TLR377HFV-LB (新产品) [ROHM]
该产品是能够保证向工业设备市场长期供应的产品，而且是非常适用于这些应用领域的产品。TLR377HFV-LB是一款输入/输出轨到轨高精度单电路CMOS运算放大器。该产品具有低输入失调电压、低噪声和低输入偏置电流等特点，适用于电池供电的设备和传感器放大器应用。;
| 型号： | TLR377HFV-LB (新产品) |
| 厂家： | 
ROHM |
| 描述： | 该产品是能够保证向工业设备市场长期供应的产品，而且是非常适用于这些应用领域的产品。TLR377HFV-LB是一款输入/输出轨到轨高精度单电路CMOS运算放大器。该产品具有低输入失调电压、低噪声和低输入偏置电流等特点，适用于电池供电的设备和传感器放大器应用。 电池 放大器 运算放大器 传感器 |
| 文件： | 总20页 (文件大小：1062K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Low Input Offset Voltage and Low Noise
High Precision and Input/Output Rail-to-Rail
CMOS Operational Amplifier
TLR377HFV-LB
General Description
Key Specifications
◼ Input Offset Voltage:
◼ Input-referred Noise Voltage Density
f = 10 Hz:
This is the product guarantees long time support in
Industrial market. And it is suitable for usage of industrial
applications.
TLR377HFV-LB is a high precision and Input/Output Rail-
to-Rail single CMOS operational amplifier features low
input offset voltage, low noise and low input bias current.
It is suitable for equipment operating from battery power
and using sensors that an amplifier.
1.7 μV (Typ)
27 nV/√Hz (Typ)
12 nV/√Hz (Typ)
f = 1 kHz:
◼ Common-mode Input Voltage Range:
VSS to VDD
0.5 pA (Typ)
◼ Input Bias Current:
◼ Operating Supply Voltage Range
Single Supply:
2.5 V to 5.5 V
Dual Supply:
◼ Operating Temperature Range:
±1.25 V to ±2.75 V
-40 °C to +125 °C
Features
◼ Long Time Support Product for Industrial Applications
◼ Low Input Offset Voltage
◼ Low Noise
Package
HVSOF5
W (Typ) x D (Typ) x H (Max)
1.6 mm x 1.6 mm x 0.6 mm
◼ Input/Output Rail-to-Rail
Applications
◼ Industrial Equipment
◼ Battery-powered Equipment
◼ Current Monitoring Amplifier
◼ ADC Front Ends, Buffer Amplifier
◼ Photodiode Amplifiers
◼ Sensor Amplifiers
Typical Application Circuit
RF = 10 kΩ
VDD = +2.5 V
RIN = 100 Ω
푅퐹
푉푂푈푇 = −
푉
퐼푁
VIN
VOUT
푅퐼푁
VSS = -2.5 V
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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TLR377HFV-LB
Pin Configuration
1
5
4
VDD
OUT
+IN
VSS
-IN
+
-
2
3
(TOP VIEW)
Pin Description
Pin No.
Pin Name
+IN
Function
1
2
3
4
5
Non-inverting input
VSS
Negative power supply / Ground
Inverting input
-IN
OUT
VDD
Output
Positive power supply
Block Diagram
1
2
VDD
OUT
5
4
+IN
Iref
+
VSS
AMP
-
3
-IN
Description of Blocks
1. AMP:
This block is a full-swing output operational amplifier with class-AB output circuit and high-precision-Rail-to-Rail
differential input stage.
2. Iref:
This block supplies reference current which is needed to operate AMP block.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage (VDD - VSS
)
VS
VI
7.0
(VSS - 0.3) to (VDD + 0.3)
±10
V
V
Input Pin Voltage (+IN, -IN)
Input Pin Current (+IN, -IN)
Maximum Junction Temperature
Storage Temperature Range
II
mA
°C
°C
Tjmax
Tstg
150
- 55 to + 150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operate over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance(Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
HVSOF5
Junction to Ambient
Junction to Top Characterization Parameter(Note 2)
θJA
358.2
39
85.3
21
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
Recommended Operating Conditions
Parameter
Symbol
Min
2.5
Typ
5.0
Max
5.5
Unit
Single Supply
Dual Supply
Supply Voltage (VDD - VSS
)
VS
V
±1.25
-40
±2.50
+25
±2.75
+125
Operating Temperature
Topr
°C
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Electrical Characteristics
(Unless otherwise specified VS = 5 V, VSS = 0 V, VICM = 2.5 V, RL = 10 kΩ to VICM, Ta = 25 °C)
Limit
Parameter
Symbol
VIO
Unit
μV
Conditions
Min
Typ
1.7
-
Max
1400
1500
-
-
No load, Absolute value
Input Offset Voltage
No load, Absolute value,
Ta = -40 °C to +125 °C
Input Offset Voltage
Temperature Drift
Absolute value, No load,
Ta = -40 °C to +125 °C
ΔVIO/ΔT
-
0.1
4.0
μV/°C
Input Offset Current
Input Bias Current
IIO
IB
-
0
0.5
-
-
pA
pA
V
Absolute value
Absolute value
VSS to VDD
-
0
-
Common-mode Input Voltage
Range
VICMR
5
-
585
-
900
No load , G = 0 dB
Supply Current
IDD
μA
No load, G = 0 dB,
Ta = -40 °C to +125 °C
-
950
-
25
-
75
IL = 1 mA, VOH = VDD - VOUT
IL = 1 mA, VOH = VDD - VOUT
Ta = -40 °C to +125 °C
,
Output Voltage High
VOH
-
100
mV
-
250
15
-
500
IL = 10 mA
IL = 1 mA
-
50
IL = 1 mA,
Ta = -40 °C to +125 °C
Output Voltage Low
VOL
-
60
mV
-
100
50
50
137
-
250
IL = 10 mA
Output Source Current (Note 1)
Output Sink Current (Note 1)
IOH
IOL
25
25
110
90
-
-
-
-
-
-
-
-
-
-
-
-
mA
mA
VOUT = VSS, Absolute value
VOUT = VDD, Absolute value
-
Large Signal Voltage Gain
AV
dB
Ta = -40 °C to +125 °C
Gain Bandwidth Product
Phase Margin
GBW
θ
4
MHz
deg
dB
G = 40 dB, CL = 25 pF
-
65
100
95
2
G = 40 dB, CL = 25 pF
Common-mode Rejection
Ratio
CMRR
PSRR
SR
77
75
-
-
Power Supply Rejection Ratio
dB
-
Slew Rate
V/μs
CL = 25 pF
f = 10 Hz
f = 1 kHz
-
27
12
Input-referred Noise Voltage
Density
Vn
nV/√Hz
-
Total Harmonic Distortion +
Noise
THD+N
-
0.001
-
%
VOUT = 4 Vp-p, f = 1 kHz
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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Typical Performance Curves
VSS = 0 V
900
800
700
600
500
400
300
200
100
900
800
700
Ta = +25 °C
VS = 5.5 V
VS = 5.0 V
VS = 2.5 V
600
500
400
300
200
100
Ta = +125 °C
Ta = -40 °C
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
50
45
40
35
30
25
20
15
10
5
50
45
40
35
30
25
20
15
10
5
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
0
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 3. Output Voltage High vs Supply Voltage
(IL = 1 mA)
Figure 4. Output Voltage High vs Ambient Temperature
(VS = 5 V, IL = 1 mA)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
30
25
20
15
10
5
30
25
Ta = +125 °C
20
Ta = +25 °C
15
Ta = -40 °C
10
5
0
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 5. Output Voltage Low vs Supply Voltage
(IL = 1 mA)
Figure 6. Output Voltage Low vs Ambient Temperature
(VS = 5 V, IL = 1 mA)
80
80
70
70
Ta = -40 °C
Ta = -40 °C
60
50
60
50
Ta = +25 °C
Ta = +25 °C
40
40
Ta = +125 °C
30
30
Ta = +125 °C
20
10
0
20
10
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Output Voltage: VOUT [V]
Output Voltage: VOUT [V]
Figure 7. Output Source Current vs Output Voltage
(VS = 5 V)
Figure 8. Output Sink Current vs Output Voltage
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
500
400
300
200
100
0
500
400
300
200
VS = 5.5 V
Ta = +125 °C
VS = 5.0 V
100
0
-100
-200
-300
-400
-500
-100
-200
-300
-400
-500
Ta = +25 °C
Ta = -40 °C
VS = 2.5 V
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Supply Voltage: VS [V]
Ambient Temperature: Ta [°C]
Figure 9. Input Offset Voltage vs Supply Voltage
Figure 10. Input Offset Voltage vs Ambient Temperature
500
400
300
160
150
Ta = -40 °C
140
130
200
Ta = +125 °C
100
0
Ta = +25 °C
Ta = +125 °C
120
110
100
90
-100
Ta = +25 °C
Ta = -40 °C
-200
-300
-400
-500
80
2
3
4
5
6
-1
0
1
2
3
4
5
6
Supply Voltage: VS [V]
Input Common Mode Voltage: VICM [V]
Figure 11. Input Offset Voltage vs Input Common-mode
Figure 12. Large Signal Voltage Gain vs Supply Voltage
(RL = 10 kΩ)
Voltage
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
160
150
160
140
120
100
80
VS = 5.5 V
VS = 5.0 V
Ta = +25 °C
140
130
120
110
100
90
Ta = -40 °C
VS = 2.5 V
Ta = +125 °C
60
40
20
80
0
-50 -25
0
25
50
75 100 125 150
2
3
4
5
6
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 13. Large Signal Voltage Gain vs Ambient
Temperature
Figure 14. Common-mode Rejection Ratio vs Supply Voltage
160
140
200
180
160
140
120
100
80
120
VS = 5.5 V
100
80
VS = 5.0 V
VS = 2.5 V
60
40
20
0
60
40
20
0
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 15. Common-mode Rejection Ratio vs Ambient
Temperature
Figure 16. Power Supply Rejection Ratio vs Ambient
Temperature
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
800
700
600
500
400
300
200
100
0
40
35
30
25
20
15
10
5
0
10
100
1000
10000
100000
0
25
50
75
100
125
150
Frequency: f [Hz]
Ambient Temperature: Ta [°C]
Figure 17. Input Bias Current vs Ambient Temperature
(VS = 5 V)
Figure 18. Input-referred Noise Voltage Density vs
Frequency
(VS = 5 V)
5
5
Fall
Fall
4
3
2
1
0
4
3
Rise
2
Rise
1
0
2
3
4
5
6
-50 -25
0
25
50
75 100 125 150
Ambient Temperature: Ta [°C]
Supply Voltage: VS [V]
Figure 19. Slew Rate vs Supply Voltage
Figure 20. Slew Rate vs Ambient Temperature
(VS = 5 V)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Typical Performance Curves - continued
VSS = 0 V
6
5
90
80
70
60
50
40
30
20
10
0
VS = 5.0 V
VS = 5.5 V
4
3
2
1
0
VS = 2.5 V
-50 -25
0
25
50
75 100 125 150
10
100
1000
Ambient Temperature: Ta [°C]
Load Capacitance: CL [pF]
Figure 21. Gain Bandwidth Product vs Ambient Temperature
Figure 22. Phase Margin vs Load Capacitance
(VS = 5 V, RF = 10 kΩ, G = 40 dB)
18
12
6
80
180
135
90
45
0
Phase
CL = 600 pF
CL = 500 pF
CL = 330 pF
60
40
0
Gain
-6
CL = 0 pF
20
-12
-18
0
100
102
103
1000
104
105
106
107
102
103
104
105
106
107
10000 100000 100000010000000
Frequency: f [Hz]
Frequency: f [Hz]
Figure 23. Voltage Gain, Phase vs Frequency
(VS = 5 V)
Figure 24. Voltage Gain vs Frequency
(VS = 5 V, G = 0 dB, VIN = 180 mVP-P
)
(Note) The above data is measurement value of typical sample, it is not guaranteed.
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Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage due to high input impedance
and low output impedance. Computation for output
voltage is shown below.
VDD
VOUT
푉푂푈푇 = 푉
퐼푁
VIN
VSS
Figure 25. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage (VOUT). The
output voltage is shown in the next expression.
VDD
RIN
VIN
푅퐹
VOUT
푉푂푈푇 = −
푉
퐼푁
푅퐼푁
This circuit has input impedance equal to RIN.
VSS
Figure 26. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is amplified
by a voltage gain, which depends on the ratio of RIN and
RF. The output voltage (VOUT) is in-phase with the input
voltage and is shown in the next expression.
VDD
푅퐹
푉푂푈푇 = (1 +
) 푉
퐼푁
VOUT
푅퐼푁
VIN
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VSS
Figure 27. Non-inverting Amplifier Circuit
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I/O Equivalence Circuits
Pin No.
Pin Name
Pin Description
Equivalence Circuit
5
4
OUT
Output
4
2
5
1
3
+IN
-IN
1, 3
Input
2
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 28. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GLG2G500080-1-2
13.Apr.2022 Rev.001
14/17
TLR377HFV-LB
Ordering Information
T L R 3 7 7 H F V
-
L B T R
Product Rank
Package
LB: for Industrial applications
Packaging and forming specification
TR: Embossed tape and reel
HFV : HVSOF5
Marking Diagram
HVSOF5 (TOP VIEW)
Part Number Marking
LOT Number
A X
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© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GLG2G500080-1-2
13.Apr.2022 Rev.001
15/17
TLR377HFV-LB
Physical Dimension and Packing Information
Package Name
HVSOF5
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© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GLG2G500080-1-2
13.Apr.2022 Rev.001
16/17
TLR377HFV-LB
Revision History
Date
Revision
001
Changes
13.Apr.2022
New Release
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© 2022 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0GLG2G500080-1-2
13.Apr.2022 Rev.001
17/17
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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