BU6909AGFT [ROHM]

BU6909AGFT是DC无刷风扇电机驱动器系列中内置霍尔元件的5V单相全波风扇电机驱动器。小型封装、Auto gain control（以下简称AGC）功能、基于软开关的静音驱动、控制电池消耗的待机功能等，是适用于笔记本电脑冷却风扇的IC。;


型号：	BU6909AGFT
厂家：	ROHM
描述：	BU6909AGFT是DC无刷风扇电机驱动器系列中内置霍尔元件的5V单相全波风扇电机驱动器。小型封装、Auto gain control（以下简称AGC）功能、基于软开关的静音驱动、控制电池消耗的待机功能等，是适用于笔记本电脑冷却风扇的IC。电池开关电机驱动电脑风扇驱动器
文件：	总21页 (文件大小：1004K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

DC Brushless Fan Motor Driver

5V Single-phase Full-wave

Fan Motor Driver

BU6909AGFT

Description

The BU6909AGFT is a 5V single-phase full-wave FAN motor driver with built in HALL element. It is part of the DC brushless

FAN motor driver series. BU6909AGFT is built in a compact package and provides Auto Gain Control function (AGC), silent

drive by soft switching, and low battery consumption via its standby function. BU6909AGFT is best used for notebook PC

cooling FANs.

Features

Package

TSSOF6

W(Typ) x D(Typ) x H(Max)

2.90mm x 3.80mm x 0.8mm

Built in HALL element

Auto Gain Control function (AGC)

Soft switching drive (PWM type)

Low PWM duty start up

Quick start function

Stand-by mode

Incorporates lock protection and automatic restart

circuit

Compact package (GFT:TSSOF6 flat lead package)

When TSSOF6 is mounted, package thickness is

0.3mm

Rotating speed pulse signal (FG) output

PWM speed control

TSSOF6

Applications

For compact 5V FAN such as notebook PC cooling FAN

Absolute Maximum Ratings

Parameter

Symbol

V_CC

Limit

Unit

Supply Voltage

Power Dissipation

0.54^{(Note 1)}

Operating Temperature

Storage Temperature

Output Voltage

Topr

Tstg

-40 to +85

°C

-55 to +125

V_OMAX

I_OMAX

V_FG

800^{(Note 2)}

Output Current

FG Signal Output Voltage

FG Signal Output Current

Junction Temperature

I_FG

°C

Tjmax

125

(Note 1) Reduce by 5.4mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)

(Note 2) This value is not to exceed Pd.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Recommended Operating Condition

Parameter

Symbol

V_CC

Limit

Unit

Operating Supply Voltage Range

1.8 to 5.5

○Product structure：Silicon monolithic integrated circuit ○This product has no protection against radioactive rays

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Block Diagram

Consider protection against

voltage rise due to reverse

connection of power supply and

back electromotive force.

Page 14.

HALL ELEMENT

OFFSET

This is an open drain output.

Connect a pull-up resistor.

Page 15.

VCC

CANCEL

A/D

CONVERSION

OSCILLATOR

CIRCUIT

GND

PWM

UVLO

TSD

Enables speed control by

applying external PWM signal.

Maximum input frequency is

CONTROL

LOGIC

PRE

DRIVER

H-BRIDGE

50KHz.

Page 10.

OUT1

OUT2

PWM DUTY

LOCK

PROTECTION

SIGNAL OUT

Conventional FAN motor driver IC with HALL element requires

adjustment of HALL bias resistor due to several factors that

affect the HALL Amplitude. This IC automatically adjusts HALL

amplitude through the use of a built in HALL element and unique

(Heat protection circuit)

TSD : Thermal shut down(heat rejection circuit)

UVLO :Under voltage lock outputs (low voltage protection circuit)

AGC function.

Page 8.

Figure 1. Block diagram and Application circuit

Pin Description

Pin No.

Pin Name

Function

FG signal output

GND

OUT1

OUT2

PWM

VCC

Motor output 1

Motor output 2

PWM signal input

Power supply

I/O truth table

・Supply magnetic direction (positive)

・Output operation

V_OUT1

V_OUT2

Marking

B_HYS

B_FWD

B_REV

B_FWD

Magnetic flux density:B

Figure 2. Output operation

Supply magnetic

direction

PWM*

OUT1

OUT2

H(OPEN)

L (Output Tr：ON)

H (Output Tr：OFF)

H(OPEN)

*When PWM terminal is L, IC state changes to stand-by mode. FG terminal is always H in stand-by mode

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Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=5V)

Parameter

Circuit Current 1

Symbol

MIN

TYP

MAX

Unit

Conditions

Characteristics

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

I_CC

mA PWM=OPEN

Circuit Current 2

(stand-by mode)

I_CC

1.5

-1.5

3.0

µA

PWM=GND

Magnetic Switch-point for

Forward Rotation

B_FWD

B_REV

B_HYS

V_PWMH

V_PWML

f_PWM

V_O

Magnetic Switch-point for

Reverse Rotation

Magnetic hysteresis

PWM Input H Level

PWM Input L Level

PWM Input Frequency

Output Voltage

2.5

5.0

V_CC

0.8

kHz

Io=200mA

Upper and Lower total

0.16

0.24

0.4

Figure 8 to 13

Figure 14,15

Figure 16

Figure 17

Figure 18

FG Low Voltage

V_FGL

I_FGL

I_FG=5mA

V_FG=7V

FG Leak Current

µA

Lock Detection ON Time

Lock Detection OFF Time

t_ON

0.35

3.5

0.50

5.0

0.65

6.5

t_OFF

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Typical Performance Curves

100

4.0

3.0

85°C

25°C

-40°C

2.0

85°C

25°C

-40°C

1.0

Operating voltage range

Operating Voltage Range

0.0

Supply voltage : V_CC[V]

Supply Voltage : V_CC[V]

Figure 3. Circuit Current 1

Figure 4. Circuit Current 2 (Stand-by mode)

2.5

2.0

2.5

2.0

1.5

85°C

25°C

-40°C

1.0

0.5

0.0

-0.5

-1.0

-1.5

-2.0

-2.5

-0.5

-1.0

-1.5

-2.0

-2.5

-40°C

25°C

85°C

OOppeerraattininggVvoollttaaggeeRraannggee

Operating voltage range

動作電圧範囲

Supply voltage : V_CC[V]

Figure 5. Magnetic Switch-point for Forward Rotation

Figure 6. Magnetic Switch-point for Reverse Rotation

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Typical Performance Curves - continued

3.0

1.0

0.8

0.6

0.4

0.2

0.0

2.5

85℃

25℃

2.0

-40℃

1.5

85°C

25°C

-40°C

1.0

0.5

Operating voltage range

0.0

0.2

0.4

0.6

0.8

Supply voltage : Vcc [V]

Output current : I_O[A]

Figure 7. Magnetic hysteresis

Figure 8. Output H Voltage

(Temperature Characteristics)

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

1.8V

85°C

25°C

5.0V

5.5V

-40°C

0.0

0.2

0.4

0.6

0.8

0.0

0.2

0.4

0.6

0.8

Output current : I_O[A]

Figure 9. Output H Voltage

(Voltage Characteristics)

Figure 10. Output L Voltage

(Temperature Characteristics)

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Typical Performance Curves - continued

1.0

0.8

0.6

0.4

0.2

0.0

1.8V

0.8

85°C

25°C

-40°C

0.6

0.4

0.2

0.0

5.0V

5.5V

0.0

0.2

0.4

0.6

0.8

0.0

0.2

0.4

0.6

0.8

Output current : I_O[A]

Figure 11. Output L Voltage

(Voltage Characteristics)

Figure 12. Total Output Voltage (Output H and L)

(Temperature Characteristics)

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.8

0.6

0.4

0.2

0.0

1.8V

85°C

5.0V

5.5V

25°C

-40°C

0.0

0.2

0.4

0.6

0.8

FG current : I_FG[mA]

Output current : I_O[A]

Figure 13. Total Output Voltage (Output H and L)

(Voltage Characteristics)

Figure 14. FG Output L Voltage

(Temperature Characteristics)

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Typical Performance Curves - continued

2.0

1.5

1.0

0.5

0.0

0.5

Operating voltage range

1.8V

0.4

0.3

0.2

0.1

0.0

5.0V

5.5V

85°C

25°C

-40°C

Supply voltage : V_CC[V]

FG current : I_FG[mA]

Figure 15. FG Output L Voltage

(Voltage Characteristics)

Figure 16. FG Output Leak Current

1.0

0.8

0.6

0.4

0.2

0.0

85°C

25°C

-40°C

85°C

25°C

-40°C

Operating voltage range

Supply voltage : V_CC[V]

Figure 17. Lock Detection ON Time

Figure 18. Lock Detection OFF Time

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Auto gain control

Conventional FAN motor driver IC with HALL element requires adjustment of HALL bias resistor for acoustic noise

characteristic and motor rotation efficiency because the magnetic field strength and the magnetic field waveform are different

in each motor. This IC automatically controls HALL amplitude generated by built in HALL element and motor magnet

through the use of a unique AGC function. AGC function needs 15 ms to select the required HALL amp gain when turning on

the power, and recovering from stand-by mode and lock protection.(Refer to Figure 23 and 24.)

At starting

( Approach AGC area)

At driving

(AGC control)

HALL signal

( image)

AGC control

Pre – AGC area

Gain up

Indefinite

area

Gain up

[+/-1.5mT]

(Insufficient magnetic force area)

Pre – AGC area

(Best magnetic force area)

Motor start up

(Excess magnetic force area)

Approach AGC area by analog circuit

Precise AGC by digital circuit

VCC

PWM

PWM soft-switching time

OUT1

OUT2

Hall amp gain select time : 15 ms

Figure 19. AGC Image of the Hall signal (In case of weak magnetic field)

After the startup, the Hall signal is increased by Hall amplifier gain. The increased Hall signal is set by the AGC around the

Pre-AGC area, the weak magnetic field of the motor as in Figure 19. To selecting a gain requires about 15ms before it

activates the motor.

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Soft switching (PWM type)

Soft switching is operated using an output PWM pulse. The output PWM signal is generated by the slope of processed

AGC HALL signal. First, the processed AGC HALL signal is converted to absolute waveform. Next, the absolute waveform

and the triangular waveform internally generated by the IC are synthesized. The synthesized waveform determines the

PWM soft switching duty and the ratio of time.

PWM soft switching time depends on motor speed. In case of a slower HALL signal, PWM soft switching time is long due to

the obtuse angle of the processed AGC HALL signal (PWM soft switching time is about 2ms to 4ms.). In case of a faster

HALL signal, PWM soft switching time is short due to the sharp slope of the AGC HALL signal (PWM soft switching time is

about 200µs to 1ms.). And, the triangular wave oscillator inside the IC uses a PWM soft switching frequency of 50kHz

(typical). Hence, input PWM frequency is not equal to PWM soft switching frequency.

(a) The processed AGC HALL signal is converted to absolute waveform

(b) Motor speed is slow

Figure 20. PWM soft switching signal synthesis

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PWM control

Rotation speed of motor can be changed by controlling ON/OFF of the upper output depending on the duty of the input

signal to PWM terminal. When PWM terminal is open, H logic is applied. Output PWM frequency is 50 kHz (Typ). This IC is

not direct PWM. Hence, input PWM frequency is not equal to output PWM frequency. Figure 21 shows the characteristic of

input PWM duty and output PWM duty.

PWM terminal has a built in digital low pass filter (LPF). Output PWM duty has 3.5ms (Max) transitional time from the point

of change in input PWM duty, this is caused by the LPF characteristic (reference is shown in Figure 22). Additionally, Input

PWM uses frequencies above 5 kHz.

100

Input PWM DUTY [%]

Figure 21. Characteristic of input PWM DUTY and output PWM DUTY

Figure 22. Timing chart of PWM control

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Low duty start up function

During motor start up from stop condition, outputs are driven by a PWM signal of about PWM 50% duty for 3 times of

changing magnetic direction. After the low PWM duty start up function, output PWM duty changes corresponding to the

input PWM duty. For cases of input PWM duty range of more than 50%, output PWM duty changes corresponding to same

input PWM duty at all driving time. This function enables the IC to start the motor regardless of input PWM signal’s duty.

When input PWM duty is 0%, the motor is held on stand-by mode. Additionally, the motor changes to idling mode for input

PWM duty range of 0% to 2.5%. Idling mode only runs on circuit current 1 (I_CC1) in the Electrical Characteristics table. Idling

mode turns all output terminals to open state.

(a) Case A : Input PWM DUTY 2.5% to 50%

(b) Case B : Input PWM DUTY 50% to 100%

Figure 23. Low duty start up function

Table 1. Truth table of input PWM duty and each outputs terminals

Input PWM duty [%]

DUTY 0

IC function (state)

OFF (Stand-by mode)

ON (Idle mode)

OUT1, OUT2

OFF, OFF (Open state)

H (Output Tr : OFF)

DUTY 0 < 2.5

(Low duty start up

Case A : DUTY 2.5 to 50

Case B : DUTY 50 to 100

H / L, L / H

H / L

driving)

ON (Normal driving)

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Quick start function

This series has an integrated quick start function. When the PWM signal is input, this function can start up the motor at

once regardless of the detection time of the lock protection function. (Consider HALL amp gain select time. Reference is

shown in Figure 24.)

Stand-by mode

Stand-by function turns off the circuit when the time of PWM=L has elapsed in order to reduce stand-by current. The circuit

current consumption during stand-by mode is specified at the parameter “Circuit current 2” of the electrical characteristics.

Figure 24 shows the timing diagram of stand-by mode and quick start function.

The 0% detection time before the IC changes to stand-by mode is variable depending on the input PWM duty. This is

because of the built in LPF at the PWM terminal. As an example, Figure 25 shows the characteristic curve of 0% detection

time and input PWM duty for a 25kHz input PWM frequency.

Figure 24. Stand-by mode and quick start function

100

0.0

1.0

2.0

3.0

4.0

0% detection time : t₀[ms]

Figure 25. Characteristic curve of 0% detection time and input PWM duty at 25kHz

Lock protection and automatic restart

Motor rotation is detected by HALL signal, while lock detection ON time (t_ON) and lock detection OFF time (t_OFF) are set by

IC internal counter. External part (C or R) is not required. Timing chart is shown in Figure 26.

Figure 26. Lock protection timing chart

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Equivalent circuit

1) Supply voltage terminal

2) PWM signal input terminal

VCC

200kΩ

10kΩ

PWM

GND

3) FG output terminal

4) Motor output terminal

VCC

OUT1

OUT2

GND

HALL position (Reference data)

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Safety measure

1) Reverse connection protection diode

Reverse connection of power results in IC destruction as shown in Figure 27. When reverse connection is possible,

reverse connection protection diode must be added between power supply and VCC.

After reverse connection destruction

In normal energization

Reverse power connection

prevention

VCC

Circuit

block

Each

Circuit

block

Each

Circuit

block

Each

GND

Internal circuit impedance high

Large current flows

→ Thermal destruction

No destruction

→ amperage small

Figure 27. Flow of current when power is connected reversely

2) Protection against VCC voltage rise by back electromotive force

Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse

connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply.

Phase switching

Figure 28. VCC voltage rise by back electromotive force

When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place a

(A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C). (D) Capacitor and resistor can

also be used to have better ESD surge protection.

(A) Capacitor

(B) Zener diode

(D) Capacitor and resistor

Figure 29. Protection against VCC voltage rise

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3) Problem of GND-line PWM switching

Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.

VCC

Motor

Driver

Controller

GND

PWM input

Prohibite

Figure 30. GND Line PWM switching prohibited

4) FG output

FG output is an open drain output and requires pull-up resistor. A VCC voltage that is beyond its absolute maximum

rating when FG output terminal is directly connected to power supply, could damage the IC. The IC can be protected by

adding resistor R1 (as shown in Figure 31).

VCC

Pull-up resistor

Protection resistor

Connector of board

Figure 31. Protection of FG terminal

Thermal derating curve

Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can

be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance

θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,

wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at

a specified condition. Figure 32. shows a thermal derating curve.

0.6

0.5

0.4

0.3

0.2

0.1

0.0

75 100 125 150

℃

AMBIENT TEMPERATURE : Ta [

]

Reduce by 5.4mW/℃ over 25℃.

(70.0mm×70.0mm×1.6mm FR4 glass epoxy board)

Figure 32. Thermal derating curve

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,

pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground

due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below

ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions

such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum

rating, increase the board size and copper area to prevent exceeding the Pd rating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

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Operational Notes – continued

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The

operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical

damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an

input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input terminals

when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the

input terminals have voltages within the values specified in the electrical characteristics of this IC.

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below

the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

Marking Diagrams

TSSOF6(TOP VIEW)

LOT Number

Part Number Marking

1 PIN MARK

www.rohm.com

TSZ02201-0H1H0B101190-1-2

17/18

TSZ22111・15・001

28.Oct.2014 Rev.002

Daattaasshheeeett

BU6909AGFT

Physical Dimension, Tape and Reel Information

Package Name

TSSOF6

www.rohm.com

TSZ22111・15・001

TSZ02201-0H1H0B101190-1-2

28.Oct.2014 Rev.002

18/18

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-GE

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-GE

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BU6909AGFT [ROHM]

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