BU4937FP3 [ROHM]
Low Voltage Standard CMOS Voltage Detector ICs;
| 型号： | BU4937FP3 |
| 厂家： | 
ROHM |
| 描述： | Low Voltage Standard CMOS Voltage Detector ICs |
| 文件： | 总19页 (文件大小：1518K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Voltage Detector IC Series
Low Voltage Standard
CMOS Voltage Detector ICs
BU48xx series BU49xx series
●General Description
●Key Specifications
Detection voltage:
0.9V to 4.8V
0.1V steps
ROHM standard CMOS reset IC series is a high-accuracy,
low current consumption reset IC series. The lineup was
established with two output types (Nch open drain and
CMOS output) and detection voltage range from 0.9V to
4.8V in increments of 0.1V, so that the series may be
selected according to the application at hand.
High accuracy detection voltage:
Ultra-low current consumption:
Operating temperature range:
●Package
±1.0%
0.55µA (Typ.)
-40°C to +125°C
●Features
SSOP5
SOP4
2.90mm x 2.80mm x 1.25mm
2.00mm x 2.10mm x 0.95mm
1.60mm x 1.60mm x 0.60mm
Ultra-low current consumption
High accuracy detection, Ultra-low voltage detection
Two output types (Nch open drain and CMOS output)
Wide operating temperature range
VSOF5
●Applications
Very small and low height package
All electronic devices that use micro controllers and logic
circuits
Package SSOP5 and SOP4 is similar to SOT-23-5 and
SC-82 respectively (JEDEC)
●Typical Application Circuit
VDD1
VDD1
VDD2
RL
Micro
controller
RST
BU49xx
Micro
RST
BU48xx
controller
CIN
CIN
CL
CL
(Capacitor for
noise filtering)
(Capacitor for
noise filtering)
GND
GND
（Open Drain Output type）
BU48xx series
（CMOS Output type）
BU49xx series
○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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●Connection Diagram & Pin Descriptions
SSOP5
TOP VIEW
SOP4
TOP VIEW
N.C.
N.C.
GND
4
N.C.
3
Lot. No
Marking
Lot. No
Marking
1
2
VOUT VDD GND
VOUT
VDD
PIN
No.
1
2
3
PIN
No.
1
2
3
Symbol
VOUT Reset output
VDD Power supply voltage
GND GND
N.C. Unconnected terminal
Function
Symbol
Function
Reset output
Power supply voltage
Unconnected terminal
GND
VOUT
VDD
N.C.
GND
4
4
5
N.C. Unconnected terminal
VSOF5
TOP VIEW
Marking
GND VDD
5
4
Lot. No
1 2 3
VOUT SUB N.C
PIN
No.
1
Symbol
Function
VOUT Reset output
SUB Substrate*
2
3
N.C. Unconnected terminal
VDD
4
Power supply voltage
5
GND GND
*Connect the substrate to VDD
●Ordering Information
B
U
x
x
x
x
x
-
T
R
Part
Output Type
Reset Voltage Value Package
Packaging and
Number
48 : Open Drain
49 : CMOS
09 : 0.9V
G
F
: SSOP5
: SOP4
forming specification
TR : Embossed tape
and reel
0.1V step
48 : 4.8V
FVE : VSOF5
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BU48xx series BU49xx series
●Lineup
Output Type
Open Drain
Part Number
CMOS
Part Number
Detection Voltage
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
1.4V
1.3V
1.2V
1.1V
1.0V
0.9V
Marking
JR
Marking
LH
LG
LF
BU4848
BU4847
BU4846
BU4845
BU4844
BU4843
BU4842
BU4841
BU4840
BU4839
BU4838
BU4837
BU4836
BU4835
BU4834
BU4833
BU4832
BU4831
BU4830
BU4829
BU4828
BU4827
BU4826
BU4825
BU4824
BU4823
BU4822
BU4821
BU4820
BU4819
BU4818
BU4817
BU4816
BU4815
BU4814
BU4813
BU4812
BU4811
BU4810
BU4809
BU4948
BU4947
BU4946
BU4945
BU4944
BU4943
BU4942
BU4941
BU4940
BU4939
BU4938
BU4937
BU4936
BU4935
BU4934
BU4933
BU4932
BU4931
BU4930
BU4929
BU4928
BU4927
BU4926
BU4925
BU4924
BU4923
BU4922
BU4921
BU4920
BU4919
BU4918
BU4917
BU4916
BU4915
BU4914
BU4913
BU4912
BU4911
BU4910
BU4909
JQ
JP
JN
LE
JM
JL
LD
LC
LB
JK
JJ
LA
JH
KZ
KY
KX
KW
KV
KU
KT
KS
KR
KQ
KP
KN
KM
KL
JG
JF
JE
JD
JC
JB
JA
HZ
HY
HX
HW
HV
HU
HT
HS
HR
HQ
HP
HN
HM
HL
HK
HJ
KK
KJ
KH
KG
KF
KE
KD
KC
KB
KA
JZ
HH
HG
HF
HE
HD
HC
HB
HA
JY
JX
JW
JV
JU
JT
JS
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BU48xx series BU49xx series
●Absolute Maximum Ratings
Parameter
Symbol
VDD
Limits
-0.3 to +7
Unit
V
Power Supply Voltage
Nch Open Drain Output
CMOS Output
GND-0.3 to +7
GND-0.3 to VDD+0.3
Output Voltage
Output Current
VOUT
V
Io
70
mA
*1*4
*2*4
*3*4
SSOP5
SOP4
VSOF5
540
400
210
Power
Dissipation
Pd
mW
Operation Temperature Range
Ambient Storage Temperature
Topt
Tstg
-40 to +125
-55 to +125
°C
℃
*1 When used at temperatures higher than Ta=25℃, the power is reduced by 5.4mW per 1℃ above 25℃.
*2 When used at temperatures higher than Ta=25℃, the power is reduced by 4.0mW per 1℃ above 25℃.
*3 When used at temperatures higher than Ta=25℃, the power is reduced by 2.1mW per 1℃ above 25℃.
*4 When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted.
●Electrical Characteristics
Limits
Typ.
Parameter
Symbol
Condition
Unit
Min.
VDET(T)
×0.99
Max.
VDET(T)
×1.01
VDD=HL , Ta=25℃,RL=470kΩ
VDET(T)
1.782
1.741
1.718
1.8
-
-
1.818
1.860
1.883
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET=1.8V
VDET=2.5V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
2.475
2.418
2.386
2.970
2.901
2.864
3.267
3.191
3.150
4.158
4.061
4.009
2.5
2.525
2.584
2.615
3.030
3.100
3.139
3.333
3.410
3.452
4.242
4.341
4.394
-
-
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
3.0
Detection Voltage
VDET
V
VDET=3.0V
VDET=3.3V
VDET=4.2V
-
-
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
3.3
-
-
4.2
-
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
-
Detection Voltage
Temperature Coefficient
*1
VDET/∆T Ta=-40℃ to 125℃
-
±30
-
ppm/℃
VDET
×0.03
VDET
×0.03
VDET
×0.05
VDET
×0.05
VDET
×0.08
VDET
×0.07
VDET≤1.0V
VDET≥1.1V
VDD=LHL
∆VDET Ta=-40℃ to 125℃
RL=470kΩ
Hysteresis Voltage
V
*1 Guaranteed by design.(Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
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Unless Otherwise Specified Ta=-25 to 125℃
Limit
Typ.
0.15
0.20
0.25
0.30
0.35
0.40
0.30
0.35
0.40
0.45
0.50
0.55
-
Parameter
Symbol
Condition
VDET=0.9-1.3V
Unit
µA
Min.
Max.
0.88
1.05
1.23
1.40
1.58
1.75
1.40
1.58
1.75
1.93
2.10
2.28
-
-
VDET=1.4-2.1V
VDET=2.2-2.7V
VDET=2.8-3.3V
VDET=3.4-4.2V
VDET=4.3-4.8V
VDET=0.9-1.3V
VDET=1.4-2.1V
VDET=2.2-2.7V
VDET=2.8-3.3V
VDET=3.4-4.2V
VDET=4.3-4.8V
-
-
Circuit Current when ON
IDD1
VDD=VDET-0.2V
-
-
-
-
-
-
Circuit Current when OFF
IDD2
VDD=VDET+2.0V
µA
-
-
-
VOL≤0.4V, Ta=25 to 125℃, RL=470kΩ
VOL≤0.4V, Ta=-40 to 25℃, RL=470kΩ
VDD=0.85V, ISINK = 20 µA
0.70
Operating Voltage Range
VOPL
VOL
V
V
V
0.90
-
-
-
-
-
-
0.05
0.5
‘Low’ Output Voltage (Nch)
VDD=1.5V, ISINK = 1 mA, VDET=1.7-4.8V
VDD=2.4V, ISINK = 4 mA, VDET=2.7-4.8V
-
-
0.5
VDD=4.8V,ISOURCE=1.7mA,
VDET=0.9V to 3.9V
VDD=6.0V,ISOURCE=2.0mA,
VDET=4.0V to 4.8V
VDD=VDS=7V
Ta=-40℃ to 85℃
VDD=VDS=7V
VDD-0.5
-
-
-
-
‘High’ Output Voltage (Pch)
(only BU49xx)
VOH
Ileak
V
VDD-0.5
Output Leak Current when
OFF
(only BU48xx)
-
-
0
0
0.1
1
µA
Ta=85℃ to 125℃
* This product is not designed for protection against radioactive rays.
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
●Block Diagrams
VDD
VDD
VOUT
VOUT
Vref
Vref
GND
GND
Fig.1 BU48xx Series
Fig.2 BU49xx Series
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●Typical Performance Curves
5
4
3
2
1
0
0.7
【BU4816】
【BU4916】
【BU4816】
【BU4916】
0.6
0.5
0.4
0.3
0.2
0.1
0.0
VDD=1.2V
0
1
2
3
4
5
6
7
0.0
0.5
1.0
1.5
2.0
2.5
VDD SUPPLY VOLTAGE ：VDD[V]
DRAIN-SOURCE VOLTAGE ： VDS[V]
Fig.4 “LOW” Output Current
Fig.3 Circuit Current
25
20
15
10
5
7
6
5
4
3
2
1
0
【BU48
16】
【BU4916】
【BU4916】
VDD=6.0V
VDD=4.8V
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
VDD SUPPLY VOLTAGE ：VDD[V]
DRAIN-SOURCE VOLTAGE ： VDS[V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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●Typical Performance Curves – continued
1.0
2.0
1.5
1.0
【BU4816】
【BU4916】
Lowto high(VDET+ΔVDET)
0.8
0.6
0.4
0.2
0.0
High to low(VDET)
【BU4816】
【BU4916】
-40
0
40
80
120
0.0
0.5
1.0
1.5
2.0
2.5
TEMPERATURE ： Ta[℃]
VDD SUPPLY VOLTAGE ： VDD[V]
Fig.8 Detecting Voltage
Release Voltage
Fig.7 Operating Limit Voltage
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.8
0.6
0.4
0.2
0.0
【BU4816】
【BU4916】
【BU4816】
【BU4916】
-40
0
40
80
120
-40
0
40
80
120
TEMPERATURE ： Ta[℃]
TEMPERATURE ： Ta[℃]
Fig.10 Circuit Current when OFF
Fig.9 Circuit Current when ON
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BU48xx series BU49xx series
●Typical Performance Curves – continued
1.0
【BU4816】
【BU4916】
0.8
0.6
0.4
0.2
0.0
-40
0
40
80
120
TEMPERATURE ： Ta[℃]
Fig.11 Operating Limit Voltage
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●Application Information
Explanation of Operation
For both the open drain type(Fig.12)and the CMOS output type(Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BU48xx series uses an open drain output
type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this
case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
R1
R2
R1
R2
Q2
Q1
RL
Vref
Vref
RESET
VOUT
VOUT RESET
Q1
R3
R3
GND
GND
Fig.12 (BU48xx type internal block diagram)
Fig.13 (BU49xx type internal block diagram)
Reference Data
Examples of Output rising value(tPLH)and Output falling value(tPHL)
Part Number
BU4845
tPLH[µs]
23.3
tPHL[µs]
275.9
BU4945
3.5
354.3
VDD=4.3V5.1V
VDD=5.1V4.3V
* This data is for reference only.
This figure will vary with the application, so please confirm actual operation conditions before use.
Timing Waveforms
Example:The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.12 and 13).
①When the power supply is turned on, the output is unsettled
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted
when the rise time of VDD is faster than tPHL.
②When VDD is greater than VOPL but less than the reset release
voltage (VDET + VDET), output (VOUT) voltages will switch to L.
③If VDD exceeds the reset release voltage (VDET + VDET), then
VOUT switches from L to H (with a delay of tPLH).
VDD
VDET+Δ VDET
⑤
VDET
VOPL
0V
④If VDD drops below the detection voltage (VDET) when the
power supply is powered down or when there is a power
supply fluctuation, VOUT switches to L (with a delay of tPHL).
⑤The potential deference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The
system is designed such that the output does not flip-flop with
power supply fluctuations within this hysteresis width,
preventing malfunctions due to noise.
VOUT
VOH
VOL
tPLH
tPHL
tPLH
tPHL
①
②
③
④
Fig.14 Timing Waveforms
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BU48xx series BU49xx series
●Circuit Applications
1) Examples of a common power supply detection reset circuit
VDD1
VDD2
Application examples of BU48xx series
(Open Drain output type) and BU49xx series
(CMOS output type) are shown below.
RL
Micro
controller
RST
BU48xx
CASE1:The power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection (V DD1).
Use the Open Drain Output Type (BU48xx series).
Attach a load resistance (RL) between the output and
VDD2. (As shown Fig.15)
CIN
CL
(Capacitor for
noise filtering)
GND
Fig.15 Open Drain Output type
CASE2:The power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use CMOS output type (BU43xx series) or Open Drain
Output Type (BU48xx series). Attach a load
resistance (RL) between the output and VDD1.
(As shown Fig.16)
VDD1
Micro
controller
RST
BU49xx
When a capacitance CL for noise filtering for setting the
output delay time is connected to the VOUT pin (the reset
signal input terminal of the microcontroller), please take
into account the waveform of the rise and fall of the output
voltage (VOUT).
CIN
CL
(Capacitor for
noise filtering)
GND
Fig.16 CMOS Output type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BU48Exxx
NO.1
BU48xx
NO.2
RST
microcontroller
GND
Fig.17
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BU48xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
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3) Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC is connected through resistor
dividers, it is possible that a through current will momentarily flow into the circuit when the output logic
switches, resulting in malfunctions (such as output oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when
the output level switches from “High” to “Low” or vice versa.)
V1
IDD
R2
I1
Through
Current
VDD
BU48xx
BU49xx
R1
VOUT
CIN
CL
GND
VDD
VDET
0
Fig.18
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and
the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage
decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this
time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a
result, the output switches from “Low” to “High”, which again causes the through current to flow and the
voltage drop. This process is repeated, resulting in oscillation.
Consider the use of BD48xx when the power supply input it with resistor dividers.
VDD - IDD PeakCurrent Ta=25°C
Temp - IDD(BU42xx)
VDD3V
BU49xx,BU43xx
BU48xx,BU42xx
BD52xx
VDD6V
VDD7V
VDD4V
10
1
2.5
2.0
1.5
1.0
0.5
0.0
BD53xx
0.1
0.01
0.001
-50 -30 -10 10 30 50 70 90 110 130
Temp
3
4
5
6
7
8
9
10
VDD[V]
Fig.19 Current Consumption vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
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BU48xx series BU49xx series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) The recommended value of RL Resistor is over 10kΩ for VDET=1.5V to 4.8V, and over 100kΩ for VDET=0.9V to 1.4V.
11) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.
12) External parameters
The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
13) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
14) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
15) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
www.rohm.com
TSZ02201-0R7R0G300060-1-2
02.Nov.2015 Rev.012
© 2015 ROHM Co., Ltd. All rights reserved.
12/15
TSZ22111・15・001
BU48xx series BU49xx series
Physical Dimension, Tape and Reel Information
Package Name
SSOP5
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© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0R7R0G300060-1-2
02.Nov.2015 Rev.012
13/15
BU48xx series BU49xx series
Physical Dimension, Tape and Reel Information
Package Name
SOP4
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0R7R0G300060-1-2
02.Nov.2015 Rev.012
14/15
BU48xx series BU49xx series
Physical Dimension, Tape and Reel Information
Package Name
VSOF5
www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-0R7R0G300060-1-2
02.Nov.2015 Rev.012
15/15
Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.002
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
Buy
BU4809F - Web Page
Distribution Inventory
Part Number
Package
BU4809F
SOP4
Unit Quantity
3000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
3000
Taping
inquiry
Yes
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