MCH032A6R2DK [ROHM]
CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000062uF, SURFACE MOUNT, 0603, CHIP;
| 型号： | MCH032A6R2DK |
| 厂家： | 
ROHM |
| 描述： | CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000062uF, SURFACE MOUNT, 0603, CHIP |
| 文件： | 总6页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCH03
Ceramic capacitors
Multi-layer ceramic chip capacitors
MCH03 (0603 size, chip capacitor)
!External dimensions (Units : mm)
!Features
1) Small size (0.6 x 0.3 x 0.3 mm) makes it perfect
for lightweight portable devices.
2) Comes packed either in tape to enable automatic
mounting.
0.6 0.03
3) Precise uniformity of shape and dimensions facilitates
highly efficient automatic mounting.
4) Barrier layer and end terminations to improve
solderability.
0.3 0.03
0.1Min. 0.17Min.
!Structure
External electrode ΙΙΙ (coating layer)
Internal electrode
External electrode ΙΙ (barrier layer)
External electrode Ι (thick membrane layer)
Ceramic element
!Product designation
Code Product thickness Packaging specifications
0.3mm Paper tape (width 8 mm, pitch 2 mm)
Reel (φ180, φ330mm) : compatible with EIAJ ET-7200A
Reel
180mm (7in.)
Basic ordening unit (pcs.)
K
φ
15,000
Part No.
Packaging style
M C H 0 3 2 F N 1 0 3 Z K
Rated voltage
Nominal
Capacitance tolerance
Capacitance-temperature characteristics
capacitance
Code Voltage
Code Code
Operating temperature (°C)
−55~+125
−55~+125
−25~+85
(−55~+125)
−25~+85
(−30~+85)
Temp. coefficient or percent change
Code
C
D
tolerance
CG(C0G)
R
A
CN
0 30ppm/°C
15%
10%
( 15%)
2
3
5
25V
16V
50V
0.25pF (0.5 ~ 5pF)
0.5pF (5.1 ~ 10pF)
5% (11pF or more)
3-digit designation
according to IEC
B
J
(X7R)
F
K
Z
10%
FN
+
30%,
22%,
−
80%
(Y5V)
(
+
−82%)
+ 80%, −20%
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
1/6
MCH03
Ceramic capacitors
!Capacitance range
For thermal compensation
Part number
MCH03
Part number
Temperature
MCH03
Temperature
A
A
(CG) (C0G)
(CG) (C0G)
characteristics
characteristics
Capacitance (pF)
Capacitance (pF)
Rated voltage
Rated voltage
(V)
(V)
25V
25V
Tolerance
Tolerance
11
12
13
0.5
0.75
1
15
16
18
1.1
1.2
1.3
20
22
24
1.5
1.6
1.8
J ( 5%)
27
30
33
2
2.2
2.4
C ( 0.25pF)
36
39
43
2.7
3
3.3
3.6
3.9
4
47
4.3
4.7
5
Product thickness (mm) 0.3 0.03
5.1
5.6
6
6.2
6.8
7
D ( 0.5pF)
7.5
8
8.2
9
9.1
10
High dielectric constant
Part number
MCH03
CN (R) (B) (X7R)
Temperature
FN (F) (Y5V)
characteristics
Rated voltage (V)
Tolerance
Capacitance (pF)
25V
25V
K ( 10%)
Z ( +80, −20%)
100
150
200
330
470
680
1,000
1,500
2,200
4,700
10,000
Product thickness (mm) 0.3 0.03
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
2/6
MCH03
Ceramic capacitors
!Characteristics
Class 1 (For thermal compensation)
Temperature characteristics
Test methods/conditions
(based on JIS C 5102)
A (CG) (C0G)
Item
−55°C ~ 125°
C
Operating temperature
Based on paragraph 7.8 and paragraph 9
Measured at room temperature and standard humidity,
Nominal capacitance (C)
Must be within the specified tolerance range.
: 1 0.1MHz
: 1 0.1Vrms.
: 1 0.1kHz
: 1 0.1Vrms.
1000pF or less Measurement frequency
Measurement voltage
100/(400+20C)% or less: Less than 30 pF
Dissipation factor (tanδ)
Over 1000pF Measurement frequency
Measurement voltage
0.1% or less : 30 pF or larger
Based on paragraph 7.6
Measurement is made after rated voltage is applied for 60 5s.
10,000M
whichever is smaller
Ω or 500MΩ ⋅ µF,
Insulation resistance (IR)
Withstanding voltage
Based on paragraph 7.1
Apply 300% of the rated voltage for 1 to 5s then measure.
The insulation must not be damaged.
The temperature coefficients in table 12, paragraph 7.12 are
calculated at 20°C and high temperature.
Within 0 30ppm/°
C
Temperature characteristics
Terminal adherence
Based on paragraph 8.11. 2.
Apply 2N for 10 1s in the
direction indicated by the arrow.
No detachment or signs of detachment.
Pressure (2N)
Test board
Capacitor
Appearance
Resistance
to vibration
There must be no mechanical damage.
Must be within initial tolerance.
Chip is mounted to a board in the manner
shown on the right, subjected to vibration
(type A in paragraph 8.2), and measured
24 2 hrs. later.
Rate of capacitance change
Board
Dissipation factor (tanδ)
Must satisfy initial specified value.
Based on paragraph 8.13
At least 3/4 of the surface of the two terminals
must be covered with new solder.
Solderability
Soldering temperature: 235 5°
Soldering time
C
: 2 0.5s
Appearance
There must be no mechanical damage.
2.5% or 0.25 pF, whichever is larger.
Must satisfy initial specified value.
Rate of capacitance change
Dissipation factor (tanδ)
Based on paragraph 8.14.
Resistance
to soldering
heat
Soldering temperature
Soldering time
Preheating
: 260 5°
C
: 5 0.5s
10,000M
whichever is smaller
Ω or 500MΩ ⋅ µF,
: 150 10°
C
for 1 to 2 min.
Insulation resistance
Withstanding voltage
Appearance
The insulation must not be damaged.
There must be no mechanical damage.
2.5% or 0.25 pF, whichever is larger.
Must satisfy initial specified value.
Rate of capacitance change
Dissipation factor (tanδ)
Based on paragraph 9.3
Temperature
cycling
Number of cycles : 5
Capacitance measured after 24 2 hrs.
10,000M
Ω or 500MΩ ⋅ µF,
Insulation resistance
whichever is smaller
There must be no mechanical damage.
7.5% or 0.75 pF, whichever is larger.
0.5% or less
Appearance
Based on paragraph 9.9
Test temperature
Relative humidity: 90% to 95%
: 40 2°
C
Rate of capacitance change
Dissipation factor (tanδ)
Humidity load
test
Applied voltage
Test time
: rated voltage
: 500 to 524 hrs.
500M
whichever is smaller
Ω or 25MΩ ⋅ µF,
Capacitance measured after 24 2 hrs.
Insulation resistance
Appearance
There must be no mechanical damage.
3.0% or 0.3 pF, whichever is larger.
0.3% or less
Based on paragraph 9.10
Test temperature: Max. operating temp.
Applied voltage : rated voltage
200%
Test time
Rate of capacitance change
Dissipation factor (tanδ)
High-
temperature
load test
×
: 1,000 to 1,048 hrs.
Capacitance measured after 24 2 hrs.
1,000MΩ or 50MΩ ⋅ µF,
Insulation resistance
whichever is smaller
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
3/6
MCH03
Ceramic capacitors
Class 2 (High dielectric constant)
Temperature characteristics
Item
Test methods/conditions
(based on JIS C 5102)
CN (R) (B) (X7R)
FN (F) (Y5V)
Operating temperature
−55°C ~ +125°C
−30°C ~ +85°C
Based on paragraph 7.8
Measured at room temperature and standard humidity,
Nominal capacitance (C)
Must be within the specified tolerance range.
Measurement frequency
Measurement voltage
: 1 0.1 kHz
: 1.0 0.2 Vrms.
2.5% or less
5.0% or less
Dissipation factor (tanδ)
(when rated voltage is 16V: 3.5% or less) (when rated voltage is 16V: 7.5% or less)
Based on paragraph 7.6
Measurement is made after rated voltage
is applied for 60 5s.
Insulation resistance (IR)
Withstanding voltage
10,000M
Ω or 500MΩ ⋅ µF, whichever is smaller
Based on paragraph 7.1
Apply 250% of the rated voltage for 1 to 5s then measure.
The insulation must not be damaged.
The temperature coefficients in paragraph 7.12,
table 8, condition B, are based on measurements
carried out at 20°C, with no voltage applied.
Temperature characteristics
Terminal adherence
Within 15%
+
22, + 82%
Based on paragraph 8. 11. 2.
Apply 2N for 10 1s
in the direction indicated
by the arrow.
No detachment or signs of detachment
Pressure (2N)
Test board
Capacitor
Appearance
Resistance
There must be no mechanical damage.
Must be within initial tolerance.
Chip is mounted to a board in the
manner shown on the right, subjected
to vibration (type A in paragraph 8.2),
and measured 48 4 hrs. later.
Rate of capacitance change
to vibration
Board
Dissipation factor (tanδ)
Must satisfy initial specified value.
Based on paragraph 8. 13
Solderability
At least 3/4 of the surface of the two terminals must be covered with new solder.
: 235
: 2 0.5s
5
°C
Soldering temperature
Soldering time
There must be no mechanical damage.
Appearance
Rate of capacitance change
Resistance
to soldering
Within 20.0%
Must satisfy initial specified value.
10,000M or 500MΩ ⋅ µF, whichever is smaller
Within 5.0%
Based on paragraph 8. 14.
Soldering temperature : 260
Dissipation factor (tanδ)
5°C
Soldering time
Preheating
: 5 0.5s
: 150 10°C for
heat
Insulation resistance
Ω
1 to 2 min.
Withstanding voltage
Appearance
The insulation must not be damaged.
There must be no mechanical damage.
Based on paragraph 9.3
Number of cycles : 5
Capacitance measured after 48 4 hrs.
Rate of capacitance change
Temperature
Within 7.5%
Within 20.0%
cycling
Dissipation factor (tanδ)
Must satisfy initial specified value.
Insulation resistance
Appearance
10,000M
Ω
or 500MΩ ⋅ µF, whichever is smaller
There must be no mechanical damage.
Based on paragraph 9.9
Test temperature: 40
Relative humidity: 90% to 95%
2°C
Rate of capacitance change
12.5% or less
5.0% or less
Within 30.0%
7.5% or less
(when rated voltage is 16V: 10.0%)
Humidity load
test
Applied voltage
Test time
: rated voltage
: 500 to 524 hrs.
Dissipation factor (tanδ)
Capacitance measured after 48 4 hrs.
Insulation resistance
500M
Ω or 25MΩ ⋅ µF, whichever is smaller
Appearance
There must be no mechanical damage.
Based on paragraph 9.10
Test temperature: Max. operating temp.
Within 10.0%
5.0% or less
Rate of capacitance change
High-
Within 30.0%
7.5% or less
(when rated voltage is 16V: 10.0%)
Applied voltage
Test time
: rated voltage
: 1,000 to 1,048 hrs.
× 200%
temperature
load test
Dissipation factor (tanδ)
Capacitance measured after 48 4 hrs.
Insulation resistance
1,000M
Ω or 50MΩ ⋅ µF, whichever is smaller
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
4/6
MCH03
Ceramic capacitors
!Packaging specifications
(Units : mm)
Taping
Reel
180 mm plastic reel
φ
t
φJ
11.4 1.0
E
D
A
B
C
F
t1
H
Label position
Pulling direction
(Paper taping)
Symbol
C
D
E
F
H
J
t
t1
8.0
3.5 1.75 2.0 4.0 φ1.5 0.37 0.5
Dimensions
+0.1
0.3 0.05 0.1 0.05 0.1
0.02 MAX.
0
Symbol
0603
A
B
Size
0.37 0.03 0.67 0.03
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
5/6
MCH03
Ceramic capacitors
!Electrical characteristics
A (C0G) Characteristics
g
5
4
3
2
1
0
1000000
100000
10000
1000
100
0.5pF
−1
−2
−3
−4
−5
10pF
10
1
0.1
−50
0
50
100
1
10
100
1000
10000
FREQUENCY (MHz)
TEMPERATURE (°C)
Fig.2 Impedance-frequency
characteristics
Fig.1 Capacitance-temperature
characteristics
CN (X7R) Characteristics
g
30
1000000
100000
10000
1000
100
20
10
0
−10
−20
−30
10
1000pF
10
5
1
0.1
−80
−40
0
40
80
120
160
1
10
100
1000
10000
FREQUENCY (MHz)
TEMPERATURE : (°C)
Fig.4 Impedance-frequency
characteristics
Fig.3 Capacitance-temperature
characteristics
FN (Y5V) Characteristics
g
20
10
0
−10
−20
−30
−40
−50
−60
−70
−80
60
50
40
30
20
10
−80
−40
0
40
80
120
160
TEMPERATURE : (°C)
Fig.5 Capacitance-temperature
characteristics
∗The design and specifications are subject to change without prior notice. Before ordering or using, please check the latest technical specification.
6/6
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