LD-101YY/HJ [ROHM]
Single Color LED, Yellow, Diffused, 5mm,;
| 型号： | LD-101YY/HJ |
| 厂家： | 
ROHM |
| 描述： | Single Color LED, Yellow, Diffused, 5mm, 显示器 |
| 文件： | 总2页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LD-101 Series
LED displays
Flat displays
LD-101 Series
The LD-101 series were designed in
response to the need for small, flat displays.
These are single-chip, flat displays with high
luminance.
!External dimensions (Units : mm)
6.0
5.0
R 6 . 0
!Features
1) Planar emission from a single chip.
2) Thin outer casing, multiple units can be
coupled together.
Cathode mark
0.5
(0.7)
0.6
(0.7)
0.6
Pin No.1
2
Pin No.1
2
(2.5)
Tolerances are 0.1 unless otherwise noted:
!Selection guide
Emitting color
Red
Orange
Yellow
Green
∗
∗
Type
LD-101VR
LD-101DU
LD-101YY
LD-101MG
∗ Order-based production.
!Absolute maximum ratings (Ta = 25°C)
Parameter
Red LD-101VR Orange LD-101DU
Yellow LD-101YY Green LD-101MG
Symbol
Unit
mW
mA
Power dissipation
Forward current
P
D
60
20
60
20
60
20
75
25
I
F
Peak forward
current
∗
∗
∗
∗
60
3
60
3
60
3
60
3
I
FP
mA
V
Reverse voltage
V
R
Operating
temperature
°C
−25~+75
−30~+85
Topr
Tstg
Storage
temperature
°C
∗
Pulse width 1ms duty 1 / 5
LD-101 Series
LED displays
! Electrical and optical characteristics (Ta = 25°C)
Red
Orange
Yellow
Green
Unit
Parameter
Symbol Conditions
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
−
−
−
−
−
−
−
−
−
V
F
I
F
= 10mA
= 3V
−
−
−
2.0
−
2.8
10
−
2.0
−
2.8
10
−
2.1
−
2.8
10
−
2.1
−
2.8
10
−
V
Forward voltage
Reverse current
Peak wavelength
I
R
V
R
µA
nm
I
I
F
= 10mA
= 10mA
650
610
585
563
λ
P
Spectral line half
width
∆λ
F
−
40
−
−
40
−
−
40
−
−
40
−
nm
!Luminous intensity vs. wavelength
1.0
Green
Yellow
Orange
Red
0.8
0.6
0.4
0.2
0
500
550
600
Wavelength : λ
650
(nm)
700
750
P
! Luminous intensity
Color
Red
Type
Min.
0.9
0.9
0.9
1.4
Typ.
2.5
2.5
2.5
4.0
Max.
Unit
mcd
mcd
mcd
mcd
LD-101VR
LD-101DU
LD-101YY
LD-101MG
−
−
−
−
Orange
Yellow
Green
Note : Measured at IF = 10mA
! Operation notes
When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and
ensure that the inside of the LED is not subjected to mechanical stress while it is hot.
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