BU34TD3WG-GTR_技术文档

Datasheet

CMOS LDO Regulator Series for Portable Equipments

Versatile Package

FULL CMOS LDO Regulator

BUxxTD3WG series

●General Description

●Key Specifications

BUxxTD3WG series is high-performance FULL CMOS

regulator with 200-mA output, which is mounted on

versatile package SSOP5 (2.9 mm × 2.8 mm × 1.25 mm).

It has excellent noise characteristics and load

responsiveness characteristics despite its low circuit

current consumption of 35μA. It is most appropriate for

various applications such as power supplies for logic IC,

RF, and camera modules.ROHM’s.

Output voltage:

1.0V to 3.4V

±1.0% (±25mV)

35μA

Accuracy output voltage:

Low current consumption:

Operating temperature range:

-40°C to +85°C

●Applications

Battery-powered portable equipment, etc.

●Package

SSOP5:

2.90mm x 2.80mm x 1.25mm

●Features

High accuracy detection

low current consumption

Compatible with small ceramic capacitor(Cin=Co=0.47uF)

With built-in output discharge circuit

High ripple rejection

ON/OFF control of output voltage

With built-in over current protection circuit

and thermal shutdown circuit

Package SSOP5 is similar to SOT-23-5 (JEDEC)

Low dropout voltage

●Typical Application Circuit

STBY

VIN

STBY

VOUT

VIN

GND

Fig.1 Application Circuit

○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

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Datasheet

BUxxTD3WG series

●Connection Diagram

VOUT

N.C.

SSOP5

Lot. No

Marking

VIN GND STBY

TOP VIEW

●Pin Descriptions

SSOP5

PIN No.

Symbol

VIN

Function

1

2

Power Supply Voltage

Grouding

GND

ON/OFF control of output voltage

(High: ON, Low: OFF)

3

STBY

4

5

N.C.

Unconnected Terminal

Output Voltage

VOUT

●Ordering Information

B

U

x

T

D

3

W

G

-

ｘ

T

R

Part

Number

Output Voltage

10 : 1.0V

Series

with

Package

Halogen Free

G : compatible

Packageing and forming specification

Embossed tape and reel

Maximum Output Current

200mA

output discharge G : SSOP5

Blank : incompatible TR : The pin number 1 is the upper right

34 : 3.4V

SSOP5

°

+

−4

2.9 0.2

5

6

°

4

1

2

3

+0.05

0.13

−0.03

+0.05

−0.04

0.42

0.1

0.95

(Unit : mm)

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Datasheet

BUxxTD3WG series

●Lineup

Marking

F0

L6

F1

M0

L5

F2

F3

F4

F5

Output Voltage

1.0V

1.1V

BU11

1.2V

BU12

1.25V

BU1C

1.3V

BU13

1.5V

BU15

1.8V

BU18

1.85V

BU1J

1.9V

BU19

Part Number

BU10

F6

F7

F8

F9

G0

G1

G2

G3

G4

2.0V

BU20

2.1V

BU21

2.5V

BU25

2.6V

BU26

2.7V

BU27

2.8V

BU28

2.85V

BU2J

2.9V

BU29

3.0V

BU30

G5

G6

G7

G8

3.1V

BU31

3.2V

BU32

3.3V

BU33

3.4V

BU34

●Absolute Maximum Ratings (Ta=25°C)

PARAMETER

Symbol

Limit

Unit

V

VMAX

Pd

Power Supply Voltage

Power Dissipation

-0.3 ～ +6.5

540(*1)

mW

℃

Maximum junction temperature

Operating Temperature Range

Storage Temperature Range

TjMAX

Topr

+125

-40 ～ +85

-55 ～ +125

℃

Tstg

℃

(*1)Pd deleted at 5.4mW/℃at temperatures above Ta=25℃, mounted on 70×70×1.6 mm glass-epoxy PCB.

● RECOMMENDED OPERATING RANGE (not to exceed Pd)

PARAMETER

Symbol

VIN

Limit

Unit

V

Power Supply Voltage

1.7～6.0

Maximum Output Current

IMAX

200

mA

●OPERATING CONDITIONS

PARAMETER

Symbol

Cin

MIN.

TYP.

0.47

MAX.

Unit

μF

CONDITION

Input Capacitor

Output Capacitor

0.22(*2)

-

Ceramic capacitor recommended

Co

μF

(*2)Make sure that the output capacitor value is not kept lower than this specified level across a variety of

temperature, DC bias, changing as time progresses characteristic.

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Datasheet

BUxxTD3WG series

●Electrical Characteristics

(Ta=25℃, VIN=VOUT+1.0V (*3), STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)

Limit

PARAMETER

Symbol

VOUT

Unit

Conditions

MIN.

TYP.

MAX.

Overall Device

VOUT×0.99

VOUT×1.01

VOUT+25mV

60

IOUT=10μA, VOUT≧2.5V

Output Voltage

V

VOUT

VOUT-25mV

IOUT=10μA, VOUT＜2.5V

IOUT=0mA

Operating Current

IIN

-

35

-

μA

Operating Current (STBY)

ISTBY

1.0

STBY=0V

Ripple Rejection Ratio

RR

45

-

70

-

dB

mV

VRR=-20dBv, fRR=1kHz, IOUT=10mA

2.5V≦VOUT≦2.6V (VIN=0.98*VOUT, IOUT=200mA)

2.7V≦VOUT≦2.85V (VIN=0.98*VOUT, IOUT=200mA)

2.9V≦VOUT≦3.1V (VIN=0.98*VOUT, IOUT=200mA)

3.2V≦VOUT≦3.4V (VIN=0.98*VOUT, IOUT=200mA)

280

260

240

220

540

500

460

420

-

Dropout Voltage

VSAT

-

Line Regulation

Load Regulation

VDL

-

2

20

80

mV

VIN=VOUT+1.0V to 5.5V (*4), IOUT=10μA

IOUT=0.01mA to 100mA

VDLO

10

Over Current Protection (OCP)

Limit Current

ILMAX

220

20

400

70

700

150

mA

Vo=VOUT*0.95

Vo=0V

Short Current

ISHORT

Standby Block

Discharge Resistor

STBY Pin Pull-down Current

RDSC

ISTB

20

0.1

50

0.6

-

80

2.0

6.0

0.3

Ω

μA

V

VIN=4.0V, STBY=0V, VOUT=4.0V

STBY=1.5V

ON

STBY Control Voltage

OFF

VSTBH

VSTBL

1.2

-0.3

-

V

This product is not designed for protection against radioactive rays.

(*3) VIN=2.5V for VOUT≦1.5V

(*4) VIN=2.5V to 3.6V for VOUT≦1.5V

●ELECTRICAL CHARACTERISTICS of each Output Voltage

(Ta=25℃, STBY=VIN, Cin=0.47μF, Co=0.47μF, unless otherwise noted.)

Output Voltage

PARAMETER

MIN.

80

TYP.

160

-

MAX.

Unit

mA

Conditions

VIN=1.7V

-

1.0V, 1.1V, 1.2V, 1.25V, 1.3V

200

60

VIN=2.1V

Maximum

120

-

VIN=1.8V

output current

1.5V

200

VIN=2.2V

1.8V, 1.85V, 1.9V, 2.0V, 2.1V

-

VIN=VOUT+0.6V

●Block Diagrams

VIN

1

VREF

VOUT

Co

VOUT

Cin

5

2

3

OCP

GND

TSD

STBY

Discharge

STBY

Cin･･･0.47μF (Ceramic)

Co ･･･0.47μF (Ceramic)

Fig. 2 Block Diagrams

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Datasheet

BUxxTD3WG series

●Reference data BU18TD3WG (Ta=25ºC unless otherwise specified.)

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.85

1.84

1.83

1.82

1.81

1.80

1.79

1.78

1.77

1.76

1.75

100

80

60

40

20

0

Temp=25°C

VIN=STBY

Io=0uA

VIN=STBY

Temp=85°C

Temp=25°C

Io=0uA

Io=100uA

Io=50mA

Io=200mA

Io=0uA

Io=100uA

Io=50mA

Io=200mA

Temp=-40°C

VIN=STBY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

1.7

1.8

1.9

2

2.1

2.2

2.3

2.4

2.5

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

0.2

85

Input Voltage (V)

Fig 5. Circuit Current IGND

Fig 3. Output Voltage

Fig 4. Line Regulation

1.85

1.84

1.83

1.82

1.81

1.6

1.4

1.2

1.0

0.8

0.6

100

80

60

40

20

0

VIN=2.8V

STBY=1.5V

Temp=85°C

Temp=25°C

Temp=85°C

1.80

1.79

1.78

1.77

1.76

1.75

Temp=-40°C

0.4

0.2

0.0

Temp=25°C

Temp=-40°C

Temp=25°C

Temp=-40°C

0.05

0

0.05

0.1

0.15

0.2

1.5

85

0

0.1

0.15

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

5.5

Output Current (A)

Input Voltage (V)

Fig 6. VSTBY - ISTBY

Fig 8. Load Regulation

Fig 7. IOUT - IGND

1.85

1.84

1.83

1.82

1.81

1.80

1.79

1.78

1.77

1.76

1.75

2.0

1.8

1.6

1.4

1.2

2.0

VIN=2.8V

STBY=1.5V

Io=0.1mA

VIN=3.8V

Io=0mA

VIN=2.8V

1.5

1.0

0.5

0.0

VIN=5.5V

VIN=2.3V

1.0

0.8

0.6

0.4

0.2

0.0

Temp=25°C

Temp=85°C

Temp=-40°C

Temp=25°C

STBY=1.5V

0

0.5

1

-40

-15

10

35

60

0.0

0.1

0.2

0.3

0.4

0.5

0.6

Temp (°C)

STBY Voltage (V)

Output Current (mA)

Fig 9. OCP Threshold

Fig 11. VOUT - Temp

Fig 10. STBY Threshold

60

50

40

30

20

10

0

1.0

0.9

0.8

0.7

0.6

VIN=2.8V

STBY=1.5V

Io=0mA

VIN=2.8V

STBY=0V

0.5

0.4

0.3

0.2

0.1

0.0

-40

-15

10

35

60

85

-40

-15

10

35

60

Temp (°C)

Fig 12. IGND - Temp

Fig 13. IGND - Temp (STBY)

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Datasheet

BUxxTD3WG series

●Reference data BU18TD3WG (Ta=25ºC unless otherwise specified.)

100

50

0

50

IOUT=0mA→50mA

IOUT=50mA→0mA

0

1.90

1.85

1.80

1.75

1.70

Fig 14. Load Response

Fig 15. Load Response

100

50

0

100

IOUT=0mA→100mA

50

0

IOUT=100mA→0mA

1.90

1.85

1.80

1.75

1.70

Fig 16. Load Response

Fig 17. Load Response

200

100

0

200

IOUT=0mA→200mA

100

0

IOUT=200mA→0mA

2.00

1.90

1.80

1.70

1.60

Fig 18. Load Response

Fig 19. Load Response

100

50

0

100

IOUT=50mA→100mA

IOUT=100mA→50mA

50

0

1.90

1.80

1.85

1.80

1.70

1.60

1.75

1.70

Fig 21. Load Response

Fig 20. Load Response

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Datasheet

BUxxTD3WG series

●Reference data BU18TD3WG (Ta=25ºC unless otherwise specified.)

2.0

1.0

0.0

2.0

STBY=0→1.5V

1.0

0.0

2.0

1.0

2.0

1.0

0.0

Fig 23. Start Up Time

Iout=200mA

Fig 22. Start Up Time

Iout=0mA

4.0

2.0

0.0

4.0

2.0

0.0

VIN=STBY=0→2.8V

VIN=STBY=2.8→0V

2.0

1.0

2.0

1.0

0.0

Fig 25. Start Up Time

(VIN=STBY) Iout=200mA

Fig 24. Start Up Time

(VIN=STBY) Iout=0mA

Iout=0mA

2.0

1.0

0.0

4.8

3.8

2.8

VIN=2.8V→3.8V→2.8V

STBY=1.5→0V

1.81

2.0

1.0

1.80

1.79

1.78

0.0

Fig 26. Discharge Time

Fig 27. VIN Response

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Datasheet

BUxxTD3WG series

z About power dissipation (Pd)

As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of

IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the

implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is

recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the

original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.

Therefore, be sure to prepare sufficient margin within power dissipation for usage.

Calculation of the maximum internal power consumption of IC (PMAX)

PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)

{ Measurement conditions

Standard ROHM Board

Layout of Board for

Measurement

Top Layer (Top View)

IC

Implementation

Position

Bottom Layer (Top View)

Measurement State

Board Material

Board Size

With board implemented (Wind speed 0 m/s)

Glass epoxy resin (Double-side board)

70 mm x 70 mm x 1.6 mm

Top layer

Wiring

Metal (GND) wiring rate: Approx. 0%

Bottom

Rate

Metal (GND) wiring rate: Approx. 50%

layer

Through Hole

Diameter 0.5mm x 6 holes

0.54W

Power Dissipation

Thermal Resistance

θja=185.2°C/W

0.6

0.5

0.4

0.3

0.2

0.1

0.54W

Standard ROHM

Board

* Please design the margin so that

PMAX becomes is than Pd (PMAX<Pd)

within the usage temperature range

0

25

50

75

100

125

85

Ta [

℃

]

Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference)

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Datasheet

BUxxTD3WG series

●Operation Notes

1.) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in

damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage

issuffered. Ifoperationalvaluesareexpectedtoexceedthemaximumratingsforthedevice, consideraddingprotectivecircuitry

(such as fuses) to eliminate the risk of damaging the IC.

2.) GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions.

Never connect a potential lower than GND to any pin, even if only transiently.

3.) Thermal design

Use a thermal design that allows for a sufficient margin for that package power dissipation rating (Pd) under actual operating

conditions.

4.) Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting or

shorts between pins may result in damage to the IC.

5.) Operation in strong electromagnetic fields

Strong electromagnetic fields may cause the IC to malfunction. Caution should be exercised in applications where strong

electromagnetic fields may be present.

6.) Common impedance

Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should

be use to keep ripple to a minimum.

7.) Voltage of STBY pin

To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting

STBY to a voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and

low (or vice versa) to a minimum.

Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing

a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may

occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged

before turning the IC on.

8.) Over-current protection circuit (OCP)

This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when

the output is shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output

shorts) and is not designed to be used as an active security device for the application. Therefore, applications should not

be designed under the assumption that this circuitry will engage.

9.) Thermal shutdown circuit (TSD)

This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the

IC exceeds about 150℃. This feature is intended to protect the IC only in the event of thermal overload and is not designed

to guarantee operation or act as an active security device for the application. Therefore, applications should not be designed

under the assumption that this circuitry will engage.

10.) Input/output capacitor

Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as

close to the IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases

stability in applications with long or winding power supply traces. The output capacitance value is directly related to the

Unstable region

overall stability and transient response of the regulator, and should be set to the largest possible value for the application

toincreasethesecharacteristics.Duringdesign, keepinmindthatingeneral,ceramiccapacitorshaveawiderangeoftolerances,

temperature coefficients and DC bias characteristics, and that their capacitance values tend to decrease over time. Confirm

these details before choosing appropriate capacitors for your application.(Please refer the technical note, regarding ceramic

capacitor of recommendation)

Cout=0.47μF, Cin=0.47μF, Temp=+25℃

11.) About the equivalent series resistance (ESR) of a ceramic capacitor

100

Capacitors generally have ESR (equivalent series resistance)

and it operates stably in the ESR-IOUT area shown on the right.

10

Since ceramic capacitors, tantalum capacitors, electrolytic

capacitors, etc. generally have different ESR, please check

1

the ESR of the capacitor to be used and use it within the

stability area range shown in the right graph for evaluation

of the actual application.

0.1

0.01

0

50

100

150

200

IOUT [mA]

Fig. 29 Stable region (example)

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Datasheet

BUxxTD3WG series

●Revision History

Date

Revision

001

Changes

7.Feb.2013

30.Jul.2013

New Release

Adding a Revision History.

VSBYH is changed.

002

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型号：	BU34TD3WG-GTR
厂家：	ROHM
描述：	Versatile Package FULL CMOS LDO Regulator 多功能包全CMOS LDO稳压器稳压器
文件：	总10页 (文件大小：483K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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