BU52737GWZ [ROHM]
两极检测（极性判别输出）霍尔IC具有S极检测用和N极检测用2种输出，因此可进行极性判别。通过将该霍尔IC与磁铁组合，可以进行智能手机和平板电脑等的保护盖开合检测、无线耳机在保护罩中的存放检测、数码相机等的液晶面板的正反面检测以及旋转方向检测。;
| 型号： | BU52737GWZ |
| 厂家： | 
ROHM |
| 描述： | 两极检测（极性判别输出）霍尔IC具有S极检测用和N极检测用2种输出，因此可进行极性判别。通过将该霍尔IC与磁铁组合，可以进行智能手机和平板电脑等的保护盖开合检测、无线耳机在保护罩中的存放检测、数码相机等的液晶面板的正反面检测以及旋转方向检测。 手机 无线 智能手机 数码相机 电脑 |
| 文件： | 总17页 (文件大小：893K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Omnipolar Detection Hall IC
(Dual Outputs for both S and N Pole Polarity Detection)
BU52737GWZ
General Description
Key Specifications
The omnipolar detection Hall IC incorporating a polarity
determination circuit enables separate operation (output) of
both the South and North poles. Using a magnet and the
Hall IC, detection of open and close of the cover are
possible in smart phones and tablets, and detection of
putting wireless earphones in a case, and detection of
front/back side or rotational direction are possible in digital
cameras and other applications involving display panels.
◼
◼
◼
◼
◼
◼
◼
VDD Voltage Range:
Operate Point:
Hysteresis:
Period:
Supply Current (AVG):
Output Type:
2.5 V to 4.5 V
±15 mT (Typ)
2 mT (Typ)
50 ms (Typ)
0.8 µA (Typ)
CMOS
Operating Temperature Range:
-40 °C to +85 °C
Package
UCSP35L1
W (Typ) x D (Typ) x H (Max)
0.80 mm x 0.80 mm x 0.40 mm
Features
◼
◼
◼
Omnipolar Detection
(OUT1 = S-pole Detection; OUT2 = N-pole Detection)
Micro Power Operation (Small Current Using
Intermittent Operation Method)
Ultra-compact Package
Applications
Smart Phones, Tablets, Wireless Earphones, Notebook
Computers, Digital Cameras, etc.
◼
Typical Application Circuit and Block Diagram
VDD
0.1 µF
TIMING
LOGIC
Adjust the bypass capacitor value as necessary,
ording to power supply noise conditions, etc.
HALL
OUT1
OUT2
ELEMEN
GND
VDD
×
GND
Pin Configuration
Pin Descriptions
Pin
No.
Pin Name
GND
Function
TOP VIEW
GND
OUT2
A1
Ground
A1
A2
B1
B2
OUT2
VDD
Output (Detect to the north pole)
Power supply(Note 1)
Output (Detect to the south pole)
OUT1
B1
OUT1
(Note 1) Dispose a bypass capacitor between VDD and GND.
VDD
〇Product structure: Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Typical Application Circuit and Block Diagram................................................................................................................................1
Pin Descriptions..............................................................................................................................................................................1
Pin Configuration ............................................................................................................................................................................1
Absolute Maximum Ratings ............................................................................................................................................................3
Recommended Operating Conditions.............................................................................................................................................3
Magnetic and Electrical Characteristics..........................................................................................................................................3
Measurement Circuit.......................................................................................................................................................................4
Typical Performance Curves...........................................................................................................................................................5
Figure 5. Operate Point, Release Point vs Ambient Temperature ................................................................................................5
Figure 6. Operate Point, Release Point vs Supply Voltage...........................................................................................................5
Figure 7. Period vs Ambient Temperature ....................................................................................................................................5
Figure 8. Period vs Supply Voltage...............................................................................................................................................5
Figure 9. Supply Current vs Ambient Temperature.......................................................................................................................6
Figure 10. Supply Current vs Supply Voltage ...............................................................................................................................6
Description of Operations ...............................................................................................................................................................7
Intermittent Operation at Power ON..............................................................................................................................................10
Magnet Selection..........................................................................................................................................................................10
Position of the Hall Element..........................................................................................................................................................10
Output Equivalence Circuit ...........................................................................................................................................................10
Operational Notes.........................................................................................................................................................................11
Ordering Information.....................................................................................................................................................................12
Marking Diagram ..........................................................................................................................................................................12
Physical Dimension and Packing Information...............................................................................................................................13
Revision History............................................................................................................................................................................14
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
Output Current
VDD
IOUT
7.0
±0.5
V
mA
W
Power Dissipation
Pd
0.10
Storage Temperature Range
Tstg
-40 to +125
°C
Maximum Junction Temperature
Tjmax
125
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Operating Temperature
Symbol
Min
2.5
-40
Typ
3.0
Max
4.5
Unit
V
VDD
Topr
+25
+85
°C
Magnetic and Electrical Characteristics (Unless otherwise specified VDD = 3.0 V Ta = 25 °C)
Parameter
Symbol
BOPS
BOPN
BRPS
BRPN
BHYSS
BHYSN
tP
Min
Typ
15
-15
13
-13
2
Max
17
-
Unit
Conditions
Output: OUT1
(Detect to the south pole)
-
-17
11
-
Operate Point
mT
Output: OUT2
(Detect to the north pole)
Output: OUT1
(Detect to the south pole)
-
Release Point
Hysteresis
mT
mT
Output: OUT2
(Detect to the north pole)
-11
-
-
-
-
2
-
-
-
Period
-
50
-
100
-
ms
V
VDD
-0.2
Output High Voltage
Output Low Voltage
Supply Current
VOH
IOUT = -0.5 mA
IOUT = +0.5 mA
Average
VOL
-
-
0.2
1.8
V
IDD
-
0.8
µA
(Note) Polarity of Magnetic flux density is defined as positive when south pole side of magnet approaches top surface of the device.
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Measurement Circuit
BOP/BRP
tP
200 Ω
VDD
OUT1
/OUT2
GND
VDD
OUT1
/OUT2
GND
VDD
VDD
100 µF
Oscilloscope
V
The period is monitored by an oscilloscope
Figure 2. tP Measurement Circuit
BOP and BRP are measured by applying an external magnetic
field
Figure 1. BOP, BRP Measurement Circuit
VOH, VOL
VDD
OUT1
/OUT2
GND
VDD
100 µF
IOUT
V
Figure 3. VOH, VOL Measurement Circuit
IDD
VDD
2200 µF
VDD
OUT1
/OUT2
G
Figure 4. IDD Measurement Circuit
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Typical Performance Curves
(Reference data)
20
10
0
20
VDD = 3.0
BOPS
BOPS
Ta = 25 °C
10
0
BRPS
BRPS
BRPN
BRPN
-10
-20
-10
-20
BOPN
BOPN
80 100
-60 -40 -20
0
20
40
60
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Ambient Temperature: Topr [°C]
Supply Voltage: VDD [V]
Figure 5. Operate Point, Release Point vs Ambient
Temperature
Figure 6. Operate Point, Release Point vs Supply Voltage
100
100
Ta = 25 °C
VDD = 3.0
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
-60 -40 -20
0
20
40
60
80 100
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Ambient Temperature: Topr [°C]
Supply Voltage: VDD [V]
Figure 7. Period vs Ambient Temperature
Figure 8. Period vs Supply Voltage
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Typical Performance Curves - continued
(Reference data)
3.0
2.0
1.0
0.0
3.0
Ta = 25 °C
VDD = 3.0
2.0
1.0
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-60 -40 -20
0
20
40
60
80 100
Ambient Temperature: Topr [°C]
Supply Voltage: VDD [V]
Figure 9. Supply Current vs Ambient Temperature
Figure 10. Supply Current vs Supply Voltage
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Description of Operations
Micropower Operation (Small Current Consumption Using Intermittent Sensing)
The omnipolar detection Hall IC uses intermittent
IDD
sensing save energy. At startup, the Hall elements,
amplifier, comparator, and other detection circuits
powered on and magnetic detection begins. During
standby, the detection circuits powered off, thereby
reducing current consumption. The detection results
are held and output during standby time.
Period
Startup Time
Peak
Current
푃푒푟푖표푑: 푡ꢀ [ms]
t
0
ꢁ
ꢂ
푆푡푎푟푡푢푝 푇푖푚푒: 50000x4 [us]
Figure 11. Timing Chart of Micropower Operation
푃푒푎푘 퐶푢푟푟푒푛푡: 1ꢃ [mA]
(Peak Current is reference data. This is not 100 %
tested.)
(Offset Cancellation)
VDD
The Hall elements are shown with an equivalent
Wheatstone (resistor) bridge circuit. Offset voltage may
be generated by a differential in this bridge resistance, or
can arise from changes of resistance due to package or
bonding stress. A dynamic offset cancellation circuit is
employed to cancel this offset voltage.
I
When the Hall elements are connected as shown in
Figure 12 and a magnetic field is applied perpendicular
to the Hall elements, a voltage is generated at the
mid-points of the bridge. This is known as Hall voltage.
Dynamic offset cancellation switches the wiring (shown
in the figure 12) to redirect the current flow to a 90 °
angle from its original path, and thereby cancels the
offset voltage of Hall elements.
B
+
×
Hall Voltage
-
Only the magnetic signal is maintained in the
sample/hold circuit process and then released.
GND
Figure 12. Equivalent Circuit of Hall Elements
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Description of Operations - continued
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux Direction
Flux Direction
Figure 13. Direction of the Detectable Magnetic Field
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
OUT1
N
S
N
S
S
N
Flux Direction
Flux Direction
OUT1 [V]
High
High
High
Low
BRPS
S-pole
BOPS
0
N-pole
Magnetic Flux Density [mT]
Figure 14. S-pole Detection
OUT1 detects only S pole magnetic field. (OUT1 doesn’t detect N pole.)
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Description of Operations - continued
OUT2
N
S
N
S
S
N
Flux Direction
Flux Direction
OUT2 [V]
High
High
B
High
Low
BOPN
BRPN
0
N-pole
S-pole
Magnetic Flux Density [mT]
Figure 15. N-pole Detection
OUT2 detects only N pole magnetic field. (OUT2 doesn’t detect S pole.)
The dual output omnipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package.
When the distance between magnet and Hall IC is far and magnetic flux density is smaller than the operate point (BOP),
output goes HIGH. When the magnet gets closer to the IC and magnetic density rises to the operate point, the output
switches LOW. In LOW output mode, the distance from the magnet to the IC increases again until the magnetic density falls
to a point just below BOP, and output returns HIGH. The point where magnetic flux density restores a HIGH output is known
as the release point, BRP. This detection and adjustment mechanism is designed to prevent noise and other erratic system
operation.
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Intermittent Operation at Power ON
Power ON
2.5 V
VDD
Startup Time
Standby Time
Standby Time
Supply Current
(Intermittent Action)
Indefinite Interval (Max: tP)
High (Not detected Magnetic Field)
Low (Detected Magnetic Field)
OUT1
/OUT2
Figure 16. Timing Chart of Intermittent Operation at Power ON
The omnipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Figure 16. The IC outputs the detection result and maintains the output condition during the standby period. The
output is an indefinite interval from power ON to the first end of startup (Max: tP).
Magnet Selection
Neodymium and ferrite are major permanent magnets. Neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling miniaturization of magnet. The larger neodymium magnet is, the stronger magnetic flux
density is. And the farther detection distance is, the weaker it is. Therefore, the proper size and detection distance of the
magnet should be determined according to the operate point of Hall IC. To increase the magnet’s detection distance, the
magnet which is thicker or larger sectional area is used.
Position of the Hall Element
Output Equivalence Circuit
(Reference)
UCSP35L1 (BU52737GWZ)
0.40
OUT1, OUT2
VDD
0.40
0.25
OUT1
/OUT2
(UNIT: mm)
GND
Figure 17. Position of the Hall Element
Figure 18. Output Equivalence Circuit
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that
will prevent the chip from being exposed to light.
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Ordering Information
B U 5 2 7 3 7 G W Z
-
E 2
Package
GWZ: UCSP35L1
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
UCSP35L1 (BU52737GWZ)
TOP VIEW
1PIN MARK
Part Number Marking
KT
LOT Number
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Physical Dimension and Packing Information
Package Name
UCSP35L1 (BU52737GWZ)
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
6000 pcs
E2
Direction of feed
The direction is the pin 1 of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
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Revision History
Date
Revision
001
Changes
05.Aug.2021
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
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H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.004
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
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General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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