BV2HM050EFV-C (新产品)

Datasheet

Automotive IPD Series

2ch High Side Switch

BV2HM050EFV-C

General Description

Key Specifications

◼ Power Supply Voltage Operating Range: 6 V to 28 V

BV2HM050EFV-C is

a 2ch high side switch for

automotive application. It has a built in hiccup mode

overcurrent protection function, thermal shutdown

protection function, open load detection function, under

voltage lockout function. It is equipped with diagnostic

output function for abnormality detection.

◼ ON-Resistance (Tj = 25 °C):

◼ Overcurrent Value:

◼ Standby Current (Tj = 25 °C):

◼ Active Clamp Energy (Tj = 25 °C):

50 mΩ (Typ)

5 A (Min)

0.5 µA (Max)

140 mJ

Package

HTSSOP-B20

W (Typ) x D (Typ) x H (Max)

Features

6.5 mm x 6.4 mm x 1.0 mm

◼ AEC-Q100 Qualified^{(Note 1)}

◼ Built in Hiccup Mode Overcurrent Protection Function

(OCP)

◼ Built-in Thermal Shutdown Protection Function (TSD)

◼ Built-in Open Load Detection Function (OLD)

◼ Built-in Under Voltage Lockout Function (UVLO)

◼ Low On-Resistance R_ON= 50 mΩ (Typ)

◼ Monolithic Power Management IC with the Control

Block (CMOS) and Power MOSFET Mounted on a

Single Chip

(Note 1) Grade1

HTSSOP-B20

Application

◼ Resistance Load, Inductance Load and Capacitance

Load for Automotive Application

Typical Application Circuit

C

VBB

ROLD1

OUT1

VBB

+B

ROLD2

RIN1

IN1

R_GND

GND

load1

DI

RST1

MCU

ST1

OUT2

R_ST2

ST2

IN2

OUT2

RIN2

OUT2

load2

Figure 1. Application Circuit

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Contents

General Description........................................................................................................................................................................1

Features..........................................................................................................................................................................................1

Application ......................................................................................................................................................................................1

Key Specifications ..........................................................................................................................................................................1

Package..........................................................................................................................................................................................1

Typical Application Circuit ...............................................................................................................................................................1

Contents .........................................................................................................................................................................................2

Pin Configuration ............................................................................................................................................................................3

Pin Description................................................................................................................................................................................3

Block Diagram ................................................................................................................................................................................4

Definition.........................................................................................................................................................................................4

Absolute Maximum Ratings ............................................................................................................................................................5

Recommended Operating Conditions.............................................................................................................................................6

Thermal Resistance........................................................................................................................................................................6

Electrical Characteristics...............................................................................................................................................................10

Typical Performance Curves.........................................................................................................................................................11

Measurement Circuits...................................................................................................................................................................16

Measurement Conditions for Time Items ......................................................................................................................................19

Timing Chart .................................................................................................................................................................................20

Description of Blocks ....................................................................................................................................................................20

Applications Example ...................................................................................................................................................................23

I/O Equivalence Circuits................................................................................................................................................................24

Operational Notes.........................................................................................................................................................................25

Ordering Information.....................................................................................................................................................................27

Marking Diagram ..........................................................................................................................................................................27

Physical Dimension and Packing Information...............................................................................................................................28

Revision History............................................................................................................................................................................29

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Pin Configuration

(TOP VIEW)

VBB

N.C.

IN1

1

2

20

19

18

17

16

15

14

13

12

11

OUT1

N.C.

3

GND

ST1

N.C.

ST2

IN2

4

5

EXP-PAD

VBB

6

N.C.

7

OUT2

8

9

N.C.

10

Figure 2. Pin Configuration

Pin Description

Pin No.

Pin Name

VBB

N.C.

IN1

Function

1

Power input pin, switch input pin

2

-

3

Channel 1 Input pin. Pull-down resistor is connected internally.

4

GND

ST1

Ground pin

5

Ground pin

6

Channel 1 Self-diagnostic output pin

7

N.C.

ST2

-

8

9

Channel 2 Self-diagnostic output pin

IN2

Channel 2 Input pin. Pull-down resistor is connected internally.

10

N.C.

OUT2

N.C.

OUT1

VBB

-

11 to 14

15

Channel 2 Switch output pin

-

16

-

17 to 20

EXP-PAD

Channel 1 Switch output pin

Power input pin, switch input pin

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Block Diagram

VBB

Channel2

Channel1

Gate Control

CLK

IN1

IN2

CChhaarrggee

PPuummpp

Clamp

GGaattee

Driver

lnternal

supply

Protect

Control

Hiccup Control

for OCP

OUT2

OUT1

OCP

OLD

ST1

ST2

TSD

UVLO

GND

Figure 3. Block Diagram

Definition

I_BB

VBB

V_DS1, V_DS2

I_OUT1, I_OUT2

I_IN1, I_IN2

IN1, IN2

OUT1, OUT2

V_OUT1, V_OUT2

V_BB

IST1, I^ST2

ST1, ST2

V_ST1, V_ST2

V_IN1, V_IN2

GND

I_GND

Figure 4. Voltage and Current Definition

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_DS

Rating

-0.3 to Internal clamp^{(Note 1)}

-0.3 to +40

Unit

V

VBB - OUT Voltage

Power Supply Voltage

Input Voltage

V_BB

V

V_IN1, V_IN2

I_IN1, I_IN2

V_ST1,V_ST2

I_OUT1,I_OUT2

Tj

-0.3 to +7.0

V

Input Current

-2.0 to +2.0

mA

V

Diagnostic Output Voltage

Output Current

-0.3 to +7.0

(Note 2)

11.0 (Overcurrent Value I_OC

-40 to +150

)

A

Junction Temperature Width

Storage Temperature Range

Maximum Junction Temperature

°C

Tstg

-55 to +150

Tjmax

150

Active Clamp Energy^{(Note 3) (Note 4)}

(Single Pulse, Tj = 25 °C)

E_AS

140

65

mJ

V

Active Clamp Energy^{(Note 3) (Note 4)}

(Single Pulse, Tj = 150 °C)

Supply Voltage for Short Circuit Protection

V_BBLIM

28

(Note 4) (Note 5)

(Note 1) Internally limited by output clamp voltage.

(Note 2) When overcurrent flows, output is turned off. (Output self-restarts after a certain time.)

(Note 3) Maximum active clamp energy using Single Pulse of I_OUT(START)= 2 A and V_BB= 14 V.

(Note 4) Not 100 % tested.

(Note 5) Maximum power supply voltage that can detect short circuit protection.

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:

1

푉_퐵퐵

퐸_퐿= × ꢀ × 퐼_{푂푈푇 푆푇퐴푅푇}^ꢁ× ꢂ1 −

ꢃ

(

)

2

푉_퐵퐵− 푉_퐷푆

Where:

ꢀ is the inductance of the inductive load.

퐼_{푂푈푇(푆푇퐴푅푇)}is the output current at the time of turning off.

The BV2HM050EFV-C integrates the active clamp function to internally absorb the reverse energy E_Lwhich is generated when the inductive load is

turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy E_Lis active

clamp energy E_AS(refer to Figure 5. Active Clamp Energy vs Output Current) or under when inductive load is used.

1000

Tj_(start)= 25 °C

100

Tj_(start)= 150 °C

10

0.5

1.0

2.0

4.0 5.0

Output Current : I_OUT[A]

Figure 5. Active Clamp Energy vs Output Current

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Recommended Operating Conditions

Parameter

Symbol

Min

Typ

Max

Unit

V_BB

6

14

28

V

Operating Power Supply Voltage

Operating Temperature

Topr

-40

+25

+150

°C

Operating Frequency

(Input Voltage 50 % Duty)

f_IN

-

1

kHz

Thermal Resistance^{(Note 1)}

Parameter

Typ

Unit

Condition

Symbol

HTSSOP-B20

108.1

42.4

33.1

°C/W

1s^{(Note 2)}

2s^{(Note 3)}

Between Junction and Surroundings Temperature

Thermal Resistance

θ_JA

2s2p^{(Note 4)}

(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV2HM050EFV-C

(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)

(Top copper foil: ROHM recommended footprint + wiring to measure, 2 oz. copper.)

(Note 3) JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layer (2s)

(Top copper foil: ROHM recommended Footprint + wiring to measure

Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side) 2 oz.)

(Note 4) JESD51-5 / -7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)

(Top copper foil: ROHM recommended Footprint + wiring to measure

2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm, copper (top & reverse side / inner layers) 2 oz / 1 oz.)

■

PCB Layout 1 layer (1s)

Footprint

100 mm²

600 mm²

1200 mm²

Figure 6. PCB Layout 1 layer (1s)

Dimension

Value

Board finish thickness

Board dimension

Board material

1.57 mm

76.2 mm x 114.3 mm

FR4

Copper thickness

Copper foil area

0.070 mm (Cu: 2oz)

Footprint / 100 mm²/ 600 mm²/ 1200 mm²

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Thermal Resistance – continued

■

PCB Layout 2 layers (2s)

Top Layer

Bottom Layer

Top Layer

Bottom Layer

via

Cross Section

Figure 7. PCB Layout 2 layers (2s)

Dimension

Value

1.60 mm

Board finish thickness

Board dimension

76.2 mm x 114.3 mm

FR4

Board material

Copper thickness (Top / Bottom layers)

Thermal vias separation / diameter

0.070 mm (Cu: 1oz + Plating)

1.2 mm / 0.3 mm

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Thermal Resistance – continued

■

PCB Layout 4 layers (2s2p)

Top Layer

2nd / Bottom Layer

3rd Layer

Top Layer

2nd Layer

3rd Layer

Bottom Layer

Isolation Clearance Diameter ≥ 0.6 mm

via

Cross Section

Figure 8. PCB Layout 4 layers (2s2p)

Dimension

Value

1.60 mm

Board finish thickness

Board dimension

76.2 mm x 114.3 mm

FR4

Board material

Copper thickness (Top / Bottom layers)

Copper thickness (Inner layers)

Thermal vias separation / diameter

0.070 mm (Cu: 1oz + Plating)

0.035 mm

1.2 mm / 0.3 mm

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Thermal Resistance – continued

■

Transient Thermal Resistance (Single Pulse)

1000

100

10

1

1s_Footprint

0.1

0.01

2s

2s2p

0.0001

0.001

0.01

0.1

1

10

100

1000

Pulse Time [s]

Figure 9. Transient Thermal Resistance

■

Thermal Resistance (θ_JAvs Copper foil area- 1s)

120

100

80

60

40

20

0

200

400

600

800

1000

1200

Copper Foil Area (1s) [mm²]

Figure 10. Thermal Resistance

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Electrical Characteristics (unless otherwise specified V_BB= 6 V to 28 V, Tj = -40 °C to +150 °C)

Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

Max

[Power Supply]

Standby Current

V_BB= 14 V, V_IN= 0 V,

V_OUT= 0 V, Tj = 25 °C

I_BBL1

I_BBL2

I_BBH

-

0.5

20

10

μA

V_BB= 14 V, V_IN= 0 V,

V_OUT= 0 V, Tj = 150 °C

V_BB= 14 V, V_IN= 5 V,

V_OUT= Open

5

mA

Operating Current

UVLO Detection Voltage

UVLO Hysteresis Voltage

[Input (V_IN1, V_IN2) ]

V_UVLO

-

5.0

1.0

V

V_UVHYS

High Level Input Voltage

Low Level Input Voltage

Input Hysteresis Voltage

High Level Input Current

Low Level Input Current

[Power MOS Output]

V_INH

V_INL

V_HYS

I_INH

2.1

-

V

-

0.9

-

0.3

50

-

V

-

150

+10

μA

V_IN= 5 V

V_IN= 0 V

I_INL

-10

R_ON1

R_ON2

-

50

-

65

115

90

mΩ

μA

V_BB= 8 V to 18 V, Tj = 25 °C

V_BB= 8 V to 18 V, Tj = 150 °C

V_BB= 6 V, Tj = 25 °C

-

Output ON Resistance

-

R_ON3

-

0.5

20

V_IN= 0 V, V_OUT= 0 V, Tj = 25 °C

V_IN= 0 V, V_OUT= 0 V, Tj = 150 °C

I_OUTL1

I_OUTL2

SR_ON

SR_OFF

t_OUTON

t_OUTOFF

V_DSCLP

Output Leak Current

-

0.05

-

μA

0.20

70

50

0.50

160

55

V/μs V_BB= 14 V, R_L= 6.5 Ω

Output Slew Rate when ON

Output Slew Rate when OFF

Output Propagation Delay Time when ON

Output Propagation Delay Time when OFF

Output Clamp Voltage

μs

V

V_BB= 14 V, R_L= 6.5 Ω

V_IN= 0 V, I_OUT= 10 mA

-

45

[Diagnostics]

V_STL

I_STL

-

0.5

10

V

I_ST= 1 mA

V_ST= 5 V

Diagnostic Output Low Voltage

Diagnostic Output Leak Current

µA

Diagnostic Output Propagation Delay Time

when ON

Diagnostic Output Propagation Delay Time

when OFF

t_STON

10

50

100

500

µs

t_STOFF

125

300

[Protection Circuit]

I_OC

t_OCON

t_OCOFF

V_OLD

I_OLD

5

-

8

11

40

A

µs

ms

V

V_OUT= 0 V

Overcurrent Value

10

2.5

3.0

20

Overcurrent Detection ON Time

Overcurrent Detection OFF Time

Open Load Detection Voltage

Open Load Detection Sink Current

1.0

2.0

-

4.0

60

µA

V_IN= 0 V, V_OUT= 5 V

Thermal Shutdown Detection Temperature

T_TSDDET

T_TSDREL

T_TSDHYS

160

150

-

185

-

210

°C

(Note 1)

Thermal Shutdown Release Temperature

-

(Note 1)

Thermal Shutdown Hysteresis Temperature

10

(Note 1)

(Note 1) Not 100 % tested.

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Typical Performance Curves

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

0.5

0.4

0.3

0.2

0.1

0.0

5

4

3

2

1

0

-50

0

50

100

150

0

5

10 15 20 25 30 35 40

Power Supply Voltage : V_BB[V]

Junction Temperature : Tj [ºC]

Figure 11. Standby Current vs Power Supply Voltage

Figure 12. Standby Current vs Junction Temperature

10

9

8

7

6

5

4

3

2

1

0

10

9

8

7

6

5

4

3

2

1

0

5

10 15 20 25 30 35 40

Power Supply Voltage : V_BB[V]

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 13. Operating Current vs Power Supply Voltage

Figure 14. Operating Current vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

5

4

3

2

1

0

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

V_INH

V_INL

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 15. UVLO Detection Voltage vs Junction Temperature

Figure 16. High / Low Level Input Voltage

vs Junction Temperature

100

90

80

70

60

50

40

30

20

10

0

90

80

70

60

50

40

30

20

10

0

-50

0

50

100

150

0

5

10 15 20 25 30 35 40

Power Supply Voltage : V_BB[V]

Junction Temperature : Tj [ºC]

Figure 17. High Level Input Current vs Junction Temperature

Figure 18. Output ON Resistance vs Power Supply Voltage

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

100

90

80

70

60

50

40

30

20

10

0

5

4

3

2

1

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 19. Output ON Resistance vs Junction Temperature

Figure 20. Output Leak Current vs Junction Temperature

0.5

0.4

160

140

120

100

0.3

SR_OFF

80

t_OUTON

0.2

60

SR_ON

t_OUTOFF

40

20

0

0.1

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 21. Output Slew Rate when ON / OFF

vs Junction Temperature

Figure 22. Output Propagation Delay Time when ON / OFF

vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

60

50

40

30

20

10

0

0.5

0.4

0.3

0.2

0.1

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 23. Output Clamp Voltage vs Junction Temperature

Figure 24. Diagnostic Output Low Voltage

vs Junction Temperature

100

90

80

70

60

50

40

30

20

10

0

500

450

400

350

300

250

200

150

100

50

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 25. Diagnostic Output Propagation Delay Time

when ON vs Junction Temperature

Figure 26. Diagnostic Output Propagation Delay Time

when OFF vs Junction Temperature

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Typical Performance Curves - continued

(Unless otherwise specified V_BB= 14 V, V_IN= 5 V, Tj = 25 °C)

12

10

8

40

35

30

25

20

15

10

5

6

4

2

0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 27. Overcurrent Value vs Junction Temperature

Figure 28. Overcurrent Detection ON Time

vs Junction Temperature

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-50

0

50

100

150

-50

0

50

100

150

Junction Temperature : Tj [ºC]

Figure 29. Overcurrent Detection OFF Time

vs Junction Temperature

Figure 30. Open Load Detection Voltage

vs Junction Temperature

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Measurement Circuits

V_BB

VBB

IN1

(IN2)

IN1

(IN2)

ST1

(ST2)

ST1

(ST2)

OUT1

(OUT2)

OUT1

(OUT2)

V_IN

V_ST

V_IN

GND

Figure 31. Standby Current

Low Level Input Current

Output Leak Current

Figure 32. Operating Current

Diagnostic Output Leak Current

V_BB

VBB

IN1

(IN2)

VBB

IN1

(IN2)

ST1

(ST2)

ST1

(ST2)

OUT1

(OUT2)

OUT1

(OUT2)

V_IN

GND

1 kΩ

Figure 33. UVLO Detection / Hysteresis Voltage

High / Low Level Input Voltage

Input Hysteresis Voltage

Figure 34. Output ON Resistance

Output Clamp Voltage

High Level Input Current

Thermal Shutdown Detection

/ Release / Hysteresis Temperature

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Measurement Circuits - continued

V_BB

VBB

IN1

(IN2)

VBB

IN1

(IN2)

10 kΩ

ST1

(ST2)

ST1

(ST2)

Monitor

I_ST

V_IN

OUT1

(OUT2)

OUT1

(OUT2)

V_ST

V_IN

Monitor

6.5 Ω

GND

1 kΩ

Figure 35. Output Slew Rate when ON / OFF

Figure 36. Diagnostic Output Low Voltage

Output Propagation Delay Time when ON / OFF

Diagnostic Output Propagation Delay Time when ON

V_BB

VBB

IN1

(IN2)

IN1

(IN2)

10 kΩ

ST1

(ST2)

ST1

(ST2)

Monitor

V_IN

OUT1

(OUT2)

OUT1

(OUT2)

V_ST

GND

Figure 37. Diagnostic Output Propagation Delay Time when OFF

Figure 38. Overcurrent Value

Overcurrent Detection ON / OFF Time

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Measurement Circuits - continued

V_BB

VBB

IN1

(IN2)

10 kΩ

ST1

(ST2)

V_ST

OUT1

(OUT2)

GND

V_OUT

Figure 39. Open Load Detection Voltage

Open Load Detection Sink Current

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Measurement Conditions for Time Items

V_INL

V_INH

V_INL

IN1

(IN2)

80 %

ΔV

80 %

ΔV

SR_ON= ΔV/t₁

SR_OFF= ΔV/t₂

OUT1

(OUT2)

OUT1

(OUT2)

20 %

t₁

t₂

t_OUTON

t_OUTOFF

ST1

(ST2)

ST1

(ST2)

10 %

tSTOFF

tSTON

Figure 40. Output Slew Rate when ON / OFF

Figure 41. Diagnostic Output Propagation Delay Time when OFF

Output Propagation Delay Time when ON / OFF

Diagnostic Output Propagation Delay Time when ON

IN1

(IN2)

OUT1

(OUT2)

ST1

(ST2)

I_OC

I_OC(min)

I_OUT1

(I_OUT2

)

t_OCOFF

t_OCON

Figure 42. Overcurrent Value

Overcurrent Detection ON / OFF Time

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Timing Chart

IN1

(IN2)

OUT1

(OUT2)

ST1

(ST2)

Normal

Open Load Detction

（OLD)

Normal

Low Voltage Output OFF

Normal

Thermal Shutdown

Normal

Overcurrent Protection

Normal

（UVLO)

（TSD)

（OCP)

Figure 43. Timing Chart

Description of Blocks

1. Protection Functions

Table 1. Detection and Release Conditions and Diagnostic Output of Each Protection Function^{(Note 1)}

Input Voltage

Diagnostic Output

V_STx

Mode

Detection / Release Conditions

V_INx

Standby

Operating

-

Low

High

Low

High

Low

High

Low

High

Low

Normal

Condition

-

High

Low

High

Detect V_OUTx≥ 3.0 V (Typ)

Release V_OUTx≤ 2.2 V (Typ)

Detect V_BB≤ 5.0 V (Max)

Release V_BB≥ 6.0 V (Max)

Detect Tj ≥ 185 °C (Typ)

Release Tj ≤ 175 °C (Typ)

Detect I_OUTx≥ 6 A (Typ)

Release I_OUTx< 6 A (Typ)

Open Load Detect (OLD)

Under Voltage Lockout (UVLO)

Thermal Shutdown Protection

(TSD)^{(Note 2)}

Overcurrent Protection (OCP)

(Note 1) x = 1, 2 and this is the same for x in the following sentence.

(Note 2) Thermal shutdown is automatically restored to normal operation.

This IC has a built-in protection detection function as mentioned above and outputs the condition with diagnostic output pin

STx.

In normal condition, when input voltage V_INxis switched from Low to High, diagnostic output V_STxturns from High to Low.

Inversely, when V_INxis switched from High to Low, V_STxturns from Low to High.

In protection function detected condition, V_STxis High when V_INxis High, and V_STxis Low when V_INxis Low. And after

detecting protection function, this IC self-restarts and operation becomes normal if above release condition is satisfied.

2. Overcurrent Protection (Output ground fault detection)

This IC has a built-in hiccup mode overcurrent protection function. When the output pin (OUTx) outputs overcurrent, the

output of Channel x is turned off and diagnostic output V_STxbecomes High. After Overcurrent Detection OFF Time (t_OCOFF

)

from turn-off, output self-restarts and operation becomes normal if overcurrent doesn’t flow. When overcurrent flows after the

self-restart, output is turned off again. So, if the condition that causes overcurrent continues, output repeats ON and OFF

periodically. And in this time V_STxkeeps High.

And output current can exceed Overcurrent Value I_OCdepending on the condition of impedance connected to VBB, OUT

pins.

3.Thermal Shutdown Protection

This IC has a built-in thermal shutdown protection function. When the chip temperature of POWER-MOS unit for Channel x

in this IC exceeds 185 °C (Typ), the output of Channel x is turned OFF and diagnostic output V_STxbecomes High.

When the chip temperature of POWER-MOS unit for Channel x goes below 175 °C (Typ), output self-restarts and operation

becomes normal.

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Description of Blocks - continued

4. Open Load Detection

VBB

SOLD

R_OLD

OUT1, OUT2

IN1, IN2

Internal

supply

5 V

R1

R2

ST1, ST2

R₃

logic

RL

Figure 44. Open Load Detection Block Diagram

This IC has a built-in Open Load Detection function. By connecting an external resistance R_OLDbetween power supply pin

(VBB) and output pin (OUTx), when output load (R_L) is disconnected during input voltage V_INxis Low, diagnostic output V_STx

becomes Low.

To reduce the standby current of the system, inserting a switch S_OLDis recommended.

The value of R_OLDis decided based on below formula.

ꢄ_푂퐿퐷< 푉_{퐵퐵푀ꢅ푁}× 37.5 × 10^ꢆ− 150 × 10^ꢆ[Ω]

푅

ꢇꢈꢉ

− ꢄ_푀ꢅ푁[Ω] )

ꢋꢌꢍꢇꢎ푋

( = 푉_{퐵퐵푀ꢅ푁}

×

ꢊ

Where:

푉

is the minimum value of power supply voltage (V_BB).

ꢏꢏꢐ퐼ꢑ

푉_OLDMAXis the maximum value of Open Load Detection Voltage (V_OLD).

ꢄ_푀ꢅ푁is the minimum value of combined resistance of internal resistors R₁, R₂and R₃.

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Description of Blocks - continued

5. Other Protection

5.1 GND Open Protection

5 V

VBB

Clamp

IN1, IN2

Internal

supply

Control

logic

OUT1, OUT2

ST1, ST2

GND

Figure 45. GND Open Protection Block Diagram

When GND of the IC is open, the output is switched OFF regardless of the input voltage V_INx. However, diagnostic output

V_STxis not flagged.

The active clamp operates when GND become open during driving inductive load.

5.2 MCU I/O Protection

VBB

5 V

Internal

supply

Clamp

IN1, IN2

Control

logic

MCU

OUT1, OUT2

ST1, ST2

GND

Figure 46. MCU I/O Protection Diagram

Negative surge voltage to input pin (IN1, IN2) or diagnostic output pin (ST1, ST2) may cause damage to the MCU's I/O

pins. In order to prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.

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Applications Example

RST2PU

RST1PU

C_VBB

VBB

BV2HM050EFV-C

GND

R

IN1

R_OLD1

R_OLD2

IN1

IN2

ST1

ST2

OUT1

R

IN2

R_L1

MCU

COUT1

R_ST1

OUT2

R_ST2

R_L2

C_OUT2

R_GND

D_GND

Symbol

Value

Purpose

R_IN1, R_IN2

R_ST1, R_ST2

1 kΩ

Limit resistance for negative surge

Pull up resistance for diagnostic output

R_ST1PU, R_ST2PU

10 kΩ

The ST1 and ST2 pins are open drain output and pull up

these pins to MCU power supply.

C_VBB

R_GND

10 µF

1 kΩ

Filter for battery line voltage spike

Current limit resistance for reverse battery connection

Protection diode for BV2HM050EFV-C against reverse

battery connection

D_GND

-

R_OLD1, R_OLD2

C_OUT1, C_OUT2

R_L1, R_L2

2 kΩ

1000 pF

-

Resistance for open load detection

Filter for radiation noise from outside of BV2HM050EFV-C

Output load

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I/O Equivalence Circuits

IN1, IN2

ST1, ST2

10 kΩ

150 Ω

IN1

IN2

ST1

ST2

100 kΩ

OUT1, OUT2

VBB

OUT1

OUT2

200 kΩ

300 kΩ

500 kΩ

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a

voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

10. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

11. Thermal Shutdown Function (TSD)

This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins. When the

Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Operational Notes – continued

12. Over Current Protection Function (OCP)

This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This

protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC

should not be used in applications characterized by continuous operation or transitioning of the protection function.

13. Active Clamp Operation

The IC integrates the active clamp function to internally absorb the reverse energy E_Lwhich is generated when the

inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a

load so that the reverse energy E_Lis active clamp energy E_AS(refer to Figure 5. Active Clamp Energy vs Output

Current) or under when inductive load is used.

14. Open Power Supply Pin

When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of input

voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same

potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).

15. Open GND Pin

When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an

inductive load is connected, the active clamp operates when the GND pin is open.

16. OUT Pin Voltage

Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition. And ensure

that OUT pin voltage is more than (GND - 0.3 V) when this IC is turned ON. Otherwise malfunction or other problems

can occur.

17. Same Pin Connection

Connect all VBB pins, GND pins, OUT1 pins, OUT2 pins to same line respectively.

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Ordering Information

B V 2 H M 0

5

0

E

F

V

-

C E 2

Part Number

Package

EFV: HTSSOP-B20

Product Rank

C: Automotive product

Packaging and Forming Specification

E2: Embossed tape and reel

Marking Diagram

HTSSOP-B20 (TOP VIEW)

Part Number Marking

LOT Number

V 2 H M 5 0

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

HTSSOP-B20

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Revision History

Date

Revision

Changes

20.Jan.2022

31.Oct.2022

001

002

New Release

Page 27 Ordering Information

The Description of “Part Number” is added.

Page 5 Absolute Maximum Ratings

Figure 5 is changed.

Page 9 Thermal Resistance

31.Jan.2023

003

The vertical axis name in Figure 10 is corrected.

Page 26 Operational Notes

14.Open Power Supply Pin

The value of output clamp voltage is changed.

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BV2HM050EFV-C (新产品)
厂家：	ROHM
描述：	BV2HM050EFV-C是一款车载用双通道高边开关。内置过电流保护功能（间歇工作模式）、过热保护功能、负载开路检测功能、低电压时输出OFF功能，还具有检测到异常时的诊断信息输出功能。开关过电流保护
文件：	总32页 (文件大小：1310K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BV2HM050EFV-C (新产品) [ROHM]

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