SML-P11VTT86R [ROHM]

Accomplishes low power consuming application specification assured at IF=1mA;


型号：	SML-P11VTT86R
厂家：	ROHM
描述：	Accomplishes low power consuming application specification assured at IF=1mA
文件：	总10页 (文件大小：277K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SML-P11x Series

ꢀꢀꢀꢀꢀPICOLED^TM-eco

Data Sheet

■Features

■Outline

• Ultra compact, thin sizeꢀ1.0×0.6mm

• Accomplishes low power consuming application

specification assured at IF=1mA

■Size

Color

Type

1006 (0402)

1.0×0.6mm (t=0.2mm)

■Dimensions

■Recommended Solder Pattern

0.6

0.5

0.4

0.5

PCB Bonding Direction

Tolerance : ±0.05

(unit : mm)

■Moisture sensitivity level(MSL) : Level 3

■Speciﬁcations

Absolute Maximum Ratings (Ta=25ºC)

Electrical and Optical Characteristics (Ta=25ºC)

Peak Forward

Forward

Current

Reverse

Voltage

Forward Voltage V_FReverse Current I_RDominant Wavelength λ_DLuminous Intensity I_V

Power

Emitting color

Chip Structure

Operating Temp. Storage Temp.

Part No.

Min.*²

Max.*²

Dissipation

Current

I_F

V_R

I_F

Typ.

Max.

Typ.

Min. Typ.

P_D(mW) I_F(mA) I_FP(mA) V_R(V)

T_opr(ºC)

T_stg(ºC)

(V) (mA) (µA)

(V)

(nm) (nm) (nm) (mA) (mcd) (mcd) (mA)

SML-P11VT(R)

SML-P11UT(R)

SML-P11DT(R)

SML-P11YT(R)

SML-P11MT(R)

622 626 632

616 621 626

601 605 609

583 586 591

566 569 574

1.6 4.0

1.0 2.5

Red

1.8

100*¹

Orange

AlGaInP

-40～+85 -40～+100

7.3

4.0

Yellow

1.9

7.6

Yellowish green

1.0 2.1

*1 : Duty 1/10, 1kHz *2 : Measurment tolerance :±1nm

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[Data Sheet]

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■Electrical Characteristics Curves

Reference

Fig.1 Forward Current

- Forward Voltages

Fig.2 Luminous Intensity -

ꢀꢀꢀꢀꢀAtmosphere Temperature

1.6

100

Ta=25ºC

SML-P11VT

SML-P11UT

SML-P11DT

SML-P11YT

SML-P11MT

I_F=20mA

1.4

1.2

0.8

0.6

0.4

SML-P11VT

SML-P11UT

SML-P11DT

SML-P11YT

SML-P11MT

0.1

-40 -30 -20 -10

10 20 30 40 50 60 70 80 90 100

1.2

1.4

1.6

1.8

2.2

2.4

2.6

2.8

FORWARD VOLTAGE : V_F[V]

ATMOSPHERE TEMPERATURE : Ta [ºC]

Fig.4 Derating

Fig.3 Luminous Intensity - Forward Current

SML-P11VT

SML-P11UT

SML-P11DT

SML-P11YT

SML-P11MT

Ta=25ºC

SML-P11VT

SML-P11UT

SML-P11DT

SML-P11YT

SML-P11MT

-40

-20

100

FORWARD CURRENT : I_F[mA]

AMBIENT TEMPERATURE : Ta [ºC]

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■Viewing Angle

Reference

SCANNING ANGLE (deg)

ｽｷｬﾝ方向

SCANNING ANGLE (deg)

SML-P11VT

- Y

- Y'

ｽｷｬﾝ方向

(Scanning Direction)

SML-P11UT

SML-P11DT

SML-P11YT

SML-P11MT

(Scanning Direction)

100

RELATIVE INTENSITY (%)

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■Rank Reference of Brightness*

*Measurement tolerance :±10%

Red(V,U)

Rank

(Ta=25ºC, I_F＝1mA)

0.4〜 0.63

0.63 〜 1.0

0.063 〜 0.1 0.1 〜 0.16 0.16 〜 0.25 0.25 〜 0.4

1.0 〜 1.6 1.6 〜 2.5 2.5 〜 4.0 4.0 〜 6.3 6.3 〜 10 10 〜 16 16 〜 25 25 〜 40

Iv (mcd)

SML-P11VT

SML-P11UT

Orange(D)

Rank

Iv (mcd)

SML-P11DT

(Ta=25ºC, I_F＝1mA)

0.063 〜 0.1

0.1 〜 0.16

0.16 〜 0.25

0.25 〜 0.4

0.4〜 0.63

0.63 〜 1.0

1.0 〜 1.6 1.6 〜 2.5 2.5 〜 4.0 4.0 〜 6.3 6.3 〜 10 10 〜 16 16 〜 25 25 〜 40

Yellow(Y)

Rank

(Ta=25ºC, I_F＝1mA)

0.4〜 0.63

0.63 〜 1.0

0.063 〜 0.1 0.1 〜 0.16 0.16 〜 0.25 0.25 〜 0.4

1.0 〜 1.6 1.6 〜 2.5 2.5 〜 4.0 4.0 〜 6.3

6.3 〜 10 10 〜 16 16 〜 25 25 〜 40

Iv (mcd)

SML-P11YT

Yellowish Green(M)

Rank

(Ta=25ºC, I_F＝1mA)

0.4〜 0.63

0.63 〜 1.0

0.063 〜 0.1 0.1 〜 0.16 0.16 〜 0.25 0.25 〜 0.4

1.0 〜 1.6 1.6 〜 2.5 2.5 〜 4.0 4.0 〜 6.3 6.3 〜 10 10 〜 16 16 〜 25 25 〜 40

Iv (mcd)

SML-P11MT

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±0.1

■Taping(T86)

4.00

+0.1

φ1.5

2.00^±0.05

±0.05

0.70

±0.05

0.32

A部詳細

Enlarged drawing of "A"

Unit:ｍｍ

±1

11.4

Note)Tolerance is within ±0.2mm unless

otherwise specified.

Packing quantity

5,000pcs/reel

Pulling

Direction

■Part No. Construction

*"-"will be taken out for emitting color

Special Code will be applied for

Emitting color WB/B/E series.

Chromaticity rank

(for white LED）

Rank sign

WB/B/E series.

(Brightness Rank)*

－

Series name

Package Type

Chip type Emitting Color

Resin Color

Taping Specification

Special Control Symbol

SML

Standard Type

Chip LED

1.0x0.6 t=0.2mm

1.6x0.8 t=0.36mm

1.6x0.8 t=0.55mm

Red

T86 Cathode at sprocket hole side(the top)

Transparent Colorless

Milky White

Black

Low Current Type

High Brightness type

Red

Orange

Yellow

2.0x1.25 t=0.8mm

3.0x2.0 t=1.3mm

Ultra High Brightness type

^Z1/ZN3.5x2.8 t=1.9mm

1.6x1.15 t=0.55mm

3.4x1.25 t=1.1mm

4.5x2.0 t=0.6mm

3.2x1.6 t=1.85mm

1.0x1.0 t=0.2mm

1.3x1.5 t=0.6mm

1.0x1.0 t=0.2mm

1.5x1.0 t=0.2mm

3.5x2.8 t=0.6mm

81/82

M2 Yellowish green

P34

P36

Yellowish green

Green

*Concerning the Brightness rank.

*Please refer to the rank chart above for

luminous intensity classification.

*Part name is individual for each rank.

*When shipped as sample,the part name will

be a representative part name.

General products are free of ranks.

Please contact sales if rank appointment

is needed.

Green

Blue

White

Phototransistors

RGB Red/Green/Blue

SCM

Chip LED

3.0x1.5 t=2.2mm

■Packing Speciﬁcation

Complying with IPC/JEDEC J-STD-033.

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■Precaution (Surface Mount Device)

１．Storage

If the product is heated during the reflow under the condition of hygroscopic state,

it may vaporize and expand which will influence the performance of the product.

Therefore, the package is waterproof. Please use the product following the conditions:

・Using Conditions

Temperature

Classification

Humidity

Expiration Date

Within 1 year

Remark

①Before using 5〜30℃

30〜70%RH

Storage with waterproof package

from Receiving

②After opening

Please storing in the airtight container

with our desiccant (silica gel)

5〜30℃ Below 70%RH

Within 168h

package

・Baking

Bake the product in case of below:

①The expiration date is passed.

②The color of 5% and 10% on humidity indicator card is not green.

(Even if the product is before expiration date.)

・Baking Conditions

Temperature

60±3℃

Time

12〜24h

Humidity

Below 20%RH

・Bake products in reel.

・Reel and embossed tape are easy to be deformed when baking,

so please try not to apply stress on it.

Remark

・Recommend bake once.

２．Application Methods

２－１．Precaution for Drive System and Oﬀ Mode

Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that

applies on the products. If drive by constant voltage, it may cause current deviation of the LED and

result in deviation of luminous intensity, so we recommend to drive by constant current.

(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,

please do not apply voltage neither forward nor reverse. Especially, for the products with the

Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result

in function failure.

２－２．About Derating

ꢀIt is considered that derating characteristics will not result in LED chip's electrical destruction.

Even within the derating, the reliability and luminous life can be affected depending on operating

conditions and ambient environment. So we would be appreciate it if you can confirm with your

application again.

２－３．About product life

Depending on operating conditions and environment(applied current, ambient temperature and

humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even

within the specification conditions.

Please contact our sales office if you use it for the following applications.

①It requires long luminosity life

②It is always lit

２－４．Applied Stress on Product

No resin hardening agent such as filler is used in the sealing resin of the product.

Therefore, please pay attention to the overstress on it which may influence its reliability.

２－５．Usage

The Product is LED. We are not responsible for the usage as the diode such as Protection Chip,

Rectifier, Switching and so on.

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３．Others

３－１．Surrounding Gas

Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or

alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of

the plating surface ) or optical characteristics changes (light intensity, chrominance) and change

in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of

the products.

Therefore, please pay attention to the storage environment for mounted product (concern the

generated gas of the surrounding parts of the products and the atmospheric environment).

３－２．Electrostatic Damage

The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged

by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from

human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance

value of electrostatic discharge and it is recommended to introduce the ESD protection circuit.

The resistance values of electrostatic discharge (actual values) vary with products, therefore,

please call our Sales staffs for inquiries.

３－３． Electromagnetic Wave

Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED,

therefore please evaluate before using it.

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４．Mounting

４－１. Soldering

・No resin hardening agent such as ﬁller is used in the sealing resin of the product. Therefore, resin

expansion and moisture absorption at humidity will cause heat stress during soldering process and

finally has bad influence on the product’s reliability.

・The product is not guaranteed for ﬂow soldering.

・Do not expose the product in the environment of high temperature (over 100℃) or rapid temperature

shift (within 3℃/sec. of temperature gradient) during the flow soldering of surrounding parts.

In case of carrying out flow soldering of surrounding parts without recommended conditions, please

・Please set appropriate reﬂow temperature based on our product usage conditions and speciﬁcation.

・The max for reﬂowing is 2 times, please ﬁnish the second reﬂow soldering and ﬂow soldering

with other parts within the usage limitation after open the moistureproof package.

・Compare with N2 reﬂow, during air reﬂow, because of the heat and surrounding conditions,

it may cause the discoloration of the resin.

・For our product that has no solder resist, because of its solder amount and soldering conditions,

ꢀone of its speciﬁc characteristics is that solder will penetrate into LED. Thus, there's high possibility

that will influence its reliability.Therefore, please be informed, concerning it before using it.

４－２. Automatic Mounting

４-２-１. Suction nozzle

Excessive load may cause damage inside the LED product, so select an optimal suction nozzle

according to the material and shape of the LED product.

４-２-２. Mini Package (Smaller than 1608 size)

・Vibration may result in low mounting rate since it will cause the static electricity of product and

adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of

the mounter to control the product stabilization. In addition, it is recommended to set ionizer

to prevent electrostatic charge.

４－３. Mounting Location

The stress like bending stress of circuit board dividing after mounting, may cause LED package crack

or damage of LED internal junction, therefore, please concern the mounting direction and position

to avoid bending or screwing with great stress of the circuit board.

Stress strength according to

he mounting position:

A＞B＞C＞D

0.6mm

４―４. Mechanical Stress after Mounting

The mechanical stress may damage the LED after Circuit Mounting,

0.5mm

so please pay attention to the touch on product.

４－５．Soldering Pattern for Recommendation

0.4mm

We recommend the soldering pattern that shows on the right.

It will be different according to mounting situation of circuit board,

0.5mm

therefore, please concern before designing.

PCB Bonding Direction

※The product has adopted the electrode structure that it should solder

with back electrode of the product.

Thus, please be informed that the shape of electrode pin of

Reference

solder fillet formation is not guaranteed.

Mask open area ratio：80%

The through hole on electrode surface is for conduction of front

Mask thickness：80〜100μm

ꢀand rear electrodes but not for formation of solder ﬁllet.

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４－６．Reﬂow Proﬁle

For reﬂow proﬁle, please refer to the conditions below:(※)

■Meaning of marks, Conditions

Mark

Ts_max

Ts_min

t_s

Meanings

Conditions

180℃

Maximum of pre-heating temperature

Minimum of pre-heating temperature

Time from Tsmin to Tsmax

Reference temperature

140℃

Over 60sec.

230〜260℃

T_L

t_L

Retention time for TL Within 40sec.

T_P

Peak temperature

Time for peak temperature

Temperature rising rate

Temperature decreasing rate

260℃(Max)

Within 10sec.

Under 3℃/sec.

Over -3℃/sec.

t_P

ΔT_R/Δt

ΔT_D/Δt

※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and

reflow furnaces before using, because stress from circuit boards and temperature variations of reflow

furnaces vary by customer’s own conditions.

４－７．Attention Points in Soldering Operation

This product was developed as a surface mount LED especially suitable for reflow soldering.

So reflow soldering is recommended. In case of implementing manual soldering,

please take care of following points.

①SOLDER USED

Sn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu

②HAND SOLDERING CONDITION

LED products do not contain reinforcement material such as a glass fillers.

So thermal stress by soldering greatly influence its reliability.

Please keep following points for manual soldering.

ITEM

RECOMMENDED CONDITION

Condition ) Temp. of iron top less than

400℃ within 3 sec.

Heating on PCB pattern, not direct to the

LED. (Fig-1)

a) Heating method

SOLDERING IRON

Fig-1

Handling after

Please handle after the part temp.

goes down to room temp.

soldering

SOLDERING

LAND

４－８．Cleaning after Soldering

Please follow the conditions below if the cleaning is necessary after soldering.

Solvent

Temperature

Ultrasonic Cleaning

Drying

We recommend to use alcohols solvent such as, isopropyl alcohols

Under 30℃ within 3 minutes

15W／Below 1 liter (capacity of tank)

Under 100℃ within 3 minutes

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Notice

N o t e s

1) The information contained herein is subject to change without notice.

2) Before you use our Products, please contact our sales representative and verify the latest specifica-

tions :

3) Although ROHM is continuously working to improve product reliability and quality, semicon-

ductors can break down and malfunction due to various factors.

Therefore, in order to prevent personal injury or fire arising from failure, please take safety

measures such as complying with the derating characteristics, implementing redundant and

fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no

responsibility for any damages arising out of the use of our Poducts beyond the rating specified by

ROHM.

4) Examples of application circuits, circuit constants and any other information contained herein are

provided only to illustrate the standard usage and operations of the Products. The peripheral

conditions must be taken into account when designing circuits for mass production.

5) The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,

any license to use or exercise intellectual property or other rights held by ROHM or any other

parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of

such technical information.

6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-

cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in

this document.

7) The Products specified in this document are not designed to be radiation tolerant.

8) For use of our Products in applications requiring a high degree of reliability (as exemplified

below), please contact and consult with a ROHM representative : transportation equipment (i.e.

cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety

equipment, medical systems, servers, solar cells, and power transmission systems.

9) Do not use our Products in applications requiring extremely high reliability, such as aerospace

equipment, nuclear power control systems, and submarine repeaters.

10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with

the recommended usage conditions and specifications contained herein.

11) ROHM has used reasonable care to ensur the accuracy of the information contained in this

document. However, ROHM does not warrants that such information is error-free, and ROHM

shall have no responsibility for any damages arising from any inaccuracy or misprint of such

information.

12) Please use the Products in accordance with any applicable environmental laws and regulations,

such as the RoHS Directive. For more details, including RoHS compatibility, please contact a

ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting

non-compliance with any applicable laws or regulations.

13) When providing our Products and technologies contained in this document to other countries,

you must abide by the procedures and provisions stipulated in all applicable export laws and

regulations, including without limitation the US Export Administration Regulations and the Foreign

Exchange and Foreign Trade Act.

14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of

ROHM.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1102

SML-P11VTT86R [ROHM]

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