LMR1001YF-C (开发中) [ROHM]
LMR1001YF-C single CMOS operational amplifier features zero drift, low input offset voltage and Rail-to-Rail input/output that are suitable for sensor amplifiers, engine control unit, electric power steering, anti-lock braking system and all automotive application.;型号: | LMR1001YF-C (开发中) |
厂家: | ROHM |
描述: | LMR1001YF-C single CMOS operational amplifier features zero drift, low input offset voltage and Rail-to-Rail input/output that are suitable for sensor amplifiers, engine control unit, electric power steering, anti-lock braking system and all automotive application. |
文件: | 总20页 (文件大小:1394K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Operational Amplifier
Automotive Zero Drift Low Offset Voltage
Rail-to-Rail input/output
CMOS Operational Amplifier
LMR1001YF-C
General Description
Key Specifications
LMR1001YF-C single CMOS operational amplifier
features zero drift, low input offset voltage and
Rail-to-Rail input/output that are suitable for sensor
amplifiers, engine control unit, electric power steering,
anti-lock braking system and all automotive application.
◼Input Offset Voltage Temperature Drift:
25 nV/°C (Typ)
12 μV (Max)
◼ Input Offset Voltage
◼ Common-mode Input Voltage Range:
VSS to VDD
◼ Input Bias Current:
◼ Operating Supply Voltage Range
Single Supply:
Dual Supply:
◼ Operating Temperature Range:
150 pA (Typ)
2.7 V to 5.5 V
±1.35 V to ±2.75 V
-40 °C to +125 °C
Features
◼ AEC-Q100 Qualified(Note 1)
◼ Low Input Offset Voltage Temperature Drift
◼ Low Input Offset Voltage
◼ Rail-to-Rail input/output
(Note 1) Grade 1
Package
W (Typ) x D (Typ) x H (Max)
5.0 mm x 6.2 mm x 1.71 mm
SOP8
Applications
◼ Engine Control Unit
◼ Electric Power Steering (EPS)
◼ Anti-lock Braking System (ABS)
◼ All Automotive Application
◼ Battery-powered Equipment
◼ Current Sense Amplifiers
◼ Input, Output ADC, and DAC Buffers
◼ Photodiode Amplifiers
◼ Sensor Amplifiers
Typical Application Circuit
RF = 10 kΩ
VDD = +2.5 V
RIN = 100 Ω
푅퐹
VIN
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
VOUT
VSS = -2.5 V
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays
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Pin Configuration
NC
1
2
3
4
8
7
6
5
NC
VDD
OUT
-
-IN
+IN
NC
VSS
(TOP VIEW)
Pin Description
Pin No.
Pin Name
NC
Function
1
2
3
4
5
6
7
8
No connect(Note 1)
Inverting input
-IN
+IN
Non-inverting input
VSS
NC
Negative power supply / Ground
No connect(Note 1)
OUT
VDD
NC
Output
Positive power supply
No connect(Note 1)
(Note 1) Keep open on an application board.
Block Diagram
Iref
8
7
6
5
NC
-IN
1
2
3
NC
-
VDD
OUT
AMP
+IN
+
VSS
NC
4
Description of Blocks
1. AMP:
This block is a Rail-to-Rail input/output operational amplifier with class-AB output circuit and differential input stage.
2. Iref:
This block supplies reference current which is needed to operate AMP block.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VDD – VSS
)
VS
VID
7.0
V
V
V
Differential Input Voltage(Note 1)
VS
Common-mode Input Voltage Range
VICMR
(VSS - 0.3) to (VDD + 0.3)
Input Current
II
±10
150
mA
°C
Maximum Junction Temperature
Storage Temperature Range
Tjmax
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input. The input pin voltage is set to VSS or more.
Thermal Resistance(Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
197.4
21
109.8
19
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
FR-4
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
Min
2.7
Typ
5.0
Max
5.5
Unit
Single Supply
Supply Voltage (VDD – VSS
)
VS
V
Dual Supply
±1.35 ±2.50 ±2.75
Operating Temperature
Topr
-40
+25
+125
°C
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Electrical Characteristics (Unless otherwise specified VS = 5 V, VSS = 0 V)
Limit
Temperature
Parameter
Symbol
VIO
Unit
Conditions
Range
Min
Typ
1
Max
12
Input Offset Voltage
25 °C
-
μV
Absolute value
Input Offset Voltage
Temperature Drift
ΔVIO/ΔT -40 °C to +125 °C
-
25
500
nV/°C
Absolute value
Input Offset Current
Input Bias Current
IIO
IB
25 °C
25 °C
-
10
150
850
-
-
-
pA
pA
Absolute value
Absolute value
-
25 °C
-
1250
1500
50
Supply Current
IDD
VOH
VOL
μA
mV
mV
RL = ∞, G = 0 dB
-40 °C to +125 °C
25 °C
-
-
20
-
RL = 10 kΩ,
VOH = VDD - VOUT
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
-40 °C to +125 °C
25 °C
-
-
100
50
10
-
RL = 10 kΩ
VOL = VOUT - VSS
-40 °C to +125 °C
25 °C
-
100
-
110
100
145
-
Av
dB
V
RL = 10 kΩ
VSS to VDD
-40 °C to +125 °C
-
Common-mode Input
Voltage Range
VICMR
25 °C
0
-
5.0
Common-mode Rejection
Ratio
CMRR
PSRR
IOH
25 °C
25 °C
25 °C
25 °C
110
95
130
115
35
-
-
-
-
dB
dB
VICM = VSS to VDD
Power Supply Rejection
Ratio
VDD = 2.7 V to 5.5 V
VOUT = VSS
Absolute value
Output Source Current (Note 1)
25
mA
mA
VOUT = VDD
Absolute value
Output Sink Current (Note 1)
IOL
25
35
RL = 10 kΩ,
G = 0 dB
Slew Rate
SR
25 °C
-
1.3
-
V/μs
RL = 10 kΩ,
G = 40 dB
Gain Bandwidth Product
Phase Margin
GBW
θ
25 °C
25 °C
-
-
1.5
70
-
-
MHz
deg
RL = 10 kΩ,
G = 40 dB
Input-referred Noise Voltage
Density
Vn
tOR
25 °C
25 °C
-
-
70
-
-
nV/√Hz f = 1 kHz
VIN = (VDD/2 + 0.2 V) to
VDD/2, G = 40 dB
VIN = (VDD/2 - 0.2 V) to
VDD/2, G = 40 dB
Overload Recovery Time
0.13
ms
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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Typical Performance Curves
VSS = 0 V
1200
1100
1000
1200
1100
1000
900
Ta = +125 °C
VDD = 5.0 V
Ta = +25 °C
900
800
700
800
700
VS = 2.7 V
Ta = -40 °C
600
500
400
600
500
400
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
50
40
30
20
10
0
50
40
30
20
10
0
Ta = +125 °C
Ta = +25 °C
VS = 5.0 V
VS = 2.7 V
Ta = -40 °C
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 3. Output Voltage High vs Supply Voltage
(RL = 10 kΩ)
Figure 4. Output Voltage High vs Ambient Temperature
(RL = 10 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
50
40
30
50
40
30
20
10
0
Ta = +125 °C
Ta = +25 °C
20
VS = 2.7V
10
VS = 5.0V
Ta = -40 °C
0
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 5. Output Voltage Low vs Supply Voltage
(RL = 10 kΩ)
Figure 6. Output Voltage Low vs Ambient Temperature
(RL = 10 kΩ)
20
16
12
8
20
16
12
8
Ta = -40 °C
Ta = -40 °C
Ta = +25 °C
Ta = +25 °C
Ta = +125 °C
Ta = +125 °C
4
4
0
0
0
1
2
3
0
1
2
3
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Figure 7. Output Source Current vs Output Voltage
(VS = 2.7 V)
Figure 8. Output Sink Current vs Output Voltage
(VS = 2.7 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
60
60
50
40
30
20
10
0
Ta = -40 °C
50
Ta = -40 °C
Ta = +25 °C
40
Ta = +25 °C
30
20
10
0
Ta = +125 °C
Ta = +125 °C
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Figure 9. Output Source Current vs Output Voltage
(VS = 5.0 V)
Figure 10. Output Sink Current vs Output Voltage
(VS = 5.0 V)
12
12
10
8
10
8
6
6
Ta = -40 °C
Ta = +25 °C
VS = 2.7 V
4
4
2
2
0
0
-2
-4
-6
-8
-10
-12
-2
-4
-6
-8
-10
-12
VS = 5.0 V
Ta = +125 °C
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 11. Input Offset Voltage vs Supply Voltage
Figure 12. Input Offset Voltage vs Ambient Temperature
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
12
10
8
12
10
8
Ta = +125 °C
Ta = -40 °C
6
4
6
Ta = -40 °C
Ta = +25 °C
4
2
2
Ta = +25 °C
0
0
-2
-4
-6
-8
-10
-12
-2
-4
-6
-8
-10
-12
Ta = +125 °C
-1
0
1
2
3
4
-1
0
1
2
3
4
5
6
Common-mode Input Voltage: VICM [V]
Common-mode Input Voltage: VICM [V]
Figure 13. Input Offset Voltage vs
Common-mode Input Voltage
(VS = 2.7 V)
Figure 14. Input Offset Voltage vs
Common-mode Input Voltage
(VS = 5.0 V)
200
180
160
140
120
100
80
200
180
160
140
120
100
80
VS = 5.0 V
Ta = -40 °C
Ta = +125 °C
Ta = +25 °C
VS = 2.7 V
60
60
40
40
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 15. Large Signal Voltage Gain vs Supply Voltage
(RL = 10 kΩ)
Figure 16. Large Signal Voltage Gain vs Ambient
Temperature
(RL = 10 kΩ)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
200
180
200
180
160
140
120
100
80
VS = 5.0 V
Ta = -40 °C
160
140
Ta = +125 °C
120
Ta = +25°C
VS = 2.7V
100
80
60
40
60
40
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 17. Common-mode Rejection Ratio vs
Figure 18. Common-mode Rejection Ratio vs
Supply Voltage
Ambient Temperature
200
180
160
140
120
100
80
80
60
40
20
0
180
135
90
45
0
Phase
Gain
60
40
102 103
104
105
106 107
108
-50 -25
0
25
50
75 100 125 150
Frequency: f [Hz]
Ambient Temperature: Ta [°C]
Figure 19. Power Supply Rejection Ratio vs
Ambient Temperature
Figure 20. Voltage Gain, Phase vs Frequency
(VS = 5.0 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
4
3
2
1
0
4
3
2
Fall
Fall
1
Rise
Rise
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 21. Slew Rate vs Supply Voltage
Figure 22. Slew Rate vs Ambient Temperature
(VS = 5.0 V)
500
450
400
350
300
250
200
150
100
50
0
0.1
1
10
100
Frequency: f [kHz]
Figure 23. Input-referred Noise Voltage Density vs
Frequency
(VS = 5.0 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage due to high input impedance
and low output impedance. Computation for output
voltage is shown below.
VDD
VOUT
푉푂푈푇 = 푉
퐼푁
VIN
VSS
Figure 24. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage (VOUT). The
output voltage is shown in the next expression.
VDD
RIN
VIN
푅퐹
VOUT
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
This circuit has input impedance equal to RIN.
VSS
Figure 25. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of RIN and RF. The output voltage (VOUT) is in-phase with
the input voltage and is shown in the next expression.
VDD
푅퐹
푉푂푈푇 = (1 +
) 푉
퐼푁
VOUT
푅퐼푁
VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VSS
Figure 26. Non-inverting Amplifier Circuit
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I/O Equivalence Circuits
Pin No.
Pin Name
Pin Description
Equivalence Circuit
7
6
6
OUT
Output
4
7
2
3
-IN
+IN
2, 3
Input
4
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 27. Example of monolithic IC structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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16.Jan.2023 Rev.001
LMR1001YF-C
Ordering Information
L M R 1
0
0
1
Y
F
-
C
E
2
Package
F: SOP8
Product class
C: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SOP8 (TOP VIEW)
Part Number Marking
LOT Number
R 1 0 0 1
Pin 1 Mark
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© 2023 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0G9G2G500130-1-2
16.Jan.2023 Rev.001
15/17
LMR1001YF-C
Physical Dimension and Packing Information
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT: mm)
PKG: SOP8
Drawing No.: EX112-5001-1
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© 2023 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0G9G2G500130-1-2
16/17
16.Jan.2023 Rev.001
LMR1001YF-C
Revision History
Date
Revision
001
Changes
16.Jan.2023
New Release
www.rohm.com
© 2023 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0G9G2G500130-1-2
17/17
16.Jan.2023 Rev.001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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