BU7264YFV-C [ROHM]
BU7264YFV-C是输入/输出全振幅低电压动作的CMOS运算放大器。工作温度范围大，可实现低电源电压工作，为低输入偏置电流，适用于传感器放大器、发动机控制单元、EPS、ABS等各类车载用途。;
| 型号： | BU7264YFV-C |
| 厂家： | 
ROHM |
| 描述： | BU7264YFV-C是输入/输出全振幅低电压动作的CMOS运算放大器。工作温度范围大，可实现低电源电压工作，为低输入偏置电流，适用于传感器放大器、发动机控制单元、EPS、ABS等各类车载用途。 放大器 运算放大器 传感器 |
| 文件： | 总22页 (文件大小：1492K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Operational Amplifier
Automotive Input/Output Full Swing
Low Voltage Operating
CMOS Operational Amplifier
BU7264YFV-C
General Description
Key Specifications
BU7264YFV-C is an input/output full swing low voltage
operating CMOS operational amplifier. This device has a
wide operating temperature range and low voltage
operation.
Operating Supply Voltage Range
Single Supply:
1.8 V to 5.5 V
±0.90 V to ±2.75 V
Dual Supply:
Operating Temperature Range: −40 °C to +125 °C
Also, it is suitable for a sensor amplifier, engine control
unit, electric power steering, anti-lock braking system and
so on because it has features of low input bias current.
Supply Current:
Input Offset Current:
Input Bias Current:
1.1 mA (Typ)
1 pA (Typ)
1 pA (Typ)
Features
Package
W (Typ) x D (Typ) x H (Max)
5.0 mm x 6.4 mm x 1.35 mm
AEC-Q100 Qualified(Note 1)
Input/Output Full Swing
Low Operating Supply Voltage
High Slew Rate
SSOP-B14
Low Input Bias Current
Wide Operating Temperature Range
(Note 1) Grade 1
Applications
Engine Control Unit
Electric Power Steering (EPS)
Anti-lock Braking System (ABS)
Automotive Electronics
Simplified Schematic
VDD
VBIAS
+IN
-IN
Class
OUT
AB control
VBIAS
VSS
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BU7264YFV-C
Pin Configuration
(TOP VIEW)
OUT1
-IN1
OUT4
-IN4
+IN1
VDD
+IN2
-IN2
+IN4
VSS
+IN3
-IN3
OUT2
OUT3
Pin Description
Pin No.
Pin Name
OUT1
Function
1
2
Output 1
Inverting input 1
Non-inverting input 1
-IN1
+IN1
VDD
+IN2
-IN2
3
4
Positive power supply
Non-inverting input 2
Inverting input 2
Output 2
5
6
7
OUT2
OUT3
-IN3
8
Output 3
9
Inverting input 3
Non-inverting input 3
Negative power supply/Ground
Non-inverting input 4
Inverting input 4
Output 4
10
11
12
13
14
+IN3
VSS
+IN4
-IN4
OUT4
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BU7264YFV-C
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VDD - VSS
)
VS
VID
7
V
V
V
Differential Input Voltage(Note 1)
VS
Common-mode Input Voltage Range
VICMR
(VSS - 0.3) to (VDD + 0.3)
Input Current
II
±10
-55 to +150
150
mA
°C
Storage Temperature Range
Maximum Junction Temperature
Tstg
Tjmax
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VSS or more.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SSOP-B14
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
159.6
13
92.8
9
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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BU7264YFV-C
Recommended Operating Conditions
Parameter
Symbol
Min
1.8
Typ
3.0
Max
5.5
Unit
Single Supply
Dual Supply
Supply Voltage (VDD - VSS
)
VS
V
±0.90
-40
±1.50
+25
±2.75
+125
Operating Temperature
Topr
°C
Electrical Characteristics (Unless otherwise specified VS = 3 V, VSS = 0 V)
Limit
Temperature
Parameter
Symbol
VIO
Unit
mV
Conditions
Range
Min
Typ
1
Max
25 °C
−40 °C to +125 °C
25 °C
-
11
VS = 1.8 V to 5.5 V
Absolute Value
Input Offset Voltage
-
-
14
Input Offset Current
Input Bias Current
IIO
IB
-
1
-
pA
pA
Absolute Value
Absolute Value
25 °C
-
1
-
25 °C
-
1.1
-
2.3
RL = ∞, AV = 0 dB,
V+IN = 1.5 V
Supply Current
IDD
VOH
VOL
AV
mA
V
−40 °C to +125 °C
25 °C
-
3.5
VDD − 0.05
-
-
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
RL = 10 kΩ
RL = 10 kΩ
RL = 10 kΩ
−40 °C to +125 °C VDD − 0.10
-
-
25 °C
−40 °C to +125 °C
25 °C
-
-
-
VSS + 50
mV
dB
-
VSS + 100
70
65
0
95
-
-
-
3
-
-
-
-
-
-
-
-
-
−40 °C to +125 °C
25 °C
Common-mode Input
Voltage Range
Common-mode Rejection
Ratio
Power Supply Rejection
Ratio
VICMR
CMRR
PSRR
-
V
-
-
-
25 °C
45
60
4
60
80
10
-
dB
dB
25 °C
25 °C
Output Source Current(Note 1)
IOH
mA
mA
VOUT = VDD − 0.4 V
VOUT = VSS + 0.4 V
−40 °C to +125 °C
25 °C
2
5
12
-
Output Sink Current(Note 1)
IOL
−40 °C to +125 °C
25 °C
3
Slew Rate
SR
GBW
θ
-
1.1
2
V/μs CL = 25 pF
Gain Bandwidth Product
Phase Margin
25 °C
-
MHz CL = 25 pF, AV = 40 dB
deg CL = 25 pF, AV = 40 dB
25 °C
-
50
Total Harmonic Distortion +
Noise
VOUT = 0.8 VP-P
f = 1 kHz
,
THD+N
CS
25 °C
25 °C
-
-
0.05
100
-
-
%
AV = 40 dB,
VOUT = 1 Vrms
Channel Separation
dB
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-
circuited continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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BU7264YFV-C
Typical Performance Curves
VSS = 0 V
3.5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta = +125 °C
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VS = 5.5 V
VS = 3.0 V
Ta = +25 °C
Ta = -40 °C
VS = 1.8 V
0
1
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
6
5
4
3
2
1
0
6
5
4
3
2
1
0
VS = 5.5 V
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
VS = 3.0 V
VS = 1.8 V
-50 -25
0
25
50
75 100 125 150
1
2
3
4
5
6
Ambient Temperature: Ta [℃]
Supply Voltage: VS [V]
Figure 3. Output Voltage High vs Supply Voltage
(RL = 10 kΩ)
Figure 4. Output Voltage High vs Ambient Temperature
(RL = 10 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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BU7264YFV-C
Typical Performance Curves - continued
VSS = 0 V
10
8
10
8
Ta = +125 °C
6
6
VS = 5.5 V
VS = 3.0 V
4
4
Ta = +25 °C
2
2
VS = 1.8 V
Ta = −40 °C
0
0
-50 -25
0
25
50
75 100 125 150
1
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [℃]
Figure 6. Output Voltage Low vs Ambient Temperature
(RL = 10 kΩ)
Figure 5. Output Voltage Low vs Supply Voltage
(RL=10 kΩ)
20
16
12
8
50
40
30
20
10
0
VS = 5.5 V
Ta = −40 °C
Ta = +25 °C
Ta = +125 °C
VS = 3.0 V
VS = 1.8 V
4
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [℃]
Output Voltage: VOUT [V]
Figure 8. Output Source Current vs Ambient
Figure 7. Output Source Current vs Output Voltage
(VS = 3.0 V)
Temperature
(VOUT = VDD - 0.4 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
40
30
20
10
0
80
Ta = −40 °C
60
Ta = +25 °C
VS = 5.5 V
40
Ta = +125 °C
VS = 3.0 V
VS = 1.8 V
20
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [℃]
Output Voltage: VOUT [V]
Figure 9. Output Sink Current vs Output Voltage
(VS = 3.0 V)
Figure 10. Output Sink Current vs Ambient
Temperature
(VOUT = VSS + 0.4 V)
5.0
4.0
5.0
4.0
VS = 5.5 V
VS = 3.0 V
3.0
3.0
Ta = +125 °C
Ta = +25 °C
2.0
2.0
1.0
1.0
0.0
0.0
VS = 1.8 V
Ta = -40 °C
-1.0
-2.0
-3.0
-4.0
-5.0
-1.0
-2.0
-3.0
-4.0
-5.0
-50 -25
0
25
50
75 100 125 150
1
2
3
4
5
6
Ambient Temperature: Ta [℃]
Supply Voltage: VS [V]
Figure 11. Input Offset Voltage vs Supply Voltage
(VICM = VS / 2, EK = -VS / 2)
Figure 12. Input Offset Voltage vs Ambient Temperature
(VICM = VS / 2, EK = -VS / 2)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
10.0
7.5
10.0
7.5
5.0
5.0
2.5
2.5
Ta = +125 °C
Ta = +125 °C
0.0
0.0
Ta = +25 °C
Ta = +25 °C
-2.5
-2.5
-5.0
-7.5
-10.0
Ta = −40 °C
Ta = -40 °C
-5.0
-7.5
-10.0
-1
0
1
2
3
-1
0
1
2
3
4
Common-mode Input Voltage: VICM [V]
Common-mode Input Voltage: VICM [V]
Figure 13. Input Offset Voltage vs Common-mode Input
Figure 14. Input Offset Voltage vs Common-mode Input
Voltage
(VS = 3.0 V)
Voltage
(VS = 1.8 V)
160
10.0
7.5
120
80
40
0
5.0
Ta = -40 °C
2.5
Ta = +25 °C
0.0
Ta = +125 °C
-2.5
-5.0
-7.5
-10.0
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
-1
0
1
2
3
4
5
6
7
1
2
3
4
5
6
Common-mode Input Voltage: VICM [V]
Supply Voltage: VS [V]
Figure 16. Large Signal Voltage Gain vs Supply Voltage
Figure 15. Input Offset Voltage vs Common-mode Input
Voltage
(VS = 5.5 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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TSZ22111 • 15 • 001
BU7264YFV-C
Typical Performance Curves - continued
VSS = 0 V
100
80
60
40
20
0
160
VS = 5.5 V
120
Ta = -40 °C
VS = 3.0 V
VS = 1.8 V
80
Ta = +25 °C
Ta = +125 °C
40
0
1
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [℃]
Figure 17. Large Signal Voltage Gain vs Ambient
Temperature
Figure 18. Common-mode Rejection Ratio vs Supply
Voltage
140
120
100
80
100
80
60
40
20
0
VS = 5.5 V
VS = 3.0 V
VS = 1.8 V
60
40
20
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [℃]
Ambient Temperature: Ta [℃]
Figure 20. Power Supply Rejection Ratio vs Ambient
Temperature
Figure 19. Common-mode Rejection Ratio vs Ambient
Temperature
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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TSZ22111 • 15 • 001
BU7264YFV-C
Typical Performance Curves - continued
VSS = 0 V
5.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VS = 5.5 V
VS = 3.0 V
VS = 5.5 V
4.0
VS = 3.0 V
3.0
2.0
VS = 1.8 V
VS = 1.8 V.
1.0
0.0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [℃]
Ambient Temperature: Ta [℃]
Figure 21. Slew Rate (L to H) vs Ambient Temperature
Figure 22. Slew Rate (H to L) vs Ambient Temperature
80
60
40
20
0
180
Phase
135
90
45
0
Gain
102
103
104
105
106
107
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
Frequency: f [Hz]
Figure 23. Voltage Gain/Phase vs Frequency
(VS = 3.0 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, VICM, VRL, Unit: V
Parameter
VF
SW1 SW2 SW3 VDD
VSS
0
EK
VICM VRL Calculation
Input Offset Voltage
VF1
VF2
VF3
VF4
VF5
VF6
VF7
ON
ON
ON OFF
3
3
-1.5
-0.5
-2.5
3
-
1
2
Large Signal Voltage Gain
ON
ON
0
0
0
1.5
1.5
0
3
Common-mode Rejection Ratio
(Common-mode Input Voltage Range)
ON
ON
ON OFF
ON OFF
3
-1.5
-
-
3
4
1.8
5.5
-0.90
-2.75
Power Supply Rejection Ratio
0
- Calculation -
ȁ
ȁ
푉퐹1
[V]
푉 =
퐼푂
1. Input Offset Voltage (VIO)
Τ
ꢀ + 푅퐹 푅푆
ሺ
Τ ሻ
∆퐸퐾 × ꢀ + 푅퐹 푅푆
[dB]
퐴ꢁ = 20 × log
2. Large Signal Voltage Gain (AV)
ȁ
ȁ
푉퐹ꢂ − 푉퐹3
ሺ
Τ ሻ
∆푉퐼ꢃꢄ × ꢀ + 푅퐹 푅푆
3. Common-mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
퐶푀푅푅 = 20 × log
푃ꢅ푅푅 = 20 × log
[dB]
ȁ
ȁ
푉퐹4 − 푉퐹5
ሺ
Τ ሻ
∆푉퐷퐷 × ꢀ + 푅퐹 푅푆
[dB]
ȁ
ȁ
푉 − 푉퐹7
퐹6
0.1 μF
RF = 50 kΩ
SW1
500 kΩ
0.01 μF
VDD
15 V
EK
VOUT
RS = 50 Ω
RI = 1 MΩ
500 kΩ
0.015 μF
0.015 μF
DUT
SW3
NULL
-15 V
1000 pF
RI = 1 MΩ
SW2
RS = 50 Ω
50 kΩ
RL
V
VICM
VF
VRL
VSS
Figure 24. Test Circuit 1
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BU7264YFV-C
Application Information - continued
Switch Condition for Test Circuit 2
Parameter
Supply Current
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
OFF OFF ON OFF OFF OFF ON OFF ON OFF OFF ON
ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON
Maximum Output Voltage (High/Low)
Output Current
Slew Rate
Gain Bandwidth Product
SW3
R2 = 100 kΩ
SW4
VDD
SW2
SW1
SW8 SW9 SW10 SW11 SW12
VSS
SW5 SW6 SW7
R1 = 1 kΩ
RL
VRL
CL
VIN-
VIN+
VOUT
Figure 25. Test Circuit 2
Output Voltage
Input Voltage
V
SR= Δ / Δt
3 V
3 V
90 %
ΔV
3 VP-P
10 %
0 V
0 V
t
t
Δ t
Input Wave
Output Wave
Figure 26. Slew Rate
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15.May.2020 Rev.001
12/19
BU7264YFV-C
Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage due to high input impedance
and low output impedance. Computation for output
voltage is shown below.
VDD
VOUT
VIN
푉푂푈푇 = 푉
퐼푁
VSS
Figure 27. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage (VOUT). The
output voltage is shown in the next expression.
VDD
RIN
VIN
푅퐹
VOUT
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
This circuit has input impedance equal to RIN.
VSS
Figure 28. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of RIN and RF. The output voltage (VOUT) is in-phase with
the input voltage and is shown in the next expression.
VDD
VSS
푅퐹
VOUT
푉푂푈푇 = (ꢀ +
) 푉
퐼푁
푅퐼푁
VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
Figure 29. Non-inverting Amplifier Circuit
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TSZ22111 • 15 • 001
TSZ02201-0GEG2G500040-1-2
15.May.2020 Rev.001
13/19
BU7264YFV-C
I/O Equivalence Circuits
Pin No.
Pin Name
Pin Description
Equivalence Circuit
4
1
7
8
OUT1
OUT2
OUT3
OUT4
Output
1, 7, 8, 14
14
11
4
2
3
5
6
9
10
12
13
-IN1
+IN1
+IN2
-IN2
-IN3
+IN3
+IN4
-IN4
2, 3,
5, 6,
9, 10,
Input
12, 13
11
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GEG2G500040-1-2
15.May.2020 Rev.001
14/19
BU7264YFV-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GEG2G500040-1-2
15.May.2020 Rev.001
15/19
BU7264YFV-C
Operational Notes – continued
10. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply
voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages
within the values specified in the electrical characteristics of this IC.
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ02201-0GEG2G500040-1-2
© 2020 ROHM Co., Ltd. All rights reserved.
16/19
TSZ22111 • 15 • 001
15.May.2020 Rev.001
BU7264YFV-C
Ordering Information
B U
7
2
6
4
Y
F V
-
C E
2
Package
Product Rank
FV: SSOP-B14
C: for Automotive
Packaging and Forming Specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B14 (TOP VIEW)
Part Number Marking
7264C
LOT Number
Pin 1 Mark
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GEG2G500040-1-2
15.May.2020 Rev.001
17/19
BU7264YFV-C
Physical Dimension and Packing Information
Package Name
SSOP-B14
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GEG2G500040-1-2
15.May.2020 Rev.001
18/19
BU7264YFV-C
Revision History
Date
Revision
001
Changes
15.May.2020
New Release.
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© 2020 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GEG2G500040-1-2
15.May.2020 Rev.001
19/19
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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