BU8254KVT-E2_技术文档

LVDS Interface ICs

35bit LVDS Transmitter

35:5 Serializer

BU8254KVT

No.13057ECT06

●Description

LVDS Interface IC of ROHM "Serializer" "Deserializer" operate from 8MHz to 150MHz wide clock range, and number of bits

range is from 35 to 70. Data is transmitted seven times (7X) stream and reduce cable number by 3(1/3) or less. The

ROHM's LVDS has low swing mode to be able to expect further low EMI.

●Features

1) 35bits data of parallel LVCMOS level inputs are converted to five channels of LVDS data stream.

2) 30bits of RGB data and 5bits of timing and control data(HSYNC,VSYNC,DE,CNTL1,CNTL2) are transmitted up to

784Mbps effective rate per LVDS channel.

3) Support clock frequency from 8MHz up to 112MHz.

4) Support consumer video format including 480i, 480P, 720P and 1080i as well.

5) Clock edge selectable

6) Power down mode

7) Support spread spectrum clock generator.

8) Support reduced swing LVDS for low EMI.

9) 30bit LVDS receiver is recommended to use BU90R104.

●Applications

Flat Panel Display

●Precaution

■This chip is not designed to protect from radioactivity.

■The chip is made strictly for the specific application or equipment.

Then it is necessary that the unit is measured as need.

■This document may be used as strategic technical data which subjects to COCOM regulations.

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2013.06 - Rev.C

1/17

Technical Note

BU8254KVT

●Block Diagram

LVCMOS Input

LVDS Output

＋

－

Data Clocks

PLL

CLKIIN

(8～112MHz)

TCLK P/N

(8～112MHz)

7

＋

－

Parallel to Serial

TA P/N

TA6-TA0

7

＋

－

TB P/N

TB6-TB0

TC6-TC0

TD6-TD0

TE6-TE0

＋

－

Parallel to Serial

TC P/N

＋

－

TD P/N

＋

－

TE P/N

RS

RF

XRST

Fig.1 Block Diagram

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2013.06 - Rev.C

2/17

Technical Note

BU8254KVT

●TQFP64V Package Outline and Specification

Product No.

BU8254KVT

Lot No.

1PIN MARK

Fig.2 TQFP64V Package Outline and Specification

www.rohm.com

2013.06 - Rev.C

3/17

Technical Note

BU8254KVT

●Pin configuration

TB6

TC0

VDD

TC1

TC2

TC3

TC4

GND

TC5

TC6

TDO

RF

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

LVDS GND

TAN

32

31

30

29

28

27

26

25

TAP

TBN

TBP

LVDS VDD

LVDS GND

TCN

64-Pin TQFP

(Top View)

TCP

24

23

22

21

20

19

18

17

TCLKN

TCLKP

TDN

TDP

TD1

TD2

TD3

TD4

TEN

TEP

LVDS GND

Fig.3 Pin Diagram (Top View)

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2013.06 - Rev.C

4/17

Technical Note

BU8254KVT

●Pin Description

Table 1 : Pin Description

Pin Name

Pin No.

30,31

28,29

24,25

20,21

18,19

22,23

Type

LVDS OUT

IN

Descriptions

TAP, TAN

TBP, TBN

LVDS data out.

LVDS clock out.

TCP, TCN

TDP, TDN

TEP, TEN

TCLKP, TCLKN

TA0～TA6

TB0～TB6

TC0～TC6

TD0～TD6

TE0～TE6

XRST

33,34,35,36,37,38,40

41,42,44,45,46,48,49

50,52,53,54,55,57,58

59,61,62,63,64,1,3

4,5,6,8,9,11,16

IN

Pixel data inputs.

IN

H : Normal operation,

13

IN

L : Power down (all outputs are Hi-Z)

LVDS swing mode, V_REF^*1select.

Small Swing

Input Support

RS

LVDS Swing

V_DD

0.6～1.4V

GND

350mV

200mV

N/A

RS-V_REF

N/A

RS

43

IN

*1 V_REFis Input Reference Voltage.

Input clock triggering edge select.

H : Rising edge, L : Falling edge.

RF

60

IN

VDD

51,7

Power

IN

Power supply pins for LVCMOS inputs and digital core.

Clock input.

CLKIN

12

GND

2,10,39,47,56

Ground

Power

Ground

Power

Ground

Ground pins for LVCMOS inputs and digital core.

Power supply pins for LVDS outputs.

Ground pins for LVDS outputs.

LVDS VDD

LVDS GND

PLLVDD

PLLGND

27

17,26,32

15

Power supply pin for PLL core.

14

Ground pins for PLL core.

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2013.06 - Rev.C

5/17

Technical Note

BU8254KVT

●Electrical characteristics

■Rating

Table 2 : Absolute Maximum Ratings

Parameter

Ratings

Symbol

Units

Min

-0.3

Max

4.0

Supply Voltage

V_DD

V_IN

V

Input Voltage

-0.3

-55

V_DD+0.3

125

Output Voltage

V_OUT

Tstg

V

Storage Temperature Range

℃

Table 3 : Package Power

PACKAGE

Power Dissipation (mW)

De-rating (mW/℃) ^*1

700

7.0

TQFP64V

1000^*2

10.0^*2

*1:

*2:

At temperature Ta >25℃

Package power when mounting on the PCB board.

The size of PCB board

:70×70×1.6(mm³)

The material of PCB board :The FR4 glass epoxy board.(3% or less copper foil area)

(It is recommended to apply the above package power requirement to PCB board

when the small swing input mode is used)

Table 4 : Recommended Operating Conditions

Ratings

Typ

Parameter

Supply Voltage

Symbol

V_DD

Units

Conditions

Min

3.0

Max

3.6

3.3

V

VDD,LVDSVDD,PLLVDD

Clock frequency

from 8MHz up to 90MHz

-40

0

-

85

70

℃

Operating

Temperature Range

Topr

Cock frequency

from 90MHz up to 112MHz

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2013.06 - Rev.C

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Technical Note

BU8254KVT

■DC characteristics

Table 5 : LVCMOS DC Specifications (VDD=3.0V～3.6V, Ta=-40℃～85℃)

Rating

Parameter

Symbol

Units

Conditions

Min

_DD×0.8

GND

_DD×0.8

GND

1.2

Typ

Max

V_DD

_DD×0.2

V_DD

0.2

High Level Input Voltage

Low Level Input Voltage

High Level Input Voltage

Low Level Input Voltage

Small Swing Voltage

V_IH

V_IL

V

-

V

exclude RS pin

-

V

V_IHRS

V_ILRS

-

RS pin

-

*1

V_DDQ

-

2.8

V

-

Input Reference Voltage

V_REF

-

V_DDQ/2

-

Small Swing(RS=V_DDQ/2)

V_REF=V_DDQ/2

Small Swing High Level

Input Voltage

V_DDQ/2

+200mV

*2

V_SH

-

V

Small Swing Low Level

Input Voltage

V_DDQ/2

-200mV

*2

V_SL

-

V

V_REF=V_DDQ/2

Input Current

I_INC

±10

µA

0V ≤ V_IN≤ V_DD

*1: V_DDQvoltage defines max voltage of small swing input. It is not an actual input voltage.

*2: Small swing signal is applied to TA[6:0], TB[6:0], TC[6:0], TD[6:0] TE[6:0], CLKIN.

Table 6 : LVDS Transmitter DC Specifications(VDD=3.0V～3.6V, Ta=-40℃～85℃)

Rating

Parameter

Symbol

Units

Conditions

Min

250

Typ

350

Min

450

Normal swing

mV

V

RS=V_DD

Differential Output Voltage

V_OD

RL=100Ω

Reduced swing

100

200

300

35

RS=GND

Change in VOD between

complementary output states

ΔV_OD

V_OC

-

Common Mode Voltage

1.125

1.25

1.375

35

RL=100Ω

Change in VOC between

complementary output states

ΔV_OC

I_OS

-

mV

mA

µA

Output Short Circuit Current

Output TRI-STATE Current

-24

V_OUT=0V, RL=100Ω

XRST=0V,

V_OUT=0V to V_DD

I_OZ

±10

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2013.06 - Rev.C

7/17

Technical Note

BU8254KVT

■Supply Current

Table 7 : Supply Current

Rating

Typ

Parameter

Symbol

Units

mA

Conditions

Min

-

Max

-

RL=100Ω,CL=5pF

V_DD=3.3V,RS=V_DD

Gray Scale Pattern

57

42

f=85MHz

Transmitter Supply

Current

I_TCCG

RL=100Ω,CL=5pF

V_DD=3.3V,RS=GND

Gray Scale Pattern

-

mA

µA

RL=100Ω,CL=5pF

V_DD=3.3V,RS=V_DD

Worst Case pattern

62

45

-

f=85MHz

Transmitter Supply

Current

I_TCCW

RL=100Ω,CL=5pF

V_DD=3.3V,RS=GND

Worst Case pattern

-

Transmitter Power Down

Supply Current

I_TCCS

10

XRST=L

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2013.06 - Rev.C

8/17

Technical Note

BU8254KVT

Gray Scale Pattern

CLKOUT

Rx0

Rx1

Rx2

Rx3

Rx4

Rx5

Rx6

X=A,B,C,D,E

Fig.4 Gray scale pattern

Worst Case Pattern (Maximum Power condition)

CLKOUT

Rx0

Rx1

Rx2

Rx3

Rx4

Rx5

Rx6

X=A,B,C,D,E

Fig.5 Worst Case Pattern

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2013.06 - Rev.C

9/17

Technical Note

BU8254KVT

■AC characteristics

Table 8 : Switching Characteristics

Parameter

Symbol

t_TCIT

t_TCP

Min

Typ

Max

Units

ns

ms

CLK IN Transition time

CLK IN Period

-

5.0

8.93

-

0.5t_TCP

t_TCP

-

125.0

CLK IN High Time

t_TCH

0.35t_TCP

0.65t_TCP

CLK IN Low Time

t_TCL

0.35t_TCP

0.65t_TCP

CLK IN to TCLK+/-Delay

LVSMOS Data Set up to CLK IN

LVCMOS Data Hold from CLK IN

LVDS Transition Time

Output Data Position 0

Output Data Position 1

Output Data Position 2

Output Data Position 3

Output Data Position 4

Output Data Position 5

Output Data Position 6

Phase Locked Loop Set Time

t_TCD

-

2.5

0

-

t_TS

t_TH

-

t_LVT

-

0.6

1.5

+0.2

t_TOP1

t_TOP0

t_TOP6

t_TOP5

t_TOP4

t_TOP3

t_TOP2

t_TPLL

-0.2

0.0

tTCP

-0.2

+0.2

7

tTCP

2

3

4

5

6

-0.2

2

3

4

5

6

+0.2

7

tTCP

-0.2

3

+0.2

7

tTCP

-0.2

4

+0.2

7

tTCP

-0.2

5

+0.2

7

tTCP

-0.2

6

+0.2

7

-

10.0

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2013.06 - Rev.C

10/17

Technical Note

BU8254KVT

●AC Timing

■AC Timing Diagrams

LVCMOS Input

90%

CLKIN

10%

t_TCIT

LVCMOS Output

LVDS Output

V_diff=(TAP)-(TAN)

TAP

80%

20%

80%

20%

V_diff

RL

TAN

t_LVT

LVDS Output Load

t_LVT

LVCMOS Input

t_TCP

t_TCH

RF=L

RF=H

CLKIN

V_DD/2

V

_DD/2

V_DD/2

t_TCL

t_TH

t_TS

V_DD/2

Tx0-Tx6

t_TCD

TCLKP

TCLKN

V_OC

Fig.6 AC Timing Diagrams

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2013.06 - Rev.C

11/17

Technical Note

BU8254KVT

■Small Swing Inputs

t_TCP

t_TCH

RF=L

RF=H

CLKIN

V

/2

V

/2

V

/2

V

REF

DDQ

t_TCL

t_TH

t_TS

V

DDQ

V

/2

V

/2

DDQ

V

DDQ

REF

GND

Tx0-Tx6

t_TCD

TCLKP

TCLKN

V_OC

Fig.7 Small Swing Inputs

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2013.06 - Rev.C

12/17

Technical Note

BU8254KVT

■AC Timing Diagrams

TCLK OUT

(Differential)

TA6

TB6

TC6

TD6

TE6

TA5

TB5

TC5

TD5

TE5

TA4

TB4

TC4

TD4

TE4

TA3

TB3

TA2

TB2

TA1

TB1

TC1

TD1

TE1

TA0

TB0

TC0

TD0

TE0

TAP/N

TBP/N

TCP/N

TDP/N

TEP/N

TC3 TC2

TD3 TD2

TE3

TE2

Previous Cycle

t_TOP1

Next Cycle

t_TOP0

t_TOP6

t_TOP5

t_TOP4

t_TOP3

t_TOP2

Fig.8 AC Timing Diagrams

■Phase Locked Loop Set Time

2.0V

XRST

3.6V

3.0V

t_TPLL

V_DD

CLKIN

V_diff=0V

TCLKP/N

Fig.9 Phase Locked Loop Set Time

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2013.06 - Rev.C

13/17

Technical Note

BU8254KVT

●System Timing Requirement

System Timing Requirement is mandatory by following two methods.

①The method of using CR circuit.( In the case that CLK does not stop after power supply)

②The method of using external specific IC. (In the case that CLK turns on/off after power supply)

It is recommend to do enough examination for target application.

①The method of using CR circuit.( In the case that CLK does not stop after power supply)

V ^DD

PVDD

LVDD

VDD

schottky barrier diode

10KΩ

220Ω

2.2µF

td

XRS

Be careful of temperature of

the capacitor especially over

and again.

B characteristic ceramics and

polymer aluminum

Recommend

after VDD up

,

XRST

CLK

Recommend

after VDD up and before XRST release

are recommended.

If unused connect to GND

td is approximately equal to 20ms when the left RC coleus are applied.

Fig.10 The method of using CR circuit.

②

The method of using external specific IC. (In the case that CLK turns on/off after power supply)

PVDD

LVDD

VDD

V_DD

external specific

IC

XRST

CLK

VOUT

Recommend

after CLK input

Recommend

after VDD up

VIN

XRST

CLK

Recommend

before XRST release

Recommend

after VDD up and before XRST release

GND

(CLK monitor and RST signal generation)

Fig.11 The method of using external specific IC.

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2013.06 - Rev.C

14/17

Technical Note

BU8254KVT

●10bit LVCMOS Level Input

Example:

BU8254KVT: LVCMOS level input/Falling edge/Normal swing

BU90R104: Falling edge

VDD

*1

F.Bead

VDD

GND

VDD

GND

LVDS VDD

LVDD

LGND

0.1uF

0.01uF

0.1uF

0.01uF

0.1uF

0.01uF

CLKIN

R4

CLKIN

TA0

TA1

TA2

TA3

TA4

TA5

TA6

TB0

TB1

TB2

TB3

TB4

TB5

TB6

TC0

TC1

TC2

TC3

TC4

TC5

TC6

TD0

TD1

TD2

TD3

TD4

TD5

TD6

TE0

TE1

TE2

TE3

TE4

TE5

TE6

CLKOUT

RA0

RA1

RA2

RA3

RA4

RA5

RA6

RB0

RB1

RB2

RB3

RB4

RB5

RB6

RC0

RC1

RC2

RC3

RC4

RC5

RC6

RD0

RD1

RD2

RD3

RD4

RD5

RD6

RE0

RE1

RE2

RE3

RE4

RE5

RE6

CLKOUT

R4

LVDS GND

R5

R6

R7

PLL VDD

PLL GND

PVDD

PGND

R8

R9

G4

0.1uF

0.01uF

0.1uF

0.01uF

G5

G6

G7

TAN

TAP

RA-

G8

100Ω

G9

RA+

B4

B5

TBN

RB-

B6

B7

TBP

RB+

B8

B9

TCN

RC-

HSYNC

VSYNC

DE

HSYNC

VSYNC

DE

TCP

RC+

R2

TCLKN

RCLK-

RCLK+

RD-

R3

BU8254KVT

BU90R104

G2

TCLKP

TDN

G3

B2

B3

OPEN

R0

TDP

RD+

R0

R1

G0

G1

B0

B1

R1

TEN

RE-

G0

G1

TEP

RE+

B0

B1

OPEN

XRST

PD

OE

PD

OE

100Ωtwist

pair Cable

or

VDD

RS

*2

PCB trace

0.1uF

DK

R/F

PCB(Transmitter)

PCB(Receiver)

*1 :

Recommended Parts:

F.Bead : BLM18A-Series (Murata Manufacturing)

*2 If RS pin is tied to VDD, LVDS swing is 350m V.

If RS pin is tied to GND, LVDS swing is 200m V.

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2013.06 - Rev.C

15/17

Technical Note

BU8254KVT

●10bit Small Swing Input

Example:

BU8254KVT : LVCMOS level input/Falling edge/Normal swing

BU90R104: Falling edge

VDD

*3

F.Bead

VDD

GND

VDD

GND

LVDS VDD

LVDD

LGND

0.1uF

0.01uF

0.1uF

0.01uF

CLKIN

R4

CLKIN

TA0

TA1

TA2

TA3

TA4

TA5

TA6

TB0

TB1

TB2

TB3

TB4

TB5

TB6

TC0

TC1

TC2

TC3

TC4

TC5

TC6

TD0

TD1

TD2

TD3

TD4

TD5

TD6

TE0

TE1

TE2

TE3

TE4

TE5

TE6

CLKOUT

RA0

RA1

RA2

RA3

RA4

RA5

RA6

RB0

RB1

RB2

RB3

RB4

RB5

RB6

RC0

RC1

RC2

RC3

RC4

RC5

RC6

RD0

RD1

RD2

RD3

RD4

RD5

RD6

RE0

RE1

RE2

RE3

RE4

RE5

RE6

CLKOUT

R4

LVDS GND

R5

R6

R7

PLL VDD

PLL GND

PVDD

PGND

R8

R9

G4

0.1uF

0.01uF

0.1uF

0.01uF

G5

G6

G7

TAN

TAP

RA-

G8

100Ω

G9

RA+

B4

B5

TBN

RB-

B6

B7

TBP

RB+

B8

B9

TCN

RC-

HSYNC

VSYNC

DE

HSYNC

VSYNC

DE

TCP

RC+

R2

TCLKN

RCLK-

RCLK+

RD-

R3

BU8254KVT

BU90R104

G2

TCLKP

TDN

G3

B2

B3

OPEN

TDP

RD+

R0

R1

G0

G1

B0

B1

R0

R1

G0

G1

B0

B1

TEN

RE-

TEP

RE+

OPEN

XRST

PD

OE

PD

OE

100Ωtwist

pair Cable

or

*4

RS

*4

PCB trace

DK

R/F

PCB(Transmitter)

PCB(Receiver)

*3 : Recommended Parts:

F.Bead : BLM18A-Series (Murata Manufacturing)

*4 : RS pin acts as VREF input pin when input voltage is set to half of high level signal input.

We recommend to locate by-pass condenser near the RS pin.

V_DD

R1 15k

R2 5.6k

RS pin

C1=0.1uF

Example for LVCMOS(1.8V input)(R1,R2)=(1.5kΩ,5.6kΩ)

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2013.06 - Rev.C

16/17

Technical Note

BU8254KVT

●Ordering Part Number

B U

8 2 5 4

K V T

Part No.

Package

KVT: TQFP64V

Packaging and forming specification

None:Tray

TQFP64V

12.0±0.3

10.0±0.2

Container

Quantity

Tray (with dry pack)

1000pcs

48

33

Direction of feed Direction of product is fixed in a tray

49

32

1pin

64

17

1

16

0.125±0.1

0.1

0.5

0.2 ± 0.1

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

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2013.06 - Rev.C

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Daattaasshheeeett

Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BU8254KVT-E2
厂家：	ROHM
描述：	Line Driver, 1 Func, 5 Driver, PQFP64, ROHS COMPLIANT, TQFP-64 驱动接口集成电路驱动器
文件：	总20页 (文件大小：446K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BU8254KVT-E2 [ROHM]

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