BU27TD3WG-TR [ROHM]
Versatile Package FULL CMOS LDO Regulator;型号: | BU27TD3WG-TR |
厂家: | ROHM |
描述: | Versatile Package FULL CMOS LDO Regulator |
文件: | 总10页 (文件大小:483K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
CMOS LDO Regulator Series for Portable Equipments
Versatile Package
FULL CMOS LDO Regulator
BUxxTD3WG series
●General Description
●Key Specifications
BUxxTD3WG series is high-performance FULL CMOS
regulator with 200-mA output, which is mounted on
versatile package SSOP5 (2.9 mm × 2.8 mm × 1.25 mm).
It has excellent noise characteristics and load
responsiveness characteristics despite its low circuit
current consumption of 35μA. It is most appropriate for
various applications such as power supplies for logic IC,
RF, and camera modules.ROHM’s.
Output voltage:
1.0V to 3.4V
±1.0% (±25mV)
35μA
Accuracy output voltage:
Low current consumption:
Operating temperature range:
-40°C to +85°C
●Applications
Battery-powered portable equipment, etc.
●Package
SSOP5:
2.90mm x 2.80mm x 1.25mm
●Features
High accuracy detection
low current consumption
Compatible with small ceramic capacitor(Cin=Co=0.47uF)
With built-in output discharge circuit
High ripple rejection
ON/OFF control of output voltage
With built-in over current protection circuit
and thermal shutdown circuit
Package SSOP5 is similar to SOT-23-5 (JEDEC)
Low dropout voltage
●Typical Application Circuit
STBY
VIN
STBY
VOUT
VOUT
VIN
GND
GND
GND
Fig.1 Application Circuit
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
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Datasheet
BUxxTD3WG series
●Connection Diagram
VOUT
N.C.
SSOP5
Lot. No
Marking
VIN GND STBY
TOP VIEW
●Pin Descriptions
SSOP5
PIN No.
Symbol
VIN
Function
1
2
Power Supply Voltage
Grouding
GND
ON/OFF control of output voltage
(High: ON, Low: OFF)
3
STBY
4
5
N.C.
Unconnected Terminal
Output Voltage
VOUT
●Ordering Information
B
U
x
x
T
D
3
W
G
-
x
T
R
Part
Number
Output Voltage
10 : 1.0V
Series
with
Package
Halogen Free
G : compatible
Packageing and forming specification
Embossed tape and reel
Maximum Output Current
200mA
output discharge G : SSOP5
Blank : incompatible TR : The pin number 1 is the upper right
34 : 3.4V
SSOP5
°
°
+
−4
2.9 0.2
5
6
°
4
4
1
2
3
+0.05
0.13
−0.03
+0.05
−0.04
0.42
0.1
0.95
(Unit : mm)
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Datasheet
BUxxTD3WG series
●Lineup
Marking
F0
L6
F1
M0
L5
F2
F3
F4
F5
Output Voltage
1.0V
1.1V
BU11
1.2V
BU12
1.25V
BU1C
1.3V
BU13
1.5V
BU15
1.8V
BU18
1.85V
BU1J
1.9V
BU19
Part Number
BU10
F6
F7
F8
F9
G0
G1
G2
G3
G4
2.0V
BU20
2.1V
BU21
2.5V
BU25
2.6V
BU26
2.7V
BU27
2.8V
BU28
2.85V
BU2J
2.9V
BU29
3.0V
BU30
G5
G6
G7
G8
3.1V
BU31
3.2V
BU32
3.3V
BU33
3.4V
BU34
●Absolute Maximum Ratings (Ta=25°C)
PARAMETER
Symbol
Limit
Unit
V
VMAX
Pd
Power Supply Voltage
Power Dissipation
-0.3 ~ +6.5
540(*1)
mW
℃
Maximum junction temperature
Operating Temperature Range
Storage Temperature Range
TjMAX
Topr
+125
-40 ~ +85
-55 ~ +125
℃
Tstg
℃
(*1)Pd deleted at 5.4mW/℃at temperatures above Ta=25℃, mounted on 70×70×1.6 mm glass-epoxy PCB.
● RECOMMENDED OPERATING RANGE (not to exceed Pd)
PARAMETER
Symbol
VIN
Limit
Unit
V
Power Supply Voltage
1.7~6.0
Maximum Output Current
IMAX
200
mA
●OPERATING CONDITIONS
PARAMETER
Symbol
Cin
MIN.
TYP.
0.47
0.47
MAX.
Unit
μF
CONDITION
Input Capacitor
Output Capacitor
0.22(*2)
0.22(*2)
-
-
Ceramic capacitor recommended
Co
μF
(*2)Make sure that the output capacitor value is not kept lower than this specified level across a variety of
temperature, DC bias, changing as time progresses characteristic.
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Datasheet
BUxxTD3WG series
●Electrical Characteristics
(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)
Limit
PARAMETER
Symbol
VOUT
Unit
Conditions
MIN.
TYP.
MAX.
Overall Device
VOUT×0.99
VOUT×1.01
VOUT+25mV
60
IOUT=10μA, VOUT≧2.5V
Output Voltage
V
VOUT
VOUT-25mV
IOUT=10μA, VOUT<2.5V
IOUT=0mA
Operating Current
IIN
-
-
35
-
μA
μA
Operating Current (STBY)
ISTBY
1.0
STBY=0V
Ripple Rejection Ratio
RR
45
-
70
-
dB
mV
mV
mV
mV
VRR=-20dBv, fRR=1kHz, IOUT=10mA
2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA)
2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA)
2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA)
3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA)
280
260
240
220
540
500
460
420
-
Dropout Voltage
VSAT
-
-
Line Regulation
Load Regulation
VDL
-
-
2
20
80
mV
mV
VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA
IOUT=0.01mA to 100mA
VDLO
10
Over Current Protection (OCP)
Limit Current
ILMAX
220
20
400
70
700
150
mA
mA
Vo=VOUT*0.95
Vo=0V
Short Current
ISHORT
Standby Block
Discharge Resistor
STBY Pin Pull-down Current
RDSC
ISTB
20
0.1
50
0.6
-
80
2.0
6.0
0.3
Ω
μA
V
VIN=4.0V, STBY=0V, VOUT=4.0V
STBY=1.5V
ON
STBY Control Voltage
OFF
VSTBH
VSTBL
1.2
-0.3
-
V
This product is not designed for protection against radioactive rays.
(*3) VIN=2.5V for VOUT≦1.5V
(*4) VIN=2.5V to 3.6V for VOUT≦1.5V
●ELECTRICAL CHARACTERISTICS of each Output Voltage
(Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)
Output Voltage
PARAMETER
MIN.
80
TYP.
160
-
MAX.
Unit
mA
Conditions
VIN=1.7V
-
-
-
-
-
1.0V, 1.1V, 1.2V, 1.25V, 1.3V
200
60
VIN=2.1V
Maximum
120
-
VIN=1.8V
output current
1.5V
200
200
VIN=2.2V
1.8V, 1.85V, 1.9V, 2.0V, 2.1V
-
VIN=VOUT+0.6V
●Block Diagrams
VIN
VIN
1
VREF
VOUT
Co
VOUT
Cin
5
2
3
OCP
GND
TSD
STBY
Discharge
STBY
STBY
Cin・・・0.47μF (Ceramic)
Co ・・・0.47μF (Ceramic)
Fig. 2 Block Diagrams
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Datasheet
BUxxTD3WG series
●Reference data BU18TD3WG (Ta=25ºC unless otherwise specified.)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
100
80
60
40
20
0
Temp=25°C
Temp=25°C
VIN=STBY
Io=0uA
VIN=STBY
Temp=85°C
Temp=25°C
Io=0uA
Io=100uA
Io=50mA
Io=200mA
Io=0uA
Io=100uA
Io=50mA
Io=200mA
Temp=-40°C
VIN=STBY
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.7
1.8
1.9
2
2.1
2.2
2.3
2.4
2.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0.2
85
Input Voltage (V)
Input Voltage (V)
Input Voltage (V)
Fig 5. Circuit Current IGND
Fig 3. Output Voltage
Fig 4. Line Regulation
1.85
1.84
1.83
1.82
1.81
1.6
1.4
1.2
1.0
0.8
0.6
100
80
60
40
20
0
VIN=2.8V
VIN=2.8V
STBY=1.5V
STBY=1.5V
Temp=85°C
Temp=25°C
Temp=85°C
Temp=85°C
1.80
1.79
1.78
1.77
1.76
1.75
Temp=-40°C
0.4
0.2
0.0
Temp=25°C
Temp=-40°C
Temp=25°C
Temp=-40°C
0.05
0
0.05
0.1
0.15
0.2
1.5
85
0
0.1
0.15
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Output Current (A)
Output Current (A)
Input Voltage (V)
Fig 6. VSTBY - ISTBY
Fig 8. Load Regulation
Fig 7. IOUT - IGND
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
2.0
1.8
1.6
1.4
1.2
2.0
VIN=2.8V
STBY=1.5V
Io=0.1mA
VIN=3.8V
Io=0mA
VIN=2.8V
1.5
1.0
0.5
0.0
VIN=5.5V
VIN=2.3V
1.0
0.8
0.6
0.4
0.2
0.0
Temp=25°C
Temp=85°C
Temp=-40°C
Temp=25°C
STBY=1.5V
0
0.5
1
-40
-15
10
35
60
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Temp (°C)
STBY Voltage (V)
Output Current (mA)
Fig 9. OCP Threshold
Fig 11. VOUT - Temp
Fig 10. STBY Threshold
60
50
40
30
20
10
0
1.0
0.9
0.8
0.7
0.6
VIN=2.8V
STBY=1.5V
Io=0mA
VIN=2.8V
STBY=0V
0.5
0.4
0.3
0.2
0.1
0.0
-40
-15
10
35
60
85
-40
-15
10
35
60
Temp (°C)
Temp (°C)
Fig 12. IGND - Temp
Fig 13. IGND - Temp (STBY)
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Datasheet
BUxxTD3WG series
●Reference data BU18TD3WG (Ta=25ºC unless otherwise specified.)
100
100
50
0
50
IOUT=0mA→50mA
IOUT=50mA→0mA
0
1.90
1.85
1.85
1.80
1.80
1.75
1.75
1.70
Fig 14. Load Response
Fig 15. Load Response
100
50
0
100
IOUT=0mA→100mA
50
0
IOUT=100mA→0mA
1.90
1.85
1.85
1.80
1.80
1.75
1.75
1.70
Fig 16. Load Response
Fig 17. Load Response
200
100
0
200
IOUT=0mA→200mA
100
0
IOUT=200mA→0mA
2.00
1.90
1.90
1.80
1.80
1.70
1.70
1.60
Fig 18. Load Response
Fig 19. Load Response
100
50
0
100
IOUT=50mA→100mA
IOUT=100mA→50mA
50
0
1.90
1.80
1.85
1.80
1.70
1.60
1.75
1.70
Fig 21. Load Response
Fig 20. Load Response
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Datasheet
BUxxTD3WG series
●Reference data BU18TD3WG (Ta=25ºC unless otherwise specified.)
2.0
1.0
0.0
2.0
STBY=0→1.5V
STBY=0→1.5V
1.0
0.0
2.0
1.0
2.0
1.0
0.0
0.0
Fig 23. Start Up Time
Iout=200mA
Fig 22. Start Up Time
Iout=0mA
4.0
2.0
0.0
4.0
2.0
0.0
VIN=STBY=0→2.8V
VIN=STBY=2.8→0V
2.0
1.0
2.0
1.0
0.0
0.0
Fig 25. Start Up Time
(VIN=STBY) Iout=200mA
Fig 24. Start Up Time
(VIN=STBY) Iout=0mA
Iout=0mA
2.0
1.0
0.0
4.8
3.8
2.8
VIN=2.8V→3.8V→2.8V
STBY=1.5→0V
1.81
2.0
1.0
1.80
1.79
1.78
0.0
Fig 26. Discharge Time
Fig 27. VIN Response
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Datasheet
BUxxTD3WG series
z About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
{ Measurement conditions
Standard ROHM Board
Layout of Board for
Measurement
Top Layer (Top View)
IC
Implementation
Position
Bottom Layer (Top View)
Measurement State
Board Material
Board Size
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
70 mm x 70 mm x 1.6 mm
Top layer
Wiring
Metal (GND) wiring rate: Approx. 0%
Bottom
Rate
Metal (GND) wiring rate: Approx. 50%
layer
Through Hole
Diameter 0.5mm x 6 holes
0.54W
Power Dissipation
Thermal Resistance
θja=185.2°C/W
0.6
0.5
0.4
0.3
0.2
0.1
0.54W
Standard ROHM
Board
* Please design the margin so that
PMAX becomes is than Pd (PMAX<Pd)
within the usage temperature range
0
0
25
50
75
100
125
85
Ta [
℃
]
Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference)
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Datasheet
BUxxTD3WG series
●Operation Notes
1.) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in
damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage
issuffered. Ifoperationalvaluesareexpectedtoexceedthemaximumratingsforthedevice, consideraddingprotectivecircuitry
(such as fuses) to eliminate the risk of damaging the IC.
2.) GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Never connect a potential lower than GND to any pin, even if only transiently.
3.) Thermal design
Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating
conditions.
4.) Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or
shorts between pins may result in damage to the IC.
5.) Operation in strong electromagnetic fields
Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong
electromagnetic fields may be present.
6.) Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should
be use to keep ripple to a minimum.
7.) Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting
STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and
low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing
a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may
occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged
before turning the IC on.
8.) Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when
the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output
shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not
be designed under the assumption that this circuitry will engage.
9.) Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the
IC exceeds about 150℃. This feature is intended to protect the IC only in the event of thermal overload and is not designed
to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed
under the assumption that this circuitry will engage.
10.) Input/output capacitor
Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as
close to the IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases
stability in applications with long or winding power supply traces. The output capacitance value is directly related to the
Unstable region
overall stability and transient response of the regulator, and should be set to the largest por the application
toincreasethesecharacteristics.Duringdesign, keepinmindthatingeneral,ceramiccapacitorshaveawiderangeoftolerances,
temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm
these details before choosing appropriate capacitors for your application.(Please refer the technical note, regarding ceramic
capacitor of recommendation)
Cout=0.47μF, Cin=0.47μF, Temp=+25℃
11.) About the equivalent series resistance (ESR) of a ceramic capacitor
100
Capacitors generally have ESR (equivalent series resistance)
and it operates stably in the ESR-IOUT area shown on the right.
10
Since ceramic capacitors, tantalum capacitors, electrolytic
capacitors, etc. generally have different ESR, please check
1
the ESR of the capacitor to be used and use it within the
stability area range shown in the right graph for evaluation
of the actual application.
0.1
0.01
0
50
100
150
200
IOUT [mA]
Fig. 29 Stable region (example)
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Datasheet
BUxxTD3WG series
●Revision History
Date
Revision
001
Changes
7.Feb.2013
30.Jul.2013
New Release
Adding a Revision History.
VSBYH is changed.
002
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