LM2904EYFJ-C (开发中)

EMARMOUR^TM

Datasheet

Operational Amplifier

Automotive Excellent EMI Immunity

Ground Sense Operational Amplifier

LM2904EYxxx-C

General Description

Key Specifications

◼ Operating Supply Voltage Range

Single Supply:

LM2904EYxxx-C is high-gain and ground sense input

operational amplifier. This IC is monolithic IC integrated

dual independent operational amplifier on a single chip.

An operating voltage range is wide with 3 V to 36 V. This

operational amplifier is the most suitable for automotive

requirements such as engine control unit, electric power

steering, anti-lock braking system and so on because it

has features of low supply current.

3.0 V to 36.0 V

±1.5 V to ±18.0 V

Dual Supply:

◼ Operating Temperature Range: -40 °C to +150 °C

◼ Low Supply Current:

◼ Input Offset Current:

◼ Input Bias Current:

0.6 mA (Typ)

2 nA (Typ)

20 nA (Typ)

Furthermore, they have the advantage of EMI tolerance.

It makes easier replacing with conventional products or

simpler designing EMI.

Package

W (Typ) x D (Typ) x H (Max)

5.0 mm x 6.2 mm x 1.71 mm

4.9 mm x 6.0 mm x 1.65 mm

2.9 mm x 4.0 mm x 0.9 mm

SOP8

SOP-J8

MSOP8

Features

◼ EMARMOUR^TMSeries

◼ AEC-Q100 Qualified^{(Note 1)}

◼ Operable from Almost GND Level for Both Input and

Output

◼ Single or Dual Power Supply Operation

◼ Standard Op-Amp Pin-assignments

◼ Low Supply Current

◼ Wide Operating Supply Voltage Range

◼ High Open Loop Voltage Gain

◼ Wide Operating Temperature Range

(Note 1) Grade 1

SOP-J8

SOP8

Applications

◼ Engine Control Unit

◼ Electric Power Steering (EPS)

◼ Anti-lock Braking System (ABS)

◼ Automotive Electronics

MSOP8

Typical Application Circuit

C_F= 10 pF

R_F= 10 kΩ

V_CC= +2.5 V

R_IN= 100 Ω

푅_퐹

V_IN

V_OUT

푉_푂푈푇= −

푉

퐼푁

푅_퐼푁

V_EE= -2.5 V

EMARMOUR^TMis a trademark or a registered trademark of ROHM Co., Ltd.

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

LM2904EYF-C: SOP8

LM2904EYFJ-C: SOP-J8

LM2904EYFVM-C: MSOP8

OUT1

-IN1

1

2

3

4

8 VCC

CH1

7 OUT2

+

-

+

+IN1

CH2

-IN2

6

-

+

5 +IN2

VEE

(TOP VIEW)

Pin Description

LM2904EYF-C: SOP8

LM2904EYFJ-C: SOP-J8

LM2904EYFVM-C: MSOP8

Pin No.

Pin Name

OUT1

-IN1

Function

1

2

3

4

5

6

7

8

Output (1 ch)

Inverting input (1 ch)

+IN1

Non-inverting input (1 ch)

VEE

Negative power supply / Ground

Non-inverting input (2 ch)

Inverting input (2 ch)

Output (2 ch)

+IN2

-IN2

OUT2

VCC

Positive power supply

Block Diagram

LM2904EYF-C: SOP8

LM2904EYFJ-C: SOP-J8

LM2904EYFVM-C: MSOP8

OUT1

1

2

8

7

VCC

Iref

OUT2

-IN1

+IN1

VEE

OPAMP

(CH1)

-

+

OPAMP

(CH2)

3

4

6

5

-IN2

+

-

+IN2

Description of Blocks

1. OPAMP:

This block is a ground sense operational amplifier with differential input stage.

2. Iref:

This block supplies reference current which is needed to operate OPAMP block.

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

Rating

Unit

Supply Voltage

V_CC-V_EE

V_ID

36

V_CC-V_EE

V

Differential Input Voltage^{(Note 1)}

Common-mode Input Voltage Range

Output Current^{(Note 2)}

V_ICMR

I_OUT

(V_EE- 0.3) to (V_EE+ 36)

±40

V

mA

Input Current

I_I

±10

150

mA

°C

Maximum Junction Temperature

Storage Temperature Range

Tjmax

Tstg

-55 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.

The input pin voltage is set to V_EEor more.

(Note 2) The excessive heat generation may occur due to the short-circuit from the output pin to the power supply pin. Do not use the output pin short to power

supply. Use the output current less than 40mA regardless of the power supply voltage.

Thermal Resistance^{(Note 3)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 5)}

2s2p^{(Note 6)}

SOP8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 4)}

θ_JA

197.4

21

109.8

19

°C/W

Ψ_JT

SOP-J8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 4)}

θ_JA

149.3

18

76.9

11

°C/W

Ψ_JT

MSOP8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 4)}

θ_JA

284.1

21

135.4

11

°C/W

Ψ_JT

(Note 3) Based on JESD51-2A(Still-Air).

(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 5) Using a PCB board based on JESD51-3.

(Note 6) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Material

Board Size

4 Layers

FR-4

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Top

Copper Pattern

Bottom

Copper Pattern

74.2 mm x 74.2 mm

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

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Recommended Operating Conditions

Parameter

Symbol

Min

3.0

Typ

Max

36.0

Unit

Single Supply

Operating Supply Voltage

Dual Supply

-

V_CC

V

±1.5

-

±18.0

+150

Operating Temperature

Topr

-40

+25

°C

Function Explanation

1. EMARMOUR^TM

EMARMOUR^TMis the brand name given to ROHM products developed by leveraging proprietary technologies covering

layout, process, and circuit design to achieve ultra-high noise immunity that limits output voltage fluctuation to ±300 mV

or less across the entire noise frequency band during noise evaluation testing under the international ISO11452-2

standard. This unprecedented noise immunity reduces design load while improving reliability by solving issues related to

noise in the development of vehicle electrical systems.

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Electrical Characteristics (Unless otherwise specified V_CC= 5 V, V_EE= 0 V)

Limit

Temperature

Parameter

Symbol

Unit

mV

Conditions

V_OUT= 1.4 V

Range

Min

Typ

2

Max

6

25 °C

-

Absolute value

V_CC= 5 V to 30 V

V_OUT= 1.4 V

Input Offset Voltage

V_IO

-40 °C to +150 °C

-

9

Absolute value

25 °C

-40 °C to +150 °C

25 °C

-

2

-

40

50

60

100

1.2

-

V_OUT= 1.4 V

Absolute value

Input Offset Current

Input Bias Current

Supply Current

I_IO

nA

-

20

-

V_OUT= 1.4 V

Absolute value

I_B

-40 °C to +150 °C

25 °C

-

0.6

-

I_CC

mA

R_L= ∞, All Op-Amps

-40 °C to +150 °C

25 °C

-

3.5

3.2

27

-

R_L= 2 kΩ

Output Voltage High

V_OH

-40 °C to +150 °C

25 °C

-

V

28

5

V_CC= 30 V, R_L= 10 kΩ

R_L= ∞

Output Voltage Low

V_OL

A_V

20

mV

dB

88

0

100

-

R_L≥ 2 kΩ, V_CC= 15 V

V_OUT= 1.4 V to 11.4 V

Large Signal Voltage Gain

-40 °C to +150 °C

25 °C

-

3.5

3.0

-

Common-mode Input

Voltage Range

(V_CC-V_EE) = 5 V

V_OUT= V_EE+ 1.4 V

V_ICMR

-40 °C to +125 °C

-40 °C to +150 °C

25 °C

0

-

V

0.2

60

70

20

10

20

2

-

Common-mode Rejection

Ratio

Power Supply Rejection

Ratio

CMRR

PSRR

80

100

30

-

dB

V_OUT= 1.4 V

-

V_CC= 5 V to 30 V

V_+IN= 1 V, V_-IN= 0 V

V_OUT= 0 V

1 ch is short circuit

Absolute value

V_+IN= 0 V, V_-IN= 1 V

V_OUT= 5 V

1 ch is short circuit

Absolute value

V_+IN= 0 V, V_-IN= 1 V

V_OUT= 200 mV

V_CC= 15 V, A_V= 0 dB

R_L= 2 kΩ, C_L= 100 pF

V_CC= +15 V, V_EE= -15 V

R_L= 2 kΩ, C_L= 100 pF

40

-

Output Source Current^{(Note 1)}

Output Sink Current^{(Note 1)}

I_OH

mA

-40 °C to +150 °C

25 °C

27

-

40

-

I_OL

-40 °C to +150 °C

25 °C

20

-

50

0.2

0.5

120

-

μA

V/μs

MHz

dB

Slew Rate

SR

GBW

CS

25 °C

-

Gain Bandwidth Product

Channel Separation

25 °C

-

25 °C

-

f = 1 kHz, Input Referred

(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited

continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.

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Typical Performance Curves

V_EE= 0 V

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

Ta = -40 °C

Ta = +25 °C

Ta = +150 °C

VCC = 3.0 V

VCC = 5.0 V

VCC = 36.0 V

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 1. Supply Current vs Supply Voltage

Figure 2. Supply Current vs Ambient Temperature

40

35

30

25

20

15

10

5

4

3

2

1

0

Ta = -40 °C

Ta = +25 °C

Ta = +150 °C

0

-50 -25

0

25

50

75 100 125 150

0

10

20

30

40

Ambient Temperature : Ta [°C]

Supply Voltage : V_CC[V]

Figure 3. Output Voltage High vs Supply Voltage

(R_L= 10 kΩ)

Figure 4. Output Voltage High vs Ambient Temperature

(V_CC= 5 V, R_L= 2 kΩ)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_EE= 0 V

50

40

30

20

10

0

Ta = -40 °C

VCC = 3.0 V

VCC = 5.0 V

VCC = 36.0 V

Ta = +25 °C

40

30

20

10

0

Ta = +150 °C

0

1

2

3

4

5

6

-50 -25

0

25 50

75 100 125 150

Output Voltage : V_OUT[V]

Ambient Temperature : Ta [°C]

Figure 5. Output Source Current vs Output Voltage

(V_CC= 5 V)

Figure 6. Output Source Current vs Ambient Temperature

(V_OUT= 0 V)

100

10

1

60

50

40

30

20

10

0

0.1

Ta = -40 °C

0.01

Ta = +25 °C

Ta = +150 °C

0.001

-50 -25

0

25 50

75 100 125 150

0

1

2

3

4

5

Ambient Temperature : Ta [°C]

Output Voltage : V_OUT[V]

Figure 7. Output Sink Current vs Output Voltage

(V_CC= 5 V)

Figure 8. Output Sink Current vs Ambient Temperature

(V_CC= 5 V, V_OUT= 5 V)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_EE= 0 V

80

70

60

50

40

30

20

80

70

60

50

40

30

20

10

0

Ta = -40 °C

VCC = 3.0 V

VCC = 5.0 V

VCC = 36.0 V

Ta = +25 °C

10

0

Ta = +150 °C

0

10

20

30

40

-50 -25

0

25 50

75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 9. Output Sink Current vs Supply Voltage

(V_OUT= 0.2 V)

Figure 10. Output Sink Current vs Ambient Temperature

(V_OUT= 0.2 V)

4

3

4

3

2

1

0

-1

-2

-3

-4

-1

-2

Ta = -40 °C

Ta = +25 °C

Ta = +150 °C

VCC = 3.0 V

VCC = 5.0 V

-3

-4

VCC = 36.0 V

0

10

20

30

40

-50 -25

0

25

50

75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 11. Input Offset Voltage vs Supply Voltage

(V_ICM= V_CC/2)

Figure 12. Input Offset Voltage vs Ambient Temperature

(V_ICM= V_CC/2)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_EE= 0 V

50

40

30

20

10

0

50

40

30

20

10

0

-10

-20

-10

-20

-30

-40

-50

Ta = -40 °C

-30

VCC = 3.0 V

VCC = 5.0 V

VCC = 36.0 V

Ta = +25 °C

-40

Ta = +150 °C

-50

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 13. Input Bias Current vs Supply Voltage

(V_ICM= V_CC/2)

Figure 14. Input Bias Current vs Ambient Temperature

(V_ICM= V_CC/2)

50

10

Ta = -40 °C

40

30

8

Ta = +25 °C

6

Ta = +125 °C

20

4

2

Ta = +150 °C

10

0

-10

-20

-30

-40

-50

-2

-4

-6

-8

-10

-50 -25

0

25 50 75 100 125 150

-1

0

1

2

3

4

5

Ambient Temperature : Ta [°C]

Common-mode Input Voltage : V_ICM[V]

Figure 15. Input Bias Current vs Ambient Temperature

(V_CC= 30 V, V_ICM= 28 V, V_OUT= 1.4 V)

Figure 16. Input Offset Voltage vs Common-mode

Input Voltage

(V_CC= 5 V)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_EE= 0 V

10

8

Ta = -40 °C

VCC = 3.0 V

VCC = 5.0 V

VCC = 36.0 V

8

6

Ta = +25 °C

6

Ta = +150 °C

4

2

0

-2

-4

-6

-8

-10

-2

-4

-6

-8

-10

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 17. Input Offset Current vs Supply Voltage

(V_ICM= V_CC/2)

Figure 18. Input Offset Current vs Ambient Temperature

(V_ICM= V_CC/2)

140

Ta = -40 °C

Ta = +25 °C

Ta = +150 °C

VCC = 3.0 V

130

120

110

100

90

130

VCC = 5.0 V

VCC = 36.0 V

120

110

100

90

80

70

60

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 19. Large Signal Voltage Gain vs Supply Voltage

(R_L= 2 kΩ)

Figure 20. Large Signal Voltage Gain vs Ambient

Temperature

(R_L= 2 kΩ)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_EE= 0 V

140

120

100

80

Ta = -40 °C

VCC = 3.0 V

VCC = 5.0 V

VCC = 36.0 V

Ta = +25 °C

120

100

80

Ta = +150 °C

60

40

0

10

20

30

40

-50 -25

0

25 50 75 100 125 150

Supply Voltage : V_CC[V]

Ambient Temperature : Ta [°C]

Figure 21. Common-mode Rejection Ratio vs Supply Voltage

Figure 22. Common-mode Rejection Ratio vs Ambient

(V_OUT= 1.4 V)

Temperature

(V_OUT= 1.4 V)

140

130

120

110

100

90

0.5

Rise

Fall

0.4

0.3

0.2

0.1

0.0

80

70

60

-50 -25

0

25 50 75 100 125 150

0

10

20

30

40

Ambient Temperature : Ta [°C]

Supply Voltage : V_CC[V]

Figure 23. Power Supply Rejection Ratio vs Ambient

Figure 24. Slew Rate vs Supply Voltage

(Ta = 25 °C, R_L= 2 kΩ)

Temperature

(V_CC= 5 V)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Typical Performance Curves - continued

V_EE= 0 V

0.5

0.4

0.3

0.2

0.1

0.0

Rise

Fall

-50 -25

0

25 50 75 100 125 150

Ambient Temperature : Ta [°C]

Figure 25. Slew Rate vs Ambient Temperature

(V_CC= 5 V, R_L= 2 kΩ)

(Note) The above data are measurement value of typical sample; it is not guaranteed.

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Application Information

EMI Immunity

LM2904EYxxx-C has high tolerance for electromagnetic interference from the outside because they have EMI filter, and the

EMI design is simple. They are most suitable to replace from conventional products. The data of the IC simple substance

on ROHM board are as follows. The test condition is based on ISO11452-2.

V_IN++0.15

<Test Condition> Based on ISO11452-2

Test Circuit: Voltage Follower

V_CC: 12 V

V_+IN: 6 V

V_IN++0.10

Test Method: Substituted Law

(Progressive Wave)

Field Intensity: 200 V/m

Conventional Product

V_IN++0.05

Test Wave: CW (Continuous Wave)

Frequency: 200 MHz – 1000 MHz (2 % step)

V_IN+

LM2904EYxxx-C

V_IN+-0.05

V_IN+-0.10

V_IN+-0.15

200

400

600

800

1000

Frequency [MHz]

Figure 26. EMI Characteristics

Figure 27. EMI Evaluation Board

VCC

BIAS

Tee

Battery

6 V

Oscillo

Scope

Battery

12 V

-

VEE

+

Antenna

Figure 28. Measurement Circuit of EMI Evaluation

(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed.

Design and Evaluate in actual application before use.

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Application Information - continued

VCC

VEE

1. Unused Circuits

When there are unused circuits, it is recommended that they are connected

as in right figure, and set the non-inverting input pin to electric potential

within the input common-mode voltage range (V_ICMR).

+

Connect

to V_ICM

-

V_ICM

2. Input Voltage

Applying V_EE+ 36 V to the input pin is possible without causing deterioration

of the electrical characteristics or destruction, regardless of the supply

voltage. However, this does not ensure circuit operation. Note that the circuit

operates normally only when the input voltage is within the common-mode

input voltage range of the electric characteristics.

Figure 29. Example of application

unused circuit processing

3. Power Supply (single/dual)

The Op-Amp operates when the voltage is supplied between the VCC and

VEE pin. Therefore, the single supply Op-Amp can be used as dual supply

Op-Amp as well.

4. Output Capacitor

When the VCC pin is shorted to V_EE(GND) electric potential in a state where electric charge is accumulated in the external

capacitor that is connected to the output pin, the accumulated electric charge flow through parasitic elements or pin

protection elements inside the circuit and discharges to the VCC pin. It may cause damage to the elements inside the

circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative feedback

circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, connect a capacitor of

0.1 µF or less to the output pin to prevent IC damage caused by the accumulation of electric charge as mentioned above.

5. Oscillation by Output Capacitor

Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop

circuit with this IC.

6. Handling the IC

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical

characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.

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Application Examples

○Voltage Follower

Using this circuit, the output voltage (V_OUT) is configured

to be equal to the input voltage (V_IN). This circuit also

stabilizes the output voltage (V_OUT) due to high input

impedance and low output impedance. Computation for

output voltage (V_OUT) is shown below.

VCC

V_OUT

V_IN

푉_푂푈푇= 푉

퐼푁

VEE

Figure 30. Voltage Follower Circuit

○Inverting Amplifier

R_F

For inverting amplifier, input voltage (V_IN) is amplified by

a voltage gain which depends on the ratio of R_INand R_F,

and then it outputs phase-inverted voltage. The output

voltage is shown in the next expression.

VCC

R_IN

V_IN

V_OUT

푅_퐹

푉_푂푈푇= −

푉

퐼푁

푅_퐼푁

This circuit has input impedance equal to R_IN.

VEE

Figure 31. Inverting Amplifier Circuit

○Non-inverting Amplifier

R_IN

R_F

For non-inverting amplifier, input voltage (V_IN) is

amplified by a voltage gain, which depends on the ratio

of R_INand R_F. The output voltage (V_OUT) is in-phase with

the input voltage (V_IN) and is shown in the next

expression.

VCC

VEE

V_OUT

푅_퐹

푉_푂푈푇= (1 +

) 푉

퐼푁

V_IN

푅_퐼푁

Effectively, this circuit has high input impedance since its

input side is the same as that of the operational amplifier.

Figure 32. Non-inverting Amplifier Circuit

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I/O Equivalence Circuits

Pin No.

Pin Name

Pin Description

Equivalence Circuit

VCC

1

7

OUT1

OUT2

Output

1, 7

VEE

2

3

5

6

-IN1

+IN1

+IN2

-IN2

2, 3, 5, 6

VEE

Input

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Operational Notes

1.

2.

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3.

4.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

6.

Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and

routing of connections.

7.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

8.

9.

Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 33. Example of Monolithic IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

L M 2 9 0 4 E Y x x x - C x x

Product Rank

Package

C: for Automotive

F: SOP8

Packaging and forming specification

E2: Embossed tape and reel

TR: Embossed tape and reel

FJ: SOP-J8

FVM: MSOP8

Lineup

Temperature

Range

Operating Supply

Voltage Range

Number of

Channels

Orderable Part

Number

Package

Reel of 2500

Reel of 3000

SOP8

LM2904EYF-CE2

LM2904EYFJ-CE2

LM2904EYFVM-CTR

-40 °C to +150 °C

3 V to 36 V

Dual

SOP-J8

MSOP8

Marking Diagram

SOP-J8 (TOP VIEW)

SOP8 (TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

2 9 0 4 E

Pin 1 Mark

MSOP8 (TOP VIEW)

Part Number Marking

2

9

0

LOT Number

4

E

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT: mm)

PKG: SOP8

Drawing No.: EX112-5001-1

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Physical Dimension and Packing Information – continued

Package Name

SOP-J8

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LM2904EYxxx-C

Physical Dimension and Packing Information – continued

Package Name

MSOP8

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LM2904EYxxx-C

Revision History

Date

Revision

001

Changes

13.Feb.2020

17.Jan.2022

29.Jun.2022

01.Oct.2022

New Release

Changed the "Absolute Maximum Ratings" and "Recommended Operating Conditions" of

the supply voltage.

002

003

Added Lineup

Modified title

004

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	LM2904EYFJ-C (开发中)
厂家：	ROHM
描述：	LM2904EYxxx-C是将高增益且接地检测输入独立的运算放大器以2个电路集成于1枚芯片的单片IC。工作电压范围宽达3V～32V，且消耗电流低，适用于引擎控制单元、EPS、ABS等各类车载应用。不仅如此，还具有出色的抗EMI性能，可轻松替换现有产品，EMI设计也更容易。放大器运算放大器
文件：	总26页 (文件大小：1541K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

LM2904EYFJ-C (开发中) [ROHM]

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