D90FCFP-E2 [ROHM]

35V Withstand Voltage 1A LDO Regulators;


型号：	D90FCFP-E2
厂家：	ROHM
描述：	35V Withstand Voltage 1A LDO Regulators
文件：	总42页 (文件大小：1565K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Single-Output LDO Regulators

35V Withstand Voltage

1A LDO Regulators

BDxxFC0 series

●Description

●Packages

(Typ)

(Max)

The BDxxFC0 series are low-saturation regulators. The

series’ output voltages are Variable, 3.0V, 3.3V, 5.0V, 6.0V,

7.0V, 8.0V, 9.0V, 10.0V, 12.0V and 15.0V and packages

are HTSOP-J8, TO252-3, and TO252-5. This series has a

built-in over-current protection circuit that prevents the

destruction of the IC due to output short circuits and a

thermal shutdown circuit that protects the IC from thermal

damage due to overloading.

HTSOP-J8

4.90mm x 6.00mm x 1.00mm

TO252-3

TO252-5

6.50mm x 9.50mm x 2.50mm

●Key Specifications

1) Output current capability: 1A

2) Output voltage: Variable, 3.0V, 3.3V, 5.0V, 6.0V, 7.0V,

8.0V, 9.0V, 10.0V, 12.0V and 15.0V

3) High output voltage accuracy (Ta=25℃): ±1%

4) Low saturation with PDMOS output

5) Built-in over-current protection circuit that prevents the

destruction of the IC due to output short circuits

6) Built-in thermal shutdown circuit for protecting the IC

from thermal damage due to overloading

7) Available Ceramic Capacitor to prevent oscillation

8) HTSOP-J8, TO252-3 and TO252-5 packages

●Features

・Output Voltage:

1.0V to 15.0V

±1%

V_O+1.0V to 26.5V

4.0V to 26.5V

・Output Voltage Precision(Ta=25℃):

・Supply Voltage(V_O≧3.0V):

・Supply Voltage(V_O＜3.0V):

・Output Current:

・Operating Temperature Range:

-25℃≦Ta≦+85℃

●Ordering part number

B D

0 W x x x

E 2

Part

Number

Output

voltage

Input

Voltage Current

Output

Shutdown

Mode

Package

Packaging and forming specification

E2: Emboss tape reel

00: Variable

30: 3.0V

33: 3.3V

50: 5.0V

60: 6.0V

70: 7.0V

80: 8.0V

90: 9.0V

J0: 10.0V

J2: 12.0V

J5: 15.0V

EFJ: HTSOP-J8

FP: TO252-3/5

F:35V C0:1.0A

“W”: Included

shutdown mode

None: Without

shutdown mode

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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BDxxFC0 Series

●Lineup

Variable 3.0 3.3 5.0 6.0 7.0 8.0 9.0 10.0 12.0 15.0

Articles

パッケージ

Reel of 2500

Reel of 2000

BDxxFC0WEFJ-E2

BDxxFC0FP-E2

○

○ ○ ○ ○ ○ ○ ○

○ ○

○ ○ ○ ○ ○ ○ ○

○

HTSOP-J8

TO252-3

TO252-5

BDxxFC0WFP-E2^{(Note 1)}

○

(Note 1) under development except for Variable

●Typical Application Circuits

〈Output Voltage Variable Type (With shutdown SW)〉

Vcc

R₁

R₂

C_IN

Vcc

C_OUT

GND

Figure 1. Typical Application Circuit

Output Voltage Variable Type(With shutdown SW)

〈Output Voltage Fixed Type (With Shutdown SW)〉

Vcc

C_IN

Vcc

C_OUT

GND

Figure 2. Typical Application Circuit

Output Voltage Fixed Type(With shutdown SW)

〈Output Voltage Fixed Type (Without Shutdown SW)〉

Vcc

C_IN

Vcc

C_OUT

GND

Figure 3. Typical Application Circuit

Output Voltage Fixed Type (Without Shutdown SW)

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BDxxFC0 Series

●Pin Configuration/Pin Description

〈With Shutdown SW (HTSOP-J8)〉

HTSOP-J8

(TOP VIEW)

FB/N.C.

GND

Vcc

N.C

Figure 4. Pin Configuration (With Shutdown SW)

Pin Function

Pin No.

Pin name

Output pin

Feedback pin (Variable Output Type)

No Connection (Fixed Output Type)

GND pin

/ N.C. ^{(Note 1)}

GND

N.C. ^{(Note 1)}

No Connection (Connect to GND or leave OPEN)

Enable pin

N.C. ^{(Note 1)}

V_CC

No Connection (Connect to GND or leave OPEN)

Power supply pin

Exposed

PAD

GND

Substrate(Connect to GND)

(Note 1) N.C. Pin can be open, because it is not connected to the IC.

〈Without Shutdown SW (TO252-3)〉

TO252-3

(TOP VIEW)

Figure 5. Pin Description (Without Shutdown SW)

Pin No.

Pin Name

Vcc

Pin Function

Power Supply Pin

No Connection (leave OPEN)

Output Pin

N.C. ^{(Note 1)}

FIN

GND

(Note 1) N.C.Pin can be open since it is not connected inside of IC.

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BDxxFC0 Series

〈With Shutdown SW (TO252-5)〉

TO252-5

(TOP VIEW)

1 2 3 4

Figure 6. Pin Configuration (With Shutdown SW)

Pin No.

Pin Name

Pin Function

Enable Pin

Vcc

Power Supply Pin

No Connection (leave OPEN)

Output Pin

N.C. ^{(Note 1)}

Variable Pin (Variable Output Type)

N.C. Pin (Fixed Output Type)

N.C. ^{(Note 1)}

FIN

GND

(Note 1) N.C.Pin can be open since it is not connected inside of IC.

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BDxxFC0 Series

●Block diagrams

■ HTSOP-J8 〈BD00FC0WEFJ (Output Voltage Variable Type) with Shutdown SW〉

VREF :

OCP :

TSD :

Bandgap Reference

Over Current Protection Circuit

Thermal Shut Down Circuit

Power Transistor Driver

Driver :

VREF

Driver

OCP

TSD

Vcc

GND

Figure 7. Block diagrams

BD00FC0WEFJ (Output Voltage Variable Type with Shutdown SW)

■ HTSOP-J8 〈BDxxFC0WEFJ (Output Voltage Fixed Type) with Shutdown SW〉

VREF : Bandgap Reference

OCP : Over Current Protection Circuit

TSD : Thermal Shut Down Circuit

Driver : Power Transistor Driver

VREF

Driver

OCP

TSD

Vcc

GND

N.C.

Figure 8. Block diagrams

BxxFC0WEFJ (Output Voltage Variable Type with shutdown SW)

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BDxxFC0 Series

■TO252-3〈BDxxFC0FP (Output Voltage Fixed Type) without Shutdown SW〉

GND

FIN

VREF Bandgap Reference

OCP Over Current Protection Circuit

TSD Thermal Shut Down Circuit

Power Transistor Driver

Driver :

VREF

Driver

OCP

TSD

NC.

Vcc

Figure 9. Block diagrams

BDxxFC0FP (Output Voltage Fixed Type, without Shutdown SW)

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BDxxFC0 Series

■ TO252-5 〈BD00FC0WFP (Output Voltage Variable Type) With Shutdown SW〉

GND

FIN

VREF Bandgap Reference

OCP Over Current Protection Circuit

TSD Thermal Shut Down Circuit

Power Transistor Driver

Driver :

VREF

Driver

OCP

TSD

Vcc

N.C.

Figure 10. Block diagram

BD00FC0WFP (Output Voltage Variable Type, with Shutdown SW)

■TO252-5〈BDxxFC0WFP (Output Voltage Fixed Type) With Shutdown SW〉

GND

FIN

VREF Bandgap Reference

OCP Over Current Protection Circuit

TSD Thermal Shut Down Circuit

Power Transistor Driver

Driver :

VREF

Driver

OCP

TSD

Vcc

N.C.

Figure 11. Block diagram

BDxxFC0WFP (Output Voltage Fixed Type, with Shutdown SW)

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BDxxFC0 Series

●Absolute Maximum Ratings (Ta= 25℃)

Parameter

Symbol

Vcc

V_EN

Tstg

Ratings

-0.3 to +35.0

-25 to +85

-55 to +150

150

Unit

℃

Supply Voltage _*

EN Voltage _*2

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

Tjmax

*1 Do not exceed Tjmax.

*2 Power Supply (Vcc) and EN pin startup sequence does not matter provided they are operated within the power supply voltage range.

●Operating Conditions (-25℃≦Ta≦+85℃)

Parameter

Supply Voltage (V_O≧3.0V)

Supply Voltage (V_O<3.0V)

Startup Voltage (I_O=0mA)

EN Voltage (with shutdown SW)

Output Current

Symbol

Vcc

V_EN

I_O

Min

V_O+1

4.0

Max

26.5

3.8

26.5

1.0

Unit

Output Voltage _*₃(BD00FC0)

V_O

1.0

15.0

*3 Please refer to Notes when using BD00FC0 at output voltage of 1.0V to 3.0V.

●Electrical Characteristics

Unless otherwise specified, Ta=25°C, Vcc=13.5V, I_O=0mA, VEN=5.0V

The resistor between FB and OUT =56.7kΩ, FB and GND =10kΩ (BD00FC0)

Guaranteed Limit

Parameter

Symbol

Unit

Conditions

Min

Typ

0.5

Max

2.5

Circuit Current at shutdown mode

Circuit Current

Output Reference Voltage (BD00FC0)

Output Voltage

I_SD

Icc

V_FB

µA

0.742

0.750

0.758

I_O=50mA

V_O

V_O×0.99

V_O

0.4

V_O×1.01

0.7

I_O=200mA

(BD30/33/50FC0)

Output Voltage

V_O×0.99

I_O=500mA _*4

(BD60/70/80/90/J0/J2/J5FC0)

Vcc=4.0V

Minimum dropout voltage

∆Vd

I_O=500mA _*

５

Minimum dropout voltage

(BD00/50/60/70/80/90/J0/J2/J5FC0)

Line Regulation

Load Regulation

EN High Voltage (with shutdown SW)

EN Low Voltage (with shutdown SW)

EN Bias Current

*4 In case of J0, J2 and J5, Vcc=Vo+4.5V

Vcc= V_O×0.95,

I_O=500mA

0.3

0.5

Reg.I

Reg.I_O

V_EN(High)

V_EN(Low)

I_EN

mV Vcc=V_O+1.0V→26.5V

μA

V_O×0.010 V_O×0.020

I_O=5mA→1A _*4

ACTIVE MODE

OFF MODE

2.0

0.8

*5 In case of Vo ≧ 4.0V

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BDxxFC0 Series

●Thermal Resistance

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

HTSOP-J8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

206.4

45.2

°C/W

Ψ_JT

TO252-5 / TO252-3

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

115.3

20.8

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-5, 7.

Thermal Via ^{(Note 5)}

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers

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BDxxFC0 Series

●Reference Data

■BD00FC0 series (5.0V Output Setting)

Unless otherwise specified, Ta=25°C, Vcc=13.5V, V_EN=5.0V, I_O=0mA, V_O=5.0V

(The resistor between FB and Vo =56.7kΩ, FB and GND =10kΩ)

1.0

0.8

0.6

0.4

0.2

0.0

10 12 14 16 18 20 22 24 26

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 12. Circuit Current

Figure 13. Shutdown Current

(IFEEDBACK_R≒75µA)

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 14. Line Regulation

(I_O=0mA)

Figure 15. Line Regulation

(I_O=500mA)

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BDxxFC0 Series

●Reference Data - Continued

1,000

900

800

700

600

500

400

300

200

100

400

800

1200 1600 2000 2400

200

400

600

800

1000

Output Current:I_O[mA]

Figure 16. Load Regulation

Figure 17. Dropout Voltage

(Vcc=4.75V)

(l_O=0mA→1000mA)

5.15

5.10

5.05

5.00

4.95

4.90

4.85

100

1000

10000 100000 1000000

-25

-5

Frequency: f [Hz]

Ambient Temperature: [℃]

Figure 18. Ripple Rejection

(I_O=100mA)

Figure 19. Output Voltage

Temperature Characteristic

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BDxxFC0 Series

●Reference Data - Continued

1.0

0.8

0.6

0.4

0.2

0.0

160

140

120

100

200

400

600

800

1000

8 10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 21. EN Voltage vs EN Current

Output Current:I_O[mA]

Figure 20. Circuit Current

(I_O=0mA→1000 mA)

(IFEEDBACK_R≒75µA)

8 10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

130

140

150

160

170

180

190

Ambient Temperature:Ta [℃]

Figure 23. Thermal Shutdown

Circuit Characteristic

Figure 22. EN Voltage vs Output Voltage

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BDxxFC0 Series

●Measurement setup for reference data

■BD00FC0 series（5.0V Output Setting）

Measurement setup for Figure 12

Measurement setup for Figure 13

Measurement setup for Figure 14

Measurement setup for Figure 15

Measurement setup for Figure 16

Measurement setup for Figure 17

Vcc

56.7kΩ

10kΩ

1µF

13.5V

1µF

GND

IFEEDBACK_R

Measurement setup for Figure 18

Measurement setup for Figure 19

Measurement setup for Figure 20

Measurement setup for Figure 21

Measurement setup for Figure 22

Measurement setup for Figure 23

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BDxxFC0 Series

●Reference Data

■BD33FC0 series

Unless otherwise specified Ta = 25°C, Vcc=13.5V, V_EN=5.0V, Io=0mA

1.0

0.8

0.6

0.4

0.2

0.0

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 25. Shutdown Current

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 24. Circuit Current

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 26. Line Regulation

(Io=0mA)

Figure 27. Line Regulation

(Io=500mA)

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BDxxFC0 Series

●Reference Data - Continued

100

1000

10000 100000 1000000

400

800 1200 1600 2000 2400

Output Current:Io [mA]

Frequency: f [Hz]

Figure 28. Load Regulation

Figure 29. Ripple Rejection

(lo=100mA)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

3.38

3.36

3.34

3.32

3.30

3.28

3.26

3.24

3.22

-25

-5

200

400

Output Current:Io [mA]

Figure 31. Circuit Current

600

800

1000

Ambient Temperature: [℃]

Figure 30. Output Voltage Temperature Characteristic

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BDxxFC0 Series

●Reference Data - Continued

160

140

120

100

10 12 14 16 18 20 22 24 26

Enablel Voltage: V_EN[V]

Figure 32. EN Voltage vs EN Current

Enable Voltage: V_EN[V]

Figure 33. EN Voltage vs Output Voltage

130

140

Ambient Temperature:Ta [℃]

Figure 34. Thermal Shutdown Circuit Characteristic

150

160

170

180

190

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BDxxFC0 Series

●Reference Data

■BD50FC0 series

Unless otherwise specified, Ta = 25°C, Vcc=13.5V, V_EN=5.0V, Io=0mA

1.0

0.8

0.6

0.4

0.2

0.0

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 35. Circuit Current

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 36. Shutdown Current

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 37. Line Regulation

(Io=0mA)

Figure 38. Line Regulation

(Io=500mA)

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BDxxFC0 Series

●Reference Data - Continued

1,000

900

800

700

600

500

400

300

200

100

400

800

1200 1600 2000 2400

200

400

600

800

1000

Output Current:Io [mA]

Figure 39. Load Regulation

Figure 40. Dropout Voltage

(Vcc=Vo×0.95V)

5.15

5.10

5.05

5.00

4.95

4.90

4.85

100

1000

10000 100000 1000000

-25

-5

Frequency: f [Hz]

Ambient Temperature: [℃]

Figure 41. Ripple Rejection

(lo=100mA)

Figure 42. Output Voltage

Temperature Characteristic

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BDxxFC0 Series

●Reference Data - Continued

1.0

0.8

0.6

0.4

0.2

0.0

160

140

120

100

10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 44. EN Voltage vs EN Current

200

400

600

800

1000

Output Current:Io [mA]

Figure 43. Circuit Current

10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 45. EN Voltage vs Output Voltage

130

140

150

160

170

180

190

Ambient Temperature:Ta [℃]

Figure 46. Thermal Shutdown Circuit Characteristic

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BDxxFC0 Series

●Reference Data

■BD80FC0 series

Unless otherwise specified, Ta = 25°C, Vcc=13.5V, V_EN=5.0V, Io=0mA

1.2

1.0

0.8

0.6

0.4

0.2

0.0

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 48. Shutdown Current

Figure 47. Circuit Current

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 49. Line Regulation

(Io=0mA)

Figure 50. Line Regulation

(Io=500mA)

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BDxxFC0 Series

●Reference Data - Continued

1,000

900

800

700

600

500

400

300

200

100

200

400

600

800

1000

400

800

Output Current:Io [mA]

Figure 51. Load Regulation

1200 1600 2000 2400

Output Current:Io [mA]

Figure 52. Dropout Voltage

(Vcc=Vo×0.95V)

8.21

8.16

8.11

8.06

8.01

7.96

7.91

7.86

7.81

7.76

100

1000

10000 100000 1000000

-25

-5

Frequency: f [Hz]

Ambient Temperature: [℃]

Figure 53. Ripple Rejection

(lo=100mA)

Figure 54. Output Voltage Temperature Characteristic

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BDxxFC0 Series

●Reference Data - Continued

160

140

120

100

1.0

0.8

0.6

0.4

0.2

0.0

200

400

600

800

1000

10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 56. EN Voltage vs EN Current

Output Current:Io [mA]

Figure 55. Circuit Current

130

140

150

160

170

180

190

10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 57. EN Voltage vs Output Voltage

Ambient Temperature:Ta [℃]

Figure 58. Thermal Shutdown Circuit Characteristic

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BDxxFC0 Series

●Reference Data

■BD90FC0 series

Unless otherwise specified, Ta = 25°C, Vcc=13.5V, V_EN=5.0V, Io=0mA

1.2

1.0

0.8

0.6

0.4

0.2

0.0

10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 59. Circuit Current

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 60. Shutdown Current

8 10 12 14 16 18 20 22 24 26

Supply Voltage:Vcc [V]

Figure 61. Line Regulation

(Io=0mA)

Figure 62. Line Regulation

(Io=500mA)

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●Reference Data - Continued

1,000

900

800

700

600

500

400

300

200

100

200

400

600

800

1000

400

800

Output Current:Io [mA]

Figure 63. Load Regulation

1200 1600 2000 2400

Output Current:Io [mA]

Figure 64. Dropout Voltage

(Vcc=Vo×0.95V)

9.23

9.13

9.03

8.93

8.83

8.73

100

1000

10000 100000 1000000

-25

-5

Frequency: f [Hz]

Ambient Temperature: [℃]

Figure 65. Ripple Rejection

(Io =100mA)

Figure 66. Output Voltage

Temperature Characteristic

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●Reference Data - Continued

160

140

120

100

1.0

0.8

0.6

0.4

0.2

0.0

10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 68. EN Voltage vs EN Current

200

400

Output Current:Io [mA]

Figure 67. Circuit Current

600

800

1000

130

140

150

160

170

180

190

10 12 14 16 18 20 22 24 26

Enable Voltage: V_EN[V]

Figure 69. EN Voltage vs Output Voltage

Ambient Temperature:Ta [℃]

Figure 70. Thermal Shutdown

Circuit Characteristic

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●Measurement setup for reference data

■BDxxFC0 series(Output Voltage FixedType)

Measurement setup for

Figure 24, 35, 47 and 59

Measurement setup for

Figure 25, 36, 48 and 60

Measurement setup for

Figure 26, 37, 49 and 61

Vcc

(1.0µF)

2.2µF

1µF

N.C.

13.5V

GND

Measurement setup for

Figure 27, 38, 50 and 62

Measurement setup for

Figure 40, 52 and 64

Measurement setup for

Figure 28, 39, 51 and 63

Measurement setup for

Figure 29, 41, 53 and 65

Measurement setup for

Figure 30, 42, 54 and 66

Measurement setup for

Figure 31, 43, 55 and 67

Measurement setup for

Figure 32, 44, 56 and 68

Measurement setup for

Figure 33, 45, 57 and 69

Measurement setup for

Figure 34, 46, 58 and 70

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●Application Examples

・Applying positive surge to the Vcc pin

If there is a possibility that surges higher than 35.0V will be applied to the Vcc pin, a Zener diode should be placed

between the Vcc pin and GND pin, as shown in the Figure below.

Vcc

GND

Figure 71.

・Applying negative surge to the Vcc pin

If there is a possibility that negative surges lower than the GND are applied to the Vcc pin, a Schottky diode should be

place between the Vcc pin and GND pin, as shown in the Figure below.

Vcc

GND

Figure 72.

・Implementing a protection diode

If there is a possibility that a large inductive load is connected to the output pin resulting in back-EMF at time of startup

and Shutdown, a protection diode should be placed as shown in the Figure below.

VVo o

Figure 73.

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●Thermal Design

■HTSOP-J8

IC mounted on ROHM standard board based on JEDEC.

Board material: FR4

3.5

Board size

114.3 mm x 76.2 mm x 1.57 mmt

2.5

②2.8 W

2s2p 114.3 mm x 76.2 mm x 1.6 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: The footprint ROHM recommend.

+ wiring to measure.

1.5

①: 1-layer PCB (Copper foil area on the reverse side of

PCB: 0 mm x 0 mm)

①0.6W

②: 4-layer PCB (2 inner layers and copper foil area on the

reverse side of PCB: 74.2mm x 74.2 mm)

0.5

Condition①: θja = 206.4 °C/W, Ψ_JT= 21°C/W

Condition②: θja = 45.2 °C/W, Ψ_JT= 13°C/W

100

125

150

Ambient Temperature: Ta[°C]

Figure 74.

■TO252-3/5

IC mounted on ROHM standard board based on JEDEC.

Board material: FR4

Board size

②6 W

114.3 mm x 76.2 mm x 1.57 mmt

2s2p 114.3 mm x 76.2 mm x 1.6 mmt

Mount condition: PCB and exposed pad are soldered.

Top copper foil: The footprint ROHM recommend.

+ wiring to measure.

①: 1-layer PCB (Copper foil area on the reverse side of

PCB: 0 mm x 0 mm)

①1.1 W

②: 4-layer PCB (2 inner layers and copper foil area on the

reverse side of PCB: 74.2mm x 74.2 mm)

100

125

150

Ambient Temperature: Ta [°C]

Figure 75.

Condition①: θja = 115.3 °C/W, Ψ_JT= 14°C/W

Condition②: θja = 20.8 °C/W, Ψ_JT= 3°C/W

When operating at temperature more than Ta=25°C, please refer to the power dissipation characteristic curve shown in Figure

74 and 75.

The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at

temperatures less than the maximum junction temperature Tjmax.

Figure 74 and 75 show the acceptable power dissipation characteristic curves of the HTSOP-J8 and TO252-3/5 packages. Even

when the ambient temperature (Ta) is at normal temperature (25°C), the chip junction temperature (Tj) may be quite high so

please operate the IC at temperatures less than the acceptable power dissipation.

The calculation method for power consumption Pc(W) is as follows

Pc=(Vcc－Vo)×Io+Vcc×Icc

Acceptable loss Pd ≥ Pc

Vcc : Input voltage

Solving this for load current Io in order to operate within the acceptable loss

: Output voltage

: Load current

: Circuit current

Pd－Vcc×Icc

Vcc－Vo

Icc

Io ≤

It is then possible to find the maximum load current Iomax with respect to the applied voltage Vcc at the time of thermal design.

Calculation Example) When TO252-3 / TO252-5, Ta=85°C, Vcc=13.5V, Vo=5.0V

3.115－13.5×Icc

Figure 75 ②θja=20.8 °C/W → -48.1mW/°C

25°C = 6W → 85°C =3.115W

Io ≤

8.5

Io ≤ 365.6mA (Icc : 0.5mA)

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●I/O equivalent circuit

Vcc Terminal

EN Terminal

200kΩ

1kΩ

Vcc

Vo Terminal BD30/33/50/60/70/80/90/J0/J2/J5FC0(W)

R₁(kΩ)

(Typ)

R₂(kΩ)

R₃(kΩ)

(Typ)

30.3

Vcc

BD30FC0(W)

BD33FC0(W)

BD50FC0(W)

BD60FC0(W)

BD50FC0(W)

BD80C0A(W)

BD90C0A(W)

BDJ0C0A(W)

BDJ2C0A(W)

BDJ5C0A(W)

56.6

83.5

61.7

48.3

61.7

76.1

R₃

R₂

R₁

BD00FC0W

Vo Terminal

FB Terminal

Vcc

15kΩ

(Typ)

Figure 76.

●Output Voltage Configuration Method (BD00FC0)

Please connect resistors R₁and R₂(which determines the output voltage) as shown in Figure 77.

Please be aware that the offset, due to the current that flows from the FB terminal, becomes large when resistors with large

values are used. Resistance values ranging from R₂=5kΩ to 10kΩ is recommended.

V_O

V_OUTsetting equation is,

R₁

R₂

V_FB0.75V

V_OUT≒V_FB×(R₁+R₂)/R₂

≒

(

)

TYP

FB pin

Thoroughly check the constant settings on the application because

circuit current increases depending on connected resistor.

Resistance value of R₂is from 5kΩ to 10kΩ.

Determine R₁by adjusting with R₂.

Figure 77.

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●Operational Notes

1. Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may

result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open

mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device,

consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.

2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external

circuits, and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.

3. GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions.

Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.

4. Ground wiring pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but

connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused

by large currents. Also, ensure that the GND traces of external components do not cause variations on GND voltage. The

power supply and ground lines must be as short and thick as possible to reduce line impedance.

5. Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in

damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by

poor soldering or foreign objects) may result in damage to the IC.

6. Operation in strong electromagnetic fields

Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications

where strong electromagnetic fields may be present.

7. Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to

stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be

turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent

damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.

8. Power Dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including

reduced current capability due to the rise of chip temperature. The mentioned power dissipation in the absolute maximum

rating of this specification, at HTSOP-J8 andTO252-3/5 package when 114.3mm×76.2mm×1.6mm glass epoxy board is

mounted, is the value of when there is no heat dissipation board. And in case this exceeds, take the measures like

enlarge the size of board; make copper foil area for heat dissipation big; and use dissipation board and do not exceed the

power dissipation.

9. Thermal consideration

Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions. Consider Pc that

does not exceed Pd in actual operating conditions. (Pd≧Pc)

Tjmax : Maximum junction temperature=150(℃), Ta : Peripheral temperature(℃) ,

θja : Thermal resistance of package-ambience(℃/W), Pd : Package Power dissipation (W),

Pc : Power consumption (W), Vcc : Input Voltage, V_O: Output Voltage, I_O: Load, Icc : Circut Current

Package Power dissipation

Power consumption

: Pd (W) = (Tjmax-Ta) / θja

: Pc (W) = (Vcc-V_O)×I_O+Vcc×Icc

10. Vcc pin

Insert a capacitor (V_O≧5.0V:capacitor≧1µF, 1.0≦V_O＜5.0V:capacitor≧2.2µF) between the Vcc and GND pins. Choose

the capacitance according to the line between the power smoothing circuit and the Vcc pin. Selection of the capacitance

also depends on the application. Verify the application and allow for sufficient margins in the design. It is recommended

to use a capacitor with excellent voltage and temperature characteristics.

Electrolytic capacitor

Ceramic capacitor, Low ESR capacitor

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11. Output pin

In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a

capacitor with a capacitance of more than 1μF(3.0V≦V_O≦15.0V). Electrolytic, tantalum and ceramic capacitors can be

used. We recommend a capacitor with a capacitance of more than 4.7μF(1.0V≦V_O<3.0V). Ceramic capacitors can be

used. When selecting the capacitor, ensure that the capacitance of more than 1μF(3.0V≦V_O≦15.0V) or more than

4.7μF(1.0V≦V_O<3.0V) is maintained at the intended applied voltage and temperature range. Due to changes in

temperature, the capacitance can fluctuate possibly resulting in oscillation. For selection of the capacitor, refer to the

Cout_ESR vs I_OUTdata. The stable operation range given in the reference data is based on the standalone IC and

resistive load. For actual applications, the stable operating range is influenced by the PCB impedance, input supply

impedance, and load impedance. Therefore, verification of the final operating environment is needed.

When selecting a ceramic type capacitor, we recommend using X5R, X7R, or better, with excellent temperature and

DC-biasing characteristics and high voltage tolerance.

Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that

the actual application meets the required specification.

6.0V≤Vcc≤26.5V

5.0V≤V_O≤15.0V

4.0V ≤ Vcc ≤ 26.5V

-25℃ ≤ Ta ≤ +85℃

5kΩ ≤ R₂≤ 10kΩ (BD00FC0W)

Cin=2.2µF ≤ Cin ≤ 100µF

1µF ≤ Cout ≤ 100µF

3.0V ≤ V_O≤ 15.0V

4.0V ≤ Vcc ≤ 26.5V

3.0V ≤ V_O≤ 15.0V

-25℃≤Ta≤+85℃

0A≤I_O≤1A

-25℃ ≤ Ta ≤ +85℃

0A ≤ I_O≤ 1A

5kΩ≤R₂≤10kΩ (BD00FC0W)

5kΩ ≤ R₂≤ 10kΩ (BD00FC0W)

100

Unstable operating region

Stable operating region

0.1

0.01

2.2

Unstable

operating region

0.001

100

200

400

600

800

1000

100

Cout(µF)

IO(mA)

Io(mA)

（

）

Cout µF

Cout_ESR vs Io

Cin vs Cout

3.0V ≤ Vo ≤ 15.0V

(Reference data)

4.0V ≤ Vcc ≤ 26.5V

1.0V ≤ Vo < 1.5V

1.5V ≤ Vo < 3.0V

1.0V ≤ Vo < 3.0V

-25°C ≤ Ta ≤ +85°C

0A ≤ Io ≤ 1A

5kΩ≤ R₁≤ 10kΩ (BD00FC0W)

5kΩ ≤ R₁≤ 10kΩ (BD00FC0W)

2.2µF ≤ Cin ≤ 100µF

4.7µF ≤ Cout ≤ 100µF

5kΩ ≤ R₁≤ 10kΩ (BD00FC0W)

2.2µF ≤ Cin ≤ 100µF

4.7µF ≤ Cout ≤ 100µF

100

Unstable operating region

Stable operating region

Unstable operating region

Stable operating region

Stable

operating region

0.5

Unstable

Stable

operating region

0.1

0.01

2.2

0.001

200

400

600

800

1000

4.7

200

400

600

800

1000

100

Io(mA)

（

）

Cout µF

Cout_ESR vs Io

1.0V ≤ Vo < 3.0V

(Reference data)

Cin vs Cout

1.0V ≤ Vo < 3.0V

(Reference data)

Vcc

Cin

Cout

(1µF or higher)

R₂

(1µF or higher)

V_CC

(4.0V to 26.5V)

(Rout)

GND

ESR

(0.001Ω

or higher)

V_EN

(5.0V)

R₁

(5k to 10kΩ)

Operation Note 11 Measurement circuit (BD00FC0W)

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4.0V ≤ Vcc ≤ 26.5V

1.0V ≤ Vo < 3.0V

4.0V ≤ Vcc ≤ 26.5V

1.0V ≤ Vo < 3.0V

(Cout and Ceramic capacitor 10µF is connected in parallel.)

-25°C ≤ Ta ≤ +85°C

(Cout and Ceramic capacitor 10µF is connected in

parallel.)

0A ≤ Io ≤ 1A

5kΩ≤ R₁≤ 10kΩ (BD00FC0W)

-25°C ≤ Ta ≤ +85°C

5kΩ ≤ R₁≤ 10kΩ (BD00FC0W)

2.2µF ≤ Cin ≤ 100µF

1µF ≤ Cout ≤ 100µF

100

Unstable operating region

Stable operating region

0.1

0.01

2.2

Unstable

operating region

0.001

100

200

400

600

Io(mA)

800

1000

（

）

Cout µF

Cin vs Cout

1.0V ≤ Vo < 3.0V

Cout and Ceramic capacitor 10µF is

connected in parallel.

Cout_ESR vs Io

1.0V ≤ Vo < 3.0V

Cout and Ceramic capacitor 10µF is

connected in parallel.

(Reference data)

Vcc

V_CC

Cin

R₂

(4.0V to 26.5V)

(1µF or higher)

Cout

(1µF

or higher)

Output

10µF

GND

load

ESR

(0.001Ω

R₁

V_EN

Io(Rout)

(5.0V)

(5k to 10kΩ)

or higher)

Operation Note 11 Measurement circuit (BD00FC0W)

12. EN pin

Do not make the voltage level of the chip’s enable pin at floating level or in between V_EN(High) and V_EN(Low). Otherwise,

the output voltage would be unstable or indefinite.

13. For a steep change of the Vcc voltage

Because MOSFET for output Transistor is used when an input voltage change is very steep, it may evoke large current.

When selecting the value of external circuit constants, please make sure that the operation on the actual application

takes these conditions into account.

14. For infinitesimal fluctuations of output voltage.

For applications that have infinitesimal fluctuations of the output voltage caused by some factors (e.g. disturbance noise,

input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert a

filter, etc.).

15. Over current protection circuit (OCP)

The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output

capacity. This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit

output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other

component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.

However, the IC should not be used in applications characterized by the continuous or transitive operation of the

protection circuits.

16. Thermal Shutdown circuit (TSD)

The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off, completely, in the event of

thermal overload. It is not designed to protect the IC from damage or guarantee its operation. IC’s should not be used

after this function has activated, or in applications where the operation of this circuit is assumed.

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17. In some applications, the Vcc and the Vo potential might be reversed, possibly resulting in circuit internal damage or

damage to the elements. For example, the accumulated charge in the output pin capacitor flow backward from the Vo to

the Vcc when the Vcc shorts to the GND. Use a capacitor with a capacitance with less than 1000μF for reducing the

damage. We also recommend using reverse polarity diodes in series between the Vcc and the GND or a bypass diode

between the Vo and the Vcc.

18. Regarding input pins of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.

PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes

and/or transistors. For example (refer to the Figure below):

○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode

○When GND > Pin B, the PN junction operates as a parasitic transistor

Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Example of monolithic IC structure

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●Physical Dimension Tape and Reel InformationS

Package Name

HTSOP-J8

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Package Name

TO252-3

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Package Name

TO252-5

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●Marking Diagram

TO252-3

(TOP VIEW)

Part Number Marking

Output

Voltage[V]

Part Number

Marking

3.3

5.0

33FC0

50FC0

LOT Number

1PIN

TO252-5

(TOP VIEW)

Output

Voltage[V]

Part Number

Marking

Part Number Marking

Variable

3.0

00FC0W

30FC0W

33FC0W

50FC0W

60FC0W

70FC0W

80FC0W

90FC0W

J0FC0W

J2FC0W

J5FC0W

3.3

5.0

6.0

7.0

LOT Number

8.0

9.0

1PIN

10.0

12.0

15.0

HTSOP-J8

HTSOP-J8 (TOP VIEW)

Output

Voltage[V]

Part Number

Marking

Part Number Marking

LOT Number

Variable

3.0

00FC0W

30FC0W

33FC0W

50FC0W

60FC0W

70FC0W

80FC0W

90FC0W

J0FC0W

J2FC0W

J5FC0W

x x F C 0 W

3.3

5.0

6.0

7.0

1PIN MARK

8.0

9.0

10.0

12.0

15.0

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●Revision History

Date

Revision

Changes

27.Aug.2013

001

002

003

New Release

Add BDxxFC0FP and BDxxFC0WFP

Change pin name OUT -> Vo

P2 Lineup modified

20.Oct. 2015

02.Dec. 2015

The document control number:TSZ02201-0GAG0A600040-1-2

-> TSZ02201-0G2G0A600040-1-2

P8 Power dissipation deleted

P8 notes added in electrical characteristics

P9 Copper Pattern area modified

16.May. 2016

004

Misentry modified in Whole page

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

BD50FC0FP - Web Page

Part Number

Package

Unit Quantity

BD50FC0FP

TO252-3

2000

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2000

Taping

inquiry

Yes

D90FCFP-E2 [ROHM]

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