TLR344FVJ-E2 [ROHM]
Low Voltage Operation Ground Sense Operational Amplifier;
| 型号： | TLR344FVJ-E2 |
| 厂家： | 
ROHM |
| 描述： | Low Voltage Operation Ground Sense Operational Amplifier |
| 文件： | 总55页 (文件大小：4750K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Operational Amplifiers
Low Voltage Operation
Ground Sense Operational Amplifier
TLR341G TLR342xxx TLR344xxx
Key Specifications
Operating Supply Voltage (Single Supply):
+1.8V to +5.5V
General Description
TLR341G, TLR342xxx, and TLR344xxx series are
single, dual, and quad CMOS operational amplifier with
low supply voltage operation and full swing output.
These are suitable for battery-operated equipment. The
MOSFET input stage provides low input bias current. It
can be used for sensor applications.
Supply Current:
TLR341G
75uA (Typ)
150uA (Typ)
300uA (Typ)
105dB (Typ)
-40°C to +85°C
4mV (Max)
TLR342xxx
TLR344xxx
Voltage Gain (RL=2kΩ):
Temperature Range:
Input Offset Voltage:
Input Bias Current:
Gain Bandwidth:
Slew Rate:
TLR341G includes shutdown function.
Features
1pA (Typ)
Low Operating Supply Voltage
Output Full Swing / Input Ground Sense
High Large Signal Voltage Gain
Low Input Bias Current
Low Supply Current
2.3MHz (Typ)
1.2V/µs (Typ)
1.2µs (Typ)
Turn-on Time from Shutdown:
Low Input Offset Voltage
Packages
SSOP6
SOP8
W(Typ) x D(Typ) x H(Max)
2.90mm x 2.80mm x 1.25mm
5.00mm x 6.20mm x 1.71mm
4.90mm x 6.00mm x 1.65mm
3.00mm x 6.40mm x 1.20mm
3.00mm x 4.90mm x 1.10mm
8.70mm x 6.20mm x 1.71mm
8.65mm x 6.00mm x 1.65mm
5.00mm x 6.40mm x 1.20mm
Applications
SOP-J8
TSSOP-B8
TSSOP-B8J
SOP14
SOP-J14
Consumer Electronics
Buffer
Sensor Amplifier
Mobile Equipment
Battery-Operated Equipment
TSSOP-B14J
Pin Configuration
TLR341G
: SSOP6
Pin No.
Pin Name
1
2
3
4
5
6
+IN
VSS
-IN
+IN
VSS
-IN
1
2
3
6 VDD
+
-
5 SHDN
OUT
——————
OUT
4
SHDN
VDD
Pin
Input condition
State
Shutdown
Active
VSS
——————
SHDN
VDD
Note: Please refer to Electrical Characteristics regarding to Shutdown Voltage Range.
○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Pin Configuration – continued
TLR342F
: SOP8
TLR342FJ
: SOP-J8
TLR342FVT : TSSOP-B8
TLR342FVJ : TSSOP-B8J
Pin No.
Pin Name
1
2
3
4
5
6
7
8
OUT1
-IN1
1
2
3
4
8
7
6
5
OUT1
-IN1
VDD
OUT2
-IN2
+IN1
VSS
+IN2
-IN2
CH1
-
+
+IN1
VSS
CH2
-
+
+IN2
OUT2
VDD
TLR344F
: SOP14
TLR344FJ
: SOP-J14
TLR344FVJ : TSSOP-B14J
Pin No.
Pin Name
OUT1
-IN1
1
2
1
2
3
4
5
6
7
14
OUT1
OUT4
3
+IN1
VDD
13
12
11
10
9
-IN1
+IN1
VDD
+IN2
-IN2
-IN4
CH1
CH4
4
-
-
+
+
5
+IN2
-IN2
+IN4
VSS
+IN3
-IN3
6
7
OUT2
OUT3
-IN3
8
9
-
-
+
+
CH2
CH3
10
11
12
13
14
+IN3
VSS
8
OUT2
OUT3
+IN4
-IN4
OUT4
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Datasheet
TLR341G TLR342xxx TLR344xxx
Absolute Maximum Ratings (TA=25°C)
Rating
Parameter
Symbol
Unit
V
TLR341G
TLR342xxx
TLR344xxx
Supply Voltage
VDD-VSS
+7
0.67(Note 1,9)
-
-
SSOP6
-
-
-
-
-
-
-
0.68(Note 2,9)
0.67(Note 3,9)
0.62(Note 4,9)
0.58(Note 5,9)
-
SOP8
SOP-J8
-
-
TSSOP-B8
TSSOP-B8J
SOP14
Power Dissipation
W
PD
-
-
-
-
0.56(Note 6,9)
1.02(Note 7,9)
0.84(Note 8,9)
SOP-J14
TSSOP-B14J
Differential Input
Voltage(Note 10)
VID
VDD - VSS
V
V
Input Common-mode
Voltage Range
VICM
(VSS-0.3) to (VDD+0.3)
Input Current (Note 11)
Operating Voltage
II
±10
mA
V
Vopr
+1.8 to +5.5
Operating
Temperature
Topr
Tstg
-40 to +85
-55 to +150
+150
°C
°C
°C
Storage Temperature
Maximum Junction
Temperature
Tjmax
(Note 1) Power dissipation is reduced by 5.4mW/°C above TA=25C.
(Note 2) Power dissipation is reduced by 5.5mW/°C above TA=25C.
(Note 3) Power dissipation is reduced by 5.4mW/°C above TA=25C.
(Note 4) Power dissipation is reduced by 5.0mW/°C above TA=25C.
(Note 5) Power dissipation is reduced by 4.7mW/°C above TA=25C.
(Note 6) Power dissipation is reduced by 4.5mW/°C above TA=25C.
(Note 7) Power dissipation is reduced by 8.2mW/°C above TA=25C.
(Note 8) Power dissipation is reduced by 6.8mW/°C above TA=25C.
(Note 9) Mounted on a FR4 glass epoxy PCB (70mm×70mm×1.6mm).
(Note 10) Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs.
The input pin voltage is set to more than VSS
.
(Note 11) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Electrical Characteristics
○TLR341G (Unless otherwise specified VDD=+1.8V, VSS=0V, V——————=VDD
)
SHDN
Limits
Temperature
Parameter
Symbol
VIO
Unit
mV
μV/°C
pA
pA
μA
nA
dB
dB
V
Conditions
Range
Min
-
-
Typ
0.3
-
Max
4
4.5
25°C
Full Range
Input Offset Voltage(Note 12,13)
-
-
-
-
-
Input Offset Voltage Drift(Note 12,13) ΔVIO/ΔT
Full Range
25°C
-
-
-
1.9
1
-
Input Bias Current(Note 12)
Input Offset Current(Note 12)
Supply Current(Note 13)
IB
IIO
200
200
25°C
1
25°C
Full Range
-
-
70
-
150
200
IDD
——————
Shutdown Current
IDD_SD
CMRR
PSRR
VICM
Av
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
-
0.2
90
95
-
1000
V
=0V
SHDN
Common-mode Rejection Ratio
Power Supply Rejection Ratio
65
75
0
-
-
VICM=0V to 0.7V
VDD=1.8V to 5.0V
CMRR ≥ 60 dB
Input Common-mode
Voltage Range
0.8
70
65
110
100
-
-
-
-
RL=10kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=10kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=10kΩ, VRL=0.9V
Large Signal Voltage Gain
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current(Note 14)
Output Sink Current(Note 14)
Slew Rate
dB
V
VDD-0.05 VDD-0.03
VDD-0.02 VDD-0.01
VOH
-
-
0.022
0.014
0.055
0.02
VOL
V
ISOURCE
ISINK
SR
6
8
13
1.2
2.2
1.2
55
7
-
mA
mA
VOUT=0V, Short Current
VOUT=1.8V, Short
Current
10
-
-
-
V/μs RL=10kΩ, V+IN=0.7VP-P
MHz CL=200pF, RL=100kΩ
MHz CL=200pF, RL=100kΩ
Gain Bandwidth
GBW
fT
-
-
Unity Gain Frequency
Phase Margin
-
-
-
θM
-
deg
dB
CL=20pF, RL=100kΩ
CL=20pF, RL=100kΩ
Gain Margin
GM
-
-
-
Input Referred Noise Voltage
VN
-
33
0.012
1.8
-
nV/ Hz f=1kHz
Total Harmonic Distortion
+ Noise
f=1kHz, RL=600Ω
AV=0dB, DIN-AUDIO
THD+N
tON
-
-
%
μs
V
Turn-on Time from Shutdown
-
-
-
(Note 15)
VSHDN_H
VSHDN_L
1.5
0
1.8
0.5
Shutdown Voltage Range
25°C
(Note 16)
-
V
(Note 12) Absolute value
(Note 13) Full Range: TA=-40°C to +85°C
(Note 14) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 15) This voltage range means active condition.
(Note 16) This voltage range means shutdown condition.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Electrical Characteristics – continued
○TLR341G (Unless otherwise specified VDD=+5V, VSS=0V, V——————=VDD
)
SHDN
Limits
Typ
0.3
-
Temperature
Parameter
Symbol
VIO
Unit
mV
μV/°C
pA
Conditions
Range
Min
-
-
Max
4
4.5
25°C
Full Range
Input Offset Voltage(Note 17,18)
-
-
-
-
-
Input Offset Voltage Drift(Note 17,18) ΔVIO/ΔT
Full Range
25°C
-
-
-
1.9
1
-
Input Bias Current(Note 17)
Input Offset Current(Note 17)
Supply Current(Note 18)
IB
IIO
200
200
25°C
1
pA
25°C
Full Range
-
-
75
-
150
200
IDD
μA
——————
Shutdown Current
IDD_SD
CMRR
25°C
25°C
-
0.2
90
1000
-
nA
V
=0V
SHDN
Common-mode Rejection Ratio
Power Supply Rejection Ratio
75
dB
VICM=0V to 3.9V
PSRR
VICM
Av
25°C
25°C
25°C
75
0
95
-
-
dB
V
VDD=1.8V to 5.0V
Input Common-mode
Voltage Range
4.0
CMRR ≥70 dB
80
75
110
105
-
-
-
RL=10kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=10kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=10kΩ, VRL=2.5V
Large Signal Voltage Gain
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current(Note 19)
Output Sink Current(Note 19)
Slew Rate
dB
VDD-0.06 VDD-0.03
VDD-0.02 VDD-0.01
VOH
VOL
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
V
V
-
-
-
0.04
0.02
0.06
0.03
ISOURCE
ISINK
SR
60
80
-
100
120
1.2
2.3
1.3
55
-
-
-
-
-
-
-
-
mA
mA
VOUT=0V, Short Current
VOUT=5V, Short Current
V/μs RL=10kΩ, V+IN=2VP-P
MHz CL=200pF, RL=100kΩ
MHz CL=200pF, RL=100kΩ
Gain Bandwidth
GBW
fT
-
Unity Gain Frequency
Phase Margin
-
θM
-
deg
dB
CL=20pF, RL=100kΩ
CL=20pF, RL=100kΩ
f=1kHz
Gain Margin
GM
VN
-
7
Input Referred Noise Voltage
-
33
nV/ Hz
V+IN=1VP-P, f=1kHz
RL=600Ω,
AV=0dB, DIN-AUDIO
Total Harmonic Distortion
+ Noise
THD+N
25°C
25°C
-
0.012
-
%
-
4.5
0
1.2
-
Turn-on Time from Shutdown
Shutdown Voltage Range
tON
μs
V
-
(Note 20)
VSHDN_H
VSHDN_L
-
-
5.0
0.8
25°C
(Note 21)
V
(Note 17) Absolute value
(Note 18) Full Range: TA=-40°C to +85°C
(Note 19) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
(Note 20) This voltage range means active condition.
(Note 21) This voltage range means shutdown condition.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Electrical Characteristics – continued
○TLR342xxx (Unless otherwise specified VDD=+1.8V, VSS=0V)
Limit
Typ
Temperature
Parameter
Symbol
VIO
Unit
Conditions
Range
Min
Max
25°C
Full Range
-
-
0.3
-
4
4.5
Input Offset Voltage(Note 22,23)
mV
μV/°C
pA
-
-
-
-
-
Input Offset Voltage Drift (Note22,23) ΔVIO/ΔT
Full Range
25°C
-
-
-
1.9
1
-
Input Bias Current(Note 22)
Input Offset Current(Note 22)
Supply Current(Note 23)
IB
IIO
200
200
25°C
1
pA
25°C
Full Range
-
-
150
-
300
400
IDD
μA
Common-mode Rejection Ratio
Power Supply Rejection Ratio
CMRR
PSRR
25°C
25°C
65
75
90
95
-
-
dB
VICM=0V to 0.7V
dB
VDD=1.8V to 5.0V
Input Common-mode
Voltage Range
VICM
25°C
0
-
0.8
V
CMRR ≥ 60 dB
70
65
110
100
-
-
-
-
RL=10kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=10kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=10kΩ, VRL=0.9V
Large Signal Voltage Gain
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current(Note 24)
Output Sink Current(Note 24)
Slew Rate
Av
VOH
VOL
ISOURCE
ISINK
SR
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
dB
V
VDD-0.05 VDD-0.03
VDD-0.02 VDD-0.01
-
-
0.022
0.014
0.055
0.02
V
6
10
-
8
-
-
-
-
-
-
-
-
mA
mA
VOUT=0V, Short Current
VOUT=1.8V, Short
Current
13
1.2
2.2
1.2
55
7
V/μs RL=10kΩ, V+IN=0.7VP-P
MHz CL=200pF, RL=100kΩ
MHz CL=200pF, RL=100kΩ
Gain Bandwidth
GBW
fT
-
Unity Gain Frequency
Phase Margin
-
θM
-
deg
dB
CL=20pF, RL=100kΩ
CL=20pF, RL=100kΩ
f=1kHz
Gain Margin
GM
VN
-
Input Referred Noise Voltage
-
33
nV/ Hz
Total Harmonic Distortion
+ Noise
f=1kHz, RL=600Ω
AV=0dB, DIN-AUDIO
THD+N
CS
25°C
25°C
-
-
0.012
110
-
-
%
Channel Separation
dB
AV=40dB, VOUT=1Vrms
(Note 22) Absolute value
(Note 23) Full Range: TA=-40°C to +85°C
(Note 24) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Electrical Characteristics – continued
○TLR342xxx (Unless otherwise specified VDD=+5V, VSS=0V)
Limit
Typ
Temperature
Parameter
Symbol
VIO
Unit
Conditions
Range
Min
Max
25°C
Full Range
-
-
0.3
-
4
4.5
Input Offset Voltage(Note 25,26)
mV
μV/°C
pA
-
-
-
-
-
Input Offset Voltage Drift(Note 25,26) ΔVIO/ΔT
Full Range
25°C
-
-
-
1.9
1
-
Input Bias Current(Note 25)
Input Offset Current(Note 25)
Supply Current(Note 26)
IB
IIO
200
200
25°C
1
pA
25°C
Full Range
-
-
150
-
300
400
IDD
μA
Common-mode Rejection Ratio
Power Supply Rejection Ratio
CMRR
PSRR
25°C
25°C
75
75
90
95
-
-
dB
VICM=0V to 3.9V
dB
VDD=1.8V to 5.0V
Input Common-mode
Voltage Range
VICM
25°C
0
-
4.0
V
CMRR ≥70 dB
80
75
110
105
-
-
-
RL=10kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=10kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=10kΩ, VRL=2.5V
Av
VOH
VOL
ISOURCE
ISINK
SR
Large Signal Voltage Gain
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current(Note 27)
Output Sink Current(Note 27)
Slew Rate
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
dB
V
VDD-0.06 VDD-0.03
VDD-0.02 VDD-0.01
-
-
-
0.04
0.02
0.06
0.03
V
60
80
-
100
120
1.2
2.3
1.3
55
-
-
-
-
-
-
-
-
mA
mA
VOUT=0V, Short Current
VOUT=5V, Short Current
V/μs RL=10kΩ, V+IN=2VP-P
MHz CL=200pF, RL=100kΩ
MHz CL=200pF, RL=100kΩ
Gain Bandwidth
GBW
fT
-
Unity Gain Frequency
Phase Margin
-
θM
-
deg
dB
CL=20pF, RL=100kΩ
CL=20pF, RL=100kΩ
f=1kHz
Gain Margin
GM
VN
-
7
Input Referred Noise Voltage
-
33
nV/ Hz
V+IN=1VP-P, f=1kHz
RL=600Ω,
AV=0dB, DIN-AUDIO
Total Harmonic Distortion
+ Noise
THD+N
CS
25°C
25°C
-
-
0.012
110
-
-
%
Channel Separation
dB
AV=40dB, VOUT=1Vrms
(Note 25) Absolute value
(Note 26) Full Range: TA=-40°C to +85°C
(Note 27) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
www.rohm.com
©2014 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
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Datasheet
TLR341G TLR342xxx TLR344xxx
Electrical Characteristics – continued
○TLR344xxx (Unless otherwise specified VDD=+1.8V, VSS=0V)
Temperature
Limit
Typ
0.3
-
Parameter
Symbol
Unit
mV
μV/°C
pA
Conditions
Range
Min
Max
4
4.5
25°C
Full Range
-
-
Input Offset Voltage(Note 28,29)
VIO
-
Input Offset Voltage Drift(Note 28,29) ΔVIO/ΔT Full Range
-
-
-
1.9
1
-
-
Input Bias Current(Note 28)
Input Offset Current(Note 28)
Supply Current(Note 29)
IB
IIO
25°C
25°C
200
200
-
1
pA
-
-
25°C
Full Range
-
-
280
-
600
800
IDD
μA
Common-mode Rejection Ratio
Power Supply Rejection Ratio
CMRR
PSRR
25°C
25°C
65
75
90
95
-
-
dB
VICM=0V to 0.7V
VDD=1.8V to 5.0V
dB
Input Common-mode
Voltage Range
VICM
25°C
0
-
0.8
V
CMRR ≥ 60 dB
70
65
110
100
-
-
-
-
RL=10kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=10kΩ, VRL=0.9V
RL=2kΩ, VRL=0.9V
RL=10kΩ, VRL=0.9V
Large Signal Voltage Gain
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current(Note 30)
Output Sink Current(Note 30)
Slew Rate
Av
VOH
VOL
ISOURCE
ISINK
SR
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
dB
V
VDD-0.05 VDD-0.03
VDD-0.02 VDD-0.01
-
-
0.022
0.014
0.055
0.02
V
6
10
-
8
-
-
-
-
-
-
-
-
mA
mA
V/μs
MHz
MHz
deg
dB
VOUT=0V, Short Current
VOUT=1.8V, Short Current
RL=10kΩ, V+IN=0.7VP-P
CL=200pF, RL=100kΩ
CL=200pF, RL=100kΩ
CL=20pF, RL=100kΩ
CL=20pF, RL=100kΩ
f=1kHz
13
1.2
2.2
1.2
55
7
Gain Bandwidth
GBW
fT
-
Unity Gain Frequency
Phase Margin
-
θM
-
Gain Margin
GM
VN
-
Input Referred Noise Voltage
-
33
nV/ Hz
Total Harmonic Distortion
+ Noise
f=1kHz, RL=600Ω
AV=0dB, DIN-AUDIO
THD+N
CS
25°C
25°C
-
-
0.012
110
-
-
%
Channel Separation
dB
AV=40dB, VOUT=1Vrms
(Note 28) Absolute value
(Note 29) Full Range: TA=-40°C to +85°C
(Note 30) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Electrical Characteristics – continued
○TLR344xxx (Unless otherwise specified VDD=+5V, VSS=0V)
Temperature
Limit
Typ
0.3
-
Parameter
Symbol
Unit
mV
μV/°C
pA
Conditions
Range
Min
-
-
Max
4
4.5
25°C
Full Range
Input Offset Voltage(Note 31,32)
-
VIO
Input Offset Voltage Drift(Note 31,32) ΔVIO/ΔT Full Range
-
-
-
1.9
1
-
-
Input Bias Current(Note 31)
Input Offset Current(Note 31)
Supply Current(Note 32)
IB
IIO
25°C
25°C
200
200
-
1
pA
-
-
25°C
Full Range
-
-
300
-
600
800
IDD
μA
CMRR
PSRR
Common-mode Rejection Ratio
Power Supply Rejection Ratio
25°C
25°C
75
75
90
95
-
-
dB
VICM=0V to 3.9V
VDD=1.8V to 5.0V
dB
Input Common-mode
Voltage Range
VICM
25°C
0
-
4.0
V
CMRR ≥70 dB
80
75
110
105
-
-
-
RL=10kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=10kΩ, VRL=2.5V
RL=2kΩ, VRL=2.5V
RL=10kΩ, VRL=2.5V
Large Signal Voltage Gain
Maximum Output Voltage(High)
Maximum Output Voltage(Low)
Output Source Current(Note 33)
Output Sink Current(Note 33)
Slew Rate
Av
VOH
VOL
ISOURCE
ISINK
SR
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
dB
V
VDD-0.06 VDD-0.03
VDD-0.02 VDD-0.01
-
-
-
0.04
0.02
0.06
0.03
V
60
80
-
100
120
1.2
2.3
1.3
55
-
-
-
-
-
-
-
-
mA
mA
V/μs
MHz
MHz
deg
dB
VOUT=0V, Short Current
VOUT=5V, Short Current
RL=10kΩ, V+IN=2VP-P
CL=200pF, RL=100kΩ
CL=200pF, RL=100kΩ
CL=20pF, RL=100kΩ
CL=20pF, RL=100kΩ
f=1kHz
GBW
fT
Gain Bandwidth
-
Unity Gain Frequency
Phase Margin
-
θM
-
GM
VN
Gain Margin
-
7
Input Referred Noise Voltage
-
33
nV/ Hz
V+IN=1VP-P, f=1kHz
RL=600Ω,
AV=0dB, DIN-AUDIO
Total Harmonic Distortion
+ Noise
THD+N
CS
25°C
25°C
-
-
0.012
110
-
-
%
Channel Separation
dB
AV=40dB, VOUT=1Vrms
(Note 31) Absolute value
(Note 32) Full Range: TA=-40°C to +85°C
(Note 33) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VDD/VSS
)
Indicates the maximum voltage that can be applied between the VDD pin and VSS pin without deterioration or
destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting pins without damaging the IC.
(3) Input Common-mode Voltage Range (VICM
)
Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or
destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pins. It can be translated into the input
voltage difference required for setting the output voltage at 0V.
(2) Input Offset Voltage drift (VIO/T)
Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation.
(3) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
(4) Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
(5) Supply Current (IDD
Indicates the current that flows within the IC under specified no-load conditions.
(6) Shutdown current (IDD_SD
)
)
Indicates the current when the circuit is shutdown.
(7) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL
)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(8) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output Voltage) / (Differential Input Voltage)
(9) Input Common-mode Voltage Range (VICM
)
Indicates the input voltage range where IC normally operates.
(10) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common-mode voltage is changed. It is normally
the fluctuation of DC.
CMRR = (Change of Input Common-mode voltage)/(Input offset fluctuation)
(11) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR = (Change of power supply voltage)/(Input offset fluctuation)
(12) Output Source Current/ Output Sink Current (ISOURCE / ISINK
)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(13) Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
(14) Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
(15) Gain Bandwidth (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
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TLR341G TLR342xxx TLR344xxx
Description of Electrical Characteristics - continued
(16) Phase Margin (θM)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
(17) Gain Margin (GM)
Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay.
(18) Input Referred Noise Voltage (VN)
Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in
series with input pin.
(19) Total Harmonic Distortion + Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
(20) Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
(21)Turn On Time From Shutdown (tON
Indicates the time from applying the voltage to shutdown terminal until the IC is active.
(22)Turn On Voltage / Turn Off Voltage (VSHDN_H/ VSHDN_L
)
)
The IC is active if the shutdown terminal is applied more than Turn On Voltage (VSHDN_H).
The IC is shutdown if the shutdown terminal is applied less than Turn Off Voltage (VSHDN_L).
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Datasheet
TLR341G TLR342xxx TLR344xxx
Typical Performance Curves
○TLR341G
100
90
80
70
60
50
1.0
0.8
85°C
25°C
TLR341G
0.6
-40°C
0.4
0.2
0.0
0
25
50
75 85 100
125
150
1
2
3
4
5
6
SupplyVoltage [V]
AmbientTemperature [°C]
Figure 2. Supply Current vs Supply Voltage
Figure 1. Power Dissipation vs Ambient Temperature
(Derating Curve)
6
5
4
3
2
1
0
100
90
80
70
60
50
5.0V
85°C
25°C
1.8V
-40°C
-50
-25
0
25
50
75
100
1
2
3
4
5
6
AmbientTemperature [°C]
Supply Voltage [V]
Figure 4. Maximum Output Voltage High
Figure 3. Supply Current vs Ambient Temperature
vs Supply Voltage (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR341G
30
25
20
15
10
5
6
5
5V
4
3
2
85°C
25°C
-40°C
1.8V
1
0
0
-50
-25
0
25
50
75
100
1
2
3
4
5
6
Supply Voltage [V]
AmbientTemperature [°C]
Figure 6. Maximum Output Voltage Low
Figure 5. Maximum Output Voltage High
vs Supply Voltage (RL=2kΩ)
vs Ambient Temperature (RL=2kΩ)
25
20
15
10
5
14
12
10
8
5V
-40°C
25°C
6
85°C
1.8V
4
2
0
0
-50
-25
0
25
50
75
100
0.0
0.5
1.0
1.5
2.0
Output Voltage [V]
AmbientTemperature [°C]
Figure 7. Maximum Output Voltage (Low)
Figure 8. Output Source Current vs Output Voltage
(VDD=1.8V)
vs Ambient Temperature (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR341G
150
120
25
20
15
10
5
-40°C
5V
90
25°C
85°C
60
30
1.8V
0
-50
0
-25
0
25
50
75
100
0.0
0.5
1.0
Output Voltage [V]
1.5
2.0
AmbientTemperature [°C]
Figure 9. Output Source Current
vs Ambient Temperature (VOUT=0V)
Figure 10. Output Sink Current vs Output Voltage
(VDD=1.8V)
150
120
4
5V
3
2
1
90
60
30
0
85°C
0
-1
-2
-3
-4
-40°C
25°C
1.8V
-50
-25
0
25
50
75
100
1
2
3
4
5
6
AmbientTemperature [°C]
Supply Voltage [V]
Figure 12. Input Offset Voltage vs Supply
Voltage
Figure 11. Output Sink Current
vs Ambient Temperature (VOUT=VDD
)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR341G
4
3
2
1
4
3
2
1
5.0V
0
0
-1
-1
-2
-3
-4
1.8V
85°C
-40°C
-2
25°C
-3
-4
-50
-25
0
25
50
75
100
-2
-1
0
1
2
3
4
5
Input Voltage [V]
AmbientTemperature [°C]
Figure 13. Input Offset Voltage
vs Ambient Temperature
Figure 14. Input Offset Voltage vs Input Voltage
(VDD=5V)
120
120
110
100
90
110
100
90
85°C
1.8V
-40°C
25°C
5V
80
80
70
70
60
60
-50
-25
0
25
50
75
100
1
2
3
4
5
6
SupplyVoltage [V]
AmbientTemperature [°C]
Figure 15. Large Signal Voltage Gain
Figure 16. Large Signal Voltage Gain
vs Supply Voltage (RL=2kΩ)
vs Ambient Temperature (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR341G
120
110
100
90
120
110
5V
25°C
100
85°C
90
1.8V
-40°C
80
70
60
80
70
60
1
2
3
4
5
6
-50
-25
0
25
50
75
100
SupplyVoltage [V]
AmbientTemperature [°C]
Figure 17. Common-mode Rejection Ratio
vs Supply Voltage (VDD=1.8V)
Figure 18. Common-mode Rejection Ratio
vs Ambient Temperature
120
110
100
90
1.6
1.5
1.4
1.3
1.2
1.1
1.0
5V
80
1.8V
70
60
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
AmbientTemperature [°C]
AmbientTemperature [°C]
Figure 20. Slew Rate L-H vs Ambient Temperature
Figure 19. Power Supply Rejection Ratio
vs Ambient Temperature (VDD=1.8V to 5.0V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR341G
1.6
1.5
100
80
60
40
20
0
200
Phase
160
120
80
40
0
1.4
5V
1.3
1.8V
Gain
1.2
1.1
1.0
102
100
103
104
105
106
107
108
-50
-25
0
25
AmbientTemperature [ꢀC]
Figure 21. Slew Rate H-L vs Ambient Temperature
50
75
100
1000 10000 100000100000100000010000000000
Frequency [Hz]
Figure 22. Voltage Gain, Phase vs Frequency
(VDD=1.8V, TA=25°C)
1000
100
10
1
1000
100
10
25°C
-40°C
5V
85°C
1.8V
1
0
0.1
1
2
3
4
5
6
-50
-25
0
25
50
75
100
SupplyVoltage [V]
AmbientTemperature [°C]
Figure 23. Shutdown Current vs Supply
Figure 24. Shutdown Current vs Ambient
——————
——————
Voltage (V
=0V)
Temperature (V
=0V)
SHDN
SHDN
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR341G
4
3
4
3
2
1
0
1.8V
2
-40°C
85°C
25°C
1
0
5V
-50
-25
0
25
50
75
100
1
2
3
4
5
6
AmbientTemperature [°C]
SupplyVoltage [V]
Figure 25. Turn On Time vs Supply Voltage
Figure 26. Turn On Time vs Ambient Temperature
1
0.8
0.6
0.4
0.2
0
3
2.5
2
VSHDN_L
VSHDN_H
1.5
1
VSHDN_L
VSHDN_H
0.5
0
0
0.5
1
1.5
2
0
1
2
3
4
5
Shutdown Voltage [V]
Shutdown Voltage [V]
Figure 27. Output Voltage vs Shutdown Voltage
(VDD=1.8V, AV=0dB, V+IN=0.7V, TA=25°C)
Figure 28. Output Voltage vs Shutdown Voltage
(VDD=5V, AV=0dB, V+IN=2.5V, TA=25°C)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR342xxx
1.0
200
180
160
140
120
100
0.8
TLR342F
TLR342FJ
85°C
0.6
TLR342FVT
TLR342FVJ
25°C
0.4
-40°C
0.2
0.0
85
0
25
50
75
100
125
150
1
2
3
4
5
6
AmbientTemperature [°C]
Supply Voltage [V]
Figure 30. Supply Current vs Supply Voltage
Figure 29. Power Dissipation vs Ambient Temperature
(Derating Curve)
200
180
160
140
120
100
6
5
4
3
2
1
0
85°C
25°C
5V
-40°C
1.8V
-50
-25
0
25
50
75
100
1
2
3
4
5
6
Supply Voltage [V]
AmbientTemperature [°C]
Figure 32. Maximum Output Voltage High
Figure 31. Supply Current vs Ambient Temperature
vs Supply Voltage (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR342xxx
30
25
20
15
10
5
6
5
5V
4
3
2
85°C
-40°C
25°C
1.8V
1
0
0
1
2
3
4
5
6
-50
-25
0
25
50
75
100
SupplyVoltage [V]
AmbientTemperature [°C]
Figure 34. Maximum Output Voltage Low
Figure 33. Maximum Output Voltage High
vs Supply Voltage (RL=2kΩ)
vs Ambient Temperature (RL=2kΩ)
14
12
10
8
25
20
15
10
5
5V
-40°C
25°C
6
85°C
1.8V
4
2
0
0
0.0
0.5
1.0
1.5
2.0
-50
-25
0
25
50
75
100
AmbientTemperature [°C]
Output Voltage [V]
Figure 36. Output Source Current vs Output Voltage
(VDD=1.8V)
Figure 35. Maximum Output Voltage (Low)
vs Ambient Temperature (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR342xxx
150
25
20
15
10
5
120
-40°C
5V
90
25°C
60
85°C
30
1.8V
0
0
-50
-25
0
25
50
75
100
0.0
0.5
1.0
Output Voltage [V]
1.5
2.0
AmbientTemperature [°C]
Figure 38. Output Sink Current vs Output Voltage
(VDD=1.8V)
Figure 37. Output Source Current
vs Ambient Temperature (VOUT=0V)
150
120
90
60
30
0
4
5V
3
2
1
-40°C
0
25°C
85°C
-1
-2
-3
-4
1.8V
-50
-25
0
25
50
75
100
1
2
3
4
5
6
AmbientTemperature [°C]
SupplyVoltage [V]
Figure 40. Input Offset Voltage vs Supply Voltage
Figure 39. Output Sink Current
vs Ambient Temperature (VOUT=VDD
)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR342xxx
4
3
2
4
3
2
1
1
-40°C
1.8V
25°C
85°C
0
0
5V
-1
-1
-2
-3
-4
-2
-3
-4
-50
-25
0
25
50
75
100
-2
-1
0
1
2
3
4
5
AmbientTemperature [°C]
Input Voltage [V]
Figure 41. Input Offset Voltage
vs Ambient Temperature
Figure 42. Input Offset Voltage vs Input Voltage
(VDD=5V)
120
120
110
100
90
110
100
90
-40°C
1.8V
25°C
5V
85°C
80
80
70
70
60
60
-50
-25
0
25
50
75
100
1
2
3
4
5
6
Supply Voltage [V]
AmbientTemperature [°C]
Figure 44. Large Signal Voltage Gain
vs Ambient Temperature (RL=2kΩ)
Figure 43. Large Signal Voltage Gain
vs Supply Voltage (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR342xxx
120
110
100
90
120
110
25°C
5V
100
1.8V
85°C
90
-40°C
80
80
70
60
70
60
-50
-25
0
25
50
75
100
1
2
3
4
5
6
AmbientTemperature [°C]
SupplyVoltage [V]
Figure 46. Common-mode Rejection Ratio
vs Ambient Temperature
Figure 45. Common-mode Rejection Ratio
vs Supply Voltage (VDD=1.8V)
120
110
100
90
1.6
1.5
1.4
1.3
1.2
1.1
1.0
5V
80
1.8V
70
60
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
AmbientTemperature [°C]
AmbientTemperature [°C]
Figure 48. Slew Rate L-H vs Ambient Temperature
Figure 47. Power Supply Rejection Ratio
vs Ambient Temperature (VDD=1.8V to 5.0V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR342xxx
1.6
1.5
100
80
60
40
20
0
200
Phase
160
120
80
40
0
5V
1.4
1.8V
1.3
Gain
1.2
1.1
1.0
1
10
02
0
1010030 10
10
0040 10
10 10 10
005001001006001000 007010000 0080000
-50
-25
0
25
AmbientTemperature [ꢀC]
Figure 49. Slew Rate H-L vs Ambient Temperature
50
75
100
Frequency [Hz]
Figure 50. Voltage Gain, Phase vs Frequency
(VDD=1.8V, TA=25°C)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR344xxx
400
340
280
220
160
100
1.2
1.0
TLR344FVJ
85°C
25°C
0.8
TLR344FJ
0.6
0.4
-40°C
TLR344F
0.2
0.0
85
0
25
50
75
100
125
150
1
2
3
4
5
6
AmbientTemperature [°C]
Supply Voltage [V]
Figure 52. Supply Current vs Supply Voltage
Figure 51. Power Dissipation vs Ambient Temperature
(Derating Curve)
6
5
4
3
2
1
0
400
340
280
220
160
100
85°C
1.8V
25°C
5V
-40°C
-50
-25
0
25
50
75
100
1
2
3
4
5
6
Supply Voltage [V]
AmbientTemperature [°C]
Figure 54. Maximum Output Voltage High
Figure 53. Supply Current vs Ambient Temperature
vs Supply Voltage (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR344xxx
30
25
20
15
10
5
6
5
5V
4
3
2
85°C
-40°C
25°C
1.8V
1
0
0
1
2
3
4
5
6
-50
-25
0
25
50
75
100
AmbientTemperature [°C]
Supply Voltage [V]
Figure 56. Maximum Output Voltage Low
Figure 55. Maximum Output Voltage High
vs Supply Voltage (RL=2kΩ)
vs Ambient Temperature (RL=2kΩ)
14
12
10
8
25
20
15
10
5
5V
-40°C
25°C
6
85°C
4
1.8V
2
0
0
-50
-25
0
25
50
75
100
0.0
0.5
1.0
1.5
2.0
AmbientTemperature [°C]
Output Voltage [V]
Figure 58. Output Source Current
vs Output Voltage (VDD=1.8V)
Figure 57. Maximum Output Voltage (Low)
vs Ambient Temperature (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves – continued
○TLR344xxx
25
20
15
10
5
150
120
-40°C
5V
90
25°C
85°C
60
30
1.8V
0
0
0.0
0.5
1.0
Output Voltage [V]
1.5
2.0
-50
-25
0
25
50
75
100
AmbientTemperature [°C]
Figure 59. Output Source Current
vs Ambient Temperature (VOUT=0V)
Figure 60. Output Sink Current
vs Output Voltage (VDD=1.8V)
150
120
90
60
30
0
4
3
2
5V
1
25°C
85°C
0
-1
-2
-3
-4
-40°C
1.8V
-50
-25
0
25
50
75
100
1
2
3
4
5
6
Supply Voltage [V]
AmbientTemperature [°C]
Figure 62. Input Offset Voltage vs Supply Voltage
Figure 61. Output Sink Current
vs Ambient Temperature (VOUT=VDD
)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR344xxx
4
3
2
4
3
2
1
1
85°C
25°C
1.8V
0
0
5.0V
-1
-1
-2
-3
-4
-40°C
-2
-3
-4
-50
-25
0
25
50
75
100
-2.0 -1.0
0.0
1.0
2.0
3.0
4.0
5.0
AmbientTemperature [°C]
Input Voltage [V]
Figure 64.Input Offset Voltage vs Input Voltage
(VDD=5V)
Figure 63. Input Offset Voltage vs Ambient Temperature
120
120
110
100
90
110
100
90
1.8V
-40°C
25°C
5V
85°C
80
80
70
70
60
60
-50
-25
0
25
50
75
100
1
2
3
4
5
6
AmbientTemperature [°C]
SupplyVoltage [V]
Figure 66. Large Signal Voltage Gain
vs Ambient Temperature (RL=2kΩ)
Figure 65. Large Signal Voltage Gain
vs Supply Voltage (RL=2kΩ)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR344xxx
120
110
100
90
120
110
-40°C
100
5V
25°C
1.8V
90
85°C
80
70
60
80
70
60
-50
-25
0
25
50
75
100
1
2
3
4
5
6
SupplyVoltage [V]
AmbientTemperature [°C]
Figure 67. Common-mode Rejection Ratio
vs Supply Voltage
Figure 68. Common-mode Rejection Ratio
vs Ambient Temperature
120
110
100
90
1.6
1.5
1.4
1.3
1.2
1.1
1.0
5V
80
1.8V
70
60
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
AmbientTemperature [°C]
AmbientTemperature [°C]
Figure 70. Slew Rate L-H vs Ambient Temperature
Figure 69. Power Supply Rejection Ratio
vs Ambient Temperature (VDD=1.8V to 5.0V)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Typical Performance Curves – continued
○TLR344xxx
100
1000
10000
100000
1000000 10000000 100000000
100
80
60
40
20
0
200
1.6
1.5
Phase
160
120
80
40
0
1.4
1.8V
1.3
5V
Gain
1.2
1.1
1.0
2
3
4
5
6
7
8
-50
-25
0
25
50
75
100
100 1,000 10,000 100,0001,000,0100,000,1000,000,000
10
10
10
10
10
10
10
AmbientTemperature [°C]
Frequency[Hz]
Figure 71. Slew Rate H-L vs Ambient Temperature
Figure 72. Voltage Gain, Phase vs Frequency
(VDD=1.8V, TA=25°C)
(*)The data above is measurement value of typical sample, it is not guaranteed.
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TLR341G TLR342xxx TLR344xxx
Application Information
NULL method condition for Test Circuit 1
VDD, VSS, EK, VICM Unit:V
Parameter
VF
SW1 SW2 SW3
VDD
5
VSS
0
EK
VICM Calculation
Input Offset Voltage
VF1
VF2
VF3
VF4
VF5
ON
ON
OFF
-2.5
-0.5
-3.5
2.5
1
Large Signal Voltage Gain
ON
ON
ON
5
5
0
2.5
2
0
3
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
ON
ON
ON
ON
OFF
OFF
0
0
-2.5
-0.9
3
4
VF6
VF7
1.8
5
Power Supply Rejection Ratio
0.5
－ Calculation－
|VF1|
1 + RF/RS
VIO
=
[V]
1. Input Offset Voltage (VIO)
EK × (1+RF/RS)
2. Large Signal Voltage Gain (AV)
[dB]
Av = 20Log
|VF2 - VF3|
VICM × (1+RF/RS)
[dB]
[dB]
CMRR = 20Log
3. Common-mode Rejection Ratio (CMRR)
4. Power Supply Rejection Ratio (PSRR)
|VF4 - VF5|
VDD × (1+ RF/RS)
PSRR = 20Log
|VF6 - VF7|
0.1μF
RF=50kΩ
500kΩ
SW1
VDD
0.01μF
15V
EK
RS=50Ω
RI=1MΩ
Vo
500kΩ
0.1μF
DUT
0.1μF
SW3
NULL
-15V
1000pF
RI=1MΩ
RS=50Ω
RL
VRL
VICM
V
VF
50kΩ
SW2
VSS
Figure 73. Test Circuit 1
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TLR341G TLR342xxx TLR344xxx
Application Information – continued
Switch Condition for Test Circuit 2
SW No.
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
Supply Current
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
OFF ON OFF OFF ON OFF OFF ON OFF OFF ON OFF
OFF ON OFF OFF ON OFF OFF OFF OFF ON OFF OFF
OFF OFF ON OFF OFF OFF ON ON OFF OFF OFF ON
ON OFF OFF ON ON OFF OFF OFF ON OFF OFF ON
OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=10kΩ
Output Current
Slew Rate
Unity Gain Frequency
Turn On Time
SW3
R2=100kΩ
SW4
●
VDD
－
＋
SW1
SW2
SW8
SW9
SW5
SW10 SW11 SW12
SW7
SW6
R1=1kΩ
VSS
RL
CL
V+IN
V-IN
VOUT
VRL
Figure 74. Test Circuit 2 (Each Op-Amp)
Output Voltage
Input Voltage
SR=V/t
VH
90%
VH
V
10%
VL
VL
t
t
t
Input Wave
Output Wave
Figure 75. Slew Rate Input and Output Wave
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TLR341G TLR342xxx TLR344xxx
Application Information – continued
——————
S H D N Voltage
VDD
VSS
t
Input Wave
Output Voltage
VOUT
50% of VOUT
tON
VSS
t
Output Wave
Figure 76. Turn On Time Input and Output Wave
VDD
VDD
R1//R2
R1//R2
VSS
VSS
R1
R2
VOUT1
1Vrms
R1
R2
V
VOUT2
V
VIN
=
100 × VOUT1
VOUT2
=
CS 20× log
Figure 77. Test Circuit 3 (Channel Separation)
(R1=1kΩ, R2=100kΩ)
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TLR341G TLR342xxx TLR344xxx
Application Information – continued
VDD
1. Unused Circuits
When there are unused op-amps, it is recommended that they are
connected as in Figure 78, setting the non-inverting input pin to a
potential within the in-phase input voltage range (VICM).
Keep this potential
VICM
in VICM
2. Input Voltage
Applying VDD+0.3V to the input pin is possible without causing
deterioration of the electrical characteristics or destruction. However, this
does not ensure normal circuit operation. Please note that the circuit
operates normally only when the input voltage is within the common
mode input voltage range of the electric characteristics.
VSS
Figure 78. Example of Application Circuit
for Unused Op-amp
3. Power Supply(single/dual)
The operational amplifiers operate when the voltage supplied is between VDD and VSS. Therefore, the single supply
operational amplifiers can be used as dual supply operational amplifiers as well.
4. Output Capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1µF between output pin and VSS pin.
5. Oscillation by Output Capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
6. Latch Up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
7. Shutdown Terminal
The shutdown terminal can’t be left unconnected. In case shutdown operation is not needed, the shutdown pin should be
connected to VDD when the IC is used. Leaving the shutdown pin floating will result in an undefined operation mode,
either shutdown or active, or even oscillating between the two modes.
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Datasheet
TLR341G TLR342xxx TLR344xxx
I/O Equivalent Circuit
Pin No.
Symbol
Equivalent Circuit
TLR341G
TLR342xxx
TLR344xxx
+IN
-IN
2,3,5,6,
9,10,12,13
1,3
2,3,5,6
OUT
4
6
5
1,7
1,7,8,14
VDD
8
4
——————
-
-
SHDN
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TLR341G TLR342xxx TLR344xxx
Application Example
○Voltage Follower
Voltage gain is 0dB.
VDD
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VOUT
VIN
VOUT=VIN
VSS
Figure 79. Voltage Follower Circuit
○Inverting Amplifier
R2
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
VDD
R1
VIN
VOUT
VOUT=-(R2/R1)・VIN
This circuit has input impedance equal to R1.
VSS
Figure 80. Inverting Amplifier Circuit
○Non-inverting Amplifier
R1
R2
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (VOUT) is in-phase with
the input voltage (VIN) and is shown in the next
expression.
VDD
VOUT
VOUT=(1 + R2/R1)・VIN
VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VSS
Figure 81. Non-inverting Amplifier Circuit
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature
that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal
resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 82(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (Tjmax), and power dissipation
(PD).
θJA = (Tjmax－TA) / PD
°C/W
The derating curve in Figure 82(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance
(θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity,
etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition. Figure 82 (c), (d), and (e) shows an example of the derating curve for TLR341G,
TLR342xxx, and TLR344xxx, respectively.
θJA=(Tjmax-TA)/ PD °C/W
Power Dissipation of LSI [W]
PDmax
Ambient Temperature TA [ °C ]
P2
P1
θJA2 < θJA1
θJA2
Tjmax
θJA1
75
150
0
25
50
100
125
Chip Surface Temperature TJ [ °C ]
Ambient Temperature TA [ °C ]
(a) Thermal Resistance
(b) Derating Curve
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
TLR342F(Note 35)
TLR342FJ(Note 36)
TLR341G (Note 34)
TLR342FVT(Note 37)
TLR342FVJ(Note 38)
85
0
25
50
75 85 100
125
150
0
25
50
75
100
125
150
AmbientTemperature [°C]
(c) TLR341G
AmbientTemperature [°C]
(d) TLR342xxx
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Datasheet
TLR341G TLR342xxx TLR344xxx
1.2
1.0
0.8
0.6
0.4
TLR344FVJ(Note 41)
TLR344FJ(Note 40)
TLR344F(Note 39)
0.2
0.0
0
25
50
75 85 100
125
150
AmbientTemperature [°C]
(e) TLR344xxx
(Note 34)
5.4
(Note 35)
5.5
(Note 36)
5.4
(Note 37)
5.0
(Note 38)
4.7
(Note 39)
4.5
(Note 40)
8.2
(Note 41)
6.8
Unit
mW/°C
When using the unit above TA =25°C, subtract the value above per Celsius degree.
Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.
Figure 82.Thermal Resistance and Derating Curve
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Datasheet
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on
the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the PD rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower
than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information
Package Name
SSOP6
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP-J8
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
TSSOP-B8
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
TSSOP-B8J
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
SOP-J14
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Datasheet
TLR341G TLR342xxx TLR344xxx
Physical Dimension, Tape and Reel Information – continued
Package Name
TSSOP-B14J
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Datasheet
TLR341G TLR342xxx TLR344xxx
Ordering Information
T
L
R
3
4
x
x
x
x
-
x
x
Part Number
TLR341G
TLR342F
Package
Packaging and forming specification
TR: Embossed tape and reel
(SSOP6)
G
F
: SSOP6
: SOP8
TLR342FJ
: SOP14
FJ : SOP-J8
: SOP-J14
FVT : TSSOP-B8
FVJ : TSSOP-B8J
: TSSOP-B14J
E2: Embossed tape and reel
(SOP8, SOP-J8, TSSOP-B8,
TSSOP-B8J, SOP14, SOP-J14,
TSSOP-B14J)
TLR342FVT
TLR342FVJ
TLR344F
TLR344FJ
TLR344FVJ
Line-up
Topr
Channels
Package
Orderable Part Number
TLR341G-TR
1ch
SSOP6
Reel of 3000
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
Reel of 2500
SOP8
TLR342F-E2
SOP-J8
TLR342FJ-E2
TLR342FVT-E2
TLR342FVJ-E2
TLR344F-E2
2ch
4ch
TSSOP-B8
TSSOP-B8J
SOP14
-40°C to +85°C
SOP-J14
TSSOP-B14J
TLR344FJ-E2
TLR344FVJ-E2
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Datasheet
TLR341G TLR342xxx TLR344xxx
Marking Diagram
SSOP6(TOP VIEW)
Part Number Marking
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
LOT Number
SOP-J8(TOP VIEW)
TSSOP-B8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
TSSOP-B8J(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
LOT Number
1PIN MARK
1PIN MARK
SOP-J14(TOP VIEW)
TSSOP-B14J (TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
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Datasheet
TLR341G TLR342xxx TLR344xxx
Marking Diagram – continued
Product Name
TLR341
Package Type
Marking
G
F
SSOP6
SOP8
BC
T342
FJ
SOP-J8
T342
TLR342
TLR344
FVT
FVJ
F
TSSOP-B8
TSSOP-B8J
SOP14
T342
T342
TLR344F
TLR344FJ
T344
FJ
SOP-J14
TSSOP-B14J
FVJ
Land Pattern Data
SSOP6
SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J, SOP14, SOP-J14, TSSOP-B14J
0.95
0.95
MIE
0.6
ℓ2
All dimensions in mm
Land length
Land pitch
Land space
MIE
Land width
b2
Package
e
≧ℓ2
SSOP6
0.95
2.4
4.60
3.9
1.0
0.6
SOP8
SOP14
1.27
1.27
1.10
1.35
0.76
0.76
SOP-J8
SOP-J14
TSSOP-B8
TSSOP-B14J
0.65
0.65
4.60
3.20
1.20
1.15
0.35
0.35
TSSOP-B8J
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Datasheet
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Revision History
Date
Revision
001
Changes
29.Aug.2014
19.Mar.2015
14.Oct.2015
03.Feb.2016
New Release
002
Add TLR342FJ, TLR342FVT, TLR342FVJ, TLR344F
Add TLR344FJ and TLR344FVJ
Add TLR341G
003
004
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
TLR341G - Web Page
Part Number
Package
Unit Quantity
TLR341G
SSOP6
3000
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
3000
Taping
inquiry
Yes
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