RW1A025APT2R [ROHM]

Small Signal Field-Effect Transistor, 2.5A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, WEMT6, 6 PIN;
RW1A025APT2R
型号: RW1A025APT2R
厂家: ROHM    ROHM
描述:

Small Signal Field-Effect Transistor, 2.5A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, WEMT6, 6 PIN

开关 光电二极管 晶体管
文件: 总12页 (文件大小:613K)
中文:  中文翻译
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RW1A025AP  
Pch -12V -2.5A Power MOSFET  
Datasheet  
lOutline  
(6)  
VDSS  
-12V  
62mW  
-2.5A  
0.7W  
(5)  
WEMT6  
(4)  
RDS(on) (Max.)  
(1)  
ID  
(2)  
PD  
(3)  
lFeatures  
lInner circuit  
1) Low on - resistance.  
(1) Drain  
(2) Drain  
(3) Gate  
(4) Source  
(5) Drain  
(6) Drain  
2) -1.5V Drive.  
3) Built-in G-S Protection Diode.  
4) Small Surface Mount Package (WEMT6).  
5) Pb-free lead plating ; RoHS compliant  
*1 ESD PROTECTION DIODE  
*2 BODY DIODE  
lPackaging specifications  
Packaging  
Taping  
180  
Reel size (mm)  
lApplication  
Tape width (mm)  
Type  
8
DC/DC converters  
Basic ordering unit (pcs)  
8,000  
T2R  
SD  
Taping code  
Marking  
lAbsolute maximum ratings(Ta = 25°C)  
Parameter  
Symbol  
Value  
-12  
Unit  
V
VDSS  
Drain - Source voltage  
Continuous drain current  
Pulsed drain current  
*1  
A
ID  
2.5  
*2  
A
ID,pulse  
VGSS  
7.5  
Gate - Source voltage  
V
0 to -8  
0.7  
*3  
W
W
°C  
°C  
PD  
Power dissipation  
*4  
0.4  
PD  
Tj  
Junction temperature  
150  
Tstg  
Range of storage temperature  
-55 to +150  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
1/11  
Data Sheet  
RW1A025AP  
lThermal resistance  
Values  
Parameter  
Symbol  
Unit  
Min.  
Typ.  
Max.  
*3  
-
-
-
-
179  
313  
°C/W  
°C/W  
RthJA  
Thermal resistance, junction - ambient  
*4  
RthJA  
lElectrical characteristics(Ta = 25°C)  
Values  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
V
Min.  
Max.  
-
Drain - Source breakdown  
voltage  
V(BR)DSS  
VGS = 0V, ID = -1mA  
-
-12  
ΔV(BR)DSS  
ΔTj  
ID= -1mA  
referenced to 25°C  
Breakdown voltage  
temperature coefficient  
-
-
mV/°C  
-12  
IDSS  
IGSS  
VDS = -12V, VGS = 0V  
VGS = -8V, VDS = 0V  
VDS = -6V, ID = 1mA  
Zero gate voltage drain current  
Gate - Source leakage current  
Gate threshold voltage  
-
-
-
-
-
-1  
-10  
-1  
mA  
mA  
V
VGS (th)  
-0.3  
ΔV(GS)th  
ΔTj  
ID= -1mA  
referenced to 25°C  
Gate threshold voltage  
temperature coefficient  
-
2.6  
-
mV/°C  
VGS= -4.5V, ID= -2.5A  
VGS= -2.5V, ID= -1.2A  
VGS= -1.8V, ID= -1.2A  
VGS= -1.5V, ID= -0.5A  
VGS= -4.5V, ID= -2.5A, Tj=125°C  
f = 1MHz, open drain  
VDS= -6V, ID= -2.5A  
-
44  
55  
75  
90  
62  
12  
7.5  
62  
77  
110  
180  
87  
-
-
Static drain - source  
on - state resistance  
*5  
-
RDS(on)  
mW  
-
-
RG  
Gate input resistannce  
Transconductance  
-
W
*5  
3.5  
-
S
gfs  
*1 Limited only by maximum temperature allowed.  
*2 Pw 10ms, Duty cycle 1%  
*3 Mounted on a ceramic board (30×30×0.8mm)  
*4 Mounted on a FR4 (15×20×0.8mm)  
*5 Pulsed  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
2/11  
Data Sheet  
RW1A025AP  
lElectrical characteristics(Ta = 25°C)  
Values  
Typ.  
2000  
130  
120  
11  
Parameter  
Symbol  
Conditions  
VGS = 0V  
Unit  
Min.  
Max.  
Ciss  
Coss  
Crss  
Input capacitance  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
VDS = -6V  
Output capacitance  
Reverse transfer capacitance  
Turn - on delay time  
Rise time  
pF  
ns  
f = 1MHz  
*5  
V
DD -6V, VGS = -4.5V  
td(on)  
*5  
ID = -1.2A  
RL = 5W  
40  
tr  
*5  
Turn - off delay time  
Fall time  
160  
60  
td(off)  
*5  
RG = 10W  
tf  
lGate Charge characteristics(Ta = 25°C)  
Values  
Typ.  
16  
Parameter  
Symbol  
Conditions  
Unit  
nC  
Min.  
Max.  
*5  
Total gate charge  
-
-
-
-
-
-
Qg  
V
DD -6V, ID= -2.5A  
VGS = -4.5V  
*5  
Gate - Source charge  
Gate - Drain charge  
2.4  
Qgs  
*5  
2.2  
Qgd  
lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)  
Values  
Typ.  
Parameter  
Symbol  
Conditions  
Unit  
Min.  
Max.  
-0.5  
-1.2  
Inverse diode continuous,  
forward current  
*1  
Ta = 25°C  
-
-
-
-
A
V
IS  
*5  
VGS = 0V, Is = -2.5A  
Forward voltage  
VSD  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
3/11  
Data Sheet  
RW1A025AP  
lElectrical characteristic curves  
Fig.2 Maximum Safe Operating Area  
Fig.1 Power Dissipation Derating Curve  
120  
100  
80  
60  
40  
20  
0
100  
Operation in this area  
is limited by RDS(on)  
( VGS = -4.5V )  
PW = 1ms  
PW = 100ms  
10  
1
PW = 10ms  
DC Operation  
0.1  
0.01  
Ta=25ºC  
Single Pulse  
Mounted on a ceramic board.  
(30mm × 30mm × 0.8mm)  
0
50  
100  
150  
200  
0.01  
0.1  
1
10  
100  
Drain - Source Voltage : -VDS [V]  
Junction Temperature : Tj [°C]  
Fig.3 Normalized Transient Thermal  
Resistance vs. Pulse Width  
Fig.4 Single Pulse Maxmum Power  
dissipation  
10  
1000  
Ta=25ºC  
Single Pulse  
Ta=25ºC  
Single Pulse  
1
100  
10  
1
top  
D=1  
D=0.5  
D=0.1  
D=0.05  
D=0.01  
0.1  
0.01  
bottom Signle  
Rth(ch-a)=179ºC/W  
Rth(ch-a)(t)=r(t)×Rth(ch-a)  
Mounted on ceramic board  
(30mm × 30mm × 0.8mm)  
0.001  
0.0001  
0.01  
1
100  
0.0001  
0.01  
1
100  
Pulse Width : PW [s]  
Pulse Width : PW [s]  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
4/11  
Data Sheet  
RW1A025AP  
lElectrical characteristic curves  
Fig.6 Typical Output Characteristics(II)  
Fig.5 Typical Output Characteristics(I)  
2.5  
2
2.5  
Ta=25ºC  
Pulsed  
Ta=25ºC  
Pulsed  
VGS= -4.5V  
VGS= -2.5V  
VGS= -1.8V  
2
VGS= -1.2V  
VGS= -1.5V  
1.5  
1
1.5  
VGS= -4.5V  
VGS= -2.5V  
VGS= -1.8V  
VGS= -1.5V  
VGS= -1.2V  
1
0.5  
0.5  
0
VGS= -1.0V  
VGS= -1.0V  
0
0
0.2  
0.4  
0.6  
0.8  
1
0
2
4
6
8
10  
Drain - Source Voltage : -VDS [V]  
Drain - Source Voltage : -VDS [V]  
Fig.7 Breakdown Voltage  
vs. Junction Temperature  
Fig.8 Typical Transfer Characteristics  
10  
40  
20  
0
VGS = 0V  
ID = -1mA  
pulsed  
VDS= -6V  
Pulsed  
1
Ta= 125ºC  
Ta= 75ºC  
Ta= 25ºC  
Ta= -25ºC  
0.1  
0.01  
0.001  
-50  
0
50  
100  
150  
0
0.5  
1
1.5  
Junction Temperature : Tj [°C]  
Gate - Source Voltage : -VGS [V]  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
5/11  
Data Sheet  
RW1A025AP  
lElectrical characteristic curves  
Fig.9 Gate Threshold Voltage  
vs. Junction Temperature  
Fig.10 Transconductance vs. Drain Current  
2
100  
10  
1
VDS= -6V  
Pulsed  
VDS = 10V  
ID = -1mA  
pulsed  
1
0
Ta= 125ºC  
Ta= 75ºC  
Ta= 25ºC  
Ta= -25ºC  
0.1  
0.1  
1
10  
-50  
0
50  
100  
150  
Junction Temperature : Tj [°C]  
Drain Current : -ID [A]  
Fig.11 Drain CurrentDerating Curve  
Fig.12 Static Drain - Source On - State  
Resistance vs. Gate Source Voltage  
1.2  
150  
100  
50  
Ta=25ºC  
Pulsed  
1
0.8  
0.6  
0.4  
0.2  
0
ID= -1.25A  
ID= -2.5A  
0
0
2
4
6
8
-25  
0
25  
50  
75 100 125 150  
Gate - Source Voltage : -VGS [V]  
Junction Temperature : Tj [ºC]  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
6/11  
Data Sheet  
RW1A025AP  
lElectrical characteristic curves  
Fig.13 Static Drain - Source On - State  
Resistance vs. Drain Current(I)  
Fig.14 Static Drain - Source On - State  
Resistance vs. Junction Temperature  
1000  
80  
60  
40  
20  
0
Ta=25ºC  
Pulsed  
VGS= -1.5V  
VGS= -1.8V  
VGS= -2.5V  
VGS= -4.5V  
100  
VGS = -4.5V  
ID = -2.5A  
pulsed  
10  
0.1  
1
10  
-50 -25  
0
25 50 75 100 125 150  
Drain Current : -ID [A]  
Junction Temperature : Tj [ºC]  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
7/11  
Data Sheet  
RW1A025AP  
lElectrical characteristic curves  
Fig.15 Static Drain - Source On - State  
Resistance vs. Drain Current(II)  
Fig.16 Static Drain-Source On-State  
Resistance vs. Drain Current(III)  
1000  
1000  
100  
10  
VGS= -2.5V  
Pulsed  
VGS= -4.5V  
Pulsed  
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
Ta= -25ºC  
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
Ta= -25ºC  
100  
10  
0.1  
1
10  
0.1  
1
10  
Drain Current : -ID [A]  
Drain Current : -ID [A]  
Fig.18 Static Drain - Source On - State  
Resistance vs. Drain Current(V)  
Fig.17 Static Drain - Source On - State  
Resistance vs. Drain Current(IV)  
1000  
1000  
VGS= -1.5V  
Pulsed  
VGS= -1.8V  
Pulsed  
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
Ta= -25ºC  
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
Ta= -25ºC  
100  
100  
10  
10  
0.1  
1
10  
0.1  
1
10  
Drain Current : -ID [A]  
Drain Current : -ID [A]  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
8/11  
Data Sheet  
RW1A025AP  
lElectrical characteristic curves  
Fig.19 Typical Capacitance  
vs. Drain - Source Voltage  
10000  
Fig.20 Switching Characteristics  
1000  
Ciss  
td(off)  
1000  
100  
tf  
Coss  
100  
10  
Ta=25ºC  
Crss  
VDD= -6V  
VGS= -4.5V  
RG=10W  
Pulsed  
Ta=25ºC  
f=1MHz  
VGS=0V  
td(on)  
tr  
10  
1
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
Drain - Source Voltage : -VDS [V]  
Drain Current : -ID [A]  
Fig.22 Source Current  
vs. Source Drain Voltage  
Fig.21 Dynamic Input Characteristics  
10  
5
VGS=0V  
Pulsed  
4
3
1
Ta=125ºC  
Ta=75ºC  
Ta=25ºC  
Ta= -25ºC  
0.1  
2
0.01  
0.001  
Ta=25ºC  
VDD= -6V  
ID= -2.5A  
1
Pulsed  
15  
Total Gate Charge : Qg [nC]  
0
0
5
10  
20  
0
0.5  
1
1.5  
Source-Drain Voltage : -VSD [V]  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
9/11  
Data Sheet  
RW1A025AP  
lMeasurement circuits  
Fig.1-1 Switching Time Measurement Circuit  
Fig.1-2Switching Waveforms  
Fig.2-1 Gate Charge Measurement Circuit  
Fig.2-2 Gate Charge Waveform  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
10/11  
Data Sheet  
RW1A025AP  
lDimensions (Unit : mm)  
D
A
c
b
WEMT6  
x
S A  
e
y
S
S
b2  
e
Patterm of terminal position areas  
MILIMETERS  
MIN  
INCHES  
DIM  
MAX  
0.65  
0.05  
0.27  
0.18  
1.70  
1.40  
MIN  
0.022  
0
0.007  
0.003  
0.059  
0.047  
MAX  
0.026  
0.002  
0.011  
0.007  
0.067  
0.055  
A
A1  
b
c
D
E
0.55  
0.00  
0.17  
0.08  
1.50  
1.20  
0.50  
0.02  
e
HE  
Lp  
x
1.50  
0.11  
-
1.70  
0.31  
0.10  
0.10  
0.059  
0.004  
-
0.067  
0.012  
0.004  
0.004  
y
-
-
MILIMETERS  
MAX  
1.29  
INCHES  
0.051  
DIM  
MIN  
MIN  
MAX  
e1  
b2  
l1  
-
-
0.37  
0.41  
-
-
0.015  
0.016  
Dimension in mm/inches  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
2013.02 - Rev.B  
11/11  
Notice  
N o t e s  
1) The information contained herein is subject to change without notice.  
2) Before you use our Products, please contact our sales representative and verify the latest specifica-  
tions :  
3) Although ROHM is continuously working to improve product reliability and quality, semicon-  
ductors can break down and malfunction due to various factors.  
Therefore, in order to prevent personal injury or fire arising from failure, please take safety  
measures such as complying with the derating characteristics, implementing redundant and  
fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no  
responsibility for any damages arising out of the use of our Poducts beyond the rating specified by  
ROHM.  
4) Examples of application circuits, circuit constants and any other information contained herein are  
provided only to illustrate the standard usage and operations of the Products. The peripheral  
conditions must be taken into account when designing circuits for mass production.  
5) The technical information specified herein is intended only to show the typical functions of and  
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,  
any license to use or exercise intellectual property or other rights held by ROHM or any other  
parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of  
such technical information.  
6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-  
cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in  
this document.  
7) The Products specified in this document are not designed to be radiation tolerant.  
8) For use of our Products in applications requiring a high degree of reliability (as exemplified  
below), please contact and consult with a ROHM representative : transportation equipment (i.e.  
cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety  
equipment, medical systems, servers, solar cells, and power transmission systems.  
9) Do not use our Products in applications requiring extremely high reliability, such as aerospace  
equipment, nuclear power control systems, and submarine repeaters.  
10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with  
the recommended usage conditions and specifications contained herein.  
11) ROHM has used reasonable care to ensur the accuracy of the information contained in this  
document. However, ROHM does not warrants that such information is error-free, and ROHM  
shall have no responsibility for any damages arising from any inaccuracy or misprint of such  
information.  
12) Please use the Products in accordance with any applicable environmental laws and regulations,  
such as the RoHS Directive. For more details, including RoHS compatibility, please contact a  
ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting  
non-compliance with any applicable laws or regulations.  
13) When providing our Products and technologies contained in this document to other countries,  
you must abide by the procedures and provisions stipulated in all applicable export laws and  
regulations, including without limitation the US Export Administration Regulations and the Foreign  
Exchange and Foreign Trade Act.  
14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of  
ROHM.  
Thank you for your accessing to ROHM product informations.  
More detail product informations and catalogs are available, please contact us.  
ROHM Customer Support System  
http://www.rohm.com/contact/  
www.rohm.com  
© 2013 ROHM Co., Ltd. All rights reserved.  
R1102  
A

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