UMX1NTL [ROHM]

Small Signal Bipolar Transistor, 0.1A I(C), 40V V(BR)CEO, 2-Element, NPN, Silicon;
UMX1NTL
型号: UMX1NTL
厂家: ROHM    ROHM
描述:

Small Signal Bipolar Transistor, 0.1A I(C), 40V V(BR)CEO, 2-Element, NPN, Silicon

晶体 小信号双极晶体管 光电二极管
文件: 总4页 (文件大小:92K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
EMX1 / UMX1N / IMX1  
Transistors  
General purpose transistors  
(dual transistors)  
EMX1 / UMX1N / IMX1  
!Features  
!External dimensions (Units : mm)  
1) Two 2SC2412K chips in a EMT or UMT or SMT  
package.  
EMX1  
( )  
3
( )  
2
( )  
1
( )  
4
( )  
5
( )  
6
2) Mounting possible with EMT3 or UMT3 or SMT3  
automatic mounting machines.  
3) Transistor elements are independent, eliminating  
interference.  
1.2  
1.6  
Each lead has same dimensions  
ROHM  
: EMT6  
4) Mounting cost and area can be cut in half.  
Abbreviated symbol : X1  
UMX1N  
!Structure  
Epitaxial planar type  
NPN silicon transistor  
1.25  
2.1  
0.1Min.  
!Equivalent circuit  
Each lead has same dimensions  
ROHM  
EIAJ  
:
UMT6  
:
SC-88  
EMX1 / UMX1N  
IMX1  
(3) (2) (1)  
(4) (5) (6)  
Abbreviated symbol : X1  
IMX1  
Tr1  
Tr1  
Tr2  
Tr2  
(4) (5) (6)  
(3) (2) (1)  
1.6  
2.8  
0.3to0.6  
The following characteristics apply to both Tr1 and Tr2.  
Each lead has same dimensions  
ROHM  
EIAJ  
:
SMT6  
:
SC-74  
!Absolute maximum ratings (Ta = 25°C)  
Abbreviated symbol : X1  
Limits  
Parameter  
Collector-base voltage  
Collector-emitter voltage  
Emitter-base voltage  
Collector current  
Symbol  
Unit  
V
V
V
V
CBO  
CEO  
EBO  
60  
50  
V
7
V
I
C
150  
mA  
1
2
EMX1, UMX1N  
Power  
150 (TOTAL)  
300 (TOTAL)  
150  
P
C
mW  
dissipation  
IMX1  
Junction temperature  
Storage temperature  
Tj  
˚C  
˚C  
Tstg  
55∼+150  
1 120mW per element must not be exceeded.  
2 200mW per element must not be exceeded.  
1/3  
EMX1 / UMX1N / IMX1  
Transistors  
!Electrical characteristics (Ta = 25°C)  
Parameter  
Symbol Min. Typ. Max. Unit  
Conditions  
Collector-base breakdown voltage  
BVCBO  
60  
50  
7
V
V
V
I
I
I
C
=
=
50µA  
1mA  
Collector-emitter breakdown voltage BVCEO  
C
Emitter-base breakdown voltage  
Collector cutoff current  
BVEBO  
E
=
50µA  
I
CBO  
EBO  
CE (sat)  
FE  
0.1 µA  
0.1 µA  
V
CB  
=60V  
Emitter cutoff current  
I
V
EB=7V  
Collector-emitter saturation voltage  
DC current transfer ratio  
Transition frequency  
V
0.4  
560  
V
I
C/I =50mA/5mA  
B
h
120  
V
CE  
=
6V, I  
C
=
1mA  
180  
2
MHz  
f
T
V
CE  
CB  
=
=
12V, I  
E
E
=2mA, f=100MHz  
V
12V, I  
=
0A, f  
=
1MHz  
Output capacitance  
Cob  
3.5 PF  
!Packaging specifications  
Package  
Taping  
TN  
Code  
T2R  
T110  
3000  
Basic ordering  
unit (pieces)  
8000  
3000  
Type  
EMX1  
UMX1N  
IMX1  
!Electrical characteristic curves  
0.50mA  
50  
10  
8
100  
30µA  
27µA  
24µA  
21µA  
Ta=25˚C  
Ta=25˚C  
VCE=6V  
0.40mA  
0.35mA  
20  
10  
5
80  
60  
40  
0.30mA  
0.25mA  
0.20mA  
0.15mA  
6
18µA  
15µA  
12µA  
9µA  
C
˚
2
1
4
Ta=100  
0.10mA  
0.05mA  
0.5  
6µA  
2
0
20  
0
3µA  
0.2  
0.1  
I
B=0A  
IB=0A  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
BASE TO EMITTER VOLTAGE : VBE (V)  
0
0.4  
0.8  
1.2  
1.6  
2.0  
0
4
8
12  
16  
20  
COLLECTOR TO EMITTER VOLTAGE : VCE (V)  
COLLECTOR TO EMITTER VOLTAGE : VCE (V)  
Fig.3 Grounded emitter output  
characteristics ( II )  
Fig.1 Grounded emitter propagation  
characteristics  
Fig.2 Grounded emitter output  
characteristics ( I )  
2/3  
EMX1 / UMX1N / IMX1  
Transistors  
500  
500  
Ta=25˚C  
0.5  
VCE=5V  
Ta=25˚C  
Ta=100˚C  
25˚C  
V
CE=5V  
3V  
1V  
200  
100  
50  
200  
100  
50  
0.2  
0.1  
55˚C  
I
C/I  
B
=50  
0.05  
20  
10  
0.02  
0.01  
20  
10  
20  
10  
0.2 0.5  
1
2
5
10 20  
50 100 200  
0.2 0.5  
1
2
5
10 20  
50 100 200  
0.2 0.5  
1
2
5
10 20  
50 100 200  
COLLECTOR CURRENT : I (mA)  
C
COLLECTOR CURRENT : I  
C
(mA)  
COLLECTOR CURRENT : I  
C
(mA)  
Fig.6 Collector-emitter saturation  
voltage vs. collector current  
Fig.5 DC current gain vs. collector  
current ( II )  
Fig.4 DC current gain vs. collector  
current ( I )  
0.5  
0.5  
0.2  
0.5  
I
C/I  
B
=50  
IC/IB=10  
Ta=25˚C  
Ta=100˚C  
25˚C  
55˚C  
0.2  
0.2  
0.1  
I
C/I  
B
=50  
20  
10  
Ta=100˚C  
25˚C  
55˚C  
0.1  
0.1  
0.05  
0.05  
0.05  
0.02  
0.01  
0.02  
0.01  
0.02  
0.01  
0.2  
0.5  
1
2
5
10  
20  
50 100  
0.2 0.5  
1
2
5
10 20  
50 100 200  
(mA)  
0.2 0.5  
1
2
5
10 20  
50 100 200  
(mA)  
COLLECTOR CURRENT : I  
C
(mA)  
COLLECTOR CURRENT : I  
C
COLLECTOR CURRENT : I  
C
Fig.9 Collector-emitter saturation  
voltage vs. collector current ( III )  
Fig.8 Collector-emitter saturation  
voltage vs. collector current ( II )  
Fig.7 Collector-emitter saturation  
voltage vs. collector current ( I )  
20  
Ta=25˚C  
Ta=25˚C  
Ta=25˚C  
f=32MH  
Z
V
CE=6V  
200  
100  
50  
500  
200  
f
=
1MHz  
V
CB=6V  
IE=0A  
10  
5
IC=0A  
100  
50  
2
1
20  
10  
0.5 1  
2  
5 10 20  
50 100  
0.2  
0.5  
1  
2  
5  
10  
0.2  
0.5  
1
2
5
10  
20  
50  
EMITTER CURRENT : I  
E
(mA)  
EMITTER CURRENT : I  
E
(mA)  
COLLECTOR TO BASE VOLTAGE : VCB (V)  
EMITTER TO BASE VOLTAGE : VEB (V)  
Fig.10 Gain bandwidth product vs.  
emitter current  
Fig.12 Base-collector time constant vs.  
emitter current  
Fig.11 Collector output capacitance vs.  
collector-base voltage  
Emitter input capacitance vs.  
emitter-base voltage  
3/3  
Appendix  
Notes  
No technical content pages of this document may be reproduced in any form or transmitted by any  
means without prior permission of ROHM CO.,LTD.  
The contents described herein are subject to change without notice. The specifications for the  
product described in this document are for reference only. Upon actual use, therefore, please request  
that specifications to be separately delivered.  
Application circuit diagrams and circuit constants contained herein are shown as examples of standard  
use and operation. Please pay careful attention to the peripheral conditions when designing circuits  
and deciding upon circuit constants in the set.  
Any data, including, but not limited to application circuit diagrams information, described herein  
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM  
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any  
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of  
whatsoever nature in the event of any such infringement, or arising from or connected with or related  
to the use of such devices.  
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or  
otherwise dispose of the same, no express or implied right or license to practice or commercially  
exploit any intellectual property rights or other proprietary rights owned or controlled by  
ROHM CO., LTD. is granted to any such buyer.  
Products listed in this document use silicon as a basic material.  
Products listed in this document are no antiradiation design.  
The products listed in this document are designed to be used with ordinary electronic equipment or devices  
(such as audio visual equipment, office-automation equipment, communications devices, electrical  
appliances and electronic toys).  
Should you intend to use these products with equipment or devices which require an extremely high level of  
reliability and the malfunction of with would directly endanger human life (such as medical instruments,  
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other  
safety devices), please be sure to consult with our sales representative in advance.  
About Export Control Order in Japan  
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control  
Order in Japan.  
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)  
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.  
Appendix1-Rev1.0  

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