 mA (sum of high
and low sides, 3ch, 4ch driver)
-
2.0
2.5
Ω
ON-Resistance
RON
-
1.5
0
2.0
Ω
OFF-Leak Current
IOZ
-10
+10
µA
Output HiZ setting
Accuracy of Average
Voltage between Output
Pins
different output voltage
setting: 2Bh
VDIFF
-5
-
+5
%
<Voltage/Current Driver Block 5ch>
IO = ±100 mA
(sum of high and low sides)
ON-Resistance
RON
IOZ
-
1.0
0
1.5
Ω
OFF-Leak Current
-10
+10
µA
Output HiZ setting
In current driver mode
5_IOUT setting: 80h
RRNF=1 Ω
Output Current
IO
190
200
210
mA
<Current Driver Block 6ch>
ON-Resistance
IO = ±100 mA
(sum of high and low sides)
Output HiZ setting
6_IOUT setting: 80h
RON
IOZ
IO
-
1.0
0
1.5
+10
210
Ω
OFF-Leak Current
Output Current
-10
190
µA
mA
200
RRNF=1 Ω
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Typical Performance Curves
(Unless otherwise specified Ta=25 °C, DVDDIO=DVDD=3.0 V, MVCC12=MVCC34=VDDAMP=5.0 V)
100
100
80
60
40
20
0
80
60
40
20
0
-50
-25
0
25
50
75
100
2.0
2.5
3.0
DVDD [V]
3.5
4.0
Temperature [°C]
Figure 1. Quiescent Current (DVDD) vs DVDD
Figure 2. Quiescent Current (DVDD) vs Temperature
10
10
8
8
6
4
2
0
6
4
2
0
-50
-25
0
25
50
75
100
1.0
2.0
3.0
DVDDIO [V]
4.0
Temperature [°C]
Figure 3. Quiescent Current (DVDDIO) vs DVDDIO
Figure 4. Quiescent Current (DVDDIO) vs Temperature
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Typical Performance Curves – continued
(Unless otherwise specified Ta=25 °C, DVDDIO=DVDD=3.0 V, MVCC12=MVCC34=VDDAMP=5.0 V)
10
10
8
6
4
2
0
8
6
4
2
0
-50
-25
0
25
50
75
100
2.0
3.0
4.0
MVCC [V]
5.0
6.0
Temperature [°C]
Figure 5. Quiescent Current (MVCC) vs MVCC
Figure 6. Quiescent Current (MVCC) vs Temperature
5
5
4
3
2
1
0
4
IO=±100 mA
IO=±100 mA
3
2
1
0
-50
-25
0
25
50
75
100
2.0
3.0
4.0
MVCC [V]
5.0
6.0
Temperature [°C]
Figure 7. ON-Resistance vs MVCC
(1ch, 2ch Driver Block)
Figure 8. ON-Resistance vs Temperature
(1ch, 2ch Driver Block)
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Typical Performance Curves – continued
(Unless otherwise specified Ta=25 °C, DVDDIO=DVDD=3.0 V, MVCC12=MVCC34=VDDAMP=5.0 V)
5
5
4
3
2
1
0
4
3
2
1
0
IO=±100 mA
IO=±100 mA
-50
-25
0
25
50
75
100
2.0
3.0
4.0
MVCC [V]
5.0
6.0
Temperature [°C]
Figure 9. ON-Resistance vs MVCC
(5ch, 6ch Driver Block)
Figure 10. ON-Resistance vs Temperature
(5ch, 6ch Driver Block)
5
4
3
2
1
0
400
300
200
100
0
32
64
96 128 160 192 224 256
Code Setting
0
32
64
96
128
Code Setting
Figure 11. Average Voltage between Output Pins vs Code
Figure12. Output Current vs Code Setting
Setting
(Current Driver Block, RRNF=1.0 Ω, RL=5.0 Ω)
(Voltage Driver Block)
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Typical Performance Curves – continued
(Unless otherwise specified Ta=25 °C, DVDDIO=DVDD=3.0 V, MVCC12=MVCC34=VDDAMP=5.0 V)
0.20
0.15
0.10
IIH=30 mA
0.05
0.00
2.0
2.5
3.0
3.5
4.0
DVDD [V]
Figure 13. Output Voltage vs DVDD
(PIOUIT1 Driver Circuit)
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Timing Chart
(Unless otherwise specified, Ta=25 °C, DVDDIO=DVDD=3.0 V)
Parameter
SCLK Input Cycle
Symbol
Design Value
100 ns or more
tSCLK
tSCLKL
tSCLKH
tSSDATA
tHSDATA
tCSBH
SCLK Low-Level Input Time
SCLK High-Level Input Time
SDATA Setup Time
50 ns or more
50 ns or more
50 ns or more
50 ns or more
380 ns or more
50 ns or more
50 ns or more
36 ns or more
18 ns or more
18 ns or more
SDATA Hold Time
CSB High-Level Input Time
CSB Setup Time
tSCSB
CSB Hold Time
tHCSB
FCLK Input Cycle
tFCLK
FCLK Low-Level Input Time
FCLK High-Level Input Time
tFCLKL
tFCLKH
0.7 x DVDDIO
0.3 x DVDDIO
CSB
tSCLK
tCSBH
tSCLKH
tSCLKL
tHCSB
tSCSB
tHCSB
tSCSB
0.7 x DVDDIO
0.3 x DVDDIO
SCLK(Note 3,4)
tSSDATA
tHSDATA
0.7 x DVDDIO
0.3 x DVDDIO
SDATA
tFCLKL
tFCLKH
tFCLK
0.7 x DVDDIO
0.3 x DVDDIO
FCLK(Note 3,4)
(Note 3) FCLK is asynchronous with SCLK.
(Note 4) The duty of FCLK and SCLK is arbitrary after observing the above table.
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Serial interface
Control command is 16-bit serial input (MSB first) and is sent via the CSB, the SCLK, and the SDATA pins.
Higher 4 bits specify addresses and lower 12 bits specify data. Data of each bit is sent via the SDATA pin and taken at a
rising edge of SCLK. The Data taken during CSB ‘L’ period is valid and is written in register at a rising edge of CSB.
CSB
SCLK
x
D15 D14 D13 D12 D11 D10 D9
Address
D8
D7
D6
D5
D4
D3
D2
D1
D0
x
SDATA
Data
Register Map(Note 5,6,7)
Address[3:0]
Data[11:0]
15
0
14
0
13
0
12
0
11
10
9
8
7
6
5
4
3
2
1
0
0
0
A_Mode[1:0]
A_SEL[2:0]
A_different_output_voltage[6:0]
A_Cycle[5:0]
A_Cycle[13:6]
0
0
0
0
0
0
1
1
0
1
0
1
0
0
0
0
0
0
0
0
0
0
A_Start_POS[3:0]
0
0
0
1
A_BEXC
A_BSL A_AEXC
0
0
A_ASL
A_UPDW_
Stop
1
1
1
0
0
0
A_POS[1:0]
0
A_PS A_Stop
0
0
0
1
1
0
0
0
A_EN
A_RT
A_Pulse[9:0]/A_UPDW_Cycle[9:0]
B_different_output_voltage[6:0]
B_Cycle[5:0]
B_Mode[1:0]
B_SEL[2:0]
0
0
0
0
1
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
0
0
0
0
0
0
0
B_Cycle[13:6]
0
0
B_BEXC
0
0
0
0
0
0
B_Start_POS[3:0]
B_BSL B_AEXC
0
0
0
B_ASL
0
1
0
1
3_CHOP[1:0]
0
4_CHOP[1:0]
3_State_CTL[1:0]
4_State_CTL[1:0]
3_PWM_Duty[6:0]
4_PWM_Duty[6:0]
B_UPDW_
Stop
1
1
1
0
0
0
B_POS[1:0]
0
B_PS B_Stop
0
1
1
1
0
1
1
1
0
0
1
0
B_EN
B_RT
B_Pulse[9:0]/B_UPDW_Cycle[9:0]
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
1
0
0
B_ANSEL A_ANSEL Edge
0
0
0
0
0
0
B_CTL A_CTL
EXT_CTL[1:0]
0
0
0
0
0
0
Chopping[1:0]
CacheM
0
5_Mode CLK_EN
CLK_DIV[3:0]
0
1
1
1
0
0
0
1
0
0
0
0
0
0
PI_CTL2 PI_CTL1
DET_SEL
SPEN[1:0]
0
0
TARSP[7:0]
0
1
1
0
1
0
PSP[2:0]
0
ISP[2:0]
SPC_
Limit_Out
1
0
0
0
0
0
SPC_Limit[3:0]
0
0
0
0
1
1
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
1
0
0
0
0
0
0
0
1
0
5_IOUT[7:0]
0
0
0
5_PWM_Duty[6:0]
0
0
5_CHOP[1:0]
0
0
0
5_State_CTL[1:0]
0
0
6_State_CTL[2:0]
1
1
1
0
6_IOUT[7:0]
0
0
0
0
0
0
Waveform_Vthh[5:0]
Waveform_Vthl[5:0]
0
STB
0
0
STM_RS CMD_RS
Other than the above
Setting Prohibited
(Note 5) The notations A and B in the register map correspond to Ach and Bch respectively. Ach is defined as 1ch and 2ch driver output, Bch as 3ch and 4ch
driver output.
(Note 6) After power on reset, the initial settings are stored in all registers.
(Note 7) Regarding Mode, different_output_voltage, Cycle, EN, and RT registers, the data written right before the access to the Pulse register is valid and
determined at a rising edge of CSB after the access to the Pulse register.
(The Mode, different_output_voltage, Cycle, EN, RT, and Pulse registers have Cache registers. Any registers other than them do not have Cache
registers.)
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Application Example
1ch / 2ch
5ch
6ch
3ch / 4ch
μ-STEP
PWM
C.C.
μ-STEP
VCM
VCM
Iris
STM
STM
Zoom
Shutter
Auto Focus
5ch
PWM
+FLL
PI
Driver
(2ch)
1ch / 2ch
μ-STEP
6ch
C.C.
3ch / 4ch
μ-STEP
VCM
LED
DCM
STM
STM
Iris
Zoom
Shutter
Auto Focus
A/F LED
3ch
PWM
+FLL
1ch / 2ch
μ-STEP
4ch
PWM
5ch
C.C.
6ch
C.C.
VCM
Iris
DCM
M
VCM
STM
Shutter
Auto Focus
Zoom
etc.
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I/O Equivalence Circuit
Pin
FCLK
CSB
Equivalent Circuit Diagram
DVDDIO DVDDIO
Pin
Equivalent Circuit Diagram
DVDD
SI
SCLK
SDATA
INA
INB
STATE11
STATE21
STATE12
STATE22
SO
DVDDIO
DVDDIO
DVDDIO
DVDDIO
DVDDIO
PIOUT1
PIOUT2
DVDD
OUT1A
OUT1B
OUT2A
OUT2B
OUT3A
OUT3B
OUT4A
OUT4B
MVCC12
MVCC34
OUT5A
OUT5B
OUT6A
OUT6B
RNF6
RNF5
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I/O Equivalence Circuit – continued
Pin
SENSE5
SENSE6
Equivalent Circuit Diagram
Pin
TEST(Note 8)
Equivalent Circuit Diagram
DVDDIO DVDDIO
VDDAMP
(Note 8) Short the TEST pin to DVSS.
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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Ordering Information
B U 2
4
0
3
6 M W V
-
E 2
Package
Packaging and forming specification
MWV: UQFN040V5050 E2: Embossed tape and reel
Marking Diagram
UQFN040V5050 (TOP VIEW)
Part Number Marking
U 2 4 0 3 6
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
UQFN040V5050
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Revision History
Date
Revision
Changes
10.Oct.2012
02.May.2013
20.May.2016
001
002
003
New Release
Update some English words, sentences, descriptions, grammar and format.
Correct comments of pin description.
In the “Typical Application Circuit” names of connected power supply are added.
In the “Pin Configuration” and “Pin Description” the “EXP-PAD” which is located at the
center of backside is added.
In the “Absolute Maximum Ratings” the “Maximum Junction Temperature” is added.
In the “Absolute Maximum Ratings” notes are added. e.g. About when operating the IC
over the “Absolute Maximum Ratings”,
“Operating Temperature” is moved to “Recommended Operating Conditions” from
“Absolute Maximum Ratings”.
004
12.Mar.2019
In the “Typical Performance Curves” Quiescent Current (DVDDIO) graphs are added.
In the “Typical Performance Curves” package power dissipation graph is removed,
because it’s same information as Note 2 in “Absolute Maximum Ratings”.
“Operational Notes” are updated.
Other formats are updated.
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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