BU33UV7NUX_技术文档

Datasheet

Synchronous Boost DC/DC Converter

(LOAD:500mA@V_OUT=3.3V, V_IN=1.8V)

BU33UV7NUX

General Description

Key Specifications

BU33UV7NUX is a synchronous boost convertor with low

power consumption and provides a power supply for

products powered by either two-cell alkaline/NiCd/NiMH

or one-cell alkaline/Li-ion or Li-polymer battery.

Output currents can go as high as 500mA(V_IN=1.8V).

BU33UV7NUX has reset circuit. (Detection voltage:1.5V,

Release Voltage:1.9V)

■

Input Voltage Range

Fixed Output Voltage

Efficiency

0.6V to 4.5V

3.3V

94%(Max)

Current Consumption

7μA(MODE=Low)

13μA(MODE=High)

0.9V

■

Start-up Voltage

BU33UV7NUX output voltage is fixed 3.3V by internal

resistor divider. V_OUTis connected with V_INwhen V_IN

voltage is higher than 3.3V.

Package

VSON010X3020

W(Typ) x D(Typ) x H(Max)

3.00mm x 2.00mm x 0.60mm

Features

■

Synchronous Boost DC/DC Converter

Iomax 500mA @V_OUT=3.3V, V_IN=1.8V(Ta=25°C)

Disconnect Function during EN-OFF and UVLO

Auto-PFM/PWM (MODE=H(=V_IN)),

■

Fixed PFM (MODE=L(=0V))

■

Reset Function (Detect Voltage = 1.5V)

Pass-Through Function (V_IN> V_OUT

Thermal Shutdown

)

Applications

10-Pin “VSON010X3020” Package

■

Single-Cell or Two-Cell Alkaline

NiCd/NiMH or Single-Cell Li Battery-Powered Products

IC Recorders

Wireless Mouse

Portable Audio Players

Cellular Phones

Personal Medical Products

Remote Controllers

Typical Application Circuit

Typical Performance Characteristics

V_IN

Efficiency(V_IN=2.4V, V_OUT=3.3V)

100

C0:10µF

INTLDO

C2:1µF

VIN

PGND

SW

95

90

85

AGND

FB

L0:4.7µH

MODE=L

MODE=H

80

75

70

65

60

EN

VOUT

MODE

V_OUT

V_IN

C1

RSTB

MODE=H: Auto-PFM/PWM

MODE=L: Fixed PFM

0.1

1

10

100

1000

Output Current:I_OUT[mA]

Figure 1. Application Circuit

Figure 2. Efficiency

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

1/20

TSZ22111 • 14 • 001

BU33UV7NUX

Pin Configuration

(TOP VIEW)

INTLDO 1

AGND 2

FB 3

10 VIN

9 PGND

8 SW

EN 4

7 VOUT

6 MODE

RSTB 5

EXP-PAD

Figure 3. Pin Configuration

Pin Descriptions

Pin No.

Pin Name

Function

1

2

3

INTLDO

AGND

FB

Internal power supply

GND

Output feedback

EN= V_IN: Power-ON

4

5

6

EN

EN=GND: Power-OFF

Low battery detection

MODE = V_IN: Auto-PFM/PWM

MODE =GND: Fixed PFM

Boost voltage output

RSTB

MODE

7

8

VOUT

SW

Inductor connection

9

10

-

PGND

VIN

EXP-PAD

Power GND

Power supply

The EXP-PAD is not connected any other pins inside the package.

(Note) Do not use the EN and MODE pin at open.

Block Diagram

Reset circuit

Detect Voltage：1.5V

Release Voltage：1.9V

+

-

VIN

V_IN

LDO

INTLDO

VOUT

+

-

RSTB

OVP

V_IN

SWP

SWN

CONTROL

LOGIC

LEVEL

SHIFT

V_IN

DRIVER

MODE

SW

ENB

EN

FB

TSD

OSC

+

-

+

-

ENB

AGND

PGND

Figure 4. Circuit Block

2/20

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

TSZ22111 • 15 • 001

BU33UV7NUX

Absolute Maximum Ratings (Ta=25 °C)

Parameter

Maximum Applied Voltage1

Symbol

Vmax1

Ratings

6.5

Unit

V

Maximum Applied Voltage2 [INTLDO] Vmax2

2.5

V

Maximum Junction Temperature

Storage Temperature Range

Tjmax

Tstg

125

-55 to +125

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Caution 2:Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

VSON010X3020

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

274.8

31

39.4

6

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of

the component package.

(Note 3) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4) Using a PCB board based on JESD51-5, 7.

Thermal Via^{(Note 5)}

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

3/20

BU33UV7NUX

Recommended Operating Conditions

Parameter

Power Supply Voltage

Operating Temperature

(Note 1) When it is V_OUT=3.3V

Symbol

V_IN

Topr

Min

0.6^{(Note 1)}

-40

Typ

-

Max

4.5

+85

Unit

V

°C

Electrical Characteristics (Unless otherwise specified V_IN=2.4V, L0=4.7µH, C1=22µF×2, Ta=25°C)

Parameter

Symbol

Min

Typ

2.7

7

Max

8.0

18

Unit

Condition

Circuit Current1

I_CC1

-

µA

EN=0V, V_IN=1.2V

EN=H, MODE=L,

Circuit Current2

Circuit Current3

I_CC2

μA

Device not switching

EN=H, MODE=H,

Device not switching

I_CC3

13

25

μA

Switching Frequency

Output Voltage MODE=H

Output Voltage MODE=L

Maximum Output Current1

Maximum Output Current2

EN Input High

f_SW

V_OUTMH

V_OUTML

I_MAX1

720

3.262

3.1

50

500

0.6

-

800

3.3

-

880

3.343

3.5

-

0.2

-

1.930

-

0.1

-

kHz

V

mA

V

I_OUT=1mA, MODE=H

I_OUT=1mA, MODE=L

MODE=L, V_IN=1.8V

MODE=H, V_IN=1.8V

I_MAX2

V_{IH_EN}

V_{IL_EN}

R_SWN

R_SWP

V_RSTR

V_RSTD

V_RSTHYS

V_OL

EN Input Low

-

V

SWN Switch On Resistance

SWP Switch On Resistance

RST Release Threshold

RST Detect Threshold

RST Hysteresis

RSTB Output Low Voltage

RSTB Output High Voltage

Minimum Start-up Voltage

Minimum Input Voltage after

Start-up

140

330

1.9

1.5

0.4

0

mΩ

V

-

1.868

-

V_IN-0.5

0.875

Isink=20μA, V_IN=0.9V

Isource=1mA

(Note 2)

V_OH

V_MIN

-

0.9

0.925

V_MINAFT

-

0.26

0.6

V

Over Current Protection

OVP Detect Threshold

Discharge Resistance

I_OCP

V_OVPD

R_DIS

1.3

5.5

-

1.55

6

90

1.8

6.5

-

A

V

Ω

V_OUTRising

(Note 2) Resistive load = 3.3kΩ, V_OUT= 3.3V at 1mA.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

4/20

BU33UV7NUX

Typical Performance Curves(Unless otherwise indicated, V_IN=2.4V,V_OUT=3.3V,L0=4.7µH,C1=22μF×2,Ta=25°C)

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

VIN=3.3V

VIN=3.0V

VIN=2.4V

VIN=1.8V

VIN=1.5V

VIN=1.2V

VIN=0.9V

VIN=3.3V

VIN=3.0V

VIN=2.4V

VIN=1.8V

VIN=1.5V

VIN=1.2V

VIN=0.9V

0.01

0.1

1

10

100

1000

0.01

0.1

1

10

100

Output Current:I_OUT[mA]

Figure 5. Efficiency vs Output Current

(MODE=L: Fixed PFM)

Figure 6. Efficiency vs Output Current

(MODE=H: Auto-PFM/PWM)

4.3

4.1

3.9

3.7

3.5

3.3

3.1

2.9

2.7

2.5

2.3

4.3

VIN=0.9V

4.1

3.9

3.7

3.5

3.3

3.1

2.9

2.7

2.5

2.3

VIN=1.8V

VIN=2.4V

VIN=3.3V

VIN=1.8V

VIN=2.4V

VIN=3.3V

0

50

100

150

200

0

100

200

300

400

500

600

Output Current:I_OUT[mA]

Figure 7. Output Voltage vs Output Current

Figure 8. Output Voltage vs Output Current

(“Load Regulation”, MODE=L: Fixed PFM)

(“Load Regulation”, MODE=H: Auto-PFM/PWM)

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

5/20

TSZ22111 • 15 • 001

BU33UV7NUX

Typical Performance Curves - continued

700

600

500

400

300

200

100

0

6

5

4

3

2

MODE=H:Auto-PFM/PWM

MODE=L:Fixed PFM

Ta=-50˚C

1

0

Ta=+25˚C

Ta=+105˚C

0

1

2

3

4

5

0.0

0.5

1.0

1.5

2.0

Power Supply Voltage:V_IN[V]

Figure 9. Output Voltage vs Power Supply Voltage

(“Line Regulation”, MODE=H: Auto-PFM/PWM,

3.3kΩ resistive load)

Figure 10. Maximum Output Current vs Power Supply

Voltage

25

20

15

10

5

2000

1800

1600

1400

1200

1000

800

600

400

200

0

1

2

3

4

5

0

1

2

3

4

5

Power Supply Voltage:V_IN[V]

Figure 11. Circuit Current1 vs Power Supply Voltage

(EN=MODE=L, No load)

Figure 12. Circuit Current2 vs Power Supply Voltage

(MODE=L: Fixed PFM, No load)

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

6/20

TSZ22111 • 15 • 001

BU33UV7NUX

Typical Performance Curves - continued

2000

1800

1600

1400

1200

1000

800

1000

900

800

700

600

Ta=-50˚C

Ta=+25˚C

Ta=+105˚C

600

400

200

0

1

2

3

4

5

0

1

2

3

4

5

Power Supply Voltage:V_IN[V]

Figure 13. Circuit Current3 vs Power Supply Voltage

(MODE=H: Auto-PFM/PWM, No load)

Figure 14. Switching Frequency vs Power Supply Voltage

(MODE=H: Auto-PFM/PWM)

500

400

300

200

100

0

100

MODE=H:Auto-PFM/PWM

90

MODE=L:Fixed PFM

80

70

60

50

40

30

20

10

0

3.0

3.5

4.0

4.5

5.0

0.01

0.1

1

10

100

1000

Power Supply Voltage:V_IN[V]

Output Current:I_OUT[mA]

Figure 15. SWP Switch On Resistance vs Power Supply

Voltage

Figure 16. Ripple Voltage vs Output Current

(V_IN=2.4V)

(MODE=H: Auto-PFM/PWM)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

7/20

BU33UV7NUX

Typical Performance Curves - continued

ch2:VOUT [100mV/div, offset=3.3V]

ch4:I_OUT[50mA/div]

Time[100μs/div]

ch4:I_OUT[50mA/div]

Time[500μs/div]

Figure 17. Transient Response

(V_IN=2.4V, MODE=L: Fixed PFM,

Output current 1mA<->100mA)

Figure 18. Transient Response

(V_IN=2.4V, MODE=L: Fixed PFM,

Output current 1mA<->100mA)

ch2:VOUT [100mV/div, offset=3.3V]

ch4:I_OUT[50mA/div]

Time[100μs/div]

Time[500μs/div]

Figure 19. Transient Response

(V_IN=2.4V, MODE=H: Auto-PFM/PWM,

Output current 1mA<->100mA)

Figure 20. Transient Response

(V_IN=2.4V, MODE=H: Auto-PFM/PWM,

Output current 1mA<->100mA)

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

8/20

TSZ22111 • 15 • 001

BU33UV7NUX

Typical Performance Curves - continued

ch1:EN [1V/div]

ch2:VOUT[2V/div]

ch3:Icoil [500mA/div]

Figure 21. Start-up Waveform

Figure 22. Start-up Waveform

(V_IN=0.9V, 3.3kΩ resistive load, MODE=L: Fixed PFM)

(V_IN=2.4V, 3.3kΩ resistive load, MODE=L: Fixed PFM)

ch1:EN [1V/div]

ch2:VOUT[2V/div]

ch3:Icoil [500mA/div]

Figure 23. Start-up Waveform

Figure 24. Start-up Waveform

(V_IN=0.9V, 3.3kΩ resistive load, MODE=H: Auto-PFM/PWM)

(V_IN=2.4V, 3.3kΩ resistive load, MODE=H: Auto-PFM/PWM)

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

9/20

BU33UV7NUX

Typical Performance Curves - continued

ch1:EN [2V/div]

ch2:VOUT[2V/div]

ch3:Icoil [500mA/div]

Figure 25. Shutdown Waveform

Figure 26. Shutdown Waveform

(V_IN=2.4V, Output current=0mA, MODE=L: Fixed PFM)

(V_IN=2.4V, Output current=0mA, MODE=H: Auto-PFM/PWM)

100

MODE=H:Auto-PFM/PWM

90

MODE=L:Fixed PFM

80

70

60

50

40

30

20

10

0

0.0

1.0

2.0

3.0

4.0

5.0

Power Supply Voltage:V_IN[V]

Figure 27. Load Resistance vs Power Supply Voltage

(“Minimum Load Resistance”, Start-Up)

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

10/20

TSZ22111 • 15 • 001

BU33UV7NUX

Detailed Description

1. Start-up (SOFT START)

After being enabled, BU33UV7NUX starts the Soft Start operation. Firstly, high side switch MOSFET is turned on and

the output voltage V_OUTis lifted to the input voltage V_INlevel, applying restriction to current. (Current Restriction

Operation) For this operation, up to around 1mA resistive load is allowed. Then, the device starts switching operation

and V_OUTis risen up to setting voltage adjusting the output slew rate by DAC for Soft Start. (Soft Start Operation) This

soft start operation is reset by EN, UVLO, TSD and SCP.

Attention is necessary to change input rush current and start-up time by the output capacitor.

EN

V_IN

“FB” Pin = V_OUT

Discharge Tr. is active.

Soft Start Operation

V_OUT

Current restriction control

Figure 28. Start-up (Soft Start) and Shutdown Operation

2. Discharge for Output Pin

The FB pin is shorted to V_OUT; the discharge Tr. in the device is active. The VOUT pin is always discharged when DC/DC

converter is in standby state.

3. Under Voltage Lock Out (UVLO)

UVLO prevents malfunction of the internal circuit at the time of rising or dropping to a lower value of power supply

voltage. If the V_INvoltage becomes lower than 0.26V (Typ), the DC/DC converter is turned off. In order to cancel

UVLO of V_IN, it is necessary to set V_INmore than 0.9V (Typ).

4. Over voltage protection (OVP)

BU33UV7NUX turns off the switching operation when the V_OUTvoltage becomes over OVPD. At that time, the VOUT pin

is not discharge (in the case that the FB pin is shorted to V_OUT). If the V_OUTvoltage becomes less than OVPD, movement

returns it.

5.

6.

Over current protection (OCP)

BU33UV7NUX has the function to limit the switching current.

OCP detector is active during low side MOSFET is in ON state.

When the heavy load is connected such that the peak of switching current Ipeak is above OCP threshold, OCP function

becomes active. ON-time of low side MOSFET is limited so that Ipeak does not exceed OCP threshold, and V_OUTvoltage

decreases.

Short circuit protection (SCP)

BU33UV7NUX has Short Current Protect function.

SCP is detected when the V_OUTvoltage becomes lower than V_IN- 0.750V (Typ). At that moment, the switching operation

is turned off and limited the current.

Then, the device starts the Soft Start operation for reboot without distinction of the value of the load resistance. If the

VOUT pin is shorted to GND or the heavy load exceeding the specification value, the device keeps Current restriction

state.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

11/20

BU33UV7NUX

Detailed Description - continued

The VOUT pin is

shorted to ground.

SCP detect

BU33UV7NUX turns off

switching operation.

V_OUT(3.3V)

The VOUT pin is

released to ground.

V_IN

V_IN- 0.750V

Soft Start Operation

V_OUTdecrease by OCP.

Current restriction control

It is turned switching off and limited the

current.

Figure 29. Output Voltage in SCP Operation

7.

8.

Thermal Shutdown (TSD)

BU33UV7NUX turns off the switching operation when the device temperature exceeds the threshold value for the device

protection. After the device temperature falls below the threshold value, the device starts the Soft Start operation.

Function Select by MODE pin

With the MODE pin, the BU33UV7NUX provides mode selection of PFM control or PFM/PWM automatic switching

control. When load current is large, the product switches automatically to the PWM mode so that high efficiency is

achievable over a wide range of load conditions.

BU33UV7NUX operates under forced PWM mode to lower the output ripple when the Input-Output voltage difference is

small at V_IN=3.2V to 3.4V.

The operation current increases when running at forced PWM mode.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

12/20

BU33UV7NUX

Selection of Components Externally Connected

V_IN

C0:10µF

INTLDO

C2:1µF

VIN

PGND

SW

AGND

FB

L0:4.7µH

EN

VOUT

MODE

V_OUT

V_IN

C1

RSTB

Figure 30. Typical Application Circuit (PFM/PWM mode)

Table 1. Components for Application Characteristic Curves

Height

(Max)

Rated

Voltage

Name

BU33UV7NUX

C0

Type

Value

3.3V

Area

Parts Number

BU33UV7NUX-E2

EMK212ABJ106KD-T

Manufacturer

ROHM

Boost

Converter

3mm×2mm

2mm×1.25mm

0.6mm

7V

TAIYO

YUDEN

muRata

TDK

Capacitor

10μF

22μF

0.85mm

16V

Capacitor

Capacitor 22μF×2

Capacitor

Inductor

2mm×1.25mm

1.6mm×0.8mm

5mm×4mm

1.25mm

0.8mm

1.5mm

25V

16V

-

GRM21BR61E226ME44L

C1608X5R1C105K080AA

VLF504015MT-4R7M

C1^{(Note 1)}

C2

L0

1μF

4.7μH

TDK

(Note 1) The effective load capacitance value considering accuracy, temperature characteristic and DC bias characteristic of output capacitors should not be less

than 22μF. The amount of output capacitance will have a significant effect on the output ripple voltage.

Layout Example

TOP View

Figure 31. Reference Board Layout (TOP Layer)

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

13/20

TSZ22111 • 15 • 001

21.Feb.2019 Rev.003

BU33UV7NUX

Application Information

1.

Inductor Selection

Inductor value of 4.7μH shows good performance over the whole input and output voltage range.

The maximum value of inductor current (Ipeak) can be estimated by using the following Equations.







IL 

Vout







( 1 )







Ipeak Iout





Vin

2













Vin

L

VoutVin

1





 



( 2 )





IL 



 





Vout

f



 





Where:

η is the efficiency.

ΔIL is the ripple Voltage.

f is switching frequency.

Ipeak

I_SW

I_IN

ΔIL

Figure 32. Switching Current

The inductor should be selected as satisfying above Ipeak value.

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

14/20

BU33UV7NUX

I/O Equivalence Circuits

Name

Equivalence circuit

V_IN

Equivalence circuit

R_DIS

EN

MODE

FB

AGND

SW

AGND

V_IN

AGND

RSTB

VOUT

AGND

V_OUT

SW

PGND

AGND

PGND

V_IN

V_OUT

INTLDO

VIN

AGND

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

15/20

TSZ22111 • 15 • 001

BU33UV7NUX

Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7.

8.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

11. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The

operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical

damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an

input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins

when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the

input pins have voltages within the values specified in the electrical characteristics of this IC.

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

16/20

TSZ22111 • 15 • 001

BU33UV7NUX

Operational Notes – continued

12. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all

within the Area of Safe Operation (ASO).

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This

protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should

not be used in applications characterized by continuous operation or transitioning of the protection circuit.

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

17/20

TSZ22111 • 15 • 001

BU33UV7NUX

Ordering Information

B U 3 3 U V 7 N U X -

E 2

Part Number

Package

NUX: VSON010X3020

Packaging and forming specification

E2: Embossed tape and reel

Marking Diagram

VSON010X3020 (TOP VIEW)

Part Number Marking

LOT Number

BU33

UV7

Pin 1 Mark

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

18/20

BU33UV7NUX

Physical Dimension and Packing Information

Package Name

VSON010X3020

www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

19/20

BU33UV7NUX

Revision History

Date

Revision

Changes

18.Nov.2016

001

New Release

P.1 Corrected the description “buck-boost->boost”

P.1 Updated Figure 1

P.6 Updated Figure 12

P.7 Updated Figure 13

P.10 Updated Figure 27

P.13 Updated Figure 30

21.Aug.2018

21.Feb.2019

002

003

P.4 Added Parameter ”Output Voltage MODE=L”

www.rohm.com

TSZ02201-0Q1Q04000300-1-2

21.Feb.2019 Rev.003

20/20

TSZ22111 • 15 • 001

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004


型号：	BU33UV7NUX
厂家：	ROHM
描述：	BU33UV7NUX是消耗电流较低的同步整流升压DCDC转换器，作为升压电源，适用于使用2节碱性、镍镉、镍氢电池或1节锂离子、锂聚合物电池的产品。即使2节干电池的电压降至1.8V，仍可提供最大500mA输出负载。而且，BU33UV7NUX还搭载了复位IC功能（检出：1.5V, 解除：1.9V）。BU33UV7NUX的输出电压固定为3.3V，如果Vin电压超过3.3V的输出电压，则Vin与Vout会在内部连接。电池 CD 转换器
文件：	总23页 (文件大小：2017K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU33UV7NUX [ROHM]

相关型号：

BU3405

BU3406

BU3407

BU3408

BU3409

BU3411

BU3417

BU34204

BU34224

BU3434

BU3437

BU3437K