BU4311FVE-TR_技术文档

Datasheet

Voltage Detector IC Series

Low Voltage Free Delay Time Setting

CMOS Voltage Detector IC Series

BU42xx series BU43xx series

●General Description

●Key Specifications

Detection voltage:

ROHM’s BU42xx and BU43xx series are CMOS Voltage

Detector ICs with adjustable output delay. It is a

high-accuracy, low current consumption Voltage Detector

IC series with a built-in delay circuit. The lineup was

established with two output types (Nch open drain and

CMOS output) and detection voltages range from 0.9V to

4.8V in increments of 0.1V, so that the series may be

selected according to application.

0.9V to 4.8V (Typ.)

0.1V steps

High accuracy detection voltage:

Ultra-low current consumption:

Operating temperature range:

●Package

±1.0%

0.55µA (Typ.)

-40°C to +125°C

SSOP5:

2.90mm x 2.80mm x 1.25mm

2.00mm x 2.10mm x 0.95mm

1.60mm x 1.60mm x 0.60mm

●Features

Delay Time Controlled by external Capacitor

Two output types (Nch open drain and CMOS output)

Ultra-low current consumption

SOP4:

VSOF5:

Wide operating temperature range

Very small and low height package

Package SSOP5 and SOP4 is similar to SOT-23-5

and SC-82 respectively (JEDEC)

●Applications

Circuits using microcontrollers or logic circuits that require

a reset.

●Typical Application Circuit

VDD1

VDD2

RL

Micro

controller

RST

BU43xx

Micro

controller

RST

BU42xx

CIN

CT

CIN

CL

(Capacitor for

noise filtering)

(Capacitor for

noise filtering)

GND

Open Drain Output type

BU42xx series

CMOS Output type

BU43xx series

●Connection Diagram & Pin Descriptions

SSOP5

TOP VIEW

SOP4

TOP VIEW

VSOF5

TOP VIEW

VOUT

4

CT

3

N.C.

CT

GND VDD

4

5

Lot. No

Marking

2 3

1

Lot. No

Marking

VOUT VDD GND

Symbol Function

VOUT Reset output

VOUT SUB CT

1

2

GND

VDD

No.

Symbol

Function

Symbol

VOUT Reset output

SUB Substrate*

Capacitor connection

Function

1

2

1

2

GND GND

1

2

VDD Power supply voltage

VDD

Power supply voltage

Capacitor connection

terminal for output

delay time

3

4

5

GND GND

3

4

CT

3

4

5

CT

terminal for output

delay time

N.C. Unconnected terminal

Capacitor connection

VOUT Reset output

VDD Power supply voltage

CT

GND GND

terminal for output

delay time

*Connect the substrate to VDD

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

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●Ordering Information

B U x x x x

x - T R

Part

Number

Output Type

42 : Open Drain

43 : CMOS

Reset Voltage Value Package

Packaging and

09 : 0.9V

G

: SSOP5

forming specification

TR : Embossed tape

and reel

0.1V step F : SOP4

FVE : VSOF5

48 : 4.8V

SSOP5

°

+

−4

2.9 0.2

6

°

4

Tape

Embossed carrier tape

3000pcs

5

4

Quantity

TR

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1

2

3

1pin

+0.05

0.13

−0.03

+0.05

−0.04

0.42

0.1

0.95

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

Reel

(Unit : mm)

∗

SOP4

VSOF5

1.6 0.05

1.0 0.05

2.0 0.2

°

+6

–4

1.3

3

°

4

5

4

1

2

0.05

+0.05

–0.03

0.13

1

2

3

S

0.13 0.05

+0.05

–0.04

0.42

0.1

S

+0.05

–0.04

0.32

0.22 0.05

0.5

(Unit : mm)

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●Lineup

Output Type

Open Drain

Part Number

CMOS

Part Number

Detection Voltage

4.8V

4.7V

4.6V

4.5V

4.4V

4.3V

4.2V

4.1V

4.0V

3.9V

3.8V

3.7V

3.6V

3.5V

3.4V

3.3V

3.2V

3.1V

3.0V

2.9V

2.8V

2.7V

2.6V

2.5V

2.4V

2.3V

2.2V

2.1V

2.0V

1.9V

1.8V

1.7V

1.6V

1.5V

1.4V

1.3V

1.2V

1.1V

1.0V

0.9V

Marking

ZR

ZQ

ZP

ZN

ZM

ZL

Marking

1H

1G

1F

BU4248

BU4247

BU4246

BU4245

BU4244

BU4243

BU4242

BU4241

BU4240

BU4239

BU4238

BU4237

BU4236

BU4235

BU4234

BU4233

BU4232

BU4231

BU4230

BU4229

BU4228

BU4227

BU4226

BU4225

BU4224

BU4223

BU4222

BU4221

BU4220

BU4219

BU4218

BU4217

BU4216

BU4215

BU4214

BU4213

BU4212

BU4211

BU4210

BU4209

BU4348

BU4347

BU4346

BU4345

BU4344

BU4343

BU4342

BU4341

BU4340

BU4339

BU4338

BU4337

BU4336

BU4335

BU4334

BU4333

BU4332

BU4331

BU4330

BU4329

BU4328

BU4327

BU4326

BU4325

BU4324

BU4323

BU4322

BU4321

BU4320

BU4319

BU4318

BU4317

BU4316

BU4315

BU4314

BU4313

BU4312

BU4311

BU4310

BU4309

1E

1D

1C

1B

1A

0Z

ZK

ZJ

ZH

ZG

ZF

0Y

0X

0W

0V

0U

0T

ZE

ZD

ZC

ZB

ZA

YZ

YY

YX

YW

YV

YU

YT

YS

YR

YQ

YP

YN

YM

YL

0S

0R

0Q

0P

0N

0M

0L

0K

0J

0H

0G

0F

0E

0D

0C

0B

0A

ZZ

ZY

ZX

ZW

ZV

ZU

ZT

ZS

YK

YJ

YH

YG

YF

YE

YD

YC

YB

YA

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●Absolute Maximum Ratings

Parameter

Symbol

VDD

Limit

Unit

Power Supply Voltage

-0.3 to +7

V

Nch Open Drain Output

GND-0.3 to +7

Output Voltage

Output Current

VOUT

Io

V

CMOS Output

GND-0.3 to VDD+0.3

70

mA

*1*4

*2*4

*3*4

SSOP5(SOT-23-5)

SOP4(SC-82)

VSOF5

540

400

210

Power

Dissipation

Pd

mW

Operation Temperature Range

Ambient Storage Temperature

Topt

Tstg

-40 to +125

-55 to +125

°C

*1 Reduced by 5.4mW/°C when used over 25°C.

*2 Reduced by 4.0mW/°C when used over 25°C.

*3 Reduced by 2.1mW/°C when used over 25°C.

*4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C)

Limit

Typ.

Parameter

Symbol

Condition

Unit

Min.

Max.

V_DET(T)

×0.99

V_DET(T)

×1.01

VDD=HÆL, Ta=25°C, RL=470kΩ

V_DET(T)

1.782

1.741

1.731

2.475

2.418

2.404

2.970

2.901

2.885

3.267

3.191

3.173

4.158

4.061

1.8

1.818

1.860

1.870

2.525

2.584

2.597

3.030

3.100

3.117

3.333

3.410

3.428

4.242

4.341

Ta=+25°C

Ta=-40°C to 85°C

-

VDET=1.8V

VDET=2.5V

VDET=3.0V

VDET=3.3V

VDET=4.2V

Ta=85°C to 125°C

-

Ta=+25°C

Ta=-40°C to 85°C

Ta=85°C to 125°C

2.5

-

3.0

-

Detection Voltage

V_DET

V

Ta=+25°C

Ta=-40°C to 85°C

Ta=85°C to 125°C

-

Ta=+25°C

Ta=-40°C to 85°C

Ta=85°C to 125°C

3.3

-

Ta=+25°C

Ta=-40°C to 85°C

4.2

-

Ta=85°C to 125°C

V_DET=0.9 to 1.3V

V_DET=1.4 TO 2.1V

V_DET=2.2 TO 2.7V

V_DET=2.8 to 3.3V

V_DET=3.4 to 4.2V

V_DET=4.3 to 4.8V

V_DET=0.9 TO 1.3V

V_DET=1.4 TO 2.1V

V_DET=2.2 to 2.7V

V_DET=2.8 to 3.3V

V_DET=3.4 to 4.2V

V_DET=4.3 to 4.8V

4.039

-

4.364

0.88

1.05

1.23

1.40

1.58

1.75

1.40

1.58

1.75

1.93

2.10

2.28

-

0.15

0.20

0.25

0.30

0.35

0.40

0.30

0.35

0.40

0.45

0.50

0.55

-

Circuit Current when ON

Circuit Current when OFF

I_DD

1

VDD=VDET-0.2V

VDD=VDET+2.0V

µA

I_DD2

µA

V

VOL≤0.4V, Ta=25 to 125°C, RL=470kΩ

VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ

VDD=4.8V, ISOURCE=1.7 mA,VDET=0.9V to 3.9V

VDD=6.0V, ISOURCE=2.0 mA,VDET=4.0V to 4.8V

VDD=0.85V, ISINK = 20 µA

0.70

Operating Voltage Range

‘High’ Output Voltage (Pch)

V_OPL

VOH

0.90

-

VDD-0.5

V

VDD-0.5

-

0.05

0.5

‘Low’ Output Voltage (Nch)

V_OL

VDD=1.5V, ISINK = 1 mA, VDET=1.7 to 4.8V

V

VDD=2.4V, ISINK = 3.6 mA, VDET=2.7 to 4.8V

*1: Design Guarantee. (Outgoing inspection is not done on all products.)

V_DET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

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●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C) - continued

Limit

Typ.

0

Parameter

Symbol

I_leak

Condition

Unit

Min.

Max.

VDD=VDS=7V Ta=-40 to 85°C

VDD=VDS=7V Ta=85 to 125°C

-

0.1

µA

1

Leak Current when OFF

0

VDD=VDET×1.1, VDET=0.9 to 2.5V Ta=25°C

RL=470kΩ

V_DD

×0.35

V_DD

×0.40

9

5

V_DD

×0.45

V_DD

×0.50

10

40

V_DD

×0.55

V_DD

×0.60

11

-

CT pin Threshold Voltage

V_CTH

V

VDD=VDET×1.1, VDET=2.6 to 4.8V Ta=25°C

RL=470kΩ

*1

Output Delay Resistance

CT pin Output Current

R_CT

I_CT

VDD=VDET×1.1 VCT=0.5V Ta=25°C

MΩ

VCT=0.1V VDD=0.85V

µA

VCT=0.5V VDD=1.5V VDET=1.7 to 4.8V

200

400

-

Detection Voltage

Temperature coefficient

V_DET/∆T Ta=-40°C to 125°C

-

±30

-

ppm/°C

V

V_DET

×0.03

V_DET

×0.05

V_DET

×0.08

VDET≤1.0V

VDET≥1.1V

VDD=LÆHÆL

∆VDET Ta=-40 to 125°C

RL=470kΩ

Hysteresis Voltage

V_DET

×0.03

V_DET

×0.05

V_DET

×0.07

*1: Design Guarantee. (Outgoing inspection is not done on all products.)

V_DET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)

R_L: Pull-up resistor to be connected between VOUT and power supply.

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●Block Diagrams

DD

V

VOUT

Vref

GND

Fig.1 BU42xx Series

CT

DD

V

VOUT

Vref

GND

CT

Fig.2 BU43xx Series

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●Typical Performance Curves

0.6

5

4

3

2

1

0

【BU4216】

【BBUU44221166】F

【】

【BU4316】

0.5

0.4

0.3

0.2

0.1

0.0

【BU4316】

V_DD=1.2V

0.0

0.5

1.0

1.5

2.0

2.5

0

1

2

3

4

5

6

7

DRAIN-SOURCE VOLTAGE V_DS[V]

：

V_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.4 “LOW” Output Current

Fig.3 Circuit Current

25

20

15

10

5

7

【BU4318】

BU4216F

【

BU4318G

【

】

【BU4216】

6

5

4

3

2

1

0

【BU4316】

V_DD=6.0V

V_DD=4.8V

0

1

2

3

4

5

6

0

1

2

3

4

5

6

7

DRAIN-SOURCE VOLTAGE V_DS[V]

：

V

_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.5 “High” Output Current

Fig.6 I/O Characteristics

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●Typical Performance Curves – continued

1.0

700

600

500

400

300

200

100

0

BU4216F

【BU4216】

【

】

BU4216F

【

】

【BU4316】

0.8

0.6

0.4

0.2

0.0

0.5

1.0

1.5

2.0

2.5

0

0.5

1

1.5

2

2.5

V

_DDSUPPLY VOLTAGE V_DD[V]

V_DDSUPPLY VOLTAGE V_DD[V]

：

Fig.7 Operating Limit Voltage

Fig.8 CT Terminal Current

0.5

2.0

1.5

1.0

【BU4216】

BU4216F

【

】

【BU4316】

Low to high(V_DET+ΔV_DET

)

0.4

0.3

0.2

0.1

0.0

High to low(V_DET

)

【BU4216】

【BU4316】

BU4216F

【

】

-40

0

40

80

120

-40

0

40

80

120

TEMPERATURE Ta[

]

℃

：

TEMPERATURE Ta[

]

℃

：

Fig.9 Detecting Voltage

Release Voltage

Fig.10 Circuit Current when ON

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●Typical Performance Curves – continued

1.0

0.5

0.0

【BU4216】

BU4216F

【BU4216】

BU4216F

【BU4316】

【

】

【

】

【BU4316】

0.8

0.6

0.4

0.2

0.0

-40

0

40

80

120

-40

0

40

TEMPERATURE Ta[ ]

℃

80

120

TEMPERATURE Ta[

]

℃

：

Fig.11 Circuit Current when OFF

Fig.12 Operating Limit Voltage

18

16

14

12

10

8

10000

1000

100

10

BU4216F

【

】

【BU4216】

BU4216F

【

】

【BU4316】

1

6

0.1

4

0.01

2

0.001

0

-40

0

40

80

120

0.0001

0.001

0.01

0.1

CAPACITANCE OF CT C^CT[μF]

：

TEMPERATURE Ta[

]

：

℃

Fig.13 C_TTerminal Circuit Resistance

Fig.14 Delay Time (t_PLH) and C_TTerminal External Capacitance

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●Application Information

Explanation of Operation

For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as

threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VouT terminal

voltage switches from either “High” to “Low” or from “Low” to “High”. BU42xx and BU43xx series have delay time function

which set tPLH (Output “Low”Æ”High”) using an external capacitor (CCT). Because the BU42xx series uses an open drain

output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High”

voltage (VOUT) in this case becomes VDD or the voltage of the other power supply].

VDD

Q2

Q1

R1

R2

R1

R2

VDD

Vref

RESET

Vref

RESET

VOUT

Q1

Q3

R3

GND

CT

Fig.15 (BU42xx series Internal Block Diagram)

Fig.16 (BU43xx type Internal Block Diagram)

Setting of Detector Delay Time

The delay time of this detector IC can be set at the rise of VDD by the capacitor connected to C_Tterminal.

Delay time at the rise of VDD t_PLH:Time until when VouT rises to 1/2 of VDD after VDD rises up and beyond the release

voltage(V_DET+∆V_DET

)

V_DD-V_CTH

V_DD

T

_PLH=-1×C_CT×R_CT×ln

C_CT

R_CT

:

C_Tpin Externally Attached Capacitance

C_Tpin Internal Impedance(P.3 R_CTrefer.)

V_CTH

ln:

:

C_Tpin Threshold Voltage(P.3 VCTH refer.)

Natural Logarithm

Reference Data of Falling Time (t_PHL) Output

Examples of Falling Time (t_PHL) Output

Part Number

BU4245

BU4345

t

_PHL[µs]

275.7

359.3

* This data is for reference only.

The figures will vary with the application, so please confirm the actual operating conditions before use.

Timing Waveforms

Example: The following shows the relationship between the input voltage VDD, the C_TTerminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are shown in

Fig.15 and 16).

① When the power supply is turned on, the output is unstable from

after over the operating limit voltage (VOPL) until tPHL. Therefore, it is

VDET+ΔVDET

possible that the reset signal is not outputted when the rise time of

VDD is faster than tPHL.

⑤

VDET

VDD

VCT

VOPL

0V

② When VDD is greater than VOPL but less than the reset release

voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)

voltages will switch to L.

③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT

switches from L to H (with a delay to the CT terminal).

④ If VDD drops below the detection voltage (VDET) when the power

supply is powered down or when there is a power supply fluctuation,

VOUT switches to L (with a delay of tPHL).

⑤ The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (VDET). The system

is designed such that the output does not toggle with power supply

fluctuations within this hysteresis width, preventing malfunctions due

to noise.

1/2 VDD

tPLH

tPHL

tPLH

tPHL

VOUT

①

②

③

④

Fig.17 Timing Waveforms

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●Circuit Applications

1) Examples of common power supply detection reset circuits

Application examples of BU42xx series

VDD1

VDD2

(Open Drain output type) and BU43xx series

(CMOS output type) are shown below.

RL

CASE1: Power supply of microcontroller (VDD2) differs

Micro

controller

RST

BU42xx

from the power supply of the reset detection (V_DD).

1

CT

Use an open drain output Type (BU42xx series) device

with a load resistance R_Las shown Fig.18.

CIN

CL

(Capacitor for

noise filtering)

CASE2: Power supply of microcontroller (V_DD) is the

1

GND

same as the power supply of the reset detection (V_DD).

1

Fig.18 Open Drain Output type

Use a CMOS output type (BU43xx series) device or an

open drain output type (BU42xx series) device with a pull

up resistor between the output and VDD1.

VDD1

Micro

controller

When a capacitance C_Lfor noise filtering is connected to

VouT pin (the reset signal input terminal of the

BU43xx

RST

microcontroller), please take into account the waveform

of the rise and fall time of the output voltage (VouT).

CIN

CT

CL

(Capacitor for

noise filtering)

GND

Fig.19 CMOS Output type

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

VDD1

VDD2

VDD3

RL

BU42xx

NO.1

BU42xx

NO.2

RST

microcontroller

CT

GND

Fig.20

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BU42xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller

(V_DD3) as shown in Fig. 20. By pulling-up to V_DD3, output “High” voltage of micro-controller power supply is possible.

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3) Examples of the power supply with resistor dividers

In applications wherein the power supply input terminal (VDD) of an IC has resistor dividers, it is possible that an in-rush

current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output

oscillations).

(In-rush current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level

switches from “High” to “Low” or vice versa.)

V1

IDD

R2

I1

Through

Current

VDD

BU42xx

BU43xx

R1

VOUT

CIN

CL

GND

VDD

VDET

0

Fig.21

A voltage drop [in-rush current (I1)] × [input resistor (R2)] is caused by the in-rush current, and causes the input voltage

to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection

voltage, the output voltage switches from “High” to “Low”. At this time, the in-rush current stops flowing through output

“Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which again causes the

in-rush current to flow and the voltage to drop. This operation repeats and will result to oscillation.

Consider the use of BD52xx when the power supply input has resistor dividers.

VDD - IDD Peak Current Ta=25°C

BU49xx,BU43xx

Temp - IDD(BU42xx)

VDD3V

VDD6V

VDD7V

VDD4V

10

1

2.5

2.0

1.5

1.0

0.5

0.0

BU48xx,BU42xx

BD52xx

BD53xx

0.1

0.01

0.001

3

4

5

6

7

8

9

10

-50 -30 -10 10 30 50 70 90 110 130

Temp

VDD[V]

Fig.22 Current Consumption vs. Power Supply Voltage

* This data is for reference only.

The figures will vary with the application, so please confirm the actual operating conditions before use.

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●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.

Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The V_DDline impedance might cause oscillation because of the detection current.

8) A V_DDto GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

10) External parameters

The case of needless “Delay Time”, recommended to insert more 470kΩ resister between VDD and CT. The

recommended value of R_LResistor is over 50kΩ to 1Mꢀ for V_DET=1.5V to 4.8V, and over 100kꢀ to 1Mꢀ for V_DET=0.9V

to 1.4V. The recommended value of C_TCapacitor is over 100pF to 0.1µF. There are many factors (board layout, etc)

that can affect characteristics. Please verify and confirm using practical applications.

11) Power on reset operation

Please note that the power on reset output varies with the V_DDrise time. Please verify the behavior in the actual

operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to

the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special

consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) C_Tpin discharge

Due to the capabilities of the C_Tpin discharge transistor, the C_Tpin may not completely discharge when a short input

pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.

15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully. If 10Mꢀ leakage is

assumed between the C_Tterminal and the GND terminal, 1Mꢀ connection between the CT terminal and the V_DD

terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the

pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external

resistor that is connected to C_Tterminal, so please consider the delay time that is decided by t × R_CT× C_CTchanges.

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Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

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a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

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extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

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[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

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●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

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●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - Rev.004


型号：	BU4311FVE-TR
厂家：	ROHM
描述：	Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series 光电二极管
文件：	总16页 (文件大小：502K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU4311FVE-TR [ROHM]

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