BU30SA5WGWZ [ROHM]
BUxxSA5WGWZ系列是输出为500mA的高性能CMOS稳压器。电路电流 33μA，低功耗且噪音特性、负载响应特性优异，适用于逻辑IC电源、RF电源、相机模块电源等各种应用。;
| 型号： | BU30SA5WGWZ |
| 厂家： | 
ROHM |
| 描述： | BUxxSA5WGWZ系列是输出为500mA的高性能CMOS稳压器。电路电流 33μA，低功耗且噪音特性、负载响应特性优异，适用于逻辑IC电源、RF电源、相机模块电源等各种应用。 稳压器 |
| 文件： | 总19页 (文件大小：943K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
CMOS LDO Regulators for Portable Equipments
1ch 500mA
CMOS LDO Regulators
BUxxSA5WGWZ series
●General Description
●Key Specifications
Input Power Supply Voltage Range:
1.8V to 5.0V
0mA to 500mA
-40℃ to +105℃
3.0V,3.3V
BUxxSA5WGWZ series are high-performance CMOS LDO
regulators with output current ability of up to 500-mA.
These devices have excellent noise and load response
characteristics despite of its low circuit current
consumption of 33µA. They are most appropriate for
various applications such as power supplies for logic IC,
RF, and camera modules.
Output Current Range:
Operating Temperature Range:
Output Voltage Lineup:
Output Voltage Accuracy:
Circuit Current:
±1.0%
33µA(Typ.)
0μA (Typ.)
Standby Current:
●Package
UCSP30L1(BUXXSA5WGWZ)
W(Typ.) x D(Typ.) x H(Max.)
0.8mm x 0.8mm x 0.33mm
●Features
High Output Voltage Accuracy: ±1.0%
High Ripple Rejection: 70 dB (Typ, 1 kHz,)
Compatible with small ceramic capacitor
(Cin=Cout=0.47 µF)
Low Current Consumption: 33µA
Output Voltage ON/OFF control
Built-in Over Current Protection Circuit (OCP)
Built-in Thermal Shutdown Circuit (TSD)
Adopting ultra-small WLCSP UCSP30L1
●Applications
Portable devices
Camera modules
Other electronic devices using microcontrollers or
logic circuits
●Typical Application Circuit
Vin
VOUT
VIN
Vout
Cin
On
Cout
BUxxSA5WGWZ
STBY
Off
GND
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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●Pin Configuration
1Pin Mark
A
1
2
B
Top View
(Mark Side)
B
A
1
2
Bottom View
●Pin Description
Pin No.
Symbol
Function
A1
A2
B1
B2
GND
STBY
VOUT
VIN
GND Pin
Output Control Pin
(High:ON, Low:OFF)
Output Pin
Input Pin
●Block Diagram
VIN
VIN
Cin
B2
VOUT
B1
-
VREF
OCP
TSD
VOUT
Cout
+
A1
A2
GND
VSTBY
STBY
STBY
Cin(min)=0.47µF (Ceramic)
Cout(min)=0.47µF (Ceramic)
Figure 2. Block diagram
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●Absolute Maximum Ratings
Parameter
Symbol
VMAX
Pd
Rating
-0.3 to +5.5
410(*1)
Unit
V
Power Supply Voltage
Power Dissipation
mW
℃
Maximum Junction
Temperature
Tjmax
Topr
+125
Operating Temperature Range
Storage Temperature Range
-40 to +105
-55 to +125
℃
Tstg
℃
(*1) Derate by 4.1mW/℃ when operating above Ta=25℃.(When mounted on a board 63mm×55mm×1.6mm glass-epoxy board, 9 layer)
●Recommended Operating Ratings
Parameter
Symbol
VIN
Limit
Unit
V
Input Power Supply Voltage
Range
1.8 to 5.0
●Recommended Operating Conditions
Rating
Parameter
Symbol
Unit
µF
Conditions
Min.
Typ.
Max.
Input capacitor
Output capacitor
Cin
0.47(*2)
1.0
－
－
A ceramic capacitor is recommended.
A ceramic capacitor is recommended.
Cout 0.47(*2)
1.0
µF
(*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics,
DC device characteristics, and degradation with time.
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●Electrical Characteristics
(Unless otherwise noted, Ta=-25℃, VIN=VOUT+1.0V(*6), VSTBY=1.5V, Cin=1μF, Cout=1μF.)
Limit
TYP.
PARAMETER
Symbol
Unit
Conditions
MIN.
MAX.
VOUT
×0.99
VOUT
×1.01
Output Voltage 1
VOUT1
VOUT
V
IOUT = 10μA, VOUT≧2.5V
VOUT
-25mV
VOUT
+25mV
Output Voltage 2
VOUT2
VOUT
V
IOUT=10μA, VOUT＜2.5V
Circuit Current
Circuit Current (STBY)
Ripple Rejection Ratio
IGND
ICCST
RR
-
-
-
33
-
70
80
1.0
-
μA
μA
dB
IOUT=0mA
STBY=0V
VRR=-20dBv,fRR=1kHz,IOUT=10mA
VIN=0.98×VOUT, IOUT=100mA
Ta=-40 to +85℃(*4), VOUT≧2.5V
Dropout Voltage
VDROP
-
80
150
mV
Line Regulation
VDLI
-
-
2
6
8
mV
mV
IOUT=10μA VIN=VOUT+0.5 to 5.0V(*5)
IOUT=0.01 to 300mA(*6)
IOUT=0.01 to 500mA(*6)
Load Regulation1
VDLO1
45
Load Regulation2
STBY Pin Current
VDLO2
ISTBY
VSTBH
VSTBL
-
-
1.2
-0.2
10
-
-
55
4.0
VIN
0.3
mV
μA
V
ON
OFF
Ta=-40 to +85℃
STBY Control
Voltage
-
V
(*3) VIN=3.5V for VOUT＜2.5V.
(*4) Typical values apply for Ta=25℃.
(*5) VIN=3.0V to 5.0V for VOUT＜2.5V.
(*6) Operating conditions are limited by Pd.
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●Reference data BU33SA5WGWZ (Unless otherwise specified, Ta=25℃.)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
Temp=25°C
VIN=STBY
Temp=25°C
VIN=STBY
IOUT=0uA
IOUT=50mA
IOUT=200mA
IOUT=0uA
IOUT=50mA
IOUT=200mA
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Input Voltage (V)
Figure 3. Output Voltage vs. Input Voltage
Figure 4. Line Regulation
100
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
VIN=STBY
IOUT=0uA
80
VIN=4.3V
STBY=1.5V
Temp=-40°C
Temp=25°C
Temp=85°C
60
Temp=25°C
40
Temp=-40°C
Temp=85°C
20
0
0
50
100
150
200
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Output Current (mA)
Input Voltage (V)
Figure 5. GND Current vs. Input Voltage
Figure 6. Load Regulation
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●Reference data BU33SA5WGWZ (Unless otherwise specified, Ta=25℃.)
120
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Temp=85°C
100
80
60
40
20
0
Temp=25°C
Temp=-40°C
VIN=3.7V
VIN=4.3V
VIN=5.5V
0
50
100
150
200
0
100 200 300 400 500 600 700 800
Output Current (mA)
Output Current (mA)
Figure 8. OCP Threshold
Figure 7. GND Current vs. Output Current
3.40
60
VIN=4.3V
STBY=1.5V
IOUT=0.1mA
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
50
40
30
20
10
0
VIN=4.3V
STBY=1.5V
IOUT=0.1
A
ｍ
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Temperature (°C)
Temperature (°C)
Figure 9. Output Voltage vs. Temperature
Figure 10. GND Current vs. Temperature
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●Reference data BU33SA5WGWZ (Unless otherwise specified, Ta=25℃.)
100
3.5
90
VIN=4.3V
3.0
2.5
2.0
1.5
1.0
0.5
0.0
IOUT=0.1mA
80
70
60
50
40
30
20
10
0
VIN=5.5V
STBY=0V
Temp=-40°C
Temp=25°C
Temp=85°C
-40
-15
10
35
60
85
0
0.25
0.5
0.75
1
1.25
1.5
Temperature (°C)
STBY Voltage (V)
Figure 11. STBY Threshold
Figure 12. GND Current (at STBY) vs. Temperature
1.6
200
180
160
140
120
100
80
VIN=0.98
×VOUT
STBY=1.5V
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Temp=85°C
Temp=25°C
Temp=-40°C
Temp=-40°C
Temp=25°C
Temp=85°C
60
40
20
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
50
100
150
200
STBY Voltage (V)
Output Current (mA)
Figure 13. STBY Pin Current vs. STBY Voltage
Figure 14. Dropout Voltage vs. Output Current
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●Reference data BU33SA5WGWZ (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
Ta = 25
℃
Iout = 10mA
Ta = 25
℃
Iout = 10mA
VIN_AC = -20dBV
3.3
3.8
4.3
4.8
5.3
100
1000
10000
100000
Input Voltage (V)
Frequency (Hz)
Figure 15. Ripple Rejection vs. Input Voltage
Figure 16. Ripple Rejection vs. Frequency
70
60
50
40
30
20
10
1
0.1
Ta = 25
℃
Vin = 4.3V
10
0
0.01
10
100
1000
10000
100000
0
50
100
150
200
Frequency (Hz)
Output Current (mA)
Figure 18. Output Noise Density vs. Frequency
Figure 17. Output Noise vs. Output Current
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●Reference data BU33SA5WGWZ (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
2.0
2.0
1.0
1.0
1V/div
1V/div
STBY=0V→1.5V
STBY=0V→1.5V
0.0
0.0
20us/div
1V/div
20us/div
1V/div
3.0
2.0
1.0
0.0
3.0
2.0
VOUT
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
Cout=0.47uF
Cout=1uF
1.0
0.0
Cout=2.2uF
VIN=4.3V
VIN=4.3V
Figure 19. Startup time ( Rout = none )
Figure 20. Startup time ( Rout = 16.5 ohm )
2.0
2.0
1.0
0.0
1.0
0.0
1V/div
1V/div
STBY=1.5V→0V
STBY=1.5V→0V
VOUT
400ms/div
Cout=0.47uF
VOUT
20us/div
3.0
2.0
3.0
2.0
1.0
0.0
Cout=0.47uF
Cout=1uF
Cout=1uF
Cout=2.2uF
1.0
0.0
Cout=2.2uF
1V/div
1V/div
VIN=4.3V
VIN=4.3V
Figure 21. Discharge time ( Rout = none )
Figure 22. Discharge time ( Rout = 16.5 ohm )
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●Reference data BU33SA5WGWZ (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
200
200
100
0
100
100mA/div
100mA/div
VIN=4.3V
STBY=4.3V
Cout=1uF
0
VIN=4.3V
STBY=4.3V
Cout=1uF
IOUT=150mA→1mA
IOUT=1mA→150mA
2.0us/div
3.35
3.40
2.0us/div
3.30
3.25
3.35
3.30
VOUT 50mV/div
VOUT
50mV/div
3.20
3.25
Figure 23. Load response
( Iout = 1mA → 150mA)
Figure 24. Load response
( Iout = 150mA → 1mA)
VIN=3.8V→4.4V
200mV/div
VIN=4.4V→3.8V
200mV/div
4.4
4.2
4.0
3.8
4.4
STBY=4.4V→3.8V
Io=10mA
Cout=1uF
STBY=3.8V→4.4V
Io=10mA
Cout=1uF
4.2
4.0
3.8
10us/div
10us/div
3.31
3.31
3.30
3.29
3.30
3.29
10mV/div
VOUT 10mV/div
VOUT
Figure 25. Line response
( Vin= 3.8 V → 4.4 V)
Figure 26. Line response
( Vin= 4.4 V → 3.8 V)
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●Input/Output Capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
It is recommended that an input capacitor is placed near pins
between the VCC pin and GND as well as an output capacitor
between the output pin and GND. The input is valid when the
power supply impedance is high or when the PCB trace has
significant length. For the output capacitor, the greater the
capacitance, the more stable the output will be depending on
the load and line voltage variations. However, please check the
actual functionality of this capacitor by mounting it on a board
for the actual application. Ceramic capacitors usually have
different, thermal and equivalent series resistance
characteristics, and may degrade gradually over continued
use.
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
10-V withstand voltage
B characteristics
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
6.3-V withstand voltage
B characteristics
10-V withstand voltage
F characteristics
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
0
0.5
1
1.5
2
2.5
3
3.5
4
For additional details, please check with the manufacturer,
and select the best ceramic capacitor for your application
DC Bias Voltage [V]
Figure 27. Capacity-bias characteristics
Stable region
Cin=Co=0.47uFꢀTa=-40 to 85℃
100
10
●Equivalent Series Resistance (ESR) of a Ceramic Capacitor
Capacitors generally have ESR (equivalent series resistance)
and it operates stably in the ESR-IOUT area shown on the right.
Since ceramic capacitors, tantalum capacitors, electrolytic
capacitors, etc. generally have different ESR, please check the
ESR of the capacitor to be used and use it within the stability
area range shown in the right graph for evaluation of the actual
application.
Unstable region
1
Stable region
0.1
0.01
0
50
100
150
200
IOUT[mA]
Figure 28. Stability area characteristics
(Example)
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●Power Dissipation (Pd)
As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so
please use these for reference. Since power dissipation changes substantially depending on the implementation conditions
(board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd
on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as
causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare
sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOMAX
Where : VIN=Input voltage
VOUT= Output voltage IOMAX: Maximum output current)
○Measurement conditions
Evaluation board
Layout of Board for
Measurement
Top Layer (Top View)
Bottom Layer (Top View)
Measurement State
Board Material
Board Size
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (9 layers)
63 mm x 55 mm x 1.6 mm
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
Diameter 0.5mm x 6 holes
0.41W
Top layer
Wiring
Rate
Bottom layer
Through Hole
Power Dissipation
Thermal
Resistance
θja=243.9°C/W
0.5
0.4
0.3
0.2
0.1
0
0.41W
Standard ROHM
board
* Please design the margin so that
PMAX is less than Pd (PMAX<Pd) within
the usage temperature range
0
25
50
75
100 105 125
Ta (℃)
Figure 29. UCSP30L1(BUXXSA5WGWZ) Power dissipation heat reduction characteristics (Reference)
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●I/O Equivalence Circuits
B1 pin (VOUT)
A1 pin (GND)
A2 pin (STBY)
B2 pin (VIN)
VIN
VOUT
Figure 30. Input / Output equivalent circuit
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●Operational Notes
1) Absolute maximum ratings
This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute
maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open
circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a
fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings.
2) GND Potential
GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a
voltage below the ground pin at any time, even during transient condition.
3) Setting of Heat
Carry out the heat design that have adequate margin considering Pd of actual working states.
4) Pin Short and Mistake Fitting
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC
may be burned up.
5) Actions in Strong Magnetic Field
Using the IC within a strong magnetic field may cause the IC to malfunction.
6) Mutual Impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible.
Use a capacitor to keep ripple to a minimum.
7) STBY Pin Voltage
To enable standby mode for all channels, set the STBY pin to 0.3V or less, and for normal operation, to 1.2V or more.
Setting STBY to a voltage between 0.3 and 1.2V may cause malfunction and should be avoided. Keep transition time
between high and low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit,
causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present,
overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always
be completely discharged before turning the IC on.
8) Over Current Protection Circuit
Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short
circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid
applications to where the over current protection circuit operates continuously.
9) Thermal Shutdown
This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175℃, the output
is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not
recommended that you design application where TSD will work in normal condition.
10) Actions under Strong light
A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes
little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like
sunrays or halogen lamps.
11) Output capacitor
To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 28. It
operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and
characteristic of output load fluctuation is also improved.
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BUxxSA5WGWZ series
●Ordering Information
B
U
x
x
S
A
5
W G W
Z
-
E
2
ROHM
Part No. xx=30:3.0V
xx=33:3.3V
Output voltage
Series name
SA5W:High-speed
SA4W:load response
Package
GWZ: UCSP30L1
GWZ: (BUXXSA5WGWZ)
Packaging and forming
specifications
E2:Embossed tape and reel
UCSP30L1(BUXXSA5WGWZ)
ꢀ
SA4W:Low noise
SA4W:Shutdown SW
●Physical Dimension Tape and Reel Information
UCSP30L1(BUXXSA5WGWZ)
<Tape and Reel information>
1PIN MARK
Tape
Embossed carrier tape
3000pcs
Quantity
0.8±0.05
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
S
0.06
A
S
φ
4
-
φ
0
0.05
.2
0
±
0
A B
.0
5
B
B
A
Direction of feed
1pin
1
0.4 2
0.2±0.05
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
●Marking Diagram
1Pin Mark
Marking
Part No.
BU30SA5WGWZ
BU33SA5WGWZ
Marking
DX
Lot No.
DV
x
x
www.rohm.com
TSZ02201-0RBR0GZ00120-1-2
2013.05.09 Rev.001
© 2012 ROHM Co., Ltd. All rights reserved.
15/16
TSZ22111・15・001
Daattaasshheeeett
BUxxSA5WGWZ series
●Revision History
Date
Revision
001
Changes
09.May.2013
New Release
www.rohm.com
TSZ02201-0RBR0GZ00120-1-2
2013.05.09 Rev.001
© 2012 ROHM Co., Ltd. All rights reserved.
16/16
TSZ22111・15・001
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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