BU52097GWZ [ROHM]
两极检测霍尔IC用于检测S极或N极的磁场。通过组合本霍尔IC和磁铁，可以实现平板电脑和智能手机的盖开闭检测功能等。;
| 型号： | BU52097GWZ |
| 厂家： | 
ROHM |
| 描述： | 两极检测霍尔IC用于检测S极或N极的磁场。通过组合本霍尔IC和磁铁，可以实现平板电脑和智能手机的盖开闭检测功能等。 手机 智能手机 电脑 |
| 文件： | 总17页 (文件大小：900K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Omnipolar Detection Hall IC
BU52097GWZ
General Description
Key Specifications
The omnipolar detection Hall IC is magnetic switch that
can operate both S-and N-pole.
This Hall IC product can be in tablets, smart phones, and
other applications in order to detect open and close of
the cover.
VDD Voltage Range:
Operate Point:
Hysteresis:
Period:
Average Supply Current:
Output Type:
1.65V to 3.6V
±15.0mT(Typ)
0.9mT(Typ)
50ms(Typ)
4.4µA (Typ)
CMOS
Operating Temperature Range:
-40°C to +85°C
Features
Omnipolar Detection
Package
UCSP35L1
W(Typ) x D(Typ) x H(Max)
0.80mm x 0.80mm x 0.40mm
Micro Power Operation (Small Current Using
Intermittent Operation Method)
Ultra-compact Package
Applications
Tablets, Smart Phones, Notebook Computers,
Digital Video Cameras, Digital Still Cameras, etc.
Typical Application Circuit, and Block Diagram
VDD
0.1µF
Adjust the bypass capacitor value
as necessary, according to voltage
noise conditions, etc.
TIMING
LOGIC
HALL
ELEMENT
×
OUT
GND
Pin Descriptions
Pin Configurations
TOP VIEW
(pads not visible)
Pin No. Pin Name
Function
A1 A2
A1
A2
B1
B2
GND
NC
Ground
Non Connect
Power supply
Output
VDD
B1 B2
OUT
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuit, and Block Diagram...............................................................................................................................1
Pin Descriptions..............................................................................................................................................................................1
Pin Configurations ..........................................................................................................................................................................1
Absolute Maximum Ratings ............................................................................................................................................................3
Recommended Operating Conditions.............................................................................................................................................3
Magnetic, Electrical Characteristics................................................................................................................................................3
Measurement Circuit.......................................................................................................................................................................4
Typical Performance Curves...........................................................................................................................................................5
Figure 5. Operate Point, Release Point vs Ambient Temperature................................................................................................5
Figure 6. Operate Point, Release Point vs Supply Voltage ..........................................................................................................5
Figure 7. Period vs Ambient Temperature....................................................................................................................................5
Figure 8. Period vs Supply Voltage..............................................................................................................................................5
Figure 9. Supply Current vs Ambient Temperature ......................................................................................................................6
Figure 10. Supply Current vs Supply Voltage...............................................................................................................................6
Description of Operations ...............................................................................................................................................................7
Intermittent Operation at Power ON................................................................................................................................................9
Magnet Selection............................................................................................................................................................................9
Position of the Hall Element............................................................................................................................................................9
I/O Equivalence Circuit ...................................................................................................................................................................9
Operational Notes.........................................................................................................................................................................10
Ordering Information.....................................................................................................................................................................12
Marking Diagrams.........................................................................................................................................................................12
Physical Dimension, Tape and Reel Information...........................................................................................................................13
Revision History............................................................................................................................................................................14
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Absolute Maximum Ratings (Ta = 25°C)
Parameter
Power Supply Voltage
Output Current
Symbol
Rating
4.5 (Note 1)
±0.5
Unit
V
VDD
IOUT
Pd
mA
W
Power Dissipation
0.1 (Note 2)
-40 to +85
-40 to +125
Operating Temperature Range
Topr
Tstg
°C
°C
Storage Temperature Range
(Note 1) Not to exceed Pd
(Note 2) Mounted on 24mm x 20mm x 1.6mm glass epoxy board. Reduce 1.00mW per 1°C above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Min
Typ
Max
3.60
Unit
V
Power Supply Voltage
VDD
1.65
1.80
Magnetic, Electrical Characteristics (Unless otherwise specified VDD=1.8V Ta=25°C)
Parameter
Symbol
BopS
BopN
BrpS
BrpN
BhysS
BhysN
Tp
Min
Typ
15.0
-15.0
14.1
-14.1
0.9
0.9
50
Max
Unit
Conditions
-
17.0
Operate Point
mT
-17.0
-
12.1
-
Release Point
Hysteresis
mT
mT
-
-
-
-
-12.1
-
-
Period
100
-
ms
V
VDD
-0.2
Output High Voltage
Output Low Voltage
Supply Current
VOH
-
IOUT=-0.5mA
VOL
-
-
-
0.2
8
V
IOUT=+0.5mA
Average
IDD
4.4
µA
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
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Measurement Circuit
Bop/Brp
Tp
200Ω
VDD
VDD
OUT
VDD
OUT
GND
VDD
100µF
Oscilloscope
V
GND
The period is monitored by an oscilloscope
Figure 2. Tp Measurement Circuit
Bop and Brp are measured by applying an external magnetic
field
Figure 1. Bop,Brp Measurement Circuit
VOH,VOL
VDD
VDD
100µF
OUT
IOUT
GND
V
Figure 3. VOH ,VOL Measurement Circuit
IDD
VDD
2200µF
VDD
OUT
GND
Figure 4. IDD Measurement Circuit
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Typical Performance Curves
18.0
18.0
12.0
6.0
Bop S
Brp S
Ta = 25°C
VDD=1.8V
Bop S
Brp S
12.0
6.0
0.0
0.0
-6.0
-12.0
-18.0
-6.0
Brp N
Brp N
Bop N
-12.0
-18.0
Bop N
3.4
1.4
1.8
2.2
2.6
3.0
3.8
-60 -40 -20
0
20
40
60
80 100
Supply Voltage [V]
Ambient Temperature [°C]
Figure 5. Operate Point, Release Point vs Ambient
Temperature
Figure 6. Operate Point, Release Point vs Supply Voltage
100
100
VDD=1.8V
Ta = 25°C
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
-60 -40 -20
0
20
40
60
80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
Ambient Temperature [°C]
Supply Voltage [V]
Figure 7. Period vs Ambient Temperature
Figure 8. Period vs Supply Voltage
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Typical Performance Curves - continued
20.0
18.0
16.0
14.0
12.0
10.0
8.0
20.0
Ta=25°C
VDD=1.8V
18.0
16.0
14.0
12.0
10.0
8.0
6.0
6.0
4.0
4.0
2.0
2.0
0.0
0.0
-60 -40 -20
0
20
40
60
80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
Ambient Temperature [°C]
Supply Voltage [V]
Figure 9. Supply Current vs Ambient Temperature
Figure 10. Supply Current vs Supply Voltage
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Description of Operations
Micropower Operation (Small Current Consumption Using Intermittent Sensing)
The omnipolar detection Hall IC uses intermittent sensing
IDD
save energy. At startup the Hall elements, amplifier,
comparator, and other detection circuits power on and
magnetic detection begins. During standby, the detection
circuits power off, thereby reducing current consumption.
The detection results are held while standby is active, and
then output.
Period
Startup Time
Standby Time
Peak
Current
Period: Tp
Startup Time: Tp /4096x4 clk
Peak Current: 8mA
t
0
Figure 11. Timing chart of Micropower Operation
(Offset Cancellation)
(Reference data, this is not thing guaranteeing.)
VDD
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a
differential in this bridge resistance, or can arise from
changes in resistance due to package or bonding stress. A
dynamic offset cancellation circuit is employed to cancel this
offset voltage.
When the Hall elements are connected as shown in Figure 12
and a magnetic field is applied perpendicular to the Hall
elements, a voltage is generated at the mid-point terminal of
the bridge. This is known as Hall voltage.
I
＋
B
×
Hall Voltage
Dynamic cancellation switches the wiring (shown in the
figure) to redirect the current flow to a 90° angle from its
original path, and thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then
released.
－
GND
Figure 12. Equivalent circuit of Hall elements
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(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux Direction
Flux Direction
Figure 13. Direction of the detectable magnetic field
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
OUT
N
S
N
S
S
N
Flux
OUT[V]
Flux
High
High
High
Low
Low
Brp S
S-pole
Bop S
Bop N
Brp N
B
0
N-pole
Magnetic Flux Density [mT]
Figure 14. S-pole and N-pole Detection
The omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets
closer to the IC and magnetic density rises to the operate point, the output switches LOW. In LOW output mode, the distance
from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output returns HIGH.
The point where magnetic flux density restores a HIGH output is known as the release point, Brp. This detection and
adjustment mechanism is designed to prevent noise, oscillation, and other erratic system operation.
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Intermittent Operation at Power ON
Power ON
1.65V
VDD
Startup Time
Standby Time
Standby Time
Supply Current
(Intermittent Action)
Indefinite Interval (Max: Tp)
High (Not detected Magnetic Field)
Low (Detected Magnetic Field)
OUT
Figure 15. Timing chart of intermittent operation at Power ON
The omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Figure 15. The IC outputs to the appropriate terminal based on the detection result and maintains the output
condition during the standby period. The output is an indefinite interval from power ON to the first end of startup (Max: Tp).
Magnet Selection
Neodymium and ferrite are major permanent magnets. Neodymium generally offers greater magnetic power per volume than
ferrite, thereby enabling miniaturization of magnet. The larger neodymium magnet is, the stronger magnetic flux density is.
And the farther detection distance is, the weaker it is. Therefore the proper size and detection distance of the magnet should
be determined according to the sensitivity of Hall IC. To increase the magnet’s detection distance, the magnet which is
thicker or larger sectional area is used.
Position of the Hall Element
I/O Equivalence Circuit
(Reference)
OUT
UCSP35L1
0.4
VDD
0.4
OUT
0.25
GND
(UNIT: mm)
Figure 16. Position of the Hall device
Figure 17. I/O Equivalence Circuit
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
15. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip
from being exposed to light.
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Ordering Information
B U 5 2 0 9 7 G W Z -
E 2
Part Number
Package
GWZ:UCSP35L1
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
UCSP35L1 (TOP VIEW)
1PIN MARK
Part Number Marking
H J
LOT Number
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Physical Dimension, Tape and Reel Information
Package Name
UCSP35L1
Unit [mm]
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
3000pcs
E2
Direction of feed
The direction is the pin 1 of product is at the upper left when you
hold reel on the left hand and you pull out the tape on the right
hand
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Revision History
Date
Revision
001
Changes
8.Aug.2016
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
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products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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H2S, NH3, SO2, and NO2
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[h] Use of the Products in places subject to dew condensation
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confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
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Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
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Notice – WE
Rev.001
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