UM6K34N [ROHM]
0.9V Drive Nch + Nch MOSFET; 0.9V驱动N沟道+ N沟道MOSFET型号: | UM6K34N |
厂家: | ROHM |
描述: | 0.9V Drive Nch + Nch MOSFET |
文件: | 总7页 (文件大小:1185K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Data Sheet
0.9V Drive Nch + Nch MOSFET
UM6K34N
Structure
Dimensions (Unit : mm)
Silicon N-channel MOSFET
UMT6
(SC-88)
<SOT-363>
(6) (5) (4)
Features
1) Mounting cost and area can be cut in half.
2) Low On-resistance.
(1) (2) (3)
3) Low voltage drive(0.9Vdrive)makes this device ideal for portable equipment.
Abbreviated symbol : K34
Application
Interfacing, Switching
Inner circuit
(6)
(5)
(4)
∗1
Packaging specifications
Package
Taping
TCN
3000
○
∗2
Type
∗2
Code
(1) Tr1 Source
(2) Tr1 Gate
(3) Tr2 Drain
(4) Tr2 Source
(5) Tr2 Gate
(6) Tr1 Drain
Basic ordering unit (pieces)
∗1
UM6K34N
(1)
(2)
(3)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
Absolute maximum ratings (Ta = 25C)
Parameter
Symbol
VDSS
VGSS
ID
Limits
50
Unit
V
Drain-source voltage
Gate-source voltage
8
V
Continuous
200
800
125
800
mA
mA
mA
mA
Drain current
Pulsed
*1
IDP
Is
Continuous
Pulsed
Source current
(Body Diode)
*1
*2
Isp
150
120
mW / TOTAL
PD
Power dissipation
mW / ELEMENT
Channel temperature
Tch
150
C
C
Range of storage temperature
*1 Pw10s, Duty cycle1%
Tstg
55 to 150
*2 Each terminal mounted on a recommended land.
Thermal resistance
Parameter
Symbol
Limits
833
Unit
˚C / W /TOTAL
˚C / W /ELEMENT
*
Channel to Ambient
Rth (ch-a)
1042
* Each terminal mounted on a recommended land.
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2011.04 - Rev.A
1/6
Data Sheet
UM6K34N
ꢀ
Electrical characteristics (Ta = 25C)
<It is the same ratings for Tr1 and Tr2.>
Parameter
Symbol
IGSS
Min.
Typ.
-
Max.
Unit
A VGS=8V, VDS=0V
ID=1mA, VGS=0V
A VDS=50V, VGS=0V
Conditions
Gate-source leakage
-
10
Drain-source breakdown voltage V (BR)DSS
50
-
-
1
V
Zero gate voltage drain current
Gate threshold voltage
IDSS
-
-
VGS (th)
0.3
-
0.8
2.2
2.4
2.8
3.3
9.0
-
V
S
VDS=10V, ID=1mA
-
1.6
1.7
2.0
2.2
3.0
-
ID=200mA, VGS=4.5V
ID=200mA, VGS=2.5V
ID=200mA, VGS=1.5V
ID=100mA, VGS=1.2V
ID=10mA, VGS=0.9V
ID=200mA, VDS=10V
-
*
Static drain-source on-state
resistance
RDS (on)
-
-
-
*
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
l Yfs l
0.2
Ciss
Coss
Crss
td(on)
tr
-
-
-
-
-
-
-
26
6
-
pF VDS=10V
-
pF VGS=0V
3
-
pF f=1MHz
5
-
ns ID=100mA, VDD 25V
ns VGS=4.5V
ns RL=250
ns RG=10
*
*
*
*
8
-
Turn-off delay time
Fall time
td(off)
tf
17
43
-
-
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
<It is the same ratings for Tr1 and Tr2.>
Parameter
Forward Voltage
Symbol
Min.
-
Typ.
-
Max. Unit
1.2
Conditions
*
VSD
V
Is=200mA, VGS=0V
*Pulsed
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2/6
2011.04 - Rev.A
Data Sheet
UM6K34N
ꢀ
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics(Ⅱ)
Fig.1 Typical Output Characteristics(Ⅰ)
0.2
0.2
0.15
0.1
VGS= 4.5V
VGS= 2.5V
VGS= 1.5V
VGS= 1.2V
0.15
VGS= 0.9V
VGS= 4.5V
VGS= 2.5V
VGS= 1.5V
VGS= 0.9V
0.1
0.05
0
VGS= 1.2V
VGS= 0.8V
Ta=25°C
pulsed
VGS= 0.8V
Ta=25°C
pulsed
0.05
0
VGS= 0.7V
VGS= 0.7V
0.8
0
0.2
0.4
0.6
1
1
1
0
2
4
6
8
10
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.4 Static Drain-Source On-State
Fig.3 Typical Transfer Characteristics
Resistance vs. Drain Current(Ⅰ)
1
10000
1000
100
VDS= 10V
Pulsed
Ta=25°C
pulsed
Ta=125°C
Ta=75°C
Ta=25°C
0.1
Ta= -25°C
.
VGS= 0.9V
VGS= 1.2V
VGS= 1.5V
VGS= 2.5V
VGS= 4.5V
0.01
0.001
0
0.2
0.4
0.6
0.8
0.001
0.01
0.1
1
GATE-SOURCE VOLTAGE : VGS[V]
DRAIN-CURRENT : ID[A]
Fig.5 Static Drain-Source On-State
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅱ)
Resistance vs. Drain Current(Ⅲ)
10000
1000
100
10000
1000
100
VGS= 4.5V
Pulsed
VGS= 2.5V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.001
0.01
0.1
0.001
0.01
0.1
1
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
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3/6
2011.04 - Rev.A
Data Sheet
UM6K34N
ꢀ
Fig.7 Static Drain-Source On-State
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current(Ⅳ)
Resistance vs. Drain Current(Ⅴ)
10000
10000
1000
100
VGS= 1.5V
Pulsed
VGS= 1.2V
Pulsed
1000
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
100
0.001
0.01
0.1
1
0.001
0.01
0.1
1
1
8
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
Fig.9 Static Drain-Source On-State
Fig.10 Forward Transfer Admittance
vs. Drain Current
Resistance vs. Drain Current(Ⅵ)
10000
10
VGS= 0.9V
Pulsed
VDS= 10V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1000
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
100
0.001
0.1
0.01
0.01
0.1
1
0.1
DRAIN-CURRENT : ID[A]
DRAIN-CURRENT : ID[A]
Fig.12 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
Fig.11 Reverse Drain Current
vs. Sourse-Drain Voltage
1
5000
4000
3000
2000
1000
0
Ta=25°C
pulsed
VGS=0V
Pulsed
ID= 0.01A
ID= 0.20A
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
0.01
0
0.5
1
1.5
0
1
2
3
4
5
6
7
SOURCE-DRAIN VOLTAGE : VSD [V]
GATE-SOURCE VOLTAGE : VGS[V]
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© 2011 ROHM Co., Ltd. All rights reserved.
4/6
2011.04 - Rev.A
Data Sheet
UM6K34N
ꢀ
Fig.14 Typical Capacitance
vs. Drain-Source Voltage
Fig.13 Switching Characteristics
1000
100
10
Ta=25°C
td(off)
VDD=25V
VGS=4.5V
RG=10Ω
Pulsed
4
3
2
1
0
tf
Ta=25°C
VDD=25V
ID= 0.2A
RG=10Ω
Pulsed
tr
td(on)
1
0.01
0.1
1
0
0.5
1
1.5
DRAIN-CURRENT : ID[A]
TOTAL GATE CHARGE : Qg [nC]
Fig.15 Typical Capacitance
vs. Drain-Source Voltage
1000
Ta=25°C
f=1MHz
VGS=0V
Ciss
100
10
1
Crss
Coss
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
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5/6
2011.04 - Rev.A
Data Sheet
UM6K34N
ꢀ
Measurement circuits
Pulse width
90%
VGS
ID
VDS
50%
10%
50%
V
GS
DS
R
L
V
10%
10%
90%
D.U.T.
V
DD
RG
90%
t
d(on)
td(off)
t
r
tf
t
on
toff
Fig.1-2ꢀSwitching Waveforms
Fig.1-1 Switching Time Measurement Circuit
Notice
This product might cause chip aging and breakdown under the large electrified environment. Please consider to design
ESD protection circuit.
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6/6
2011.04 - Rev.A
Notice
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