LM324F [ROHM]

Ground Sense Operational Amplifiers;


型号：	LM324F
厂家：	ROHM
描述：	Ground Sense Operational Amplifiers 放大器
文件：	总48页 (文件大小：1413K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Operational Amplifiers

Ground Sense Operational Amplifiers

LM358xxx LM324xxx LM2904xxx LM2902xxx

General Description

Key Specifications

LM358xxx and LM2904xxx series are dual ground

sense operational amplifiers. LM324xxx and

LM2902xxx series are quad. These have features of

low current consumption and wide operating voltage

range from 3V to 32V (single power supply).

 Operating Supply Voltage (Single Supply):

3.0V to 32.0V

 Operating Temperature Range:

LM358xxx:

LM324xxx:

LM2904xxx:

LM2902xxx:

-40°C to +85°C

-40°C to +125°C

4.5mV (Max)

Features

 Input Offset Voltage:

 Input Bias Current:

 Operable with a Single Power Supply

 Wide Operating Supply Voltage Range

 Input/output Ground Sense

 High Large Signal Voltage Gain

20nA (Typ)

Packages

SOP8

W(Typ) x D(Typ) x H(Max)

5.00mm x 6.20mm x 1.71mm

4.90mm x 6.00mm x 1.65mm

3.00mm x 6.40mm x 1.35mm

3.00mm x 6.40mm x 1.20mm

3.00mm x 4.90mm x 1.10mm

2.90mm x 4.00mm x 0.90mm

8.70mm x 6.20mm x 1.71mm

8.65mm x 6.00mm x 1.65mm

5.00mm x 6.40mm x 1.35mm

5.00mm x 6.40mm x 1.20mm

Applications

SOP-J8

 Current Sense Application

 Buffer Application Amplifier

 Active Filter

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

 Consumer Electronics

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

Pin Configuration

LM358F, LM2904F

LM358FJ, LM2904FJ

LM358FV, LM2904FV

: SOP8

: SOP-J8

: SSOP-B8

LM358FVT, LM2904FVT : TSSOP-B8

LM358FVJ, LM2904FVJ : TSSOP-B8J

LM358FVM, LM2904FVM : MSOP8

Pin No.

Pin Name

OUT1

-IN1

OUT1

VCC

OUT2

-IN2

+IN1

VEE

+IN2

-IN2

CH1

-IN1

CH2

+IN1

+IN2

VEE

OUT2

VCC

○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

LM324F, LM2902F

LM324FJ, LM2902FJ

LM324FV, LM2902FV

: SOP14

: SOP-J14

: SSOP-B14

LM324FVJ, LM2902FVJ : TSSOP-B14J

Pin No.

Pin Name

OUT1

-IN1

OUT1

OUT4

-IN4

+IN1

VCC

-IN1

+IN1

VCC

+IN2

-IN2

CH1

CH4

+IN4

VEE

+IN2

-IN2

OUT2

OUT3

-IN3

10 +IN3

CH2

CH3

-IN3

+IN3

VEE

OUT2

OUT3

+IN4

-IN4

OUT4

Absolute Maximum Ratings (T_A=25°C)

Parameter

Rating

Symbol

Unit

LM358xxx

LM324xxx LM2904xxx LM2902xxx

Supply Voltage

V_CC-V_EE

0.68^{(Note 1,9)}

SOP8

0.67^{(Note 2,9)}

0.62^{(Note 3,9)}

0.67^{(Note 2,9)}

0.62^{(Note 3,9)}

SOP-J8

SSOP-B8

0.62^{(Note 3,9)}

0.58^{(Note 4,9)}

0.62^{(Note 3,9)}

0.58^{(Note 4,9)}

TSSOP-B8

TSSOP-B8J

MSOP8

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

V_ID

Power Dissipation

P_D

0.56^{(Note 5,9)}

1.02^{(Note 6,9)}

0.87^{(Note 7,9)}

0.85^{(Note 8,9)}

0.56^{(Note 5,9)}

1.02 ^{(Note 6,9)}

0.87^{(Note 7,9)}

0.85^{(Note 8,9)}

Differential Input Voltage ^{(Note 10)}

Input Common-mode Voltage Range

Input Current^{(Note 11)}

V_ICM

(V_EE-0.3) to (V_EE+36)

±10

I_I

V_opr

Operating Supply Voltage

3.0 to 32.0

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature

T_opr

-40 to +85

-40 to +125

°C

T_stg

-55 to +150

150

T_jmax

(Note 1) Reduce by 5.5mW per 1°C above 25C.

(Note 2) Reduce by 5.4mW per 1°C above 25°C.

(Note 3) Reduce by 5.0mW per 1°C above 25°C.

(Note 4) Reduce by 4.7mW per 1°C above 25°C.

(Note 5) Reduce by 4.5mW per 1°C above 25°C.

(Note 6) Reduce by 8.2mW per 1°C above 25°C.

(Note 7) Reduce by 7.0mW per 1°C above 25°C.

(Note 8) Reduce by 6.8mW per 1°C above 25°C.

(Note 9) Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).

(Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs.

The input pin voltage is set to more than V_EE

(Note 11) An excessive input current will flow when input voltages of less than V_EE-0.6V are applied.

The input current can be set to less than the rated current by adding a limiting resistor.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Electrical Characteristics

○LM358xxx, LM2904xxx (Unless otherwise specified V_CC=+5V, V_EE=0V)

Limits

Temperature

Parameter

Symbol

Unit

Condition

Range

Min

Typ

Max

4.5

25°C

V_OUT=1.4V

V_CC=5 to 30V, V_OUT=1.4V

Input Offset Voltage^{(Note 12,13)}

Input Offset Voltage Drift^{(Note 12)}

Input Offset Current^{(Note 12,13)}

V_IO

∆V_IO/∆T

I_IO

Full Range

μV/°C V_OUT=1.4V

25°C

Full Range

25°C

200

250

300

1.2

1.5

_OUT=1.4V

Input Bias Current^{(Note 12,13)}

Supply Current^{(Note 13)}

I_B

Full Range

25°C

0.6

I_CC

mA R_L=∞, All Op-Amps

Full Range

25°C

3.5

R_L=2kΩ

Maximum Output Voltage (High)^{(Note 13)}

Maximum Output Voltage (Low)^{(Note 13)}

Large Signal Voltage Gain

V_OH

V_OL

A_V

Full Range

V_CC=30V, R_L=10kΩ

mV R_L=∞

100

V/mV

R_L≧2kΩ, V_CC=15V

25°C

V_OUT=1.4 to 11.4V

V_ICM=V_EEto (V_CC-1.5V)

V_OUT=1.4V

Input Common-mode Voltage Range

V_ICM

3.5

Input Common-mode Voltage Range

(VEE side) ^{(Note 14)}

V_ICM

Full Range

25°C

0.1

100

V_OUT=1.4V

Common-mode Rejection Ratio

Power Supply Rejection Ratio

CMRR

PSRR

dB V_OUT=1.4V

25°C

dB V_CC=5 to 30V

25°C

_+IN=1V, V_-IN=0V

Output Source Current^{(Note 13,15)}

I_SOURCE

V_OUT=0V, Short Current

Full Range

25°C

V_+IN=0V, V_-IN=1V

V_OUT=5V, Short Current

Output Sink Current^{(Note 13,15)}

I_SINK

Full Range

25°C

V_+IN=0V, V_-IN=1V

V_OUT=200mV

120

0.3

μA

Channel Separation

Slew Rate

GBW

25°C

dB f=1kHz, Input Referred

V_CC=15V, Av=0dB

V/μs

25°C

R_L=2kΩ, C_L=100pF

V_CC=15V, V_EE=-15V

R_L=2kΩ, C_L=100pF

Gain Bandwidth

Phase Margin

25°C

0.8

MHz

deg Av=40dB

V_CC=15V, V_EE=-15V

R_S=100Ω, V_IN=0V, f=1kHz

Input Referred Noise Voltage

V_N

nV/ Hz

(Note 12) Absolute value

(Note 13) LM358xxx Full Range: T_A=-40C to +85C, LM2904xxx Full Range: T_A=-40C to +125C

(Note 14) LM2904xxx only.

(Note 15) Consider the power dissipation of the IC under high temperature when selecting the output current value.

There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Electrical Characteristics - continued

○LM324xxx, LM2902xxx (Unless otherwise specified V_CC=+5V, V_EE=0V)

Limits

Temperature

Parameter

Symbol

Unit

Condition

Range

Min

Typ

Max

4.5

25°C

V_OUT=1.4V

V_CC=5 to 30V, V_OUT=1.4V

Input Offset Voltage^{(Note 16,17)}

Input Offset Voltage Drift^{(Note 17)}

Input Offset Current^{(Note 16,17)}

V_IO

∆V_IO/∆T

I_IO

Full Range

μV/°C V_OUT=1.4V

25°C

Full Range

25°C

200

250

300

_OUT=1.4V

Input Bias Current^{(Note 16,17)}

Supply Current^{(Note 17)}

I_B

Full Range

25°C

I_CC

mA R_L=∞, All Op-Amps

Full Range

25°C

2.5

3.5

R_L=2kΩ

Maximum Output Voltage (High)^{(Note 17)}

Maximum Output Voltage (Low)^{(Note 17)}

Large Signal Voltage Gain

V_OH

V_OL

A_V

Full Range

V_CC=30V, R_L=10kΩ

mV R_L=∞

100

V/mV

R_L≧2kΩ, V_CC=15V

25°C

V_OUT=1.4 to 11.4V

V_ICM=V_EEto (V_CC-1.5V)

V_OUT=1.4V

Input Common-mode Voltage Range

V_ICM

3.5

Input Common-mode Voltage Range

(VEE side) ^{(Note 18)}

V_ICM

Full Range

25°C

0.1

100

V_OUT=1.4V

Common-mode Rejection Ratio

Power Supply Rejection Ratio

CMRR

PSRR

dB V_OUT=1.4V

25°C

dB V_CC=5 to 30V

25°C

_+IN=1V, V_-IN=0V

Output Source Current^{(Note 17,19)}

I_SOURCE

V_OUT=0V, Short Current

Full Range

25°C

V_+IN=0V, V_-IN=1V

V_OUT=5V, Short Current

Output Sink Current^{(Note 17,19)}

I_SINK

Full Range

25°C

V_+IN=0V, V_-IN=1V

V_OUT=200mV

120

0.3

μA

Channel Separation

Slew Rate

GBW

25°C

dB f=1kHz, Input Referred

V_CC=15V, Av=0dB

V/μs

25°C

R_L=2kΩ, C_L=100pF

V_CC=15V, V_EE=-15V

R_L=2kΩ, C_L=100pF

Gain Bandwidth

Phase Margin

25°C

0.8

MHz

deg Av=40dB

V_CC=15V, V_EE=-15V

R_S=100Ω, V_IN=0V, f=1kHz

Input Referred Noise Voltage

V_N

nV/ Hz

(Note 16) Absolute value

(Note 17) LM324xxx Full Range: T_A=-40C to +85C, LM2902xxx Full Range: T_A=-40C to +125C

(Note 18) LM2902xxx only.

(Note 19) Consider the power dissipation of the IC under high temperature when selecting the output current value.

There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Description of Electrical Characteristics

Below are the descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown.

Note that item names, symbols, and their meanings may differ from those of another manufacturer’s document or general

document.

1. Absolute Maximum Ratings

Absolute maximum rating items indicate the conditions which must not be exceeded. Application of voltage in excess of the

absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of

electrical characteristics.

(1) Supply Voltage (V_CC/V_EE

)

Indicates the maximum voltage that can be applied between the VCC pin and VEE pin without deterioration of

characteristics of internal circuit.

(2) Differential Input Voltage (V_ID)

Indicates the maximum voltage that can be applied between the non-inverting and inverting pins without damaging

the IC.

(3) Input Common-mode Voltage Range (V_ICM

)

Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or

destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure

normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.

(4) Power Dissipation (P_D)

Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C

(normal temperature). As for package product, P_Dis determined by the temperature that can be permitted by the IC in

the package (maximum junction temperature) and the thermal resistance of the package.

2. Electrical Characteristics

(1) Input Offset Voltage (V_IO)

Indicates the voltage difference between non-inverting pin and inverting pin. It can be translated to the input voltage

difference required for setting the output voltage to 0V.

(2) Input Offset Voltage Drift (∆V_IO/∆T)

Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.

(3) Input Offset Current (I_IO)

Indicates the difference of input bias current between the non-inverting and inverting pins.

(4) Input Bias Current (I_B)

Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the

non-inverting and inverting pins.

(5) Supply Current (I_CC

)

Indicates the current that flows within the IC under specified no-load conditions.

(6) Maximum Output Voltage (High) / Maximum Output Voltage (Low) (V_OH/V_OL

)

Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output

voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output

voltage low indicates the lower limit.

(7) Large Signal Voltage Gain (A_V)

Indicates the amplification rate (gain) of output voltage against the voltage difference between non-inverting pin and

inverting pin. It is normally the amplification rate (gain) with reference to DC voltage.

Av = (Output Voltage) / (Differential Input Voltage)

(8) Input Common-mode Voltage Range (V_ICM

)

Indicates the input voltage range at which IC normally operates.

(9) Common-mode Rejection Ratio (CMRR)

Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally

the fluctuation of DC.

CMRR = (Change of Input Common-mode Voltage)/(Input Offset Fluctuation)

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LM358xxx LM324xxx LM2904xxx LM2902xxx

(10) Power Supply Rejection Ratio (PSRR)

Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.

It is normally the fluctuation of DC.

PSRR= (Change of Power Supply Voltage)/( Input Offset Fluctuation)

(11) Output Source Current/ Output Sink Current (I_SOURCE/ I_SINK

)

The maximum current that the IC can output under specific output conditions. The output source current indicates the

current flowing out from the IC, and the output sink current indicates the current flowing into the IC.

(12) Channel Separation (CS)

Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of

the channel which is not driven.

(13) Slew Rate (SR)

Indicates the rate of the change of the output voltage with time when a step input signal is applied.

(14) Gain Bandwidth (GBW)

The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.

(15) Phase Margin (θ)

Indicates the margin of phase from 180 degree phase lag at unity gain frequency.

(16) Input Referred Noise Voltage (V_N)

Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in

series with input pin.

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LM358xxx LM324xxx LM2904xxx LM2902xxx

Typical Performance Curves

○LM358xxx, LM2904xxx

1.6

1.2

0.8

0.4

0.0

1.6

1.2

0.8

0.4

0.0

25°C

36V

85°C

-40°C

125°C

-50 -25

75 100 125 150

SupplyVoltage [V]

AmbientTemperature [°C]

Figure 2. Supply Current vs Ambient

Temperature

Figure 1. Supply Current vs Supply Voltage

125°C

85°C

25°C

-40°C

-50 -25

75 100 125 150

SupplyVoltage [V]

AmbientTemperature [°C]

Figure 3. Maximum Output Voltage (High) vs

Figure 4. Maximum Output Voltage (High) vs

Supply Voltage (R_L=10kΩ)

Ambient Temperature (V_CC=5V, R_L=10kΩ)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM358xxx, LM2904xxx

-40°C

25°C

85°C

125°C

-50 -25

75 100 125 150

Output Voltage [V]

AmbientTemperature [°C]

Figure 5. Maximum Output Voltage (High) vs

Ambient Temperature (V_CC=5V, R_L=2kΩ)

Figure 6. Output Source Current vs

Output Voltage (V_CC=5V)

25°C

85°C

125°C

36V

-40°C

-50 -25

75 100 125 150

AmbientTemperature [°C]

Output Voltage [V]

Figure 7. Output Source Current vs

Ambient Temperature (V_OUT=0V)

Figure 8. Output Sink Current vs

Output Voltage (V_CC=5V)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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LM358xxx LM324xxx LM2904xxx LM2902xxx

Typical Performance Curves - continued

○LM358xxx, LM2904xxx

10²

100

36V

10¹

125°C

10⁰

85°C

25°C

10^-1

-40°C

10^-2

10^-3

-50 -25

75 100 125 150

0.5

1.5

AmbientTemperature [°C]

Output Voltage [V]

Figure 9. Output Sink Current vs Ambient

Figure 10. Low Level Sink Current vs

Output Voltage (V_CC=5V)

Temperature (V_OUT=V_CC

)

10⁰

36V

125°C

85°C

25°C

10^-1

-40°C

10^-2

0.25

0.5

0.75

-50 -25

75 100 125 150

Output Voltage [V]

AmbientTemperature [°C]

Figure 12. Low Level Sink Current vs Ambient

Temperature (V_OUT=200mV)

Figure 11. Low Level Sink Current vs

Output Voltage (Enlarged view)

(V_CC=5V)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM358xxx, LM2904xxx

125°C

85°C

25°C

36V

-1

-2

-3

-4

-1

-2

-3

-4

-40°C

-50 -25

75 100 125 150

SupplyVoltage [V]

AmbientTemperature [°C]

Figure 13. Input Offset Voltage vs Supply

Voltage (V_ICM=V_CC/2, E_K=-V_CC/2)

Figure 14. Input Offset Voltage vs Ambient

Temperature (V_ICM=V_CC/2, E_K=-V_CC/2)

100

-40°C

25°C

85°C

36V

125°C

-50 -25

75 100 125 150

AmbientTemperature [°C]

Supply Voltage [V]

Figure 16. Input Bias Current vs Ambient

Temperature (V_ICM=V_CC/2, E_K=-V_CC/2)

Figure 15. Input Bias Current vs Supply

Voltage (V_ICM=V_CC/2, E_K=-V_CC/2)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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LM358xxx LM324xxx LM2904xxx LM2902xxx

Typical Performance Curves - continued

○LM358xxx, LM2904xxx

100

125°C

85°C

-1

-2

-3

-4

25°C

-40°C

-50 -25

75 100 125 150

-1

AmbientTemperature [°C]

Common-mode InputVoltage [V]

Figure 18. Input Offset Voltage vs

Common-mode Input Voltage (V_CC=5V)

Figure 17. Input Bias Current vs Ambient

Temperature (V_CC=30V, V_ICM=28V, E_K=-1.4V)

-40°C

85°C

125°C

36V

-2

-4

-6

-8

-10

-2

-4

-6

-8

-10

25°C

SupplyVoltage [V]

-50 -25

75 100 125 150

AmbientTemperature [°C]

Figure 20. Input Offset Current vs Ambient

Temperature (V_ICM=V_CC/2, E_K=-V_CC/2)

Figure 19. Input Offset Current vs Supply

Voltage (V_ICM=V_CC/2, E_K=-V_CC/2)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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LM358xxx LM324xxx LM2904xxx LM2902xxx

Typical Performance Curves - continued

○LM358xxx, LM2904xxx

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.6

0.5

0.4

0.3

0.2

0.1

0.0

125°C

85°C

25°C

-40°C

25°C

-40°C

SupplyVoltage [V]

Figure 21. Slew Rate Rise vs Supply Voltage

Figure 22. Slew Rate Fall vs Supply Voltage

(R_L=2kΩ, Low to High)

(R_L=2kΩ, High to Low)

100

240

180

120

Phase

Gain

10⁸

10¹

10²

10³

10⁴

10²

10³

10⁴

10⁵

10⁶

10⁷

Frequency [Hz]

Frequency[Hz]

Figure 23. Input Referred Noise Voltage vs

Frequency (V_CC=5V)

Figure 24. Voltage Gain, Phase vs Frequency

(V_CC=30V, R_L=2kΩ, C_L=100pF)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM358xxx, LM2904xxx

140

120

100

140

120

100

36V

85°C

25°C

125°C

-40°C

SupplyVoltage [V]

-50 -25

75 100 125 150

AmbientTemperature [°C]

Figure 25. Large Signal Voltage Gain vs

Figure 26. Large Signal Voltage Gain vs

Supply Voltage (R_L=2kΩ)

Ambient Temperature (R_L=2kΩ)

120

100

120

100

36V

-40°C

25°C

85°C

125°C

-50 -25

75 100 125 150

Supply Voltage [V]

AmbientTemperature [°C]

Figure 27. Common-mode Rejection Ratio vs

Supply Voltage

Figure 28. Common-mode Rejection Ratio vs

Ambient Temperature

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM358xxx, LM2904xxx

140

120

100

-50 -25

75 100 125 150

AmbientTemperature [°C]

Figure 29. Power Supply Rejection Ratio vs

Ambient Temperature

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM358xxx: -40°C to +85°C

LM2904xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

2.0

1.6

1.2

0.8

0.4

0.0

2.0

1.6

1.2

0.8

0.4

0.0

36V

25°C

85°C

-40°C

125°C

-50 -25

25 50 75 100 125 150

SupplyVoltage [V]

AmbientTemperature [°C]

Figure 31. Supply Current vs Ambient

Temperature

Figure 30. 回路電流－電源電圧特性

125°C

85°C

25℃

-40°C

-50 -25

75 100 125 150

Supply Voltage [V]

AmbientTemperature [°C]

Figure 33. Maximum Output Voltage (High) vs

Figure 32. Maximum Output Voltage (High) vs

Ambient Temperature (V_CC=5V, R_L=10kΩ)

Supply Voltage (R_L=10kΩ)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

-40°C

25°C

85°C

125°C

-50 -25

75 100 125 150

AmbientTemperature [°C]

Output Voltage [V]

Figure 34. Maximum Output Voltage (High) vs

Figure 35. Output Source Current vs Output

Voltage (V_CC=5V)

Ambient Temperature (V_CC=5V, R_L=2kΩ)

25°C

85°C

125°C

36V

-40°C

-50 -25

75 100 125 150

AmbientTemperature [°C]

Output Voltage [V]

Figure 36. Output Source Current vs Ambient

Temperature (V_OUT=0V)

Figure 37. Output Sink Current vs Output

Voltage (V_CC=5V)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

10²

100

36V

10¹

125°C

85°C

10⁰

25°C

10^-1

-40°C

10^-2

10^-3

-50 -25

75 100 125 150

0.5

1.5

AmbientTemperature [°C]

Output Voltage [V]

Figure 38. Output Sink Current vs Ambient

Figure 39. Low Level Sink Current vs

Output Voltage (V_CC=5V)

Temperature (V_OUT=V_CC

)

36V

125°C

85°C

25°C

10^-1

-40°C

10^-2

0.25

0.5

0.75

-50 -25

75 100 125 150

Output Voltage [V]

AmbientTemperature [°C]

Figure 40. Low Level Sink Current vs

Output Voltage (Enlarged view)

(V_CC=5V)

Figure 41. Low Level Sink Current vs Ambient

Temperature (V_OUT=200mV)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

36V

125°C

85°C

25°C

-1

-2

-3

-4

-1

-2

-3

-4

-40°C

-50 -25

75 100 125 150

SupplyVoltage [V]

AmbientTemperature [°C]

Figure 42. Input Offset Voltage vs Supply

Voltage (V_ICM=V_CC/2, E_K=-V_CC/2)

Figure 43. Input Offset Voltage vs Ambient

Temperature (V_ICM=V_CC/2, E_K=-V_CC/2)

100

-40°C

25°C

85°C

36V

125°C

-50 -25

75 100 125 150

AmbientTemperature [°C]

Supply Voltage [V]

Figure 45. Input Bias Current vs Ambient

Temperature (V_ICM=V_CC/2, E_K=-V_CC/2)

Figure 44. Input Bias Current vs Supply

Voltage (V_ICM=V_CC/2, E_K=-V_CC/2)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

100

125°C

85°C

-1

-2

-3

-4

25°C

-40°C

-50 -25

75 100 125 150

-1

AmbientTemperature [°C]

Common-mode InputVoltage [V]

Figure 47. Input Offset Voltage vs

Common-mode Input Voltage (V_CC=5V)

Figure 46. Input Bias Current vs Ambient

Temperature (V_CC=30V, V_ICM=28V, E_K=-1.4V)

-40°C

85°C

125°C

36V

-2

-4

-6

-8

-10

-2

-4

-6

-8

-10

25°C

-50 -25

75 100 125 150

Supply Voltage [V]

AmbientTemperature [°C]

Figure 49. Input Offset Current vs Ambient

Temperature (V_ICM=V_CC/2, E_K=-V_CC/2)

Figure 48. Input Offset Current vs Supply

Voltage (V_ICM=V_CC/2, E_K=-V_CC/2)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.6

0.5

0.4

0.3

0.2

0.1

0.0

125°C

85°C

125°C

85°C

25°C

-40°C

25°C

-40°C

Supply Voltage [V]

SupplyVoltage [V]

Figure 50. Slew Rate Rise vs Supply Voltage

Figure 51. Slew Rate Fall vs Supply Voltage

(R_L=2kΩ, Low to High)

(R_L=2kΩ, High to Low)

100

240

180

120

Phase

Gain

10⁸

10¹

10²

10³

10⁴

10²

10³

10⁴

10⁵

10⁶

10⁷

Frequency[Hz]

Figure 52. Input Referred Noise Voltage vs

Frequency (V_CC=5V)

Figure 53. Voltage Gain, Phase vs Frequency

(V_CC=30V, R_L=2kΩ, C_L=100pF)

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

140

120

100

140

120

100

36V

85°C

25°C

125°C

-40°C

SupplyVoltage [V]

-50 -25

75 100 125 150

AmbientTemperature [°C]

Figure 54. Large Signal Voltage Gain vs

Figure 55. Large Signal Voltage Gain vs

Supply Voltage (R_L=2kΩ)

Ambient Temperature (R_L=2kΩ)

120

100

120

100

36V

-40°C

25°C

85°C

125°C

-50 -25

75 100 125 150

Supply Voltage [V]

AmbientTemperature [°C]

Figure 57. Common-mode Rejection Ratio vs

Ambient Temperature

Figure 56. Common-mode Rejection Ratio vs

Supply Voltage

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Typical Performance Curves - continued

○LM324xxx, LM2902xxx

140

120

100

-50 -25

75 100 125 150

AmbientTemperature [°C]

Figure 58. Power Supply Rejection Ratio vs

Ambient Temperature

(*) The above data are measurement value of typical sample, they are not guaranteed.

LM324xxx: -40°C to +85°C

LM2902xxx: -40°C to 125°C

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Application Information

NULL method condition for Test Circuit 1

V_CC, V_EE, E_K, V_ICMUnit: V

Parameter

Input Offset Voltage

V_F

V_F1

V_F2

V_F3

V_F4

V_F5

V_F6

V_F7

V_F8

V_F9

V_F10

SW1

SW2

SW3

V_CC

V_EE

E_K

V_ICMCalculation

OFF 5 to 30

-1.4

Input Offset Current

Input Bias Current

OFF

-1.4

OFF

-1.4

Large Signal Voltage Gain

OFF

-11.4

Common-mode Rejection Ratio

(Input Common-mode Voltage Range)

-1.4

3.5

Power Supply Rejection Ratio

- Calculation -

|V_F1|

1. Input Offset Voltage (V_IO)

V_IO

[V]

1 + R_F/R_S

|V_F2- V_F1|

2. Input Offset Current (I_IO)

3. Input Bias Current (I_B)

I_IO

[A]

R_Ix (1 + R_F/R_S)

|V_F4- V_F3|

I_B=

[A]

2 x R_Ix (1 + R_F/R_S)

E_K× (1+R_F/R_S)

4. Large Signal Voltage Gain (A_V)

[dB]

Av = 20Log

|V_F6- V_F5|

V_ICM× (1+R_F/R_S)

5. Common-mode Rejection Ratio (CMRR)

[dB]

CMRR = 20Log

PSRR = 20Log

|V_F8- V_F7|

VCC × (1+ R_F/R_S)

6. Power Supply Rejection Ratio (PSRR)

[dB]

|V_F10- V_F9|

0.1μF

R_F=50kΩ

500kΩ

SW1

0.1μF

V_CC

15V

E_K

R_S=50Ω

R_I=10kΩ

V_OUT

500kΩ

DUT

SW3

NULL

-15V

1000pF

R_I=10kΩ

R_S=50Ω

R_L

V_ICM

V V_F

50kΩ

SW2

V_EE

Figure 59. Test Circuit 1 (One Channel Only)

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Application Information – continued

Switch Condition for Test Circuit 2

Parameter

SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW13

Supply Current

OFF OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF

OFF OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF

OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF ON OFF

OFF OFF ON OFF OFF ON OFF OFF OFF OFF OFF OFF ON

OFF OFF OFF ON OFF OFF OFF ON ON ON OFF OFF OFF

Maximum Output Voltage(High)

Maximum Output Voltage(Low)

Output Source Current

Output Sink Current

Slew Rate

Gain Bandwidth Product

Input Referred Noise Voltage

OFF

ON OFF OFF ON ON OFF OFF ON ON OFF OFF OFF

OFF OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF

SW4

SW5

●

V_CC

－

SW1

R_S

SW2

SW3

＋

SW9 SW10 SW11 SW12 SW13

SW6

SW7

SW8

V_EE

R_L

C_L

V_-IN

V_+IN

V_OUT

Figure 60. Test Circuit 2 (Each Op-Amp)

Output Voltage

Input Voltage

SR=V/t

90%

V

10%

t

Input Wave

Output Wave

Figure 61. Slew Rate Input and Output Wave

V_CC

R1//R2

V_EE

V_OUT1

V_OUT2

V_IN

= 1V_RMS

100 × V_OUT1

V_OUT2

CS 20 × log

Figure 62. Test Circuit 3 (Channel Separation)

(R1=1kΩ,R2=100kΩ)

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Application Information – continued

V_CC

Unused Circuits

It is recommended to apply the connection (see Figure 63) and set the

non-inverting input pin at a potential within the Input Common-mode

Voltage Range (V_ICM) for any unused circuit.

Keep this potential

V_ICM

in V_ICM

Input Voltage

Regardless of the supply voltage, applying V_EE+36V to the input pin is

possible without causing deterioration of the electrical characteristics or

destruction. However, this does not ensure normal circuit operation.

Please note that the circuit operates normally only when the input

voltage is within the common mode input voltage range of the electric

characteristics.

V_EE

Figure 63. The Example of Application

Circuit for Unused Op-amp

Power Supply (Single/Dual)

The operational amplifiers operate when the voltage supplied is between VCC pin and VEE pin. Therefore, the single

supply operational amplifiers can be used as dual supply operational amplifiers as well.

IC Handling

When pressure is applied to the IC through warp on the printed circuit board, the characteristics may fluctuate due to

the piezo effect. Be careful with the warp on the printed circuit board.

The IC Destruction Caused by Capacitive Load

The IC may be damaged when VCC pin and VEE pin is shorted with the charged output pin capacitor. When IC is used

as an operational amplifier or as an application circuit where oscillation is not activated by an output capacitor, output

capacitor must be kept below 0.1µF in order to prevent the damage mentioned above.

I/O Equivalent Circuit

Symbol

Pin No.

Equivalent Circuit

LM358xxx, LM2904xxx: 2,3,5,6

LM324xxx, LM2902xxx:

2,3,5,6,9,10,12,13

+IN

-IN

VCC

LM358xxx, LM2904xxx: 1,7

LM324xxx, LM2902xxx: 1,7,8,14

OUT

VEE

VCC

LM358xxx, LM2904xxx: 8

LM324xxx, LM2902xxx: 4

VCC

VEE

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Examples of Circuit

○Voltage Follower

Voltage gain is 0dB.

V_CC

Using this circuit, the output voltage (V_OUT) is configured

to be equal to the input voltage (V_IN). This circuit also

stabilizes the output voltage (V_OUT) due to high input

impedance and low output impedance. Computation for

output voltage (V_OUT) is shown below.

V_OUT

V_IN

V_OUT=V_IN

V_EE

Figure 64. Voltage Follower Circuit

○Inverting Amplifier

For inverting amplifier, input voltage (V_IN) is amplified by

a voltage gain and depends on the ratio of R1 and R2.

The out-of-phase output voltage is shown in the next

expression

V_CC

V_IN

V_OUT

V_OUT=-(R2/R1)・V_IN

This circuit has input impedance equal to R1.

R1//R2

V_EE

Figure 65. Inverting Amplifier Circuit

○Non-inverting Amplifier

For non-inverting amplifier, input voltage (V_IN) is

amplified by a voltage gain, which depends on the ratio

of R1 and R2. The output voltage (V_OUT) is in-phase with

the input voltage (V_IN) and is shown in the next

expression.

V_CC

V_OUT=(1 + R2/R1)・V_IN

V_OUT

V_IN

Effectively, this circuit has high input impedance since its

input side is the same as that of the operational amplifier.

V_EE

Figure 66. Non-inverting Amplifier Circuit

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Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at T_A=25°C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to rise above the ambient temperature. The allowable temperature that

the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal

resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of the package. Thermal resistance, represented by the symbol θ_JA°C/W, indicates this heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 67(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the

Thermal resistance (θ_JA), given the ambient temperature (T_A), maximum junction temperature (Tjmax), and power dissipation

(P_D).

θ_JA

(Tjmax－T_A) / P_D

°C/W

The Derating Curve in Figure 67(b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance

(θ_JA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,

etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value

measured at a specified condition. Figures 67(c) to (f) show the examples of derating curves for LM358xxx, LM2904xxx,

LM324xxx, and LM2902xxx respectively.

Power Dissipation of LSI [W]

P_Dmax

θ_JA=(Tjmax-T_A)/ P_D°C/W

θ_JA2< θ_JA1

Ambient Temperature, T_A[ °C ]

θ_JA2

Tjmax

θ_JA1

150

100

125

Chip Surface Temperature, T_J[ °C ]

Ambient Temperature, T_A[ °C ]

(b) Derating Curve

(a) Thermal Resistance

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

LM358F ^{(Note 20)}

LM358FJ ^{(Note 21)}

LM2904FVT ^{(Note 22)}

LM2904FV ^{(Note 22)}

LM358FVT ^{(Note 22)}

LM358FV ^{(Note 22)}

LM2904F ^{(Note 20)}

LM2904FJ ^{(Note 21)}

LM358FVJ ^{(Note 23)}

LM358FVM ^{(Note 23)}

LM2904FVJ^{(Note 23)}

LM2904FVM ^{(Note 23)}

100

125

150

100

125

150

AmbientTemperature [°C]

(d) LM2904xxx

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1.5

1.2

0.9

0.6

0.3

0.0

1.5

1.2

0.9

0.6

0.3

0.0

LM324FJ ^{(Note 25)}

LM2902FJ ^{(Note 25)}

LM324FV ^{(Note 26)}

LM324FVJ ^{(Note 27)}

LM2902FV ^{(Note 26)}

LM2902FVJ ^{(Note 27)}

LM324F ^{(Note 24)}

LM2902F ^{(Note 24)}

100

125

150

100

125

150

AmbientTemperature [°C]

(e) LM324xxx

AmbientTemperature [°C]

(f) LM2902xxx

Note 20

5.5

Note 21

5.4

Note 22

5.0

Note 23

4.7

Note 24

4.5

Note 25

8.2

Note 26

7.0

Note 27

6.8

Unit

mW/°C

When using the unit above T_A=25°C, subtract the value above per Celsius degree.

Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted.

Figure 67. Thermal Resistance and Derating Curve

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Operational Notes

Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute maximum rating of the P_Dstated in this specification is when

the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the P_Drating.

Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

In-rush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

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Datasheet

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Operational Notes – continued

11. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Figure 68. Example of monolithic IC structure

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Physical Dimensions, Tape and Reel Information

Package Name

SOP8

(Max 5.35 (include.BURR))

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP-J8

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

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Physical Dimensions, Tape and Reel Information – continued

Package Name

SSOP-B8

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

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Physical Dimensions, Tape and Reel Information – continued

Package Name

TSSOP-B8

Tape

Embossed carrier tape

3000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

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Physical Dimensions, Tape and Reel Information – continued

Package Name

TSSOP-B8J

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

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Physical Dimensions, Tape and Reel Information – continued

Package Name

MSOP8

Tape

Embossed carrier tape

3000pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

1pin

Direction of feed

Order quantity needs to be multiple of the minimum quantity.

Reel

∗

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP14

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Physical Dimensions, Tape and Reel Information – continued

Package Name

SOP-J14

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Physical Dimensions, Tape and Reel Information – continued

Package Name

SSOP-B14

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Physical Dimensions, Tape and Reel Information – continued

Package Name

TSSOP-B14J

Tape

Embossed carrier tape

2500pcs

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

(

)

Direction of feed

1pin

Reel

Order quantity needs to be multiple of the minimum quantity.

∗

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Ordering Information

L M

Part Number

LM358F

LM358FJ

LM358FV

LM358FVT

LM358FVJ

LM358FVM

LM324F

Package

Packaging and forming specification

E2: Embossed tape and reel

(SOP8/SOP-J8/SSOP-B8/

TSSOP-B8/ SOP14/SOP-J14/

SSOP-B14/TSSOP-B14J)

TR: Embossed tape and reel

(MSOP8)

: SOP8

: SOP14

: SOP-J8

: SOP-J14

: SSOP-B8

: SSOP-B14

: TSSOP-B8

: TSSOP-B8J

FVT

FVJ

LM324FJ

LM324FV

LM324FVJ

LM2904F

: TSSOP-B14J

: MSOP8

FVM

LM2904FJ

LM2904FV

LM2904FVT

LM2904FVJ

LM2904FVM

LM2902F

LM2902FJ

LM2902FV

LM2902FVJ

Line-up

Operating Temperature Range

Channel

Package

Orderable Part Number

SOP8

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

Reel of 3000

Reel of 2500

LM358F-E2

SOP-J8

LM358FJ-E2

LM358FV-E2

LM358FVT-E2

LM358FVJ-E2

LM358FVM-TR

LM324F-E2

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

2ch

-40°C to +85°C

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

SOP8

LM324FJ-E2

LM324FV-E2

LM324FVJ-E2

LM2904F-E2

LM2904FJ-E2

LM2904FV-E2

LM2904FVT-E2

LM2904FVJ-E2

LM2904FVM-TR

LM2902F-E2

LM2902FJ-E2

LM2902FV-E2

LM2902FVJ-E2

4ch

2ch

4ch

SOP-J8

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

-40°C to +125°C

SOP14

SOP-J14

SSOP-B14

TSSOP-B14J

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Marking Diagram

SOP8(TOP VIEW)

SOP-J8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

TSSOP-B8(TOP VIEW)

SSOP-B8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SOP14(TOP VIEW)

SOP-J14(TOP VIEW)

SSOP-B14(TOP VIEW)

TSSOP-B8J(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

Part Number Marking

LOT Number

1PIN MARK

TSSOP-B14J (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

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Datasheet

LM358xxx LM324xxx LM2904xxx LM2902xxx

Marking Diagram – continued

Product Name

Package Type

Marking

358L

SOP8

SOP-J8

FVT

FVJ

FVM

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

LM358

SOP14

LM324F

SOP-J14

SSOP-B14

TSSOP-B14J

SOP8

LM324FJ

LM324

LM2904

LM2902

FVJ

324L

2904L

04L

SOP-J8

FVT

FVJ

FVM

SSOP-B8

TSSOP-B8

TSSOP-B8J

MSOP8

2904L

SOP14

LM2902F

SOP-J14

SSOP-B14

TSSOP-B14J

LM2902FJ

FVJ

2902L

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Datasheet

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Revision History

Date

Revision

001

Changes

10.Jul.2015

09.Oct.2015

10.Feb.2016

06.Jun.2016

New Release

002

LM358FJ, LM358FV, LM358FVT, and LM324F are added

003

LM2904xxx (F, FJ, FV, FVT, FVM, FVJ), and LM358xxx (FVM, FVJ) are added

LM324xxx (FJ, FV, FVJ), and LM2902xxx (F, FJ, FV, FVJ) are added

004

Correction of erroneous description (P.4 Icc Full Range 1.5→2.5mA)

Delete Land Pattern Data(P.44)

01.Aug.2016

005

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

Datasheet

LM2904F - Web Page

Part Number

Package

LM2904F

SOP8

Unit Quantity

2500

Minimum Package Quantity

Packing Type

Constitution Materials List

RoHS

2500

Taping

inquiry

Yes

LM324F [ROHM]

相关型号：

LM324F-A

LM324F-B

LM324F-E2

LM324FJ

LM324FJ-E2

LM324FSIIA

LM324FV

LM324FV-E2

LM324FVJ

LM324FVJ-E2

LM324G-D14-T

LM324G-P14-R