RCX081N20 [ROHM]

Nch 200V 8.0A 功率MOSFET;
RCX081N20
型号: RCX081N20
厂家: ROHM    ROHM
描述:

Nch 200V 8.0A 功率MOSFET

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RCX081N20  
Nch 200V 8.0A Power MOSFET  
Datasheet  
lOutline  
VDSS  
200V  
770mW  
8.0A  
TO-220FM  
RDS(on) (Max.)  
ID  
(3)  
PD  
(2)  
40W  
(1)  
lFeatures  
lInner circuit  
1) Low on-resistance.  
(1) Gate  
(2) Drain  
(3) Source  
2) Fast switching speed.  
3) Drive circuits can be simple.  
4) Parallel use is easy.  
*1 BODY DIODE  
5) Pb-free lead plating ; RoHS compliant  
6) 100% Avalanche tested  
lPackaging specifications  
Packaging  
Bulk  
Reel size (mm)  
-
lApplication  
Tape width (mm)  
Type  
-
Switching Power Supply  
Automotive Motor Drive  
Automotive Solenoid Drive  
Basic ordering unit (pcs)  
500  
Taping code  
Marking  
-
RCX081N20  
lAbsolute maximum ratings(Ta = 25°C)  
Parameter  
Symbol  
VDSS  
Value  
200  
Unit  
V
Drain - Source voltage  
*1  
Tc = 25°C  
A
ID  
8.0  
Continuous drain current  
*1  
Tc = 100°C  
A
ID  
4.3  
*2  
Pulsed drain current  
A
ID,pulse  
32  
VGSS  
Gate - Source voltage  
Avalanche energy, single pulse  
Avalanche current  
V
30  
*3  
5.17  
mJ  
A
EAS  
*3  
4.0  
IAR  
Tc = 25°C  
Ta = 25°C  
PD  
PD  
Tj  
40  
W
W
°C  
°C  
Power dissipation  
2.23  
Junction temperature  
150  
Tstg  
Range of storage temperature  
-55 to +150  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
1/12  
Data Sheet  
RCX081N20  
lThermal resistance  
Values  
Parameter  
Symbol  
Unit  
Min.  
Typ.  
Max.  
RthJC  
RthJA  
Tsold  
-
-
-
-
-
-
3.125 °C/W  
Thermal resistance, junction - case  
Thermal resistance, junction - ambient  
Soldering temperature, wavesoldering for 10s  
56  
°C/W  
°C  
265  
lElectrical characteristics(Ta = 25°C)  
Values  
Typ.  
-
Parameter  
Symbol  
Conditions  
Unit  
V
Min.  
200  
Max.  
-
V(BR)DSS VGS = 0V, ID = 1mA  
VDS = 200V, VGS = 0V  
Drain - Source breakdown voltage  
-
-
-
-
10  
Tj = 25°C  
IDSS  
Zero gate voltage drain current  
mA  
VDS = 200V, VGS = 0V  
100  
Tj = 125°C  
IGSS  
VGS = 30V, VDS = 0V  
Gate - Source leakage current  
Gate threshold voltage  
-
3.25  
-
-
-
nA  
V
100  
5.25  
770  
VGS (th) VDS = 10V, ID = 1mA  
VGS = 10V, ID = 4.0A  
550  
Static drain - source  
on - state resistance  
*4  
VGS = 10V, ID = 4.0A  
Tj = 125°C  
RDS(on)  
mW  
-
1090  
2.0  
1500  
-
gfs  
VDS = 10V, ID = 4.0A  
Forward transfer admittance  
1.0  
S
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
2/12  
Data Sheet  
RCX081N20  
lElectrical characteristics(Ta = 25°C)  
Values  
Typ.  
330  
33  
Parameter  
Symbol  
Conditions  
VGS = 0V  
Unit  
Min.  
Max.  
Ciss  
Coss  
Crss  
Input capacitance  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
VDS = 25V  
f = 1MHz  
Output capacitance  
Reverse transfer capacitance  
Turn - on delay time  
Rise time  
pF  
ns  
15  
*4  
VDD 100V, VGS = 10V  
13  
td(on)  
*4  
ID = 4.0A  
RL = 25W  
RG = 10W  
20  
tr  
*4  
Turn - off delay time  
Fall time  
18  
td(off)  
*4  
8
tf  
lGate Charge characteristics(Ta = 25°C)  
Values  
Typ.  
8.5  
Parameter  
Symbol  
Conditions  
DD 100V  
Unit  
Min.  
Max.  
*4  
V
Total gate charge  
-
-
-
-
-
-
-
-
Qg  
*4  
ID = 8.0A  
Gate - Source charge  
Gate - Drain charge  
Gate plateau voltage  
3.4  
nC  
V
Qgs  
*4  
VGS = 10V  
3.4  
Qgd  
V(plateau)  
VDD 100V, ID = 4.0A  
7.9  
lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)  
Values  
Parameter  
Symbol  
Conditions  
Unit  
Min.  
Typ.  
Max.  
8.0  
32  
1.5  
-
*1  
Continuous source current  
Pulsed source current  
Forward voltage  
-
-
-
-
-
-
-
A
A
IS  
Tc = 25°C  
*2  
ISM  
*4  
VGS = 0V, IS = 8.0A  
-
V
VSD  
*4  
Reverse recovery time  
Reverse recovery charge  
75  
210  
ns  
nC  
trr  
IS = 4.0A  
*4  
di/dt = 100A/ms  
-
Qrr  
*1 Limited only by maximum temperature allowed.  
*2 Pw 10ms, Duty cycle 1%  
*3 L 500mH, VDD = 50V, Rg = 25W, starting Tj = 25°C  
*4 Pulsed  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
3/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.2 Maximum Safe Operating Area  
Fig.1 Power Dissipation Derating Curve  
120  
100  
80  
60  
40  
20  
0
100  
Ta=25ºC  
Single Pulse  
PW = 100ms  
10  
PW = 1ms  
Operation in this  
area is limited  
by RDS(on)  
1
0.1  
0.01  
PW = 10ms  
0.1  
1
10  
100  
1000  
0
25 50 75 100 125 150 175  
Drain - Source Voltage : VDS [V]  
Junction Temperature : Tj [°C]  
Fig.3 Normalized Transient Thermal  
Resistance vs. Pulse Width  
10  
Ta=25ºC  
Single Pulse  
Rth(j-c)(t) = r(t)×Rth(ch-c)  
Rth(j-c) = 56ºC/W  
1
0.1  
top D = 1  
D = 0.5  
D = 0.1  
D = 0.05  
D = 0.01  
D = Single  
0.01  
0.0001  
0.01  
1
100  
Pulse Width : PW [s]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
4/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.5 Avalanche Energy Derating Curve  
Fig.4 Avalanche Current vs Inductive Load  
vs Junction Temperature  
100  
120  
100  
80  
60  
40  
20  
0
VDD=50V,RG=25W  
VGF=10V,VGR=0V  
Starting Tch=25ºC  
10  
1
0.1  
0.01  
0.1  
1
10  
100  
0
25 50 75 100 125 150 175  
Coil Inductance : L [mH]  
Junction Temperature : Tj [°C]  
Fig.7 Typical Output Characteristics(II)  
Fig.6 Typical Output Characteristics(I)  
2
8
VGS=10.0V  
Ta=25ºC  
Ta=25ºC  
Pulsed  
VGS=10.0V  
7
6
5
4
3
2
1
0
Pulsed  
VGS=8.0V  
1.5  
VGS=8.0V  
VGS=7.0V  
VGS=7.0V  
1
VGS=6.0V  
0.5  
VGS=6.0V  
VGS=5.0V  
0.8  
Drain - Source Voltage : VDS [V]  
0
0
0.2  
0.4  
0.6  
1
0
2
4
6
8
10  
Drain - Source Voltage : VDS [V]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
5/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.8 Breakdown Voltage  
vs. Junction Temperature  
Fig.9 Typical Transfer Characteristics  
280  
10  
VDS= 10V  
VGS = 0V  
270  
ID = 1mA  
260  
1
250  
240  
230  
220  
210  
200  
190  
180  
0.1  
Ta= 125ºC  
Ta= 75ºC  
Ta= 25ºC  
Ta= -25ºC  
0.01  
0.001  
-50  
0
50  
100  
150  
0
1
2
3
4
5
6
7
8
9 10  
Junction Temperature : Tj [°C]  
Gate - Source Voltage : VGS [V]  
Fig.10 Gate Threshold Voltage  
vs. Junction Temperature  
Fig.11 Transconductance vs. Drain Current  
10  
5.5  
VDS= 10V  
VDS = 10V  
ID = 1mA  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
1
Ta= -25ºC  
Ta=25ºC  
Ta=75ºC  
Ta=125ºC  
0.1  
0.01  
0.01  
0.1  
1
10  
-50 -25  
0
25 50 75 100 125 150  
Junction Temperature : Tj [°C]  
Drain Current : ID [A]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
6/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.12 Static Drain - Source On - State  
Resistance vs. Gate Source Voltage  
Fig.13 Static Drain - Source On - State  
Resistance vs. Drain Current(I)  
10000  
1000  
100  
2000  
Ta=25ºC  
Ta=25ºC  
1500  
ID = 4.0A  
VGS= 10V  
ID = 8.0A  
1000  
500  
0
0.01  
0.1  
1
10  
0
10  
20  
Gate - Source Voltage : VGS [V]  
Drain Current : ID [A]  
Fig.14 Static Drain - Source On - State  
Resistance vs. Junction Temperature  
1200  
1100  
1000  
900  
800  
700  
600  
500  
400  
300  
VGS = 10V  
ID = 4A  
-50  
0
50  
100  
150  
Junction Temperature : Tj [ºC]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
7/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.15 Static Drain - Source On - State  
Resistance vs. Drain Current(II)  
Fig.16 Drain Current Derating Curve  
120  
100  
80  
60  
40  
20  
0
10000  
VGS= 10V  
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
Ta= -25ºC  
1000  
100  
10  
0.01  
0.1  
1
10  
0
25 50 75 100 125 150 175  
Drain Current : ID [A]  
Junction Temperature : Tj [°C]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
8/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.17 Typical Capacitance  
vs. Drain - Source Voltage  
Fig.18 Switching Characteristics  
10000  
1000  
100  
10  
10000  
Ta=25ºC  
Ta = 25ºC  
f = 1MHz  
VGS = 0V  
VDD= 100V  
VGS= 10V  
RG=10W  
tf  
1000  
Ciss  
td(off)  
100  
10  
1
Coss  
td(on)  
Crss  
tr  
1
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
Drain - Source Voltage : VDS [V]  
Drain Current : ID [A]  
Fig.19 Dynamic Input Characteristics  
20  
Ta=25ºC  
VDD= 100V  
18  
ID= 8.0A  
RG=10W  
16  
14  
12  
10  
8
6
4
2
0
0
5
10  
15  
20  
Total Gate Charge : Qg [nC]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
9/12  
Data Sheet  
RCX081N20  
lElectrical characteristic curves  
Fig.20 Source Current  
Fig21 Reverse Recovery Time  
vs.Source Current  
vs. Source - Drain Voltage  
1000  
10  
VGS=0V  
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
1
0.1  
Ta= -25ºC  
100  
Ta=25ºC  
di / dt = 100A / ms  
VGS = 0V  
10  
0.01  
0.1  
1
10  
0.0  
0.5  
1.0  
1.5  
Source-Drain Voltage : VSD [V]  
Source Current : IS [A]  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
10/12  
Data Sheet  
RCX081N20  
lMeasurement circuits  
Fig.1-1 Switching Time Measurement Circuit  
Fig.1-2Switching Waveforms  
Fig.2-2 Gate Charge Waveform  
Fig.3-2 Avalanche Waveform  
Fig.2-1 Gate Charge Measurement Circuit  
Fig.3-1 Avalanche Measurement Circuit  
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© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
11/12  
Data Sheet  
RCX081N20  
lDimensions (Unit : mm)  
E
D
TO-220FM  
A
E1  
b1  
Q
c
e
b
x
A
MILIMETERS  
INCHES  
DIM  
MIN  
16.60  
1.80  
14.80  
6.80  
0.70  
1.10  
0.70  
9.90  
4.40  
MAX  
17.60  
2.20  
15.40  
7.20  
0.85  
1.50  
0.85  
10.30  
4.80  
MIN  
MAX  
0.693  
0.087  
0.606  
0.283  
0.033  
0.059  
0.033  
0.406  
0.189  
A
A1  
A2  
A4  
b
b1  
c
D
0.654  
0.071  
0.583  
0.268  
0.028  
0.043  
0.028  
0.39  
E
0.173  
2.54  
0.10  
e
E1  
F
L
p
Q
x
2.70  
2.80  
11.50  
3.00  
2.10  
-
3.00  
3.20  
12.50  
3.40  
3.10  
0.381  
0.106  
0.11  
0.453  
0.118  
0.083  
-
0.118  
0.126  
0.492  
0.134  
0.122  
0.015  
Dimension in mm/inches  
www.rohm.com  
© 2012 ROHM Co., Ltd. All rights reserved.  
2012.08 - Rev.A  
12/12  
Notice  
N o t e s  
No copying or reproduction of this document, in part or in whole, is permitted without the  
consent of ROHM Co.,Ltd.  
The content specified herein is subject to change for improvement without notice.  
The content specified herein is for the purpose of introducing ROHM's products (hereinafter  
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,  
which can be obtained from ROHM upon request.  
Examples of application circuits, circuit constants and any other information contained herein  
illustrate the standard usage and operations of the Products. The peripheral conditions must  
be taken into account when designing circuits for mass production.  
Great care was taken in ensuring the accuracy of the information specified in this document.  
However, should you incur any damage arising from any inaccuracy or misprint of such  
information, ROHM shall bear no responsibility for such damage.  
The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or  
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and  
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the  
use of such technical information.  
The Products specified in this document are intended to be used with general-use electronic  
equipment or devices (such as audio visual equipment, office-automation equipment, commu-  
nication devices, electronic appliances and amusement devices).  
The Products specified in this document are not designed to be radiation tolerant.  
While ROHM always makes efforts to enhance the quality and reliability of its Products, a  
Product may fail or malfunction for a variety of reasons.  
Please be sure to implement in your equipment using the Products safety measures to guard  
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The Products are not designed or manufactured to be used with any equipment, device or  
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More detail product informations and catalogs are available, please contact us.  
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R1120A  

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