BU45K262G [ROHM]

罗姆的BU45xxxxx、BU46xxxxx系列，是采用了CMOS工艺的高精度、低消耗电流的RESET IC系列。通过内置计数器定时器延迟电路，无需外接延迟时间设定用电容器。为保证客户可根据应用进行选择，备有Nch漏极开路输出BU45xxxxx和CMOS输出BU46xxxxx两个系列的产品。检测电压可在2.3V～4.8V之间按0.1V阶跃选择，固定延迟时间可按200ms、400ms进行选择。;


型号：	BU45K262G
厂家：	ROHM
描述：	罗姆的BU45xxxxx、BU46xxxxx系列，是采用了CMOS工艺的高精度、低消耗电流的RESET IC系列。通过内置计数器定时器延迟电路，无需外接延迟时间设定用电容器。为保证客户可根据应用进行选择，备有Nch漏极开路输出BU45xxxxx和CMOS输出BU46xxxxx两个系列的产品。检测电压可在2.3V～4.8V之间按0.1V阶跃选择，固定延迟时间可按200ms、400ms进行选择。电容器计数器
文件：	总17页 (文件大小：1015K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Voltage Detector IC Series

Counter Timer Built-in

CMOS Voltage Detector IC

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

Key Specifications

◼ Detection voltage:

●General Description

2.3V, 2.4V, 2.6V, 2.9V, 3.0V,

3.3V, 3.6V, 4.0V, 4.2V (Typ.)

ROHM’s BU45xxxxx and BU46xxxxx series are highly

accurate, low current consumption voltage detector IC

series. Because the counter timer delay circuit is built-in,

an external capacitor for the delay time setting is

unnecessary. Two output types are available (Nch open

drain and CMOS output) and detection voltages are

2.3V, 2.4V, 2.6V, 2.9V, 3.0V, 3.3V, 3.6V, 4.0V, 4.2V with

fixed delay time of 200ms and 400ms, that may be

selected according to application.

◼ High accuracy detection voltage:

◼ Low current consumption:

±1.0%

2.3µA (Typ.)

-40°C to +105°C

200ms

◼ Operating temperature range:

◼ Two internal, fixed delay time:

400ms

●Package

●Features

SSOP3

2.92mm x 2.80mm x 1.25mm

◼ Counter Timer Built-in

◼ No delay time setting capacitor required

◼ Low current consumption

●Applications

◼ Two output types (Nch open drain and CMOS output)

◼ Package SSOP3 is similar to SOT-23-3 (JEDEC)

Circuits using microcontrollers or logic circuits that require

a reset

●Typical Application Circuit

DD1

DD2

DD1

Micro

controller

Micro

controller

BD46 xxxxx

BU45 xxxxx

Noise-filtering

（

Noise-filtering

（

Capacitor

）

Capacitor

）

GND

（Open Drain Output Type）

（CMOS Output Type）

BU45xxxxx series

BU46xxxxx series

●Connection Diagram

●Pin Descriptions

BU45KxxxG / BU46KxxxG

SSOP3

PIN No.

Symbol

Function

GND

VDD

GND

VOUT

VDD

GND

Reset Output

Power Supply Voltage

TOP VIEW

BU45LxxxG

PIN No.

Symbol

VOUT

VDD

Function

Reset Output

Power Supply Voltage

GND

VOUT

VDD

GND

VOUT

BU45KxxxG

BU46KxxxG

BU45LxxxG

GND

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays.

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Ordering Information

x - T

Part

Number

Output Type

45 : Open Drain

46 : CMOS

Package 1

Reset Voltage Value Counter Timer

23 : 2.3V Delay Time Settings

0.1V step 2 : 200ms

4 : 400ms

Package 2

Packaging and

forming specification

TL : Embossed tape

and reel

23 : 2.3V

42 : 4.2V

48 : 4.8V

Package 1 Package 2 Package name

SSOP3 (1pin GND)

SSOP3 (3pin GND)

●Lineup

Table 1. Open Drain Output Type

Counter Timer Delay Time Settings

1-Pin GND

3-Pin GND

200ms

400ms

200ms

400ms

Detection

Voltage

Part

Number

Part

Number

Part

Number

Part

Number

Marking

BU45K422

BU45K362

BU45K332

4.2V

3.6V

3.3V

3.0V

2.9V

2.6V

2.4V

2.3V

BU45K304

BU45K292

BU45K262

BU45K242

BU45K294

BU45L232

BU45L234

Table 2. CMOS Output Type

Counter Timer Delay Time Settings

1-Pin GND

200ms

Detection

Voltage

Marking

Part Number

BU46K402

BU46K292

4.0V

2.9V

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

⚫ Absolute maximum ratings (Ta=25°C)

Parameter

Symbol

Limit

-0.3 to +6.0

GND-0.3 to +6.0

GND-0.3 to VDD+0.3

Unit

Power Supply Voltage

VDD-GND

Nch Open Drain Output

CMOS Output

Output Voltage

Output Current

VOUT

°C

Power Dissipation (Note1, Note2)

Operating Temperature

700

Topr

Tstg

-40 to +105

-55 to +125

Ambient Storage Temperature

°C

(Note 1) Use above Ta=25°C results in a 7.0mW loss per degree.

(Note 2) When mounted on ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board).

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open

circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Limit

Parameter

Symbol

Condition

Unit

Min.

0.6

Typ.

Max.

6.0

VOL≤0.4V, RL=470kΩ, Ta=25~105°C

VOL≤0.4V, RL=470kΩ, Ta=-40~25°C

Operating Voltage Range

VOPL

0.9

6.0

VDET(T)

×0.99

2.970

2.901

2.885

3.267

3.191

3.173

4.158

4.061

4.039

VDET(T)

×1.01

3.030

3.100

3.117

3.333

3.410

3.428

4.242

4.341

4.364

VDET(T)

VDD=H→L, RL=470kΩ (Note 1)

3.0

Ta=25°C

VDET=3.0V

VDET=3.3V

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=25°C

3.3

Detection Voltage

VDET

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=25°C

4.2

VDET=4.2V

Ta=-40°C to 85°C

Ta=85°C to 105°C

Detection Voltage

Temperature coefficient

VDET/∆T

∆VDET

±50

±360 ppm/°C

-40°C~105°C

VDET(T) VDET(T) VDET(T)

VDD＝L→H→L, RL=470kΩ

Hysteresis Voltage

×0.03

120

×0.05

×0.08

280

460

235

560

920

470

7.00

8.00

0.3

200

Ta=25°C

CL=100pF,

Ta=-40°C to 85°C

Ta=85°C to 105°C

Ta=25°C

BU4XXXX2G

RL=100kΩ

( Note1,

Note 2,

‘High’ Output

Delay time

tPLH

240

190

170

0.60

1.10

400

BU4XXXX4G Ta=-40°C to 85°C

Ta=85°C to 105°C

Note 3 )

Circuit Current when ON

Circuit Current when OFF

IDD1

IDD2

2.30

2.80

µA

VDD=VDET-0.2V, VDET=2.3V~4.2V

VDD=VDET+1.0V, VDET=2.3V~4.2V

VDD=1.2V, ISINK = 2.0mA

‘Low’Output Voltage (Nch)

VOL

0.3

VDD=2.4V, ISINK = 8.5mA, VDET(2.9V to 4.2V)

VDD=VDS=6.0V (Note 1)

Leak Current when OFF

Ileak

1.0

µA

VDET(T):Standard Detection Voltage (2.3V, 2.4V, 2.6V, 2.9V, 3.0V, 3.3V, 3.6V, 4.0V, 4.2V)

RL :Pull-up resistor to be connected between VOUT and power supply.

CL :Capacitor to be connected between VOUT and GND.

(Note 1) Guarantee is Ta=25°C.

(Note 2) tPLH:VDD=(VDET(T)-0.5V)→(VDET(T)+0.5V)

(Note 3) tPLH:VDD=Please set up the rise up time between VDD=V_OPL→VDET more than 10µs.

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Block Diagrams

VDD

VOUT

Oscillator

Circuit Counter

Timer

Vref

GND

Fig.1 BU45xxxxx Series

VDD

Oscillator

Circuit Counter

Timer

VOUT

Vref

GND

Fig.2 BU46xxxxx Series

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Typical Performance Curves

[BU45L232G]

Ta=-40°C

Ta=105°C

Ta=25°C

Ta=105°C

Ta=25°C

Ta=-40°C

DRAIN-SOURCE VOLTAGE: V_DS[V]

VDD SUPPLYVOLTAGE: V_DD[V]

Fig.3 Circuit Current

Fig.4 “LOW” Output Current

VDD=1.2V

[BU46K292G]

[BU45L232G]

Ta=25°C

Ta=-40°C

Ta=105°C

Ta=25°C

Ta=105°C

DRAIN-SOURCE VOLTAGE: V_DS[V]

VDD SUPPLY VOLTAGE: V_DD[V]

Fig.5 “HIGH” Output Current

Fig.6 I/O Characteristics

VDD=3.9V

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Typical Performance Curves - Continued

2.6

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

[BU45L232G]

2.5

Low to high (V_DET+ ∆V_DET

)

2.4

2.3

2.2

2.1

High to low (V_DET

)

-40 -20

100

-40 -20

100

TEMPERATURE:Ta[°C]

TEMPERATURE: Ta[°C]

Fig.7 Detection Voltage

Release Voltage

Fig.8 Circuit Current when ON

(VDD=V_DET-0.2V)

VDD=2.1V

3.5

3.3

3.1

2.9

2.7

2.5

2.3

2.1

1.9

1.7

1.5

0.6

0.5

0.4

0.3

0.2

0.1

0.0

[BU45L232G]

-40 -20

100

-40 -20

100

TEMPERATURE: Ta[°C]

Fig.9 Circuit Current when OFF

(VDD=V_DET+1V)

Fig.10 Operating Limit Voltage

VDD=3.3 V

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Typical Performance Curves - Continued

300

3.0

2.0

1.0

0.0

280

260

240

220

200

180

160

140

120

100

[BU45L232G]

-40 -20

100

-40 -20

100

TEMPERATURE: Ta[°C]

Fig.11 Output Delay Time

“Low” → “High”

“High” → “Low”

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Application Information

Explanation of Operation

For both the open drain type (Fig.13) and the CMOS output type (Fig.14), the detection and release voltages are used as

threshold voltages. When the voltage applied to the V_DDpins reaches the applicable threshold voltage, the V_OUTterminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU45xxxxx series uses an open drain

output type, it is necessary to connect a pull-up resistor to V_DDor another power supply if needed [The output “High” voltage

(V_OUT) in this case becomes V_DDor the voltage of the other power supply].

VDD

Vref

Reset

VOUT

Oscillator

Circuit Counter

Timer

Oscillator

Circuit Counter

Timer

Reset

VOUT

GND

Fig.13 (BU45xxxxx Type Internal Block Diagram)

Fig.14 (BU46xxxxx Type Internal Block Diagram)

Reference Data

Examples of Leading (t_PLH) and Falling (t_PHL) Output

Part Number

BU45L232G

t_PLH[ms]

208

t_PHL[µs]

1.4

VDD=1.8V→2.8V

VDD=2.8V→1.8V

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

Timing Waveform

Example: The following shows the relationship between the input voltages V_DDand the output voltage V_OUTwhen the input

power supply voltage V_DDis made to sweep up and sweep down (the circuits are those in Fig. 13 and 14).

When the power supply is turned on, the output is unstable from

after over the operating limit voltage (V_OPL) until t_PHL. Therefore it is

possible that the reset signal is not outputted when the rise time of

VDD

VDET+ΔVDET

VDET

VDD

V_DDis faster than t_PHL

⑤

VOPL

When V_DDis greater than V_OPLbut less than the reset release

voltage (V_DET+ ∆V_DET), the output voltages will switch to Low.

VOH

If V_DDexceeds the reset release voltage (V_DET+ ∆V_DET), the

tPLH

counter timer start and V_OUTswitches from L to H.

VOUT

tPHL

If V_DDdrops below the detection voltage (V_DET) when the power

VOL

tPHL

supply is powered down or when there is a power supply fluctuation,

V_OUTswitches to L (with a delay of t_PHL).

①

②

④

③

The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (∆V_DET). The

system is designed such that the output does not toggle with power

supply fluctuations within this hysteresis width, thus, preventing

malfunctions due to noise.

Fig.15 Timing Waveform

Timing may change depending on application and use. Please verify and confirm using practical applications.

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Circuit Applications

1. Examples of a common power supply detection reset circuit.

Application examples of BU45xxxxx series (Open Drain

output type) and BU46xxxxx series (CMOS output type)

are shown below.

VDD1

VDD2

Micro

controller

BU45xxxxx

RST

CASE1: Power supply of microcontroller (VDD2) differs

from the power supply of the reset detection (V_DD1).

Use an open drain output Type (BU45xxxxx series)

device with a load resistance R_Las shown Fig.16.

（Noise-filtering

Capacitor）

GND

Fig.16 Open Drain Output Type

CASE2: Power supply of the microcontroller (V_DD1) is

same as the power supply of the reset detection (V_DD1).

Use a CMOS output type (BU46xxxxx) device or an open

drain output type (BU45xxxxx) with pull up resistor

between the output and V_DD1. (As shown Fig.17)

VDD1

Micro

controller

BU46xxxxx

RST

When a capacitance C_Lfor noise filtering is connected to

the V_OUTpin (the reset signal input terminal of the

microcontroller), please take into account the waveform of

the rise and fall of the output voltage (V_OUT).

（Noise-filtering

Capacitor）

GND

Fig.17 CMOS Output Type

2. The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

VDD1

VDD2

VDD3

Micro

controller

BU45xxxxx

RST

GND

Fig. 18

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BU45xxxxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the

microcontroller (V_DD3) as shown in Fig. 18. By pulling-up to V_DD3, output “High” voltage of micro-controller power supply is

possible.

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

Examples of the power supply with resistor dividers.

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow

into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of

current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow

may cause malfunction in the systems operation such as output oscillations, etc.

VDD

BU45xxxxx

BU46xxxxx

VOUT

CIN

GND

Fig. 19

When an in-rush current (I1) flows into the circuit (Refer to Fig. 19) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD

voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”

condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches

again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to

oscillation.

IDD

In-rush Current

VDD

VDET

Fig. 20 Current Consumption vs. Power Supply Voltage

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply

lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting

the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of

temperature and aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on

the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

7. Rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of

connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to

many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge

deposited in between pins during assembly to name a few.

11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance

and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to

the power supply or ground line.

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

12. Regarding Input Pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 21. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and

GND. Be careful when using extremely big capacitor as transient response will be affected.

15. The VDD line impedance might cause oscillation because of the detection current.

16. A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

17. External Parameters

The recommended parameter range for RL is 50kΩ to 470kΩ. There are many factors (board layout, etc) that can

affect characteristics. Please verify and confirm using practical applications.

18. Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

19. Power-on Reset Operation

Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual

operation.

20. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might

cause unexpected operations. Application values in these conditions should be selected carefully.

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

Physical Dimension, Tape and Reel Information

Package Name

SSOP3

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Datasheet

BU45Kxxxx, BU46Kxxxx, BU45Lxxxx series

●Revision History

Date

Revision

004

Changes

03.Feb.2014

New Release

Updated Fig.5 VDD condition

Updated Operational Notes and Notice

03.July.2014

02.Sep.2021

005

006

Deleted Not Recommended New Designs product

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BU45K262G [ROHM]

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