LMR342FJ-E2 [ROHM]
Low Supply Current Output Full Swing CMOS Operational Amplifiers;
| 型号： | LMR342FJ-E2 |
| 厂家： | 
ROHM |
| 描述： | Low Supply Current Output Full Swing CMOS Operational Amplifiers |
| 文件： | 总54页 (文件大小：4594K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Low Supply Current Output Full Swing
CMOS Operational Amplifiers
LMR341G LMR342xxx LMR344xxx
Key Specifications
Operating Supply Voltage (Single Supply):
+2.7V to +5.5V
General Description
The LMR341G, LMR342xxx and LMR344xxx are input
ground sense, output full swing operational amplifiers.
They have the features of low operating supply voltage,
low supply current and low input bias current. These are
suitable for sensor amplifier, battery-powered electronic
equipment, battery monitoring and audio pre-amps for
voice. Shutdown function is applied to LMR341G.
Supply Current (VDD=2.7V, TA=25°C):
LMR341G(Single)
80µA(Typ)
200µA(Typ)
400µA(Typ)
103dB(Typ)
-40°C to +85°C
4mV(Max)
LMR342xxx(Dual)
LMR344xxx(Quad)
Voltage Gain (RL=2k):
Temperature Range:
Input Offset Voltage (TA=25°C):
Input Bias Current (TA=25°C):
Turn on time from shutdown:
1pA(Typ)
2µS(Typ)
Features
Low Operating Supply Voltage
Low Input Bias Current
Low Supply Current
Low Input Offset Voltage
Package s
SSOP6
SOP8
SOP-J8
SSOP-B8
TSSOP-B8
MSOP8
TSSOP-B8J
SOP14
W(Typ) xD(Typ) xH(Max)
Applications
Sensor Amplifier
Battery Monitoring
Battery-Powered Electronic Equipment
Audio Pre-Amps for Voice
Active Filter
2.90mm x 2.80mm x 1.25mm
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.35mm
3.00mm x 6.40mm x 1.20mm
2.90mm x 4.00mm x 0.90mm
3.00mm x 4.90mm x 1.10mm
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.20mm
Buffer
Consumer Electronics
SOP-J14
TSSOP-B14J
Pin Configuration
LMR341G : SSOP6
+IN
1
2
3
6 VDD
Pin No.
Pin Name
+
-
VSS
-IN
5 SHDN
1
2
3
4
5
6
+IN
VSS
-IN
OUT
4
OUT
——————
SHDN
VDD
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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Datasheet
LMR341G LMR342xxx LMR344xxx
LMR342F
LMR342FJ
LMR342FV
: SOP8
: SOP-J8
: SSOP-B8
LMR342FVT : TSSOP-B8
LMR342FVM : MSOP8
LMR342FVJ : TSSOP-B8J
Pin No.
Pin Name
OUT1
-IN1
1
2
3
4
5
6
7
8
OUT1
-IN1
1
2
3
4
8
7
6
5
VDD
OUT2
-IN2
CH1
+IN1
-
+
VSS
+IN1
CH2
+IN2
-
+
-IN2
+IN2
VSS
OUT2
VDD
LMR344F
: SOP14
LMR344FJ
: SOP-J14
LMR344FVJ : TSSOP-B14J
Pin No.
Pin Name
OUT1
-IN1
1
2
OUT1
1
2
3
4
5
6
7
14
OUT4
-IN4
13
12
11
10
9
-IN1
+IN1
VDD
+IN2
-IN2
CH1
CH4
3
+IN1
VDD
-
-
+
+
4
+IN4
VSS
+IN3
-IN3
5
+IN2
-IN2
6
7
OUT2
OUT3
-IN3
-
-
+
+
8
CH2
CH3
9
8
OUT3
OUT2
10
11
12
13
14
+IN3
VSS
+IN4
-IN4
OUT4
Package
SOP-J8
SSOP6
SOP8
LMR342F
SSOP-B8
TSSOP-B8
LMR341G
LMR342FJ
Package
SOP14
LMR342FV
LMR342FVT
MSOP8
TSSOP-B8J
LMR342FVJ
SOP-J14
TSSOP-B14J
LMR344FVJ
LMR342FVM
LMR344F
LMR344FJ
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Datasheet
LMR341G LMR342xxx LMR344xxx
Ordering Information
L
M R
3
4
x
x
x
x
-
x
x
Part Number
LMR341G
LMR342xxx
LMR344xxx
Package
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SOP-J8/SSOP-B8/TSSOP-B8/TSSOP-B8J/
SOP14)
G
F
:
SSOP6
: SOP8
: SOP14
FJ : SOP-J8
TR: Embossed tape and reel
(SSOP6/MSOP8)
: SOP-J14
FV : SSOP-B8
FVT : TSSOP-B8
FVM : MSOP8
FVJ : TSSOP-B8J
: TSSOP-B14J
Line-up
Operation Temperature Range
Channels
Package
Orderable Part Number
LMR341G-TR
1ch
SSOP6
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 3000
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
SOP8
LMR342F-E2
SOP-J8
LMR342FJ-E2
LMR342FV-E2
LMR342FVT-E2
LMR342FVM-TR
LMR342FVJ-E2
LMR344F-E2
SSOP-B8
TSSOP-B8
MSOP8
2ch
4ch
-40°C to +85°C
TSSOP-B8J
SOP14
SOP-J14
TSSOP-B14J
LMR344FJ-E2
LMR344FVJ-E2
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Datasheet
LMR341G LMR342xxx LMR344xxx
Absolute Maximum Ratings (TA=25°C)
Ratings
LMR342xxx
+7.0
Parameter
Supply Voltage
Symbol
Unit
LMR341G
LMR344xxx
VDD - VSS
SSOP6
V
0.67 (Note 1,9)
-
-
SOP8
SOP-J8
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
SOP14
SOP-J14
TSSOP-B14J
VID
-
-
-
-
-
-
-
-
-
0.68 (Note 2,9)
0.67 (Note 3,9)
0.62 (Note 4,9)
0.62 (Note 4,9)
0.58 (Note 5,9)
0.58 (Note 5,9)
-
-
-
-
-
Power Dissipation
PD
W
-
-
0.56 (Note 6,9)
1.02 (Note 7,9)
0.84 (Note 8,9)
-
-
Differential Input Voltage (Note 8)
Input Common-Mode Voltage Range
Input Current (Note 9)
VDD - VSS
V
V
VICM
(VSS-0.3) to (VDD+0.3)
±10
II
mA
V
Operating Supply Voltage
Operating Temperature
Vopr
+2.7 to +5.5
- 40 to +85
- 55 to +150
+150
Topr
°C
°C
°C
Storage Temperature
Tstg
Maximum Junction Temperature
TJmax
(Note 1) To use at temperature above TA=25°C reduce 5.4mW/°C.
(Note 2) To use at temperature above TA=25°C reduce 5.5mW/°C.
(Note 3) To use at temperature above TA=25°C reduce 5.4mW/°C.
(Note 4) To use at temperature above TA=25°C reduce 5.0mW/°C.
(Note 5) To use at temperature above TA=25°C reduce 4.7mW/°C.
(Note 6) To use at temperature above TA=25C reduce 4.5mW/°C.
(Note 7) To use at temperature above TA=25C reduce 8.2mW/°C.
(Note 8) To use at temperature above TA=25C reduce 6.8mW/°C.
(Note 9) Mounted on 1-layer glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
(Note 10) The voltage difference between inverting input and non-inverting input is the differential input voltage.
The input pin voltage is set to more than VSS.
(Note 11) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
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Datasheet
LMR341G LMR342xxx LMR344xxx
Electrical Characteristics:
——————
○LMR341G (Unless otherwise specified VDD=+2.7V, VSS=0V, SHDN=VDD)
Limits
Typ
Temperature
Range
Parameter
Symbol
VIO
Unit
Condition
Min
Max
25°C
Full Range
-
-
0.25
-
4
4.5
Input Offset Voltage (Note 12,13)
mV
μV/°C
pA
-
-
-
-
Input Offset Voltage Drift
VIO/T Full Range
-
-
-
1.7
1
-
-
(Note 12,13)
Input Offset Current (Note 12)
Input Bias Current (Note 12)
Supply Current(Note 13)
IIO
IB
25°C
25°C
1
200
pA
25°C
Full Range
-
-
80
-
170
230
RL=∞,
AV=0dB, +IN=VDD/2
IDD
μA
_______________
Shutdown Current
IDD_SD
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
0.2
1000
nA
SHDN=GND
VDD-0.06 VDD-0.03
VDD-0.03 VDD-0.01
-
RL=2kΩ to VDD/2
RL=10kΩ to VDD/2
RL=2kΩ to VDD/2
RL=10kΩ to VDD/2
RL=10kΩ to VDD/2
RL=2kΩ to VDD/2
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Large Signal Voltage Gain
V
-
0.06
0.03
-
-
-
78
72
0.03
0.01
113
V
AV
dB
103
-
Input Common-Mode
Voltage Range
VICM
0
56
65
20
30
-
-
1.7
V
-
Common-Mode Rejection Ratio CMRR
80
82
32
45
1.0
2.0
1.2
50
4.5
-
-
-
-
-
-
-
-
-
dB
VICM=VDD/2
VDD=2.7V to 5.0V
VICM=0.5V
Power Supply Rejection Ratio
Output Source Current (Note 14)
Output Sink Current (Note 14)
Slew Rate
PSRR
ISOURCE
ISINK
SR
dB
mA
mA
V/μs
MHz
MHz
deg
OUT=0V, short current
OUT=2.7V
short current
RL=10kΩ, +IN=1.2VP-P
CL=200pF, RL=100kΩ
AV=40dB, f=100kHz
Gain Bandwidth
GBW
fT
-
CL=200pF, RL=100kΩ
AV =40dB, gain=0dB
Unit Gain Frequency
Phase Margin
-
CL=20pF, RL=100kΩ
AV=40dB
θM
-
CL=20pF, RL=100kΩ
AV=40dB
f=1kHz, AV=40dB
Gain Margin
GM
-
dB
-
-
40
3
-
-
nV/ Hz
Input Referred Noise Voltage
VN
µVrms AV=40dB, DIN-AUDIO
RL=600Ω, AV=0dB
OUT=1VP-P, f=1kHz
DIN-AUDIO
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.017
-
%
Turn On Time From Shutdown
Turn On Voltage High
TON
25°C
25°C
25°C
-
-
-
2
-
-
-
μs
V
-
-
-
VSHDN_H
VSHDN_L
1.8
1.1
Turn On Voltage Low
V
(Note 12) Absolute value.
(Note 13) Full Range: TA=-40°C to +85°C
(Note 14) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
LMR341G LMR342xxx LMR344xxx
Electrical Characteristics - continued
——————
○LMR341G (Unless otherwise specified VDD=+5.0V, VSS=0V, SHDN=VDD)
Limits
Typ
Temperature
Range
Parameter
Symbol
VIO
Unit
Condition
Min
Max
25°C
Full Range
-
-
0.25
-
4
4.5
Input Offset Voltage (Note 15,16)
mV
μV/°C
pA
-
-
-
-
Input Offset Voltage Drift
VIO/T Full Range
-
-
-
1.9
1
-
-
-
(Note 15,16)
Input Offset Current (Note 15)
Input Bias Current (Note 15)
Supply Current (Note 16)
IIO
IB
25°C
25°C
1
pA
25°C
Full Range
-
-
80
-
200
260
RL=∞,
AV=0dB, +IN=VDD/2
IDD
μA
_______________
Shutdown Current
IDD_SD
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
0.5
1000
nA
SHDN=GND
VDD-0.06 VDD-0.04
VDD-0.03 VDD-0.01
-
RL=2kΩ to VDD/2
RL=10kΩ to VDD/2
RL=2kΩ to VDD/2
RL=10kΩ to VDD/2
RL=10kΩ to VDD/2
RL=2kΩ to VDD/2
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Large Signal Voltage Gain
V
-
0.06
0.03
-
-
-
78
72
0.04
0.01
116
V
AV
dB
107
-
Input Common-Mode
Voltage Range
VICM
0
56
65
85
80
-
-
4
-
-
-
-
-
-
-
-
-
V
-
Common-Mode Rejection Ratio CMRR
86
dB
VICM= VDD/2
VDD=2.7V to 5.0V
VICM=0.5V
Power Supply Rejection Ratio
Output Source Current (Note 17)
Output Sink Current (Note 17)
Slew Rate
PSRR
ISOURCE
ISINK
SR
82
dB
113
115
1.0
2.0
1.2
50
mA
mA
V/μs
MHz
MHz
deg
OUT=0V, short current
OUT=5V, short current
RL=10kΩ, +IN=2VP-P
CL=200pF, RL=10kΩ
AV=40dB, f=100kHz
Gain Bandwidth
GBW
fT
-
CL=200pF, RL=10kΩ
AV=40dB, gain=0dB
Unit Gain Frequency
Phase Margin
-
CL=20pF, RL=100kΩ
AV=40dB
θM
-
CL=20pF, RL=100kΩ
AV=40dB
f=1kHz, AV=40dB
Gain Margin
GM
-
4.5
dB
-
-
40
3
-
-
nV/ Hz
Input Referred Noise Voltage
VN
µVrms AV=40dB, DIN-AUDIO
RL=600Ω, AV=0dB
OUT=1VP-P, f=1kHz
DIN-AUDIO
Total Harmonic Distortion
+ Noise
THD+N
25°C
-
0.012
-
%
Turn On Time From Shutdown
Turn On Voltage High
TON
25°C
25°C
25°C
-
-
-
2
-
-
-
μs
V
-
-
-
VSHDN_H
VSHDN_L
3.0
2.0
Turn On Voltage Low
V
(Note 15) Absolute value
(Note 16) Full Range: TA=-40°C to +85°C
(Note 17) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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Datasheet
LMR341G LMR342xxx LMR344xxx
Electrical Characteristics - continued
○LMR342xxx (Unless otherwise specified VDD=+2.7V, VSS=0V, TA=25°C)
Limit
Temperature
Range
Parameter
Symbol
Unit
Condition
Min
Typ
Max
25°C
Full Range
-
-
0.25
-
4
4.5
Input Offset Voltage (Note 18,19)
Input Offset Voltage Drift (Note 18,19)
Input Offset Current (Note 18)
Input Bias Current (Note 18)
VIO
VIO/T
IIO
mV
μV/°C
pA
pA
μA
V
-
-
-
-
Full Range
25°C
-
-
-
1.7
1
-
-
IB
25°C
1
200
25°C
Full Range
-
-
200
-
340
460
-
-
0.06
0.03
-
RL=∞, All Op-Amps
AV=0dB, +IN=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
Supply Current (Note 19)
IDD
VDD-0.06 VDD-0.03
VDD-0.03 VDD-0.01
Maximum Output Voltage (High)
Maximum Output Voltage (Low)
Large Single Voltage Gain
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
-
78
72
0.03
0.01
113
V
AV
dB
V
103
-
Input Common-Mode Voltage
Range
VICM
CMRR
PSRR
ISOURCE
ISINK
SR
0
56
65
20
15
-
-
1.7
-
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Output Source Current (Note 20)
Output Sink Current (Note 20)
Slew Rate
80
82
32
24
1.0
2
-
-
-
-
-
-
-
-
-
dB VICM=VDD/2
VDD=2.7V to 5.0V
VICM=VDD/2
dB
mA
mA
OUT=0V
Short Circuit Current
OUT=2.7V
Short Circuit Current
V/μs RL=10kΩ, +IN=1.2VP-P
CL=200pF, RL=100kΩ
MHz
Gain Bandwidth
GBW
fT
-
AV=40dB, f=100kHz
CL=200pF, RL=100kΩ
Unity Gain Frequency
Phase Margin
-
1.2
50
4.5
MHz
AV=40dB
CL=20pF, RL=100kΩ
θM
-
deg
AV=40dB
CL=20pF, RL=100kΩ
Gain Margin
GM
-
dB
AV=40dB
f=1kHz, Av=40dB
AV=40dB, DIN-AUDIO
-
-
40
3
-
-
nV/ Hz
Input Referred Noise Voltage
VN
µVrms
RL=600Ω, AV=0dB
OUT=1VP-P, f=1kHz
DIN-AUDIO
AV=40dB, f=1kHz
OUT=0.8Vrms
Total Harmonic Distortion + Noise THD+N
25°C
25°C
-
-
0.017
100
-
-
%
Channel Separation
CS
dB
(Note 18) Absolute value.
(Note 19) Full Range: TA=-40°C to +85°C
(Note 20) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
LMR341G LMR342xxx LMR344xxx
Electrical Characteristics - continued
○LMR342xxx (Unless otherwise specified VDD=+5.0V, VSS=0V, TA=25°C)
Limit
Temperature
Range
Parameter
Symbol
Unit
Condition
Min
Typ
Max
25°C
Full Range
-
-
0.25
-
4
4.5
Input Offset Voltage (Note 21,22)
Input Offset Voltage Drift (Note 21,22)
Input Offset Current (Note 21)
Input Bias Current (Note 21)
VIO
VIO/T
IIO
mV
μV/°C
pA
pA
μA
V
-
-
-
-
Full Range
25°C
-
-
-
1.9
1
-
-
IB
25°C
1
200
25°C
Full Range
-
-
214
-
400
520
-
-
0.06
0.03
-
RL=∞, All Op-Amps
AV=0dB, +IN=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
Supply Current (Note 22)
IDD
VDD-0.06 VDD-0.04
VDD-0.03 VDD-0.01
Maximum Output Voltage (High)
Maximum Output Voltage (Low)
Large Single Voltage Gain
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
-
78
72
0.04
0.01
116
V
AV
dB
V
107
-
Input Common-Mode Voltage
Range
VICM
CMRR
PSRR
ISOURCE
ISINK
SR
0
56
65
85
50
-
-
4.0
-
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Output Source Current (Note 23)
Output Sink Current (Note 23)
Slew Rate
86
85
113
75
1.0
2
-
-
-
-
-
-
-
-
-
dB VICM=VDD/2
VDD=2.7V to 5.0V
VICM=VDD/2
dB
mA
mA
OUT=0V
Short Circuit Current
OUT=5.0V
Short Circuit Current
V/μs RL=10kΩ, +IN=2.0VP-P
CL=200pF, RL=100kΩ
MHz
Gain Bandwidth
GBW
fT
-
AV=40dB, f=100kHz
CL=200pF, RL=100kΩ
Unity Gain Frequency
Phase Margin
-
1.2
50
4.5
MHz
AV=40dB
CL=20pF, RL=100kΩ
θM
-
deg
AV=40dB
CL=20pF, RL=100kΩ
Gain Margin
GM
-
dB
AV=40dB
f=1kHz, Av=40dB
-
-
39
3
-
-
nV/ Hz
Input Referred Noise Voltage
VN
AV=40dB, DIN-AUDIO
RL=600Ω, AV=0dB
OUT=1VP-P, f=1kHz
DIN-AUDIO
AV=40dB, f=1kHz
OUT=0.8Vrms
µVrms
Total Harmonic Distortion + Noise THD+N
25°C
25°C
-
-
0.012
100
-
-
%
Channel Separation
CS
dB
(Note 21) Absolute value.
(Note 22) Full Range: TA=-40°C to +85°C
(Note 23) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
LMR341G LMR342xxx LMR344xxx
Electrical Characteristics - continued
○LMR344xxx (Unless otherwise specified VDD=+2.7V, VSS=0V, TA=25°C)
Limit
Temperature
Range
Parameter
Symbol
Unit
Condition
Min
Typ
Max
25°C
Full Range
-
-
0.25
-
4
4.5
Input Offset Voltage (Note 24,25)
Input Offset Voltage Drift (Note 24,25)
Input Offset Current (Note 24)
Input Bias Current (Note 24)
VIO
VIO/T
IIO
mV
μV/°C
pA
pA
μA
V
-
-
-
-
Full Range
25°C
-
-
-
1.7
1
-
-
IB
25°C
1
200
25°C
Full Range
-
-
400
-
680
920
-
-
0.06
0.03
-
RL=∞, All Op-Amps
AV=0dB, +IN=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
Supply Current (Note 25)
IDD
VDD-0.06 VDD-0.03
VDD-0.03 VDD-0.01
Maximum Output Voltage (High)
Maximum Output Voltage (Low)
Large Single Voltage Gain
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
-
78
72
0.03
0.01
113
V
AV
dB
V
103
-
Input Common-Mode Voltage
Range
VICM
CMRR
PSRR
ISOURCE
ISINK
SR
0
56
65
20
15
-
-
1.7
-
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Output Source Current (Note 26)
Output Sink Current (Note 26)
Slew Rate
80
82
32
24
1.0
2
-
-
-
-
-
-
-
-
-
dB VICM=VDD/2
VDD=2.7V to 5.0V
VICM=VDD/2
dB
mA
mA
OUT=0V
Short Circuit Current
OUT=2.7V
Short Circuit Current
V/μs RL=10kΩ, +IN=1.2 VP-P
CL=200pF, RL=100kΩ
MHz
Gain Bandwidth
GBW
fT
-
AV=40dB, f=100kHz
CL=200pF, RL=100kΩ
Unity Gain Frequency
Phase Margin
-
1.2
50
4.5
MHz
AV=40dB
CL=20pF, RL=100kΩ
θM
-
deg
AV=40dB
CL=20pF, RL=100kΩ
Gain Margin
GM
-
dB
AV=40dB
f=1kHz, Av=40dB
AV=40dB, DIN-AUDIO
-
-
40
3
-
-
nV/ Hz
Input Referred Noise Voltage
VN
µVrms
RL=600Ω, AV=0dB
OUT=1VP-P, f=1kHz
DIN-AUDIO
AV=40dB, f=1kHz
OUT=0.8Vrms
Total Harmonic Distortion + Noise THD+N
25°C
25°C
-
-
0.017
100
-
-
%
Channel Separation
CS
dB
(Note 24) Absolute value.
(Note 25) Full Range: TA=-40°C to +85°C
(Note 26) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
LMR341G LMR342xxx LMR344xxx
Electrical Characteristics - continued
○LMR344xxx (Unless otherwise specified VDD=+5.0V, VSS=0V, TA=25°C)
Limit
Temperature
Range
Parameter
Symbol
Unit
Condition
Min
Typ
Max
25°C
Full Range
-
-
0.25
-
4
4.5
Input Offset Voltage (Note 27,28)
Input Offset Voltage Drift (Note 27,28)
Input Offset Current (Note 27)
Input Bias Current (Note 27)
VIO
VIO/T
IIO
mV
μV/°C
pA
pA
μA
V
-
-
-
-
Full Range
25°C
-
-
-
1.9
1
-
-
IB
25°C
1
200
25°C
Full Range
-
-
428
-
800
1040
-
-
0.06
0.03
-
RL=∞, All Op-Amps
AV=0dB, +IN=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=10kΩ, VRL=VDD/2
RL=2kΩ, VRL=VDD/2
Supply Current (Note 28)
IDD
VDD-0.06 VDD-0.04
VDD-0.03 VDD-0.01
Maximum Output Voltage (High)
Maximum Output Voltage (Low)
Large Single Voltage Gain
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
-
78
72
0.04
0.01
116
V
AV
dB
V
107
-
Input Common-Mode Voltage
Range
VICM
CMRR
PSRR
ISOURCE
ISINK
SR
0
56
65
85
50
-
-
4.0
-
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Output Source Current (Note 29)
Output Sink Current (Note 29)
Slew Rate
86
85
113
75
1.0
2
-
-
-
-
-
-
-
-
-
dB VICM=VDD/2
VDD=2.7V to 5.0V
VICM=VDD/2
dB
mA
mA
OUT=0V
Short Circuit Current
OUT=5V
Short Circuit Current
V/μs RL=10kΩ, +IN=2.0VP-P
CL=200pF, RL=100kΩ
MHz
Gain Bandwidth
GBW
fT
-
AV=40dB, f=100kHz
CL=200pF, RL=100kΩ
Unity Gain Frequency
Phase Margin
-
1.2
50
4.5
MHz
AV=40dB
CL=20pF, RL=100kΩ
θM
-
deg
AV=40dB
CL=20pF, RL=100kΩ
Gain Margin
GM
-
dB
AV=40dB
f=1kHz, Av=40dB
AV=40dB, DIN-AUDIO
-
-
39
3
-
-
nV/ Hz
Input Referred Noise Voltage
VN
µVrms
RL=600Ω, AV=0dB
OUT=1VP-P, f=1kHz
DIN-AUDIO
AV=40dB, f=1kHz
OUT=0.8Vrms
Total Harmonic Distortion + Noise THD+N
25°C
25°C
-
-
0.012
100
-
-
%
Channel Separation
CS
dB
(Note 27) Absolute value.
(Note 28) Full Range: TA=-40°C to +85°C
(Note 29) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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LMR341G LMR342xxx LMR344xxx
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-Mode Voltage Range (VICM
)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Voltage drift (VIO/T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(4) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(5) Supply Current (IDD
)
Indicates the current that flows within the IC under specified no-load conditions.
(6) Shutdown current (IDD_SD)
Indicates the current when the circuit is shutdown.
(7) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL
)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(8) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(9) Input Common-Mode Voltage Range (VICM
)
Indicates the input voltage range where IC normally operates.
(10) Common-Mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(11) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR = (Change of power supply voltage)/(Input offset fluctuation)
(12) Output Source Current/ Output Sink Current (ISOURCE / ISINK
)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(13) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(14) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
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(15) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
(16) Phase Margin (θ) (θM)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(17) Gain Margin (GM)
Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay.
(18) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input terminal.
(19) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
(20) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
(21) Turn On Time From Shutdown (Ton)
Indicates the time from applying the voltage to shutdown terminal until the IC is active.
(22) Turn On Voltage / Turn Off Voltage (VSHDN_H/ VSHDN_L)
The IC is active if the shutdown terminal is applied more than Turn On Voltage (VSHDN_H).
The IC is shutdown if the shutdown terminal is applied less than Turn Off Voltage (VSHDN_L).
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves
○LMR341G
1.0
100
90
80
70
60
50
0.8
85°C
LMR341G
25°C
0.6
0.4
0.2
0.0
-40°C
1
2
3
4
5
6
0
25
50
75
100
125
150
SupplyVoltage [V]
Ambient Temperature [°C]
Figure 1. Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 2. Supply Current vs Supply Voltage
100
90
80
70
60
50
6
5
4
3
2
1
0
85°C
25°C
5.0V
2.7V
-40°C
-50
-25
0
25
50
75
100
2
3
4
5
6
Ambient Temperature [°C]
SupplyVoltage [V]
Figure 3. Supply Current vs Ambient Temperature
Figure 4. Maximum Output Voltage High
vs Supply Voltage
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR341G
6
30
25
20
15
10
5
5
5V
4
3
85°C
25°C
2.7V
2
-40°C
1
0
0
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 5. Maximum Output Voltage (High)
vs Ambient Temperature
(RL=2kΩ)
Figure 6. Maximum Output Voltage (Low)
vs Supply Voltage
(RL=2kΩ)
25
20
15
10
5
40
30
20
10
0
-40°C
5V
25°C
85°C
2.7V
0
-50
-25
0
25
50
75
100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Ambient Temperature [°C]
Output Voltage [V]
Figure 7. Maximum Output Voltage (Low)
vs Ambient Temperature
(RL=2kΩ)
Figure 8. Output Source Current vs Output Voltage
(VDD=2.7V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR341G
150
80
60
40
20
0
120
-40°C
5V
25°C
90
60
2.7V
30
85°C
0
-50
-25
0
25
50
75
100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Ambient Temperature [°C]
Output Voltage [V]
Figure 9. Output Source Current
vs Ambient Temperature
(OUT=0V)
Figure 10. Output Sink Current vs Output Voltage
(VDD=2.7V)
150
4
3
2
5V
120
90
60
30
0
1
25°C
-40°C
0
2.7V
85°C
-1
-2
-3
-4
-50
-25
0
25
50
75
100 125
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 12. Input Offset Voltage vs Supply Voltage
(VICM=VDD/2, EK=-VDD/2)
Figure 11. Output Sink Current
vs Ambient Temperature
(OUT=VDD)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR341G
4
3
2
4
3
85°C
25°C
2
1
1
-40°C
2.7V
0
0
-1
-1
-2
-3
-4
5.0V
-2
-3
-4
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
-50
-25
0
25
50
75
100 125
Input Voltage [V]
Ambient Temperature [°C]
Figure 13. Input Offset Voltage
vs Ambient Temperature
Figure 14. Input Offset Voltage vs Input Voltage
(VDD=2.7V, EK=-VDD/2)
(VICM=VDD/2, EK=-VDD/2)
120
110
100
90
120
110
100
90
5V
25°C
85°C
2.7V
-40°C
80
80
70
70
60
60
-50
-25
0
25
50
75
100 125
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 15. Large Signal Voltage Gain
vs Supply Voltage
Figure 16. Large Signal Voltage Gain
vs Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR341G
120
110
100
90
120
110
25°C
85°C
5V
100
90
-40°C
2.7V
80
80
70
70
60
60
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 17. Common-Mode Rejection Ratio
vs Supply Voltage
Figure 18. Common-Mode Rejection Ratio
vs Ambient Temperature
(VDD=2.7V)
1.3
1.2
1.1
1.0
0.9
120
110
100
90
5V
2.7V
80
70
60
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 19. Power Supply Rejection Ratio
vs Ambient Temperature
Figure 20. Slew Rate L-H vs Ambient Temperature
(RL=10kΩ)
(VDD=2.7V to 5.0V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR341G
1.5
100
80
60
40
20
0
200
160
120
80
Phase
1.4
5V
1.3
2.7V
Gain
1.2
1.1
1
40
0
102
105
106
107
103
104
108
-50
-25
0
25
50
75
100 125
Frequency [Hz]
Ambient Temperature [°C]
Figure 21. Slew Rate H-L vs Ambient Temperature
Figure 22. Voltage Gain・Phase vs Frequency
(C=20pF)
(RL=10kΩ)
2
1.5
1
4
3
2
1
0
VSHDN_L
VSHDN_H
VSHDN_L
VSHDN_H
0.5
0
1
2
3
4
5
0
1
2
3
Shutdown Voltage [V]
Shutdown Voltage [V]
Figure 23. Shutdown Voltage vs Output Voltage
(VDD=2.7V, Av=0dB, VIN=1.35V)
Figure 24. Shutdown Voltage vs Output Voltage
(VDD=5V, Av=0dB, VIN=2.5V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR342xxx
1.0
350
300
250
200
150
100
0.8
LMR342F
LMR342FJ
LMR342FV
LMR342FVT
0.6
85°C
LMR342FVJ
LMR342FVM
0.4
0.2
0.0
25°C
-40°C
0
25
50
75
100
125
150
2
3
4
5
6
Supply Voltage [V]
Ambient Temperature [°C]
Figure 26. Supply Current vs Supply Voltage
Figure 25. Power Dissipation vs Ambient Temperature
(Derating Curve)
6
5
4
3
2
1
0
350
85°C
300
250
200
150
100
-40°C
25°C
2.7V
5V
-50
-25
0
25
50
75
100 125
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 27. Supply Current vs Ambient Temperature
Figure 28. Maximum Output Voltage (High)
vs Supply Voltage
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR342xxx
6
30
25
20
15
10
5
5
85°C
5V
4
25°C
3
-40°C
2.7V
2
1
0
0
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 30. Maximum Output Voltage (Low)
vs Supply Voltage
Figure 29. Maximum Output Voltage (High)
vs Ambient Temperature
(RL=2kΩ)
(RL=2kΩ)
40
30
20
10
0
25
20
15
10
5
-40°C
5V
25°C
85°C
2.7V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50
-25
0
25
50
75
100 125
Output Voltage [V]
Ambient Temperature [°C]
Figure 31. Maximum Output Voltage (Low)
vs Ambient Temperature
(RL=2kΩ)
Figure 32. Output Source Current vs Output Voltage
(VDD=2.7V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR342xxx
150
60
50
40
30
20
10
0
120
-40°C
5V
25°C
85°C
90
60
2.7V
30
0
-50
-25
0
25
50
75
100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Ambient Temperature [°C]
Output Voltage [V]
Figure 33. Output Source Current
vs Ambient Temperature
(OUT=0V)
Figure 34. Output Sink Current
vs Output Voltage
(VDD=2.7V)
150
120
90
60
30
0
4
3
2
5V
1
25°C
-40°C
85°C
0
-1
-2
-3
-4
2.7V
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 36. Input Offset Voltage vs Supply Voltage
(VICM=VDD/2, EK=-VDD/2)
Figure 35. Output Sink Current
vs Ambient Temperature
(OUT=2.7V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR342xxx
4
3
5
4
3
2
2
1
-40°C
1
2.7V
25°C
0
0
5.0V
-1
85°C
-1
-2
-3
-4
-2
-3
-4
-5
-50
-25
0
25
50
75
100 125
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
Ambient Temperature [°C]
Input Voltage [V]
Figure 37. Input Offset Voltage
vs Ambient Temperature
Figure 38. Input Offset Voltage
vs Input Voltage
(VICM=VDD/2, EK=-VDD/2)
(VDD=2.7V, EK=-VDD/2)
120
110
100
90
120
110
100
90
-40°C
25°C
2.7V
85°C
5V
80
80
70
70
60
60
-50
-25
0
25
50
75
100 125
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 40. Large Signal Voltage Gain
vs Ambient Temperature
Figure 39. Large Signal Voltage Gain
vs Supply Voltage
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR342xxx
120
120
110
100
90
5V
110
-40°C
85°C
2.7V
100
25°C
90
80
70
60
80
70
60
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 41. Common-Mode Rejection Ratio
vs Supply Voltage
Figure 42. Common-Mode Rejection Ratio
vs Ambient Temperature
(VDD=2.7V)
1.5
1.4
1.3
1.2
1.1
1.0
120
110
100
90
5V
2.7V
80
70
60
-50
-25
0
25
50
75
100 125
-50
-25
0
25
50
75
100 125
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 43. Power Supply Rejection Ratio
vs Ambient Temperature
Figure 44. Slew Rate L-H vs Ambient Temperature
(RL=10kΩ)
(VDD=2.7V to 5.0V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR342xxx
1.5
1.4
100
80
60
40
20
0
200
160
120
80
Phase
5V
1.3
2.7V
Gain
1.2
40
1.1
1
0
2
3
4
10
5
10
6
10
7
8
10
10
10
10
-50
-25
0
25
50
75
100 125
Frequency [Hz]
Ambient Temperature [°C]
Figure 45. Slew Rate H-L vs Ambient Temperature
Figure 46. Voltage Gain・Phase vs Frequency
(RL=10kΩ)
(C=20pF)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR344xxx
700
600
500
400
300
200
1.0
LMR344FVJ
LMR344FJ
0.8
85°C
25°C
0.5
-40°C
0.3
LMR344F
0.0
85
0
25
50
75
100
125
150
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 47. Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 48. Supply Current vs Supply Voltage
6
5
4
3
2
1
0
700
600
500
400
300
200
85°C
-40°C
25°C
2.7V
5V
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 49. Supply Current vs Ambient Temperature
Figure 50. Maximum Output Voltage (High)
vs Supply Voltage
(RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR344xxx
6
30
25
20
15
10
5
5
5V
85°C
25°C
4
3
2.7V
-40°C
2
1
0
0
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 51. Maximum Output Voltage (High)
vs Ambient Temperature
(RL=2kΩ)
Figure 52. Maximum Output Voltage (Low)
vs Supply Voltage
(RL=2kΩ)
25
40
30
20
10
0
-40°C
20
15
10
5
2.7Ｖ
25°C
85°C
5Ｖ
0
-50
-25
0
25
50
75
100
125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Ambient Temperature [°C]
Output Voltage [V]
Figure 53. Maximum Output Voltage (Low)
vs Ambient Temperature
(RL=2kΩ)
Figure 54. Output Source Current
vs Output Voltage
(VDD=2.7V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR344xxx
150
60
50
40
30
20
10
0
-40°C
120
5V
25°C
85°C
90
60
2.7V
30
0
-50
-25
0
25
50
75
100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Ambient Temperature [°C]
Output Voltage [V]
Figure 55. Output Source Current
vs Ambient Temperature
(OUT=0V)
Figure 56. Output Sink Current
vs Output Voltage
(VDD=2.7V)
4
3
2
1
0
150
120
90
60
30
0
5V
-40°C
25°C
85°C
-1
2.7V
-2
-3
-4
-50
-25
0
25
50
75
100
125
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 57. Output Sink Current
vs Ambient Temperature
(OUT=2.7V)
Figure 58. Input Offset Voltage
vs Supply Voltage
(VICM=VDD/2, EK=-VDD/2)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR344xxx
4
3
5
4
3
2
2
1
-40°C
1
25°C
2.7V
0
0
5.0V
85°C
-1
-1
-2
-3
-4
-2
-3
-4
-5
-50
-25
0
25
50
75
100 125
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
Input Voltage [V]
Ambient Temperature [°C]
Figure 59. Input Offset Voltage
vs Ambient Temperature
Figure 60. Input Offset Voltage vs Input Voltage
(VDD=2.7V, EK=-VDD/2)
(VICM=VDD/2, EK=-VDD/2)
120
110
100
90
120
110
100
90
-40°C
25°C
2.7V
85°C
5V
80
80
70
70
60
60
-50
-25
0
25
50
75
100 125
2
3
4
5
6
Ambient Temperature [°C]
Supply Voltage [V]
Figure 61. Large Signal Voltage Gain
vs Supply Voltage
Figure 62. Large Signal Voltage Gain
vs Ambient Temperature
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR344xxx
120
120
110
100
90
5V
110
-40°C
85°C
2.7V
100
25°C
90
80
70
60
80
70
60
2
3
4
5
6
-50
-25
0
25
50
75
100 125
Supply Voltage [V]
Ambient Temperature [°C]
Figure 63. Common-Mode Rejection Ratio
vs Supply Voltage
Figure 64. Common-Mode Rejection Ratio
vs Ambient Temperature
(VDD=2.7V)
1.5
120
110
100
90
5V
1.4
1.3
1.2
1.1
1.0
2.7V
80
70
60
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100 125
Ambient Temperature [°C]
Ambient Temperature [°C]
Figure 65. Power Supply Rejection Ratio
vs Ambient Temperature
Figure 66. Slew Rate L-H vs Ambient Temperature
(RL=10kΩ)
(VDD=2.7V to 5.0V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Typical Performance Curves – continued
○LMR344xxx
100
80
60
40
20
0
200
160
120
80
1.5
1.4
Phase
5V
1.3
2.7V
Gain
1.2
40
1.1
1
0
2
3
4
5
6
7
8
10
10
10
10
10
10
10
-50
-25
0
25
50
75
100
125
Frequency [Hz]
Ambient Temperature [°C]
Figure 68. Voltage Gain・Phase vs Frequency
Figure 67. Slew Rate H-L vs Ambient Temperature
(C=20pF)
(RL=10kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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LMR341G LMR342xxx LMR344xxx
Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, VICM Unit: V
Parameter
Input Offset Voltage
VF
SW1 SW2 SW3 VDD VSS
EK
VICM Calculation
VF1
VF2
VF3
VF4
VF5
VF6
VF7
ON
ON
ON OFF
ON ON
5
5
0
0
-2.5
-0.5
-2.5
2.5
1.5
1
2
Large Signal Voltage Gain
0
3
Common-Mode Rejection Ratio
(Input Common-Mode Voltage Range)
ON
ON
ON OFF
ON OFF
5
0
0
-1.5
-1.2
3
4
2.7
5
Power Supply Rejection Ratio
0
- Calculation -
|VF1|
1 + RF/RS
[V]
1. Input Offset Voltage (VIO)
VIO =
EK × (1+RF/RS)
[dB]
Av = 20Log
2. Large Signal Voltage Gain (AV)
|VF3 - VF2|
VICM × (1+RF/RS)
[dB]
[dB]
CMRR = 20Log
PSRR = 20Log
3. Common-Mode Rejection Ration (CMRR)
4. Power Supply Rejection Ratio (PSRR)
|VF5 - VF4|
VDD × (1+ RF/RS)
|VF7 - VF6|
0.1μF
RF=50kΩ
500kΩ
SW1
VDD
0.01μF
15V
EK
RS=50Ω
RI=1MΩ
Vo
500kΩ
0.015μF
DUT
0.015μF
SW3
NULL
-15V
1000pF
RI=1MΩ
RS=50Ω
RL
VRL
VICM
V VF
50kΩ
SW2
VSS
Figure 69. Test Circuit 1 (one channel only)
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LMR341G LMR342xxx LMR344xxx
Application Information – continued
Switch Condition for Test Circuit 2
SW SW SW SW SW SW SW SW SW SW SW
10 11
SW No.
1
2
3
4
5
6
7
8
9
Supply Current
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF
OFF ON OFF OFF ON OFF ON OFF OFF ON OFF
OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF
OFF OFF ON OFF OFF ON OFF ON OFF OFF ON
ON OFF OFF ON ON OFF OFF ON OFF OFF ON
Maximum Output Voltage (RL=10kΩ)
Output Current
Slew Rate
Unity Gain Frequency
SW3
SW4
R2=100kΩ
●
VDD
－
＋
SW1
SW2
SW7 SW8
SW9
SW10 SW11
SW5
SW6
R1=1kΩ
VSS
RL
CL
IN-
IN+
VDD/2
Vo
Figure 70. Test Circuit 2 (each channel)
Output voltage
Input voltage
SR=V/t
90%
V
10%
t
t
t
Input wave
Output wave
Figure 71. Slew Rate Input and Output Wave
R2=100kΩ
R2=100kΩ
VDD
VDD
R1=1kΩ
R1=1kΩ
－
＋
－
＋
OUT1
=0.8Vrms
OUT2
IN
VSS
VSS
100 × OUT1
OUT2
CS = 20Log
Figure 72. Test Circuit 3 (Channel Separation)
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Datasheet
LMR341G LMR342xxx LMR344xxx
Examples of Circuit
○Voltage Follower
Voltage gain is 0dB.
VDD
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT
IN
OUT=IN
VSS
Figure 73. Voltage Follower Circuit
○Inverting Amplifier
R2
VDD
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
R1
IN
OUT
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
VSS
Figure 74. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (IN) is amplified
by a voltage gain, which depends on the ratio of R1 and
R2. The output voltage (OUT) is in-phase with the input
voltage (IN) and is shown in the next expression.
VDD
OUT=(1 + R2/R1)・IN
OUT
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational
amplifier.
IN
VSS
Figure 75. Non-inverting Amplifier Circuit
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Datasheet
LMR341G LMR342xxx LMR344xxx
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 76(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA
=
(TJmax－TA) / PD
°C/W
The derating curve in Figure 76(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 76(c), (d), (e) shows an example of the derating curve for
LMR341G, LMR342xxx, and LMR344xxx.
Power dissipation of LSI [W]
PDmax
θJA=(TJmax-TA)/ PD °C/W
P2
θJA2 < θJA1
Ambient temperature TA [ °C ]
θJA2
P1
TJmax
θJA1
Chip surface temperature TJ [ °C ]
150
0
25
50
75
100
125
(a) Thermal Resistance
Ambient temperature TA [ °C ]
(b) Derating Curve
0.8
0.6
0.4
0.2
0
1.0
0.8
0.6
0.4
0.2
0.0
LMR341G (Note 30)
LMR342F (Note 31)
LMR342FJ (Note 32)
LMR342FV (Note 33)
LMR342FVT (Note 34)
LMR342FVJ (Note 34)
LMR342FVM (Note 34)
85
85
0
25
50
75
100 125 150
0
25
50
75
100
125
150
Ambient Temperature [℃]
Ambient Temperature [°C]
(c) LMR341G
(d) LMR342xxx
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Datasheet
LMR341G LMR342xxx LMR344xxx
LMR344FVJ (Note 37)
1.0
LMR344FJ (Note 36)
0.8
0.5
LMR344F (Note 35)
0.3
0.0
85
0
25
50
75
100
125
150
Ambient Temperature [°C]
(e) LMR344xxx
Figure 76. Thermal Resistance and Derating Curve
(Note 30)
5.4
(Note 31)
5.5
(Note 32)
5.4
(Note 33)
5.0
(Note 34)
4.7
(Note 35)
4.5
(Note 36)
8.2
(Note 37)
6.8
Unit
mW/°C
When using the unit above TA =25°C, subtract the value above per Celsius degree.
Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.
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Datasheet
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when
no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins
have voltages within the values specified in the electrical characteristics of this IC.
VDD
13. Unused Circuits
When there are unused op-amps, it is recommended that they are
connected as in Figure 77, setting the non-inverting input terminal to a
potential within the input common-mode voltage range (VICM).
Keep this potential
VICM
in VICM
14. Input Voltage
Applying VDD+0.3V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction. However,
this does not ensure normal circuit operation. Please note that the circuit
operates normally only when the input voltage is within the common
mode input voltage range of the electric characteristics.
VSS
Figure 77. Example of Application Circuit
for Unused Op-amp
15. Power Supply(single/dual)
The operational amplifiers operate when the voltage supplied is between VDD and VSS. Therefore, the single supply
operational amplifiers can be used as dual supply operational amplifiers as well.
16. Output Capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1µF between output pin and VSS pin.
17. Oscillation by Output Capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
18. Latch Up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
19. Shutdown Terminal
The shutdown terminal can’t be left unconnected. In case shutdown operation is not needed, the shutdown pin should
be connected to VDD when the IC is used. Leaving the shutdown pin floating will result in an undefined operation
mode, either shutdown or active, or even oscillating between the two modes.
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Datasheet
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Physical Dimension, Tape and Reel Information
Package Name
SSOP6
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Datasheet
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Physical Dimension, Tape and Reel Information - continued.
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Physical Dimension, Tape and Reel Information – continued
Package Name
SOP-J8
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Physical Dimension, Tape and Reel Information – continued
Package Name
SSOP-B8
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Physical Dimension, Tape and Reel Information – continued
Package Name
TSSOP-B8
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Datasheet
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Physical Dimension, Tape and Reel Information – continued
Package Name
TSSOP-B8J
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Datasheet
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Physical Dimension, Tape and Reel Information – continued
Package Name
MSOP8
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Datasheet
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Physical Dimensions Tape and Reel Information – continued
Package Name
SOP14
(Max 9.05 (include.BURR)
(UNIT
mm)
PKG : SOP14
Drawing No. : EX113-5001
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Datasheet
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Physical Dimension, Tape and Reel Information – continued
Package Name
SOP-J14
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Datasheet
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Physical Dimension, Tape and Reel Information – continued
Package Name
TSSOP-B14J
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Datasheet
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Marking Diagram
SSOP6 (TOP VIEW)
LOT Number
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number Marking
SOP-J8(TOP VIEW)
Part Number Marking
SSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
SOP14(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B14J (TOP VIEW)
Part Number Marking
SOP-J14(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
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Datasheet
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Marking Diagram - Continued
Product Name
LMR341
Package Type
Marking
G
F
SSOP6
BD
R342
SOP8
FJ
SOP-J8
R342
FV
FVT
FVJ
FVM
F
SSOP-B8
TSSOP-B8
TSSOP-B8J
MSOP8
R342
LMR342
LMR344
R342
R342
R342
SOP14
R344
FJ
SOP-J14
TSSOP-B14J
LMR344FJ
R344
FVJ
Land Pattern Data
All dimensions in mm
Land length
Land pitch
e
Land space
MIE
Land width
b2
Package
SSOP6
≧ℓ 2
0.95
1.27
2.4
1.0
0.6
SOP8
SOP14
4.60
1.10
0.76
SOP-J8
SOP-J14
1.27
0.65
0.65
3.9
1.35
1.20
1.20
0.76
0.35
0.35
SSOP-B8
4.60
4.60
TSSOP-B8
TSSOP-B14J
MSOP8
0.65
0.65
2.62
3.20
0.99
1.15
0.35
0.35
TSSOP-B8J
SSOP6
SOP8, SOP-J8, SSOP-B8, MSOP8, TSSOP-B8, TSSOP-B8J,
SOP14, SOP-J14, TSSOP-B14J
0.95
0.95
MIE
0.6
ℓ 2
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LMR341G LMR342xxx LMR344xxx
Revision History
Date
Revision
001
Changes
03.Jul.2013
09.Oct.2013
7.Jan.2014
11.Jun.2014
New Release
002
LMR344F Added
LMR341G Added
003
004
Added LMR342F, LMR342FJ, LMR342FV, LMR342FVT, LMR342FVM
Correction of Marking. ( LMR341G : AX to BD)
08.Jul.2014
005
Correction of Figure 76. ([mW] to [W])
Correction of Operating Supply Voltage to +5.5V from +5.0V.(Page 1,4)
16.Jan.2015
16.Jun.2015
006
007
Added LMR344FJ, LMR344FVJ
Correction of Product Name.(LMR344F-G to LMR344F)
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Daattaasshheeeett
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.001
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Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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Datasheet
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LMR341G - Web Page
Distribution Inventory
Part Number
Package
Unit Quantity
LMR341G
SSOP6
3000
Minimum Package Quantity
Packing Type
Constitution Materials List
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相关型号：
LMR342FV
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LMR342FVT
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LMR344F
LMR344F是输入接地检测、输出全振幅的CMOS运算放大器。具有低电压工作、低消耗电流的特点，是适用于传感器放大器、电池驱动设备、电池监视、语音用音频前置放大器用途的运算放大器。
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LMR344FJ
LMR344FJ是输入接地检测、输出全振幅的CMOS运算放大器。LMR341G/LMR342xxx/LMR344xxx具有低电压工作、低消耗电流的特点，是适用于传感器放大器、电池驱动设备、电池监视、语音用音频前置放大器用途的运算放大器。LMR341G带关断功能。
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