首页 |元器件品牌

BU52012NVX-TR [ROHM]

Unipolar Detection Hall ICs; 单极检测霍尔IC
BU52012NVX-TR
型号： BU52012NVX-TR
厂家： ROHM    ROHM
描述：

Unipolar Detection Hall ICs
单极检测霍尔IC
文件： 总20页 (文件大小：387K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
 查看货源
Hall ICs  
Unipolar Detection  
Hall ICs  
No.10045ECT03  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Description  
The unipolar Detection Hall IC detects only either the N pole or S pole.  
The output turns ON (active Low) upon detection.  
●Features  
1) Unipolar detection  
2) Micropower operation (small current using intermittent operation method)  
3) Ultra-compact CSP4 package (BU52002GUL, BU52003GUL)  
4) Ultra- Small outline package (BU52012NVX)  
5) Small outline package (BU52012HFV, BU52013HFV)  
6) Line up of supply voltage  
For 1.8V Power supply voltage (BU52012NVX, BU52012HFV, BU52013HFV)  
For 3.0V Power supply voltage (BU52002GUL, BU52003GUL)  
7) High ESD resistance 8kV(HBM)  
●Applications  
Mobile phones, notebook computers, digital video camera, digital still camera, etc.  
●Lineup matrix  
Supply  
Supply  
voltage  
(V)  
Operate  
point  
Hysteresis  
(mT)  
Period  
(ms)  
current  
(AVG.)  
(µA)  
Function Product name  
Output type  
Package  
(mT)  
※
BU52002GUL 2.40～3.30  
BU52012NVX 1.65～3.60  
BU52012HFV 1.65～3.30  
BU52003GUL 2.40～3.30  
BU52013HFV 1.65～3.30  
3.7  
0.8  
0.9  
0.9  
0.8  
0.9  
50  
50  
50  
50  
50  
6.5  
3.5  
3.5  
6.5  
3.5  
VCSP50L1  
SSON004X1216  
HVSOF5  
CMOS  
COMS  
CMOS  
CMOS  
CMOS  
※
3.0  
S pole  
N pole  
※
3.0  
※
-3.7  
VCSP50L1  
HVSOF5  
※
-3.0  
※Plus is expressed on the S-pole; minus on the N-pole  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
1/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Absolute maximum ratings  
BU52002GUL,BU52003GUL (Ta=25℃)  
BU52012NVX (Ta=25℃)  
Parameter  
Symbol  
Ratings  
Unit  
V
Parameter  
Symbol  
VDD  
Ratings  
Unit  
V
1
3
Power Supply Voltage  
VDD  
-0.1～+4.5※  
Power Supply Voltage  
Output Current  
-0.1～+4.5※  
Output Current  
IOUT  
Pd  
±1  
mA  
mW  
℃
IOUT  
Pd  
±0.5  
mA  
mW  
℃
2
4
※
Power Dissipation  
420※  
Power Dissipation  
2049  
Operating  
Temperature Range  
Operating  
Temperature Range  
Topr  
Tstg  
-40～+85  
Topr  
Tstg  
-40～+85  
Storage  
Temperature Range  
Storage  
Temperature Range  
-40～+125  
℃
-40～+125  
℃
※1. Not to exceed Pd  
※3. Not to exceed Pd  
※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃  
(mounted on 50mm×58mm Glass-epoxy PCB)  
※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃  
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)  
BU52012HFV,BU52013HFV (Ta=25℃)  
Parameter  
Symbol  
Ratings  
Unit  
V
5
-0.1～+4.5※  
Power Supply Voltage  
VDD  
Output Current  
IOUT  
Pd  
mA  
mW  
℃
±0.5  
6
536※  
Power Dissipation  
Operating  
Temperature Range  
Topr  
Tstg  
-40～+85  
Storage  
Temperature Range  
℃
-40～+125  
※5. Not to exceed Pd  
※6. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃  
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)  
●Magnetic, Electrical characteristics  
BU52002GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
2.4  
Typ.  
Max.  
3.3  
Power Supply Voltage  
Operate Point  
Release Point  
Hysteresis  
VDD  
BopS  
3.0  
V
-
3.7  
2.9  
0.8  
50  
-
5.5  
mT  
mT  
mT  
ms  
V
BrpS  
0.8  
-
BhysS  
TP  
-
-
100  
-
Period  
-
7
7
※
B<BrpS  
OUT=-1.0mA  
Output High Voltage  
Output Low Voltage  
Supply Current  
VOH  
VDD-0.4  
I
※
BopS<B  
OUT =+1.0mA  
VOL  
-
-
-
-
-
0.4  
9
V
I
IDD(AVG)  
IDD(EN)  
IDD(DIS)  
6.5  
4.7  
3.8  
µA  
mA  
µA  
Average  
Supply Current  
During Startup Time  
-
During Startup Time Value  
During Standby Time Value  
Supply Current  
During Standby Time  
-
※7. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output.  
Radiation hardiness is not designed.  
www.rohm.com  
2010.08 - Rev.C  
2/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52003GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
2.4  
Typ.  
Max.  
3.3  
Power Supply Voltage  
Operate Point  
Release Point  
Hysteresis  
VDD  
BopN  
3.0  
V
-5.5  
-3.7  
-2.9  
0.8  
50  
-
-
mT  
mT  
mT  
ms  
V
BrpN  
-
-0.8  
BhysN  
TP  
-
-
100  
-
Period  
-
8
8
※
BrpN<B  
OUT=-1.0mA  
Output High Voltage  
Output Low Voltage  
Supply Current  
VOH  
VDD-0.4  
I
※
B<BopN  
OUT =+1.0mA  
VOL  
-
-
-
-
-
0.4  
9
V
I
IDD(AVG)  
IDD(EN)  
IDD(DIS)  
6.5  
4.7  
3.8  
µA  
mA  
µA  
Average  
Supply Current  
During Startup Time  
-
During Startup Time Value  
During Standby Time Value  
Supply Current  
During Standby Time  
-
※8. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output.  
Radiation hardiness is not designed.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
3/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52012NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
1.65  
Typ.  
Max.  
3.60  
Power Supply Voltage  
Operate Point  
VDD  
BopS  
1.80  
V
-
3.0  
2.1  
0.9  
50  
-
5.0  
mT  
mT  
mT  
ms  
V
Release Point  
BrpS  
0.6  
-
Hysteresis  
BhysS  
-
-
Period  
TP  
-
100  
9
9
※
※
B<BrpS  
OUT =-0.5mA  
Output High Voltage  
Output Low Voltage  
Supply Current 1  
VOH  
VDD-0.2  
-
I
BopS<B  
OUT =+0.5mA  
VOL  
-
-
-
-
-
-
-
-
0.2  
V
I
IDD1(AVG)  
IDD1(EN)  
IDD1(DIS)  
IDD2(AVG)  
IDD2(EN)  
IDD2(DIS)  
3.5  
2.8  
1.8  
8.0  
5.3  
5.2  
5.5  
µA  
mA  
µA  
µA  
mA  
µA  
VDD=1.8V, Average  
VDD=1.8V,  
Supply Current  
During Startup Time 1  
-
During Startup Time Value  
Supply Current  
During Standby Time 1  
VDD=1.8V,  
-
During Standby Time Value  
Supply Current 2  
12.5  
VDD=3.0V, Average  
Supply Current  
During Startup Time 2  
VDD=3.0V,  
-
-
During Startup Time Value  
Supply Current  
During Standby Time 2  
VDD=3.0V,  
During Standby Time Value  
※9. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output.  
Radiation hardiness is not designed.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
4/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52012HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
1.65  
Typ.  
Max.  
3.30  
Power Supply Voltage  
Operate Point  
VDD  
BopS  
1.80  
V
-
3.0  
2.1  
0.9  
50  
-
5.0  
mT  
mT  
mT  
ms  
V
Release Point  
BrpS  
0.6  
-
Hysteresis  
BhysS  
-
-
Period  
TP  
-
100  
10  
10  
※
B<BrpS  
OUT =-0.5mA  
Output High Voltage  
Output Low Voltage  
Supply Current 1  
VOH  
VDD-0.2  
-
0.2  
5.5  
-
I
※
BopS<B  
OUT =+0.5mA  
VOL  
-
-
-
-
-
-
-
-
V
I
IDD1(AVG)  
IDD1(EN)  
IDD1(DIS)  
IDD2(AVG)  
IDD2(EN)  
IDD2(DIS)  
3.5  
2.8  
1.8  
6.5  
4.5  
4.0  
µA  
mA  
µA  
µA  
mA  
µA  
VDD=1.8V, Average  
VDD=1.8V,  
Supply Current  
During Startup Time 1  
During Startup Time Value  
Supply Current  
During Standby Time 1  
VDD=1.8V,  
-
During Standby Time Value  
Supply Current 2  
9
VDD=2.7V, Average  
Supply Current  
During Startup Time 2  
VDD=2.7V,  
-
During Startup Time Value  
Supply Current  
During Standby Time 2  
VDD=2.7V,  
-
During Standby Time Value  
※10. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output.  
Radiation hardiness is not designed.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
5/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52013HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)  
Limits  
Parameter  
Symbol  
Unit  
Conditions  
Min.  
1.65  
Typ.  
Max.  
3.30  
Power Supply Voltage  
Operate Point  
VDD  
BopN  
1.80  
V
-5.0  
-3.0  
-2.1  
0.9  
50  
-
mT  
mT  
mT  
ms  
V
Release Point  
BrpN  
-
-
-
-0.6  
Hysteresis  
BhysN  
-
Period  
TP  
100  
11  
11  
※
VDD  
-0.2  
BrpN<B  
Output High Voltage  
Output Low Voltage  
Supply Current 1  
VOH  
-
-
0.2  
5.5  
-
IOUT =-0.5mA  
※
B<BopN  
I
VOL  
-
-
-
-
-
-
-
-
V
OUT =+0.5mA  
IDD1(AVG)  
IDD1(EN)  
IDD1(DIS)  
IDD2(AVG)  
IDD2(EN)  
IDD2(DIS)  
3.5  
2.8  
1.8  
6.5  
4.5  
4.0  
µA  
mA  
µA  
µA  
mA  
µA  
VDD=1.8V, Average  
VDD=1.8V,  
Supply Current  
During Startup Time 1  
During Startup Time Value  
Supply Current  
During Standby Time 1  
VDD=1.8V,  
-
During Standby Time Value  
Supply Current 2  
9
VDD=2.7V, Average  
Supply Current  
During Startup Time 2  
VDD=2.7V,  
-
During Startup Time Value  
Supply Current  
During Standby Time 2  
VDD=2.7V,  
-
During Standby Time Value  
※11. B = Magnetic flux density  
1mT=10Gauss  
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.  
After applying power supply, it takes one cycle of period (TP) to become definite output.  
Radiation hardiness is not designed.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
6/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Figure of measurement circuit  
Bop/Brp  
Tp  
200Ω  
VDD  
GND  
VDD  
GND  
VDD  
VDD  
OUT  
100µF  
OUT  
Oscilloscope  
V
The period is monitored by Oscilloscope.  
Fig.2 Tp measurement circuit  
Bop and Brp are measured with applying the magnetic field  
from the outside.  
Fig.1 Bop,Brp measurement circuit  
VOH  
Product Name  
IOUT  
VDD  
GND  
VDD  
OUT  
100µF  
BU52002GUL, BU52003GUL  
1.0mA  
IOUT  
BU52012NVX, BU52012HFV,  
BU52013HFV  
V
0.5mA  
Fig.3  
VOH measurement circuit  
VOL  
Product Name  
IOUT  
VDD  
VDD  
OUT  
100µF  
BU52002GUL, BU52003GUL  
1.0mA  
GND  
IOUT  
V
BU52012NVX, BU52012HFV,  
BU52013HFV  
0.5mA  
Fig.4 VOL measurement circuit  
IDD  
A
VDD  
2200µF  
VDD  
OUT  
GND  
Fig.5  
IDD measurement circuit  
www.rohm.com  
2010.08 - Rev.C  
7/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Technical (Reference) Data  
BU52002GUL (VDD=2.4～3.3V type)  
8.0  
6.0  
8.0  
6.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Ta = 25°C  
VDD=3.0V  
V
DD=3.0V  
Bop S  
Brp S  
Bop S  
Brp S  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-2.0  
-4.0  
-6.0  
-8.0  
-2.0  
-4.0  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
AMBIENT TEMPERATURE [  
]
℃
SUPPLY VOLTAGE  
V
［ ］  
AMBIENT TEMPERATURE [  
]
℃
Fig.6 Bop,Brp – Ambient temperature  
Fig.7 Bop,Brp – Supply voltage  
Fig.8 TP –Ambient temperature  
100  
20.0  
20.0  
18.0  
90  
18.0  
16.0  
14.0  
12.0  
10.0  
8.0  
VDD=3.0V  
Ta = 25°C  
Ta = 25°C  
80  
70  
60  
50  
40  
30  
20  
10  
0
16.0  
14.0  
12.0  
10.0  
8.0  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
2.0  
2.4  
2.8  
3.2  
3.6  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.11 IDD – Supply voltage  
Fig.10 IDD – Ambient temperature  
Fig.9 TP – Supply voltage  
BU52003GUL (VDD=2.4～3.3V type)  
8.0  
8.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Ta = 25°C  
6.0  
6.0  
VDD=3.0V  
VDD=3.0V  
4.0  
2.0  
0.0  
4.0  
2.0  
0.0  
Brp N  
Bop N  
Brp N  
-2.0  
-2.0  
-4.0  
-6.0  
-8.0  
-4.0  
Bop N  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
AMBIENT TEMPERATURE [  
]
℃
SUPPLY VOLTAGE  
V
］
［
AMBIENT TEMPERATURE [  
]
℃
Fig.14 TP – Ambient temperature  
Fig.13 Bop,Brp – Supply voltage  
Fig.12 Bop,Brp – Ambient temperature  
100  
20.0  
20.0  
Ta = 25°C  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
18.0  
18.0  
VDD=3.0V  
Ta = 25°C  
16.0  
14.0  
12.0  
10.0  
8.0  
16.0  
14.0  
12.0  
10.0  
8.0  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
2.0  
2.4  
2.8  
3.2  
3.6  
2.0  
2.4  
2.8  
3.2  
3.6  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.16  
I
DD – Ambient temperature  
Fig.17 IDD – Supply voltage  
Fig.15 TP –Supply voltage  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
8/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52012NVX (VDD=1.65～3.6V type)  
8.0  
6.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
8.0  
6.0  
Ta = 25°C  
VDD=1.8V  
VDD=1.8V  
Bop S  
Brp S  
Bop S  
Brp S  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-2.0  
-4.0  
-6.0  
-8.0  
-2.0  
-4.0  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE  
AMBIENT TEMPERATURE [  
]
℃
V
［
］
AMBIENT TEMPERATURE [  
]
℃
Fig.18 Bop,Brp – Ambient temperature  
Fig.20 TP – Ambient temperature  
Fig.19 Bop,Brp – Supply voltage  
20.0  
100  
20.0  
18.0  
16.0  
14.0  
12.0  
10.0  
8.0  
90  
VDD=1.8V  
18.0  
Ta = 25°C  
Ta = 25°C  
16.0  
14.0  
12.0  
10.0  
8.0  
80  
70  
60  
50  
40  
30  
20  
10  
0
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
1.4  
1.8 2.2  
2.6 3.0  
3.4 3.8  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.21 TP – Supply voltage  
Fig.23 IDD – Supply voltage  
Fig.22 IDD – Ambient temperature  
BU52012HFV (VDD=1.65～3.3V type)  
100  
8.0  
8.0  
Ta = 25°C  
90  
VDD=1.8V  
6.0  
6.0  
VDD=1.8V  
Bop S  
80  
70  
60  
50  
40  
30  
20  
10  
0
Bop S  
4.0  
2.0  
4.0  
2.0  
Brp S  
Brp S  
0.0  
0.0  
-2.0  
-4.0  
-6.0  
-2.0  
-4.0  
-6.0  
-8.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
AMBIENT TEMPERATURE [  
]
℃
SUPPLY VOLTAGE  
V
［ ］  
AMBIENT TEMPERATURE [  
]
℃
Fig.25 Bop,Brp – Supply voltage  
Fig.24 Bop,Brp – Ambient temperature  
Fig.26 TP – Ambient temperature  
20.0  
100  
20.0  
18.0  
16.0  
14.0  
12.0  
10.0  
8.0  
90  
VDD=1.8V  
18.0  
Ta = 25°C  
Ta = 25°C  
16.0  
14.0  
12.0  
10.0  
8.0  
80  
70  
60  
50  
40  
30  
20  
10  
0
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
1.4  
1.8 2.2  
2.6 3.0  
3.4 3.8  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.27 TP – Supply voltage  
Fig.29  
I
DD – Supply voltage  
Fig.28 IDD – Ambient temperature  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
9/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52013HFV (VDD=1.65～3.3V type)  
8.0  
6.0  
8.0  
6.0  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Ta = 25°C  
VDD=1.8V  
VDD=1.8V  
4.0  
4.0  
2.0  
2.0  
0.0  
0.0  
Brp N  
Bop N  
Brp N  
Bop N  
-2.0  
-4.0  
-6.0  
-8.0  
-2.0  
-4.0  
-6.0  
-8.0  
-60 -40 -20  
0
20 40 60 80 100  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE  
AMBIENT TEMPERATURE [  
]
℃
V
［
］
AMBIENT TEMPERATURE [  
]
℃
Fig.32 TP – Ambient temperature  
Fig.31 Bop,Brp – Supply voltage  
Fig.30 Bop,Brp – Ambient temperature  
100  
20.0  
20.0  
90  
18.0  
Ta = 25°C  
18.0  
VDD=1.8V  
Ta = 25°C  
80  
70  
60  
50  
40  
30  
20  
10  
16.0  
14.0  
12.0  
10.0  
8.0  
16.0  
14.0  
12.0  
10.0  
8.0  
6.0  
6.0  
4.0  
4.0  
2.0  
2.0  
0
0.0  
0.0  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
-60 -40 -20  
0
20 40 60 80 100  
1.4 1.8 2.2 2.6 3.0 3.4 3.8  
SUPPLY VOLTAGE [V]  
SUPPLY VOLTAGE [V]  
AMBIENT TEMPERATURE [  
]
℃
Fig.35 IDD – Supply voltage  
Fig.33 TP – Supply voltage  
Fig.34 IDD – Ambient temperature  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
10/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Block Diagram  
BU52002GUL, BU52003GUL  
0.1µF  
VDD  
A1  
Adjust the bypass capacitor value as  
necessary, according to voltage noise  
conditions, etc.  
TIMING LOGIC  
HALL  
The CMOS output terminals enable direct connection to  
the PC, with no external pull-up resistor required.  
ELEMENT  
×
B1 OUT  
A2  
GND  
Fig.36  
A2  
B2  
A1  
B1  
A1  
A2  
PIN No. PIN NAME  
FUNCTION  
POWER SUPPLY  
GROUND  
COMMENT  
A1  
A2  
B1  
B2  
VDD  
GND  
OUT  
N.C.  
OUTPUT  
B1  
Surface  
B2  
OPEN or Short to GND.  
Reverse  
BU52012NVX  
0.1µF  
VDD  
Adjust the bypass capacitor value as  
necessary, according to voltage  
noise conditions, etc.  
4
The CMOS output terminals enable direct  
connection to the PC, with no external pull-up  
resistor required.  
TIMING LOGIC  
HALL  
ELEMENT  
×
OUT  
1
2
GND  
4
Fig.37  
3
2
3
2
4
1
PIN No. PIN NAME  
FUNCTION  
OUTPUT  
COMMENT  
1
2
3
4
OUT  
GND  
N.C.  
VDD  
GROUND  
OPEN or Short to GND.  
1
POWER SUPPLY  
Surface  
Reverse  
www.rohm.com  
2010.08 - Rev.C  
11/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52012HFV, BU52013HFV  
0.1µF  
VDD  
Adjust the bypass capacitor value as  
necessary, according to voltage noise  
conditions, etc.  
4
TIMING LOGIC  
HALL  
The CMOS output terminals enable direct connection to  
the PC, with no external pull-up resistor required.  
ELEMENT  
×
OUT  
5
2
GND  
Fig.38  
4
3
4
3
5
1
5
1
PIN No. PIN NAME  
FUNCTION  
GROUND  
COMMENT  
1
2
3
4
5
N.C.  
GND  
N.C.  
VDD  
OUT  
OPEN or Short to GND.  
OPEN or Short to GND.  
POWER SUPPLY  
OUTPUT  
2
2
Surface  
Reverse  
●Description of Operations  
The unipolar detection Hall IC adopts an intermittent operation  
method to save energy. At startup, the Hall elements, amp,  
comparator and other detection circuit power ON and magnetic  
detection begins. During standby, the detection circuits power  
OFF, thereby reducing current consumption. The detection results  
are held while standby is active, and then output.  
(Micropower Operation)  
IDD  
Period  
Startup time  
Standby  
Reference period: 50ms (MAX100ms)  
Reference startup time: 24µs  
t
Fig.39  
(Offset Cancelation)  
VDD  
The Hall elements form an equivalent Wheatstone (resistor)  
bridge circuit. Offset voltage may be generated by a differential in  
this bridge resistance, or can arise from changes in resistance  
due to package or bonding stress. A dynamic offset cancellation  
circuit is employed to cancel this offset voltage.  
I
When Hall elements are connected as shown in Fig. 40 and a  
magnetic field is applied perpendicular to the Hall elements,  
voltage is generated at the mid-point terminal of the bridge. This  
is known as Hall voltage.  
＋
B
×
Hall Voltage  
Dynamic cancellation switches the wiring (shown in the figure) to  
redirect the current flow to a 90˚ angle from its original path, and  
thereby cancels the Hall voltage.  
The magnetic signal (only) is maintained in the sample/hold  
circuit during the offset cancellation process and then released.  
－
GND  
Fig.40  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
12/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
(Magnetic Field Detection Mechanism)  
S
N
S
S
N
S
N
Flux  
Flux  
Fig.41  
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.  
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.  
www.rohm.com  
2010.08 - Rev.C  
13/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
BU52002GUL,BU52012HFV  
S-Pole  
N
S
N
S
S
N
OUT [V]  
Flux  
High  
Flux  
High  
High  
Low  
B
Brp S  
S-Pole  
Bop S  
0
N-Pole  
Magnetic flux density [mT]  
Fig.42 S-Pole Detection  
BU52002GUL, BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.  
BU52003GUL, BU52013HFV  
N-Pole  
N
S
N
S
S
N
OUT [V]  
Flux  
Flux  
High  
High  
B
High  
Low  
Bop N Brp N  
N-Pole  
0
S-Pole  
Magnetic flux density [mT]  
Fig.43 N-Pole Detection  
BU52003GUL, BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.  
The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an  
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance  
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets  
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the  
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output  
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This  
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
14/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Intermittent Operation at Power ON  
Power ON  
VDD  
Startup time  
Standby time  
High  
Startup time  
Standby time  
Supply current  
(Intermittentaction)  
Indefinite  
interval  
OUT  
(No magnetic  
field present)  
Indefinite  
interval  
OUT  
(Magnetic  
field present)  
Low  
Fig.44  
The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as  
shown in Fig.44. It outputs to the appropriate terminal based on the detection result and maintains the output condition  
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it  
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be  
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.  
●Magnet Selection  
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume  
than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment  
applications. Fig.45 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The  
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet  
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig.46 shows Hall IC detection distance – a good guide for  
determining the proper size and detection distance of the magnet. Based on the BU52012HFV, BU52013HFV operating  
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and  
10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.  
10  
9
t=3mm  
8
7
t=1mm  
t=2mm  
6
5
4
3
2
1
0
7.6mm 9.2mm  
10.4mm  
0
X
2
4
6
8
10  
12  
14  
16  
18  
20  
Distance between magnet and Hall IC [mm]  
Fig.45  
Magnet material: NEOMAX-44H (material)  
Maker: NEOMAX CO.,LTD.  
Magnet  
t
Y
t
X=Y=4mm  
t=1mm,2mm,3mm  
L: Variable  
…Flux density measuring point  
Magnet size  
Fig.46 Magnet Dimensions and Flux Density Measuring Point  
www.rohm.com  
2010.08 - Rev.C  
15/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Position of the Hall effect IC(Reference)  
HVSOF5  
0.6  
VCSP50L1  
SSON004X1216  
0.6  
0.55  
0.8  
0.8  
0.55  
0.35  
0.2  
0.2  
(UNIT: mm)  
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)  
VCSP50L1 SSON004X1216  
Please avoid having potential overstress from  
PCB material, strength, mounting positions.  
If you had any further questions or concerns,  
please contact your Rohm sales and affiliate.  
HVSOF5  
(UNIT: mm)  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
16/19  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Operation Notes  
1) Absolute maximum ratings  
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or  
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this  
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in  
excess of absolute rating limits.  
2) GND voltage  
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower  
than the potential of all other pins.  
3) Thermal design  
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.  
4) Pin shorts and mounting errors  
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning  
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted  
together, or if shorts occur between the output pin and supply pin or GND.  
5) Positioning components in proximity to the Hall IC and magnet  
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore  
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in  
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and  
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.  
6) Operation in strong electromagnetic fields  
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause  
the IC to malfunction.  
7) Common impedance  
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,  
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or  
capacitor.  
8) GND wiring pattern  
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set  
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes  
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same  
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.  
9) Exposure to strong light  
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such  
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and  
fluorescent light sources was shown to have no significant effect on the IC.  
10) Power source design  
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under  
examine adequate evaluations when designing the power source.  
www.rohm.com  
2010.08 - Rev.C  
17/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
●Ordering part number  
B
U
5
2
0
0
2
G U  
L
-
E
2
Part No.  
Part No.  
52002,52003,  
52012,52013  
Package  
GUL : VSCP50L1  
HFV : HVSOF5  
Packaging and forming specification  
E2: Embossed tape and reel  
(VSCP50L1)  
NVX: SSON004X1216  
TR: Embossed tape and reel  
(HVSOF5, SSON004X1216)  
VCSP50L1(BU52002GUL)  
<Tape and Reel information>  
1PIN MARK  
Tape  
Embossed carrier tape  
3000pcs  
Quantity  
E2  
1.10±0.1  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
S
0.08  
S
φ
4- 0.25±0.05  
0.05  
A B  
A
B
B
A
1
2
0.30±0.1  
0.50  
Direction of feed  
1pin  
Reel  
Order quantity needs to be multiple of the minimum quantity.  
(Unit : mm)  
∗
VCSP50L1(BU52003GUL)  
<Tape and Reel information>  
1PIN MARK  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
E2  
1.10±0.1  
Direction  
of feed  
The direction is the 1pin of product is at the upper left when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
S
0.08  
S
φ
4- 0.25±0.05  
0.05  
A B  
A
B
B
A
1
2
0.30±0.1  
0.50  
Direction of feed  
1pin  
Reel  
(Unit : mm)  
Order quantity needs to be multiple of the minimum quantity.  
∗
HVSOF5  
<Tape and Reel information>  
1.6 0.05  
(0.8)  
(0.3)  
Tape  
Embossed carrier tape  
Quantity  
3000pcs  
1.0 0.05  
TR  
Direction  
of feed  
5
1
4
3
4
5
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
3
2 1  
2
1pin  
0.13 0.05  
S
0.1  
S
0.5  
0.22 0.05  
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
M
0.08  
Reel  
∗
(Unit : mm)  
www.rohm.com  
2010.08 - Rev.C  
18/19  
© 2010 ROHM Co., Ltd. All rights reserved.  
Technical Note  
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV  
SSON004X1216  
<Tape and Reel information>  
1.2 0.1  
Tape  
Embossed carrier tape  
5000pcs  
Quantity  
TR  
Direction  
of feed  
1PIN MARK  
The direction is the 1pin of product is at the upper right when you hold  
reel on the left hand and you pull out the tape on the right hand  
(
)
S
0.08  
S
+0.05  
0.65 0.1  
0.2  
-
0.04  
1
2
4
3
Direction of feed  
Order quantity needs to be multiple of the minimum quantity.  
1pin  
0.75 0.1  
Reel  
(Unit : mm)  
∗
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.08 - Rev.C  
19/19  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
against the possibility of physical injury, fire or any other damage caused in the event of the  
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM  
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed  
scope or not in accordance with the instruction manual.  
The Products are not designed or manufactured to be used with any equipment, device or  
system which requires an extremely high level of reliability the failure or malfunction of which  
may result in a direct threat to human life or create a risk of human injury (such as a medical  
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-  
controller or other safety device). ROHM shall bear no responsibility in any way for use of any  
of the Products for the above special purposes. If a Product is intended to be used for any  
such special purpose, please contact a ROHM sales representative before purchasing.  
If you intend to export or ship overseas any Product or technology specified herein that may  
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to  
obtain a license or permit under the Law.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
R1010  
A

相关型号：

BU52013HFV

 Hall effect Switch
ROHM

BU52013HFV-TL

 Sensor/Transducer, CMOS, 6 Pin, Plastic/epoxy,
ROHM

BU52013HFV-TR

 暂无描述
ROHM

BU52014HFV

 Hall effect Switch
ROHM

BU52014HFV-TR

 Hall Effect Sensor, 0.6mT Min, 5mT Max, 0.20-1.60V, CMOS, Plastic/epoxy, Rectangular, 6 Pin, Surface Mount, ROHS COMPLIANT, HVSOF-5
ROHM

BU52014HFVTR

 MAGNETIC FIELD SENSOR-HALL EFFECT, 0.6-5mT, 0.20-1.60V, RECTANGULAR, SURFACE MOUNT, ROHS COMPLIANT, HVSOF-5
ROHM

BU52015GUL

 Hall effect Switch
ROHM

BU52015GUL-E2

 Hall Effect Sensor, 0.6mT Min, 5mT Max, 0.20-1.60V, Bipolar, Plastic/epoxy, Square, 4 Pin, Surface Mount, ROHS COMPLIANT, VCSP-4
ROHM

BU52021HFV

 Hall effect Switch
ROHM

BU52021HFV-TR

 暂无描述
ROHM

BU52025G

 Hall effect Switch
ROHM

BU52025G-TR

 Hall Effect Sensor, 0.8mT Min, 5.5mT Max, 0.40-2.60V, Plastic/epoxy, Rectangular, 6 Pin, Surface Mount, ROHS COMPLIANT, SSOP-5
ROHM
©2020 ICPDF网 联系我们和版权申明