BU7244YFV-C [ROHM]
本产品是输入/输出全振幅低消耗电流的CMOS运算放大器。工作温度范围大，可实现低电源电压工作，为低输入偏置电流，适用于电池驱动设备及传感器放大器。;
| 型号： | BU7244YFV-C |
| 厂家： | 
ROHM |
| 描述： | 本产品是输入/输出全振幅低消耗电流的CMOS运算放大器。工作温度范围大，可实现低电源电压工作，为低输入偏置电流，适用于电池驱动设备及传感器放大器。 电池 放大器 驱动 运算放大器 传感器 |
| 文件： | 总24页 (文件大小：1253K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Input/Output Rail-to-Rail Low Supply Current
CMOS Operational Amplifier
for Automotive
BU7244YFV-C
General Description
Key Specifications
Operating Supply Voltage Range
Single Supply:
BU7244YFV-C is an input/output rail-to-rail CMOS
operational amplifier that operates on
a
wide
1.8 V to 5.5 V
temperature range and low supply current. It is suitable
for a sensor amplifier and battery-powered equipment
which require low input bias current.
Dual Supply:
±0.90 V to ±2.75 V
Operating Temperature Range: -40 °C to +125 °C
Supply Current:
Input Offset Current:
Input Bias Current:
360 µA (Typ)
1 pA (Typ)
1 pA (Typ)
Features
AEC-Q100 Qualified(Note 1)
Input/Output Rail-to-Rail
Low Operating Supply Voltage
Low Supply Current
Special Characteristic
Input Offset Voltage
-40 °C to +125 °C:
12 mV (Max)
Low Input Bias Current
Wide Operating Temperature Range
(Note 1) Grade 1
Package
W(Typ) x D(Typ) x H(Max)
5.00 mm x 6.40 mm x 1.35 mm
SSOP-B14
Applications
Sensor Amplifiers
Battery-powered Equipment
Automotive Electronics
Pin Description
Pin Configuration
Pin
Pin
Function
No.
Name
(TOP VIEW)
1
2
OUT1
IN1-
Output 1
14
OUT4
OUT1 1
Inverting input 1
Non-inverting input 1
Positive power supply
Non-inverting input 2
Inverting input 2
Output 2
CH1
CH4
-
13 IN4-
12 IN4+
11 VSS
IN1-
IN1+
VDD
IN2+
2
3
4
5
3
IN1+
VDD
IN2+
IN2-
-
+
+
4
5
6
IN3+
IN3-
10
9
7
OUT2
OUT3
IN3-
-
CH2
+
+
-
IN2- 6
CH3
8
Output 3
9
Inverting input 3
Non-inverting input 3
Negative power supply/Ground
Non-inverting input 4
Inverting input 4
Output 4
8 OUT3
7
OUT2
10
11
12
13
14
IN3+
VSS
IN4+
IN4-
OUT4
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
.
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Block Diagram
VDD
VBIAS
IN+
IN-
Class
OUT
AB control
VBIAS
VSS
Figure 1. Block Diagram
Absolute Maximum Ratings (Ta=25 °C)
Rating
Parameter
Symbol
Unit
V
Supply Voltage
VDD-VSS
Pd
7
0.87(Note 2,3)
VDD - VSS
Power Dissipation
W
Differential Input Voltage(Note 4)
Common-mode Input Voltage Range
Input Current
VID
V
VICM
II
(VSS - 0.3) to (VDD + 0.3)
±10
V
mA
°C
°C
Storage Temperature Range
Maximum Junction Temperature
Tstg
Tjmax
-55 to +150
150
Caution 1:Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2:Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2) To use at temperature above Ta=25 C reduce 7.0 mW/°C.
(Note 3) Mounted on an FR4 glass epoxy PCB 70 mm×70 mm×1.6 mm (Copper foil area less than 3 %).
(Note 4) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to more than VSS.
Recommended Operating Conditions
Parameter
Operating Supply Voltage
Operating Temperature
Symbol
Vopr
Min
Typ
Max
Unit
V
1.8
±0.90
3.0
±1.5
5.5
±2.75
Topr
-40
+25
+125
°C
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Electrical Characteristics (Unless otherwise specified VDD=3 V, VSS=0 V, Ta=25 °C)
Limit
Temperature
Parameter
Symbol
Unit
Conditions
Range
Min
Typ
Max
25 °C
Full range
25 °C
-
1
10
Input Offset Voltage(Note 5,6)
Input Offset Current(Note 5)
Input Bias Current(Note 5,6)
VIO
IIO
IB
mV VDD=1.8 V to 5.5 V
-
-
1
12
-
-
pA
pA
pA
-
-
-
25 °C
-
1
300
Full range
25 °C
-
-
6000
-
360
-
750
RL=∞,AV=0 dB,
VIN+=1.5 V
Supply Current(Note 6)
IDD
VOH
VOL
AV
μA
V
Full range
25 °C
-
1200
VDD-0.05
-
-
Maximum Output Voltage (High)(Note 6)
Maximum Output Voltage (Low)(Note 6)
Large Signal Voltage Gain(Note 6)
RL=10 kΩ
RL=10 kΩ
Full range VDD-0.10
-
-
25 °C
Full range
25 °C
-
-
-
VSS+0.05
V
-
VSS+0.10
70
65
0
100
-
-
-
3
-
-
-
-
-
-
-
-
-
-
-
dB RL=10 kΩ
Full range
25 °C
Common-mode Input Voltage Range
Common-mode Rejection Ratio
Power Supply Rejection Ratio
VICM
-
V
-
-
-
CMRR
PSRR
25 °C
45
60
4
70
80
10
-
dB
dB
25 °C
25 °C
Output Source Current(Note 6,7)
Output Sink Current(Note 6,7)
ISOURCE
mA VOUT=VDD-0.4 V
mA VOUT=VSS+0.4 V
Full range
25 °C
2
5
15
-
ISINK
Full range
25 °C
3
Slew Rate
SR
GBW
θ
-
0.4
1
V/μs CL=25 pF
Gain Bandwidth Product
Phase Margin
25 °C
-
MHz CL=25 pF, AV=40 dB
25 °C
-
50
0.05
100
deg CL=25 pF, AV=40 dB
VOUT=0.8 VP-P
f=1 kHz
,
Total Harmonic Distortion + Noise
Channel Separation
THD+N
CS
25 °C
-
%
AV=40 dB,
VOUT=1 Vrms
25 °C
-
dB
(Note 5) Absolute value
(Note 6) Full range: Ta=-40 °C to +125 °C
(Note 7) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
When the output pins are short-circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the
IC.
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Description of Terms in Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols generally used
are also shown. Note that item names and symbols, and their meanings may differ from those on another manufacturer’s or
general documents.
1. Absolute Maximum Ratings
Absolute maximum rating items indicates the condition which must not be exceeded even if it is instantaneous. Applying of a
voltage exceeding the absolute maximum ratings or use outside the temperature range which is provided in the absolute
maximum ratings cause characteristic deterioration or destruction of the IC.
1.1 Supply Voltage (VDD/VSS)
This indicates the maximum voltage that can be applied between the positive power supply pin and the negative
power supply pin without deteriorating the characteristics of internal circuit or without destroying it.
1.2 Differential Input Voltage (VID)
This indicates the maximum voltage that can be applied between the non-inverting input pin and the inverting input
pin without deteriorating the characteristics of the IC or without destroying it.
1.3 Common-mode Input Voltage Range (VICM
)
This indicates the maximum voltage that can be applied to the non-inverting input pin and inverting input pin without
deteriorating the characteristics of the IC or without destroying it. Common-mode Input Voltage Range of the maximum
ratings does not assure normal operation of IC. For normal operation, use the IC within the Common-mode Input Voltage
Range characteristics.
1.4 Power Dissipation (Pd)
This indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25 °C
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
2.1 Input Offset Voltage (VIO)
This indicates the voltage difference between non-inverting and inverting pins. It can be translated as the input
voltage difference required for setting the output voltage at 0 V.
2.2 Input Offset Current (IIO)
This indicates the difference of input bias current between the non-inverting and inverting pins.
2.3 Input Bias Current (IB)
This indicates the current that flows into or out from the input pin. It is defined by the average of input bias currents at
the non-inverting and inverting pins.
2.4 Supply Current (IDD
)
This indicates the current of the IC itself flowing under the specified conditions and under no-load or steady-state
conditions.
2.5 Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL)
This indicates the voltage range of the output under specified load condition. It is typically divided into maximum
output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum
output voltage low indicates the lower limit.
2.6 Large Signal Voltage Gain (AV)
This indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential input voltage)
2.7 Common-mode Input Voltage Range (VICM
)
This indicates the input voltage range where IC normally operates.
2.8 Common-mode Rejection Ratio (CMRR)
This indicates the ratio of fluctuation of input offset voltage when Common-mode Input Voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power Supply Rejection Ratio (PSRR)
This indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.10 Output Source Current/ Output Sink Current (ISOURCE / ISINK
)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
2.11 Slew Rate (SR)
This is a parameter representing the operational speed of the operational amplifier. This indicates the rate at which
the output voltage can change in the specified unit time.
2.12 Gain Band Width (GBW)
This indicates the product of an arbitrary frequency and its gain in the range of the gain slope of 6 dB/octave.
2.13 Phase Margin (θ)
This indicates the margin of phase from the phase delay of 180 degree at the frequency at which the gain of the
operational amplifier is 1.
2.14 Total Harmonic Distortion+Noise (THD+N)
This indicates the content ratio of harmonic and noise components relative to the output signal.
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Typical Performance Curves
1.2
1000
800
600
400
200
0
+125 °C
0.9
0.6
0.3
0.0
+25 °C
-40 °C
0
25
50
75
100
125
150
1
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 2. Power Dissipation vs
Ambient Temperature (Derating Curve)
Figure 3. Supply Current vs Supply Voltage
1000
800
600
400
200
0
6
5
4
3
2
1
0
+125 °C
5.5 V
+25 °C
-40 °C
3.0 V
1.8 V
-50
-25
0
25
50
75
100 125
1
2
3
4
5
6
Supply Voltage [V]
Ambient Temperature [°C]
Figure 4. Supply Current vs Ambient Temperature
Figure 5. Maximum Output Voltage (High) vs
Supply Voltage (RL=10 kΩ)
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
6
20
15
10
5
5.5 V
5
4
3.0 V
3
1.8 V
2
+125 °C
+25 °C
1
0
-40 °C
0
-50
-25
0
25
50
75
100 125
1
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 6. Maximum Output Voltage (High) vs
Figure 7. Maximum Output Voltage (Low) vs
Ambient Temperature (RL=10 kΩ)
Supply Voltage (RL=10 kΩ)
10
8
20
15
10
5
-40 °C
+25 °C
6
+125 °C
4
5.5 V
3.0 V
2
1.8 V
0
0
0.0
0.3
0.6
0.9
1.2
1.5
1.8
-50
-25
0
25
50
75
100 125
Ambient Temperature [°C]
Output Voltage [V]
Figure 8. Maximum Output Voltage (Low) vs
Figure 9. Output Source Current vs Output Voltage
(VDD=1.8 V)
Ambient Temperature (RL=10 kΩ)
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
50
80
70
60
50
40
30
20
10
0
+125 °C
40
+125 °C
30
+25 °C
20
+25 °C
-40 °C
-40 °C
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
1
2
3
4
5
6
Output Voltage [V]
Output Voltage [V]
Figure 10. Output Source Current vs Output Voltage
(VDD=3.0 V)
Figure 11. Output Source Current vs Output Voltage
(VDD=5.5 V)
20
16
12
8
20
16
12
8
-40 °C
+25 °C
5.5 V
+125 °C
3.0 V
1.8 V
4
4
0
0
-50
-25
0
25
50
75
100 125
0
0.3
0.6
0.9
1.2
1.5
1.8
Ambient Temperature [°C]
Output Voltage [V]
Figure 13. Output Sink Current vs Output Voltage
(VDD=1.8 V)
Figure 12. Output Source Current vs
Ambient Temperature (VOUT=VDD-0.4 V)
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
100
80
60
40
20
0
50
+125 °C
+25 °C
40
+125 °C
30
+25 °C
-40 °C
20
-40 °C
10
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0
1
2
3
4
5
6
Output Voltage [V]
Output Voltage [V]
Figure 15. Output Sink Current vs Output Voltage
(VDD=5.5 V)
Figure 14. Output Sink Current vs Output Voltage
(VDD=3.0 V)
40
30
20
10
0
10.0
7.5
5.0
2.5
0.0
5.5 V
+25 °C
+125 °C
-40 °C
-2.5
-5.0
-7.5
-10.0
3.0 V
1.8 V
-50
-25
0
25
50
75
100 125
1
2
3
4
5
6
Supply Voltage [V]
Ambient Temperature [°C]
Figure 16. Output Sink Current vs
Ambient Temperature (VOUT=VSS+0.4 V)
Figure 17. Input Offset Voltage vs Supply Voltage
(VICM=VDD, EK=-VDD/2)
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
10.0
7.5
5.0
2.5
0.0
10.0
7.5
5.0
2.5
0.0
5.5 V
+25 °C
-40 °C
+125 °C
3.0 V
1.8 V
-2.5
-5.0
-2.5
-5.0
-7.5
-10.0
-7.5
-10.0
-1
0
1
2
3
-50
-25
0
25
50
75
100 125
Ambient Temperature [°C]
Input Voltage [V]
Figure 18. Input Offset Voltage vs
Ambient Temperature (VICM=VDD, EK=-VDD/2)
Figure 19. Input Offset Voltage vs Input Voltage
(VDD=1.8 V)
10.0
7.5
10.0
7.5
5.0
5.0
2.5
2.5
+125 °C
+25 °C
0.0
0.0
+25 °C +125 °C
-40 °C
-2.5
-5.0
-7.5
-10.0
-2.5
-5.0
-7.5
-10.0
-40 °C
-1
0
1
2
3
4
5
6
7
-1
0
1
2
3
4
Input Voltage [V]
Input Voltage [V]
Figure 20. Input Offset Voltage vs Input Voltage
(VDD=3.0 V)
Figure 21. Input Offset Voltage vs Input Voltage
(VDD=5.5 V)
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
160
120
80
160
+125 °C
+25 °C
5.5 V
120
1.8 V
3.0 V
-40 °C
80
40
40
0
0
-50
-25
0
25
50
75
100 125
1
2
3
4
5
6
Supply Voltage [V]
Ambient Temperature [°C]
Figure 22. Large Signal Voltage Gain vs
Supply Voltage
Figure 23. Large Signal Voltage Gain vs
Ambient Temperature
120
100
80
60
40
20
0
120
100
80
60
40
20
0
5.5 V
+25 °C
3.0 V
1.8 V
+125 °C
-40 °C
-50
-25
0
25
50
75
100 125
1
2
3
4
5
6
Supply Voltage [V]
Ambient Temperature [°C]
Figure 24. Common-mode Rejection Ratio vs
Supply Voltage
Figure 25. Common-mode Rejection Ratio vs
Ambient Temperature
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Typical Performance Curves - continued
140
120
100
80
2.0
1.5
1.0
0.5
0.0
5.5 V
3.0 V
60
40
1.8 V
20
0
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 26. Power Supply Rejection Ratio vs
Ambient Temperature
Figure 27. Slew Rate(L-H) vs Ambient Temperature
2.0
1.5
1.0
0.5
0.0
100
200
Phase
Gain
2
80
60
40
20
0
160
120
80
40
0
5.5 V
3.0 V
1.8 V
3
4
5
6
7
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
10 10 10 10 10 10
-50
-25
0
25
50
75
100 125
Frequency [Hz]
Ambient Temperature [°C]
Figure 29. Voltage Gain/Phase vs Frequency
(VDD=3.0 V)
Figure 28. Slew Rate(H-L) vs Ambient Temperature
(Note) The above characteristics are measurements of typical sample, they are not guaranteed.
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Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, VICM, VRL, Unit: V
EK VICM VRL Calculation
Parameter
VF
SW1 SW2 SW3 VDD
VSS
0
Input Offset Voltage
VF1
VF2
VF3
VF4
VF5
VF6
VF7
ON
ON
ON OFF
3
3
-1.5
-0.5
-2.5
3
-
1
2
Large Signal Voltage Gain
ON
ON
0
0
0
1.5
1.5
0
3
Common-mode Rejection Ratio
(Common-mode Input Voltage Range)
ON
ON
ON OFF
ON OFF
3
-1.5
-
-
3
4
1.8
5.5
-0.90
-2.75
Power Supply Rejection Ratio
0
- Calculation -
|VF1|
1+RF/RS
1. Input Offset Voltage (VIO)
=
=
[V]
VIO
ΔEK × (1+RF/RS)
2. Large Signal Voltage Gain (AV)
Av
[dB]
20Log
|VF2-VF3|
ΔVICM × (1+RF/RS)
=
=
20Log
20Log
3. Common-mode Rejection Ratio (CMRR) CMRR
[dB]
|VF4 - VF5|
ΔVDD × (1+ RF/RS)
4. Power Supply Rejection Ratio (PSRR)
PSRR
[dB]
|VF6 - VF7|
0.1 μF
RF=50 kΩ
500 kΩ
SW1
VDD
0.01 μF
+15 V
EK
RS=50 Ω
RI=1 MΩ
VOUT
500 kΩ
0.015 μF
DUT
0.015 μF
SW3
NULL
-15 V
1000 pF
RI=1 MΩ
RS=50 Ω
50 kΩ
RL
VRL
VICM
V
VF
SW2
VSS
Figure 30. Test Circuit 1
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Application Information - continued
Switch Condition for Test Circuit 2
Parameter
Supply Current
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON
Maximum Output Voltage (High/Low)
Output Current
Slew Rate
Gain Bandwidth Product
SW3
R2=100 kΩ
SW4
●
VDD
－
＋
SW2
SW1
SW8 SW9 SW10 SW11SW12
VSS
SW5 SW6 SW7
R1=1 kΩ
RL
VRL
CL
VIN-
VIN+
VOUT
Figure 31. Test Circuit 2
Output Voltage
Input Voltage
V
/ Δ t
SR =
Δ
3 V
3 V
90%
ΔV
3 V P-P
10%
0 V
0 V
t
t
Δ t
Input Wave
Output Wave
Figure 32. Slew Rate
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Application Information – continued
1.
Unused Circuits
When there are unused op-amps, it is recommended that they are connected as in Figure 33, set the non-inverting
input pin to a potential within the Common-mode Input Voltage Range (VICM).
VDD
Potential
within VICM
VICM
VSS
Figure 33. Example of Application Circuit
for Unused Op-amp
2.
Input Voltage
Applying VSS-0.3V to VDD+0.3V to the input pin is possible without causing deterioration of the electrical characteristics
or destruction. However, this does not ensure normal circuit operation. Note that the circuit operates normally only
when the input voltage is within the common mode input voltage range of the electric characteristics.
3.
4.
5.
6.
Power Supply (Single/Dual)
The operational amplifier operates when the voltage supplied is between the VDD and VSS pin. Therefore, the single
supply operational amplifiers can be used as dual supply operational amplifiers as well.
Latch-up
Do not set the voltage of the input/output pin to VDD or more and VSS or less because there is a possibility of latch-up
state peculiar to the CMOS device. Also, be careful that the abnormal noise and etc. are not added to the IC.
Decoupling Capacitor
Insert the decoupling capacitance between VDD and VSS, for stable operation of operational amplifier.
If a decoupling capacitor is not inserted, malfunction may occur due to power supply noise.
Start-up the Supply Voltage
This IC has ESD protection diode between input pin and the VDD and VSS pin. When apply the voltage to input pin
before start-up the supply voltage, then a current flows in VDD or VSS pin through this diode. The current is
depending on applied voltage. This phenomena causes breakdown the IC or malfunction. Therefore, give a special
consideration to input pin protection and start-up order of supply voltage.
Also, after turning on the power supply, this IC outputs High level voltage regardless of the state of input up to around
1 V of the start-up voltage of the circuit. Pay attention to the sequence of turning on the power supply and the etc.,
because there is a possibility of the set malfunction.
7.
Output Capacitor
When the VDD pin is shorted to the VSS(GND) potential with the electric charge accumulated in the external
capacitor connected to the output pin, the accumulated electric charge passes through the parasitic element or
protective element inside the circuit and is discharged to the VDD pin, the elements inside the circuit may be
damaged.(Thermal destruction)
If use this IC as an application circuit which does not cause the oscillation phenomenon due to output capacitive load
(e.g., a voltage comparator not constituting a negative feedback circuit), the capacitor connected to the output pin
should be 0.1 µF or less in order to prevent the damage of IC due to accumulated charge of it.
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Application Information – continued
8.
Oscillation by Output Capacitor
When designing an application circuit which constitutes a negative feedback circuit using this IC, check sufficiently
about oscillation by capacitive load.
When the amplifier is used with a full feedback loop, a capacitive load must be up to 100 pF because there is a risk of
oscillation.
The following figures show the frequency characteristics for each load capacitance.
50
40
30
20
10
0
20
10
0
150 pF
100 pF
5 pF
-10
-20
150 pF
100 pF
5 pF
105
Frequency [Hz]
103
104
105
106
107
103
104
106
107
Frequency [Hz]
Figure 34. Voltage Gain vs Frequency
(VDD=3.0 V, GV=40 dB)
Figure 35. Voltage Gain vs Frequency
(VDD=3.0 V, GV=0 dB)
70
60
50
40
30
20
10
0
70
60
50
40
30
20
10
0
10
100
1000
10
100
1000
Load Capacitance [pF]
Load Capacitance [pF]
Figure 36. Phase Margin vs Load Capacitance
(VDD=3.0 V, GV=40 dB)
Figure 37. Phase Margin vs Load Capacitance
(VDD=3.0 V, GV=0 dB)
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8. Oscillation by Output Capacitor – continued
The following figure shows an improved circuit example of the frequency characteristics due to the output capacitor.
Figure 38. Improvement Circuit Example 1
Figure 39. Improvement Circuit Example 2
20
10
0
20
10
0
RL=0 Ω
RL=0 Ω
RL=500 Ω
RL=500 Ω
RL=1 kΩ
RL=1 kΩ
-10
-20
-10
-20
103
104
105
106
107
103
104
105
106
107
Frequency [Hz]
Frequency [Hz]
Figure 40. Voltage Gain vs Frequency
(VDD=3.0 V, GV=0 dB, CL=100 pF, Circuit: Figure38)
Figure 41. Voltage Gain vs Frequency
(VDD=3.0 V, GV=0 dB, CL=100 pF, Circuit: Figure39)
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Examples of Circuit
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VDD
OUT
VOUT=VIN
IN
VSS
Figure 42. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VDD
R1
IN
OUT
VOUT=-(R2/R1)VIN
This circuit has input impedance equal to R1.
VSS
Figure 43. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (VOUT) is in-phase with
the input voltage (VIN) and is shown in the next
expression.
VDD
VSS
OUT
VOUT=(1 + R2/R1)VIN
IN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
Figure 44. Non-inverting Amplifier Circuit
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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Physical Dimension and Packing Information
Package Name
SSOP-B14
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Ordering Information
B U
7
2
4
4
Y
F
V
-
C E
2
Package
Part Number
BU7244YFV
Product Rank
C: for Automotive
FV:SSOP-B14
Packaging and forming specification
E2: Embossed Tape and Reel
Marking Diagram
SSOP-B14(TOP VIEW)
Part Number Marking
7244C
LOT Number
Pin 1 Mark
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Revision History
Date
Revision
001
Changes
27.Dec.2017
06.Aug.2019
New Release
002
Fix Pin Configuration.
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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