RT1E060XN [ROHM]
4V Drive Nch MOSFET; 4V驱动N沟道MOSFET型号: | RT1E060XN |
厂家: | ROHM |
描述: | 4V Drive Nch MOSFET |
文件: | 总7页 (文件大小:1146K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
4V Drive Nch MOSFET
RT1E060XN
Structure
Dimensions (Unit : mm)
Silicon N-channel MOSFET
TSST8
(8)
(1)
(7)
(2)
(6)
(3)
(5)
(4)
Features
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (TSST8).
Abbreviated symbol : XR
Application
Switching
Packaging specifications
Inner circuit
Package
Taping
TCR
3000
(8)
(7)
(6)
(5)
Type
Code
Basic ordering unit (pieces)
∗2
RT1E060XN
(1) Drain
(2) Drain
(3) Drain
(4) Gate
(5) Source
(6) Drain
(7) Drain
(8) Drain
∗1
Absolute maximum ratings (Ta = 25C)
Parameter Symbol
Drain-source voltage
Limits
Unit
V
(1)
(2)
(3)
(4)
VDSS
VGSS
ID
30
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
Gate-source voltage
20
V
Continuous
Pulsed
6
A
Drain current
*1
IDP
24
A
Continuous
Pulsed
IS
1
24
A
Source current
(Body Diode)
*1
*2
ISP
A
Power dissipation
PD
1.25
W
C
C
Channel temperature
Tch
Tstg
150
Range of storage temperature
*1 Pw10s, Duty cycle1%
55 to 150
*2 Mounted on a ceramic board.
Thermal resistance
Parameter
Symbol
Rth (ch-a)*
Limits
100
Unit
Channel to Ambient
*Mounted on a ceramic board.
C / W
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Data Sheet
RT1E060XN
Electrical characteristics (Ta = 25C)
Parameter
Symbol
IGSS
Min.
Typ.
-
Max.
Unit
A VGS=20V, VDS=0V
ID=1mA, VGS=0V
A VDS=30V, VGS=0V
Conditions
Gate-source leakage
-
10
Drain-source breakdown voltage V(BR)DSS
30
-
-
1
2.5
22
29
32
-
V
Zero gate voltage drain current
Gate threshold voltage
IDSS
-
-
VGS (th)
1.0
-
V
VDS=10V, ID=1mA
ID=6A, VGS=10V
ID=6A, VGS=4.5V
ID=6A, VGS=4.0V
ID=6A, VDS=10V
-
16
21
23
-
Static drain-source on-state
resistance
*
RDS (on)
m
-
-
*
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
l Yfs l
Ciss
4.5
S
-
-
-
-
-
-
-
-
-
-
440
170
85
8
-
pF VDS=10V
pF VGS=0V
pF f=1MHz
ns ID=3A, VDD 15V
ns VGS=10V
ns RL=5
Coss
Crss
-
-
td(on)
-
*
*
*
*
*
*
*
tr
td(off)
tf
16
32
8
-
Turn-off delay time
Fall time
-
-
ns RG=10
nC ID=6A, VDD 15V
nC VGS=5V
nC
Total gate charge
Gate-source charge
Gate-drain charge
Qg
Qgs
Qgd
6.8
1.6
2.6
-
-
-
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
Min.
-
Typ.
-
Max. Unit
1.2
Conditions
*
VSD
V
Is=6A, VGS=0V
*Pulsed
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2011.04 - Rev.A
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Data Sheet
RT1E060XN
ꢀ
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics (Ⅱ)
Fig.1 Typical Output Characteristics (Ⅰ)
6
5
4
3
2
1
0
6
Ta=25°C
VGS=3.0V
Pulsed
VGS=10.0V
VGS=4.5V
5
VGS=10.0V
VGS=4.0V
VGS=2.8V
VGS=2.5V
VGS=4.5V
VGS=4.0V
4
3
2
1
0
VGS=3.0V
VGS=2.8V
VGS=2.5V
Ta=25°C
Pulsed
0
0.2
0.4
0.6
0.8
1
0
2
4
6
8
10
Drain-Source Voltage : VDS [V]
Drain-Source Voltage : VDS [V]
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current
100
Fig.3 Static Drain-Source On-State Resistance vs. Drain Current
100
10
1
VGS=10V
pulsed
Ta=25°C
Pulsed
10
VGS=4.0V
VGS=4.5V
VGS=10V
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.01
0.01
0.1
1
10
100
0.1
1
10
100
Drain Current : ID [A]
Drain Current : ID [A]
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current
100
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
100
VGS=4.5V
pulsed
VGS=4V
pulsed
Ta=125°C
10
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.01
1
0.01
0.1
1
10
100
0.1
1
10
100
Drain Current : ID [A]
Drain Current : ID [A]
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2011.04 - Rev.A
Data Sheet
RT1E060XN
ꢀ
Fig.8 Typical Transfer Characteristics
Fig.7 Forward Transfer Admittance vs. Drain Current
100
10
100
10
VDS=10V
pulsed
VDS=10V
pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
1
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.01
0.001
0.001
0.01
0.1
1
10
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Gate-Source Voltage : VGS [V]
Drain Current : ID [A]
Fig.9 Source Current vs. Source-Drain Voltage
Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
100
100
10
VGS=0V
pulsed
Ta=25°C
Pulsed
80
ID=6.0A
ID=3.0A
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
60
1
40
20
0
0.1
0.01
0
2
4
6
8
10
0.0
0.5
1.0
1.5
2.0
Gate-Source Voltage : VGS [V]
Source-Drain Voltage : VSD [V]
Fig.11 Switching Characteristics
Fig.12 Dynamic Input Characteristics
1000
100
10
10
8
V
DD≒15V
Ta=25°C
VDD=15V
ID=6A
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
tf
Pulsed
td(off)
6
td(on)
4
2
tr
1
0
0.01
0.1
1
10
100
0
2
4
6
8
10
12
14
Total Gate Charge : Qg [nC]
Drain Current : ID [A]
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2011.04 - Rev.A
Data Sheet
RT1E060XN
ꢀ
Fig.13 Typical Capacitance vs. Drain-Source Voltage
Fig.14 Maximum Safe Operating Area
10000
1000
100
100
10
Operation in this area is limited by RDS(on)
(VGS = 10V)
Ta=25°C
f=1MHz
VGS=0V
PW = 100μs
1
Ciss
PW = 1ms
PW = 10ms
Coss
0.1
Ta=25°C
Crss
Single Pulse
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
DC operation
100
10
0.01
0.01
0.1
1
10
100
0.01
0.1
1
10
Drain-Source Voltage : VDS [ V ]
Drain-Source Voltage : VDS [V]
Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width
10
Ta=25°C
Single Pulse
1
0.1
0.01
Mounted on a ceramic board.
(30mm × 30mm × 0.8mm)
Rth(ch-a)=100°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
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2011.04 - Rev.A
Data Sheet
RT1E060XN
Measurement circuits
Pulse width
90%
VGS
ID
VDS
50%
10%
50%
V
V
GS
DS
R
L
10%
10%
90%
D.U.T.
V
DD
RG
90%
t
d(on)
td(off)
t
r
tf
t
on
toff
Fig.1-2ꢀSwitching Waveforms
Fig.1-1 Switching Time Measurement Circuit
V
G
VGS
I
D
VDS
Q
g
RL
V
GS
D.U.T.
I
G(Const.)
Q
gs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
Notice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design
ESD protection circuit.
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2011.04 - Rev.A
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Notice
N o t e s
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More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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R1120A
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Power Field-Effect Transistor, 6A I(D), 30V, 0.032ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TSST8, 8 PIN
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