BU27006MUC-Z [ROHM]
BU27006MUC-Z是搭载闪变传感器的数字颜色传感器IC。检测光的颜色模式(RGB)和红外光，将其转换为数字数据。具有高灵敏度、大检测范围、优异的红外光去除特性，因此可轻松、高精度地获取环境光线的照度和颜色温度。而且，闪变传感器可以检测出显示器和室内灯的闪变噪声。适用于调整TV、手机、平板电脑等液晶背光的应用。;
| 型号： | BU27006MUC-Z |
| 厂家： | 
ROHM |
| 描述： | BU27006MUC-Z是搭载闪变传感器的数字颜色传感器IC。检测光的颜色模式(RGB)和红外光，将其转换为数字数据。具有高灵敏度、大检测范围、优异的红外光去除特性，因此可轻松、高精度地获取环境光线的照度和颜色温度。而且，闪变传感器可以检测出显示器和室内灯的闪变噪声。适用于调整TV、手机、平板电脑等液晶背光的应用。 手机 电脑 电视 传感器 显示器 |
| 文件： | 总18页 (文件大小：925K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Color Sensor IC Series
Digital 16bit Serial Output Type
Color Sensor IC
BU27006MUC-Z
General Description
Key Specifications
BU27006MUC-Z is a digital color sensor IC with Flicker
sensing function. This IC senses Red, Green, Blue
(RGB) and Infrared and converts them to digital values.
The high sensitivity, wide dynamic range and excellent
Ircut characteristics make it possible for this IC to obtain
the accurate illuminance and color temperature of
ambient light. It is also possible to detect flicker light
noise of display and room lighting. It is ideal for adjusting
LCD backlight of TV, mobile phone and tablet PC.
■ VCC Voltage Range:
1.7 V to 3.6 V
50 klx (Typ)
10 klx (Typ)
■ LUX and CCT Detection Range(Note 1)
:
■ Flicker Detection Range(Note 1)
:
■ Current Consumption(Note 1)
Color Sensing:
:
220 μA (Typ)
200 μA (Typ)
2 μA (Typ)
Flicker Sensing:
■ Power Down Current:
■ Operating Temperature Range:
(Note 1) White LED is used.
-40 °C to +85 °C
Package
WQFN12X2520A
W (Typ) x D (Typ) x H (Max)
2.50 mm x 2.00 mm x 0.55 mm
Features
RGB/IR + Flicker Detection
Built-in Ircut Filter
Rejecting 50 Hz/60 Hz Light Noise for Color Sensor
I2C Bus Interface (f/s mode support)
Correspond to 1.8 V Logic Interface
LUX Resolution 0.015 lx/count (Typ) in Color Sensor
(In the highest gain and the longest measurement time
setting)
Sampling frequency 1 kHz/2 kHz is selectable in flicker
sensor
Applications
Mobile Phone, Tablet PC, Notebook PC, Digital Camera,
Portable Game Machine, LCD TV
Typical Application Circuits
0.1 μF
VCC
PD
ADC
Micro
Controller
SDA
SCL
INT
ADC Logic
PD
PD
PD
+
ADC
ADC
I2C Interface
or
+
INT Interface
+
Baseband
Processor
FIFO
ADC
PD
FLICKER
POR
OSC
GND
〇Product structure: Silicon integrated circuit
〇This product does not include laser transmitter.
〇This product includes Photo detector, (Photo Diode) inside of it.
〇This product has no designed protection against radioactive rays.
〇This product does not include optical load.
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Pin Configuration
TOP VIEW
NC
12
NC
11
1
2
NC
NC
NC
NC
GND
SCL
SDA
10
9
8
3
4
7
VCC
5
6
NC
INT
Pin Description
Pin No.
Pin Name
Function
1
GND
SCL
SDA
VCC
INT
Ground
2
I2C bus serial clock(Note 1)
I2C bus serial data(Note 1)
Power supply (Note 2)
Interrupt(Note 1)
3
4
6
5, 7 to 12
NC
Non connect(Note 3)
(Note 1) If there is a device falls sharply among other devices connected to the SDA, SCL, and INT pins, it might generate undershoot and the pin voltage might
be the ground potential or below. When the undershoot occurs, must take a measure like adding a capacitor near to the pin of the device concerned.
(Note 2) Dispose a bypass capacitor as close as possible to the IC
(Note 3) Please use the NC pin as open pin
Block Diagram
VCC
PD
ADC
ADC Logic
+
SDA
SCL
INT
PD
PD
PD
I2C Interface
ADC
ADC
+
INT Interface
+
FIFO
ADC
GND
PD
FLICKER
POR OSC
Description of Blocks
IRCUT FILTER
RED, GREEN, BLUE, IR
PD
: Infrared cut filter
: Red, Green, Blue, Infrared pass filter
: Photodiode
ADC
: Analog-to-Digital Converter for obtaining 16 bit digital data depending on quantity
of the light.
ADC Logic + I2C Interface
+ INT Interface + FIFO
: ADC control logic and I/F logic + FIFO (for Flicker function)
: Clock generator for internal logic
OSC
POR
: Power ON Reset. All registers are reset after VCC is supplied.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Supply Voltage
Symbol
Rating
Unit
VCC_MR
VIN_MR
Tstg
4.5
V
V
Input Voltage [INT,SCL,SDA]
Storage Temperature Range
Maximum Junction Temperature
-0.3 to +4.5
-40 to +100
100
°C
Tjmax
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
WQFN12X2520A
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
220.6
42
126.9
38
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.6 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Temperature
Supply Voltage
Topr
VCC
VIN
-40
1.7
0
+25
1.8
-
+85
3.6
3.6
°C
V
Input Voltage[INT,SCL,SDA]
V
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Electrical Characteristics
(Unless otherwise specified, VCC = 1.8 V, Ta = 25 °C, RGB_GAIN = x32 gain mode,
MEAS_MODE = 100 ms mode, FLC_GAIN = x32 gain mode, FLC_MODE = 2 kHz mode)
Parameter
Current Consumption 1
Current Consumption 2
Symbol
Min
Typ
220
200
Max
310
280
Unit
Conditions
Ev = 300 lx(Note 1)
ICC1
-
-
µA
RGB_EN = ‘1’, FLC_EN = ‘0’
Ev = 300 lx(Note 1)
ICC2
µA
RGB_EN = ‘0’, FLC_EN = ‘1’
No input light
Power Down Current
ICC3
-
2
5
µA
RGB_EN = ‘0’, FLC_EN = ‘0’
SCL = SDA = 1.8 V(Note 2)
Red Data Count Value
DRED
DGREEN
DBLUE
DIR
count Ev = 20 µW/cm2(Note 3)
count Ev = 20 µW/cm2(Note 4)
count Ev = 20 µW/cm2(Note 5)
count Ev = 20 µW/cm2(Note 6)
count Ev = 300 lx(Note 1)
count No input light
count No input light
ms
2040
2975
1785
560
370
-
2400
2760
4025
2415
940
630
2
Green Data Count Value
Blue Data Count Value
IR Data Count Value
3500
2100
750
Flicker Data Count Value
RGB/IR Dark Count Value
FLICKER Dark Count Value
RGB/IR Measurement Time
FLICKER Measurement Time
INT Output ‘L’ Voltage
DFLICKER
S0_0
500
-
SF_0
tMT
-
-
5
-
-
100
525
0.4
-
tFLC
475
0
500
µs
VINTL
VIH
-
-
-
-
V
V
V
V
IOL = 3 mA
IOL = 3 mA
SCL SDA Input ‘H’ Voltage
SCL SDA Input ‘L’ Voltage
0.84
-
VIL
0.45
0.4
SDA Output ‘L’ Voltage
VOL
0
(Note 1) White LED is used.
(Note 2) Current value depends on the voltage difference between the VCC pin and the SCL or SDA pins.
(Note 3) Red LED is used.
(Note 4) Green LED is used.
(Note 5) Blue LED is used.
(Note 6) Infrared LED is used.
Typical Performance Curves
1
0.8
0.6
0.4
0.2
0
1
0.8
0.6
0.4
0.2
0
400 500 600 700 800 900 1000 1100
Wavelength [nm]
400 500 600 700 800 900 1000 1100
Wavelength [nm]
Figure 1. RGB/IR Sensitivity Ratio vs Wavelength
(RGB/IR Spectral Response)
Figure 2. FLICKER Sensitivity Ratio vs Wavelength
(FLICKER Spectral Response)
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I2C Bus Timing Characteristics (Unless otherwise specified VCC = 1.8 V, Ta = 25 °C)
P: STOP
S: Repeated START
S: START
S: START
VIH
VIH
VIL
VIH
VIH
VIL
SDA
SCL
VIL
VIL
tBUF
tHD;STA
tSU;DAT
VIH
VIH
VIL
VIH
VIH
VIH
VIH
VIL
VIL
tHIGH
tLOW
tHD;STA
tHD;DAT
tSU;STA
tSU;STO
Parameter
Symbol
fSCL
tLOW
Min
Typ
Max
Unit
SCL Clock Frequency
‘L’ Period of the SCL Clock
‘H’ Period of the SCL Clock
Setup Time for Repeated START
Hold Time for START
Data Setup Time
0
-
-
-
-
-
-
-
-
-
400
kHz
µs
µs
µs
µs
ns
µs
µs
µs
1.3
0.6
0.6
0.6
100
0
-
-
-
-
-
-
-
-
tHIGH
tSU;STA
tHD;STA
tSU;DAT
tHD;DAT
tSU;STO
tBUF
Data Hold Time
Setup Time for STOP
0.6
1.3
Bus Free Time between STOP and START
I2C Bus Communication
1. Write Format
(1) Indicate register address
W
0
S
Slave Address
ACK
Register Address
Register Address
ACK
ACK
P
(2) Write data after indicating register address
W
S
Slave Address
ACK
0
Data specified at register
address field
Data specified at register
address field + N
ACK
…
ACK
ACK
P
2. Read Format
(1) Read data after indicating register address
W
0
S
S
Slave Address
Slave Address
ACK
ACK
…
Register Address
ACK
ACK
R
1
Data specified at register
address field
Data specified at register
address field + 1
Data specified at register
address field + N
ACK
ACK
NACK
NACK
P
P
(2) Read data from the specified register
R
1
Data specified at register
address field
S
Slave Address
ACK
ACK
Data specified at register
address field + 1
Data specified at register
address field + N
ACK
…
ACK
: from master to slave
: from slave to master
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I2C Bus Slave Address
The slave address is “0111000”.
Register MAP(Note 1)
Register
Register Name
Address
R/W
D7
D6
D5
D4
D3
D2
D1
D0
SW_
RESET
0x40
0x41
0x42
SYSTEM_CONTROL
MODE_CONTROL1
MODE_CONTROL2
RW
RW
RW
0
0
0
PART ID
0
RGB_GAIN
FLC_GAIN
0
0
0
MEAS_MODE
FLC_
0
0
MODE
RGB_
VALID
FLC_
VALID
0x43
MODE_CONTROL3
RED_DATA
RW
0
0
INT SEL
RGB_EN FLC_EN
0x50
0x51
0x52
0x53
0x54
0x55
0x56
0x57
R
R
R
R
R
R
R
R
RED_DATA [7:0]
RED_DATA [15:8]
GREEN_DATA [7:0]
GREEN_DATA [15:8]
BLUE_DATA [7:0]
BLUE_DATA [15:8]
IR_DATA [7:0]
GREEN_DATA
BLUE_DATA
IR_DATA
IR_DATA [15:8]
0x58
0x59
0x5A
0x5B
0x5C
R
R
R
R
R
FLICKER_DATA [7:0]
FLICKER_DATA
0
0
0
0
0
0
0
FLICKER_DATA [12:8]
FLICKER_COUNTER [7:0]
FIFO_LEVEL [6:0]
FIFO_DATA [7:0]
FLICKER_COUNTER
FIFO_LEVEL
FIFO_DATA
0x5D
0x92
FIFO_DATA
R
R
FIFO_DATA [12:8]
MANUFACTURER_ID
MANUFACTURER_ID
(Note 1) Do not write any commands to other addresses except above. Do not write ‘1’ to the field in which value is ‘0’ in above table.
(0x40) SYSTEM_CONTROL
Fields
Function
All registers are reset and this IC is in power down state by software reset.
0: Software reset is not done.
1: Software reset is done.
SW_RESET
PART ID
Part ID 0x10 (Read only register)
Default value 0x10
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Register MAP - continued
(0x41) MODE_CONTROL1
Fields
Function
Gain setting for RGB/IR Data.
00: x1 gain mode
RGB_GAIN
01: x4 gain mode
10: x32 gain mode
11: x128 gain mode
Measurement mode for RGB/IR Data
00: Forbidden to use
01: 55 ms mode
MEAS_MODE
10: 100 ms mode
11: Forbidden to use
Measurement time is specified in Electrical Characteristics.
Default value 0x02
MEAS_MODE: When measurement mode is 55ms and RGB_GAIN is x1 or x32, maximum output of RED_DATA is 0xC800.
(0x42) MODE_CONTROL2
Fields
Function
Gain setting for FLICKER sensor
000: x1 gain mode
001: x2 gain mode
010: x4 gain mode
FLC_GAIN
011: x8 gain mode
100: x16 gain mode
101: x32 gain mode
110: Forbidden to use
111: Forbidden to use
Measurement mode for FLICKER Data
0: 1 kHz mode
FLC_MODE
1: 2 kHz mode
Default value 0x00
(0x43) MODE_CONTROL3
Fields
Function
RGB_VALID
FLC_VALID
Refer to “VALID Register”
Refer to “VALID Register”
00: Disable
01: Measurement completion of RGB/IR data
10: Measurement completion of FLICKER data
11: 64 DATAs are ready in FIFO.
INT_SEL
0: RGB/IR measurement is inactive.
1: RGB/IR measurement is active.
0: Flicker measurement is inactive.
1: Flicker measurement is active.
RGB_EN
FLC_EN
Default value 0x00
Default value 0x0000
Default value 0x0000
(0x50 / 0x51) RED_DATA
Fields
Function
RED_DATA [15:0]
RED measurement result
(0x52 / 0x53) GREEN_DATA
Fields
Function
GREEN_DATA [15:0]
GREEN measurement result
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Register MAP - continued
(0x54 / 0x55) BLUE_DATA
Fields
Function
Function
Function
BLUE_DATA [15:0]
BLUE measurement result
Default value 0x0000
Default value 0x0000
(0x56 / 0x57) IR_DATA
Fields
IR_DATA [15:0]
IR measurement result
(0x58 / 0x59) FLICKER_DATA
Fields
FLICKER measurement result
ADC Dynamic range of 1 kHz mode is from 0x0000 to 0x17FF.
ADC Dynamic range of 2 kHz mode is from 0x0000 to 0x07FF.
When ADC is overflow, 0x1FFF is registered.
FLICKER_DATA [12:0]
Default value 0x0000
Default value 0x00
Default value 0x00
(0x5A) FLICKER_COUNTER
Fields
Function
FLICKER_COUNTER [7:0]
Refer to “FLICKER_COUNTER Register”
(0x5B) FIFO_LEVEL
Fields
Function
Refer to “FIFO Register”
FIFO_LEVEL [6:0]
(0x5C / 0x5D) FIFO_DATA
Fields
Function
Refer to “FIFO Register”
ADC Dynamic range of 1 kHz mode is from 0x0000 to 0x17FF.
ADC Dynamic range of 2 kHz mode is from 0x0000 to 0x07FF.
When ADC is overflow, 0x1FFF is registered.
FIFO_DATA [12:0]
Default value 0x0000
Default value 0xE0
(0x92) MANUFACTURER_ID
Fields
Function
MANUFACTURER_ID
MANUFACTURER_ID: 0xE0
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VALID Register
VALID registers (RGB_VALID and FLC_VALID) are measurement data update flag. It turns to ‘1’ when measurement data is
updated.
These registers are cleared and turn to ‘0’ by writing MODE_CONTROL1 to MODE_CONTROL3 registers (0x41, 0x42, 0x43)
or reading itself.
FLICKER_COUNTER Register
Measured number from previous sync to latest sync is in this register. It is possible to calibrate the flicker frequency by correcting
the flicker sensor measurement period (tMEAS).
tMEAS = tSYNC / FLICKER_COUNTER
tSYNC = Time measured by host.
This register is cleared by writing MODE_CONTROL register (0x41, 0x42, 0x43) or reading itself.
When the measurement is done for 127 times in 128 ms, like in the figure below, tMEAS is 128/127 ms.
Read register.
ex. FLICKER_COUNTER = 127
ex. tSYNC = 128 ms
Host Command
Sync
Sync
…
Meas1
Meas2
1
Meas3
2
Meas4
3
Meas127 Meas128
126 127
0
0
1
…
FLICKER_COUNTER
FIFO Register
There is a FIFO for FLICKER sensor. Total 100 data are possible to be stored in the FIFO. Number of stored data is written in
FIFO_LEVEL register. FIFO_DATA is possible to be read continuously like in below figure.
FIFO_LEVEL register and FIFO_DATA register are cleared by writing MODE_CONTROL1 to MODE_CONTROL3 registers
(0x41, 0x42, 0x43).
R
1
Data specified at register
address field
Data specified at register
address field + 1
S
Slave Address
ACK
ACK
ACK
…
Data at
0x5A
Data at
0x5B
Data at
0x5C
Data at
0x5D
Data at
0x5C
Data at
0x5D
…
ACK
ACK
ACK
ACK
ACK
ACK
…
2nd FIFO_DATA
1st FIFO_DATA
: from master to slave
: from slave to master
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Power Supply Sequence (Unless otherwise specified VCC = 1.8 V, Ta = 25 °C)
tPSL
VCC (Min)
VCC (Min)
VCC (Min)
VCC
0.4 V
0.4 V
0.4 V
tPSC
tPSC
Command Acceptable
Conditions
Command Acceptable
Undefined Behavior
Undefined Behavior
Parameter
Symbol
tPSC
Min
100
1
Typ
Max
Unit
Command Input Wait Time
after Power-up
-
-
-
-
µs
Power Down Time
tPSL
ms
Command input is available after “tPSC” from VCC is supplied.
If VCC voltage is below the recommended operating voltage range, internal state is “Undefined Behavior”. In this case, please
once power down and power up again.
Keep VCC < 0.4 V for “tPSL” or more before VCC is supplied again.
Optical Design for the Device
TOP VIEW
2.50 mm
1.25 mm
0.644 mm
1.00 mm
2.00 mm
PKG center
PD area; (0.40 x 0.63 mm)
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I/O Equivalence Circuits
Pin Name
Equivalent Circuit
VCC
Pin Name
Equivalent Circuit
VCC
SCL
SDA
VCC
INT
-
-
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ02201-0M1M0F019080-1-2
02. Apr. 2019 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
12/15
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BU27006MUC-Z
Ordering Information
B U 2
7
0
0
6 M U
C
-
ZTR
Part Number
Package
MUC: WQFN12X2520A
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
WQFN12X2520A (TOP VIEW)
Pin 1 Mark
Part Number Marking
A
A
LOT Number
www.rohm.com
TSZ02201-0M1M0F019080-1-2
02. Apr. 2019 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
13/15
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BU27006MUC-Z
Physical Dimension and Packing Information
Package Name
WQFN12X2520A
www.rohm.com
TSZ02201-0M1M0F019080-1-2
02. Apr. 2019 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
14/15
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BU27006MUC-Z
Revision History
Date
Revision
001
Changes
02. Apr. 2019
New Release
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TSZ02201-0M1M0F019080-1-2
02. Apr. 2019 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
15/15
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BU27034NUC (开发中)
BU27034NUC is a digital Ambient Light Sensor IC with I²C bus interface. This IC is most suitable for obtaining ambient light data for adjusting LCD and backlight power of TV and mobile phone. It is capable of detecting a very wide range of illuminance.
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