RZR040P01TL [ROHM]
Small Signal Field-Effect Transistor, 4A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TSMT3, 3 PIN;型号: | RZR040P01TL |
厂家: | ROHM |
描述: | Small Signal Field-Effect Transistor, 4A I(D), 12V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TSMT3, 3 PIN 驱动 |
文件: | 总5页 (文件大小:218K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
1.5V Drive Pch MOSFET
RZR040P01
zStructure
zDimensions (Unit : mm)
Silicon P-channel MOSFET
TSMT3
1.0MAX
2.9
0.4
0.85
0.7
zFeatures
(
(
)
)
3
1) Low on-resistance.
2) High power package.
3) Low voltage drive. (1.5V)
( )
2
1
0.95 0.95
1.9
0.16
zApplications
(1) Gate
Each lead has same dimensions
Switching
(2) Source
(3) Drain
Abbreviated symbol : YE
zPackaging specifications
zInner circuit
Package
Taping
TL
(3)
Type
Code
Basic ordering unit (pieces)
3000
RZR040P01
∗2
(1)
zAbsolute maximum ratings (Ta=25°C)
Parameter
Drain-source voltage
Symbol
VDSS
VGSS
ID
Limits
Unit
V
∗1
−12
10
(1) Gate
(2) Source
(3) Drain
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
Gate-source voltage
V
(2)
Continuous
Pulsed
4
16
A
Drain current
∗1
IDP
A
Source current
(Body diode)
Continuous
Pulsed
IS
−0.8
−16
1.0
A
∗1
∗2
ISP
A
Total power dissipation
Channel temperature
PD
W
°C
°C
Tch
Tstg
150
Range of Storage temperature
∗1 Pw≤10µs, Duty cycle≤1%
−55 to +150
∗2 When mounted on a ceramic board
zThermal resistance
Parameter
Symbol
Rth(ch-a) ∗
Limits
125
Unit
Channel to ambient
∗ When mounted on a ceramic board.
°C / W
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RZR040P01
Data Sheet
zElectrical characteristics (Ta=25°C)
Parameter
Symbol Min. Typ. Max.
Conditions
µA VGS= 10V, VDS=0V
Unit
Gate-source leakage
IGSS
−
−
−
10
−
Drain-source breakdown voltage V(BR) DSS −12
Zero gate voltage drain current
V
µA
V
ID= −1mA, VGS=0V
IDSS
−
−
−
−1
−1.0
30
42
60
110
−
−
−
−
−
−
−
−
−
−
−
VDS= −12V, VGS=0V
DS= −6V, ID= −1mA
Gate threshold voltage
VGS (th) −0.3
V
−
−
−
−
6.5
22
30
40
55
−
2350
310
280
11
70
380
210
30
4.0
3.5
mΩ ID= −4A, VGS= −4.5V
mΩ ID= −2A, VGS= −2.5V
mΩ ID= −2A, VGS= −1.8V
mΩ ID= −0.8A, VGS= −1.5V
∗
Static drain-source on-state
resistance
RDS (on)
∗
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Yfs
Ciss
S
VDS= −6V, ID= −4A
VDS= −6V
−
−
−
−
−
−
−
−
pF
pF
pF
ns
ns
ns
ns
Coss
Crss
td (on)
VGS=0V
f=1MHz
∗
∗
∗
∗
∗
∗
∗
V
DD −6V
I
D
= −2A
t
r
V
R
GS= −4.5V
Turn-off delay time
Fall time
td (off)
tf
L
3Ω
=10Ω
RG
Total gate charge
Gate-source charge
Qg
nC VDD −6V
RL
1.5Ω
ID= −4A
Qgs
Qgd
−
−
nC
RG
=10Ω
VGS= −4.5V
Gate-drain charge
nC
∗Pulsed
zBody diode characteristics (Source-drain) (Ta=25°C)
Parameter
Symbol Min. Typ. Max.
Conditions
IS= −4A, VGS=0V
Unit
∗
Forward voltage
V
SD
−
−
−1.2
V
∗Pulsed
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RZR040P01
Data Sheet
zElectrical characteristics curves
10
10
8
10
1
Ta=25°C
Pulsed
VDS= -6V
Pulsed
VGS= -4.5V
GS= -2.5V
GS= -1.8V
GS= -1.5V
V
VGS= -4.5V
GS= -2.5V
GS= -1.8V
8
6
4
2
0
V
V
V
V
6
VGS= -1.5V
VGS= -1.2V
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.1
VGS= -1.3V
4
VGS= -1.2V
0.01
0.001
2
VGS= -1.1V
Ta=25°C
Pulsed
0
0
2
4
6
8
10
0
0.5
1
1.5
2
10
1
0
0.2
0.4
0.6
0.8
1
10
10
DRAIN-SOURCE VOLTAGE : -VDS[V]
DRAIN-SOURCE VOLTAGE : -VDS[V]
GATE-SOURCE VOLTAGE : -VGS[V]
Fig.2 Typical output characteristics(
)
Ⅱ
Fig.3 Typical Transfer Characteristics
Fig.1 Typical output characteristics(
)
Ⅰ
1000
1000
100
10
1000
100
10
VGS= -4.5V
Pulsed
Ta=25°C
Pulsed
VGS= -2.5V
VGS= -4.5V
GS= -2.5V
GS= -1.8V
VGS= -1.5V
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Pulsed
V
V
100
10
1
1
1
0.1
1
0.1
1
10
0.1
1
DRAIN-CURRENT : -ID[A]
DRAIN-CURRENT : -ID[A]
DRAIN-CURRENT : -ID[A]
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current(
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current(
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(
)
)
)
Ⅲ
Ⅰ
Ⅱ
1000
100
10
1000
100
10
10
1
VGS= -1.5V
Pulsed
VGS= -1.8V
Pulsed
VGS=0V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.1
0.01
1
1
0.1
1
10
0.1
1
0
0.2
0.4
0.6
0.8
DRAIN CURRENT : -ID[A]
DRAIN CURRENT : -ID[A]
SOURCE-DRAIN VOLTAGE : -VSD [V]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current(
)
Ⅳ
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current(
Fig.9 Reverse Drain Current
vs. Sourse-Drain Voltage
)
Ⅴ
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RZR040P01
Data Sheet
100
10
1
200
150
100
50
5
4
3
2
1
0
VDS= -6V
Pulsed
Ta=25°C
Pulsed
Ta=25°C
DD= -6V
ID= -4.0A
G=10Ω
Pulsed
V
R
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
ID= -2.0A
ID= -4.0A
0
0
5
10
0.1
1
10
0
5
10
15
20
25
30
35
TOTAL GATE CHARGE : Qg [nC]
GATE-SOURCE VOLTAGE : -VGS[V]
DRAIN CURRENT : -ID[A]
Fig.10 Static Drain-Source On-State
Fig.12 Dynamic Input Characteristics
Fig.11 Forward Transfer Admittance
vs. Drain Current
Resistance vs. Gate Source Voltage
1000
100
10
10000
1000
100
Ta=25°C
f=1MHz
VGS=0V
tf
td(off)
Ciss
td(on)
Crss
Coss
tr
Ta=25°C VDD= -6V
GS=-4.5V RG=10Ω
V
Pulsed
1
0.01
0.1
1
10
100
0.01
0.1
1
10
GATE-SOURCE VOLTAGE : -VDS[V]
DRAIN-CURRENT : -ID[A]
Fig.14 Switching Characteristics
ꢀ
Fig.13 Typical Capacitance
vs. Drain-Source Voltage
zMeasurement circuits
Pulse Width
I
D
VDS
VGS
V
V
GS
10%
50%
R
L
50%
90%
D.U.T.
10%
10%
90%
V
DD
RG
90%
tr
DS td(on)
td(off)
tf
t
on
toff
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
V
G
I
D
VDS
VGS
Q
g
RL
V
GS
D.U.T.
I
G(Const.)
Q
gs
Qgd
VDD
RG
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
zNotice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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illustrate the standard usage and operations of the Products. The peripheral conditions must
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However, should you incur any damage arising from any inaccuracy or misprint of such
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