CX1SCSM4 [RSG]
8 MHz to 250 MHz Miniature Surface Mount AT Quartz Crystal; 8 MHz到250 MHz的微型表面贴装AT石英晶体
| 型号： | CX1SCSM4 |
| 厂家： | 
RSG ELECTRONIC COMPONENTS GMBH |
| 描述： | 8 MHz to 250 MHz Miniature Surface Mount AT Quartz Crystal |
| 文件： | 总2页 (文件大小：65K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CX1SM AT CRYSTAL
8 MHz to 250 MHz
Miniature Surface Mount AT Quartz Crystal
™
Fundamental Mode: 8 MHz - 250 MHz
Third Overtone Mode: 48 MHz - 160 MHz
actual size
side view
DESCRIPTION
STATEK’s miniature CX1SM AT crystals in leadless ceramic
packages are designed for surface mounting on printed
circuit boards or hybrid substrates. Due to its robust design,
this product has gained wide acceptance in the industry.
X
X
X
X
S
glass lid
ceramic lid
PACKAGE DIMENSIONS
FEATURES
Designed for surface mount applications using
infrared, vapor phase, or epoxy mount techniques
Low profile hermetically sealed ceramic package
D
Excellent aging characteristics
Available with glass or ceramic lid
High shock and vibration resistance
Custom designs available
TOP
BOTTOM
A
E
D
Full military testing available
E
B
Designed and manufactured in the USA
C
APPLICATIONS
TYPICAL
MAXIMUM
Medical
DIM
A
inches
0.315
0.140
-
mm
8.00
3.56
-
inches
mm
8.38
3.94
Infusion Pumps
0.330
0.155
Monitoring Equipment
Industrial, Computer & Communications
Instrumentation
B
C
see below
D
0.045
0.060
1.14
1.52
0.055
0.070
1.40
1.78
Process Control
E
Environmental Control
Telemetry
THICKNESS (DIM C) MAXIMUM
Military & Aerospace
Communications
GLASS LID
CERAMIC LID
inches
mm
1.65
1.70
1.78
inches
0.070
0.072
0.075
mm
1.78
1.83
1.90
Satellite Command and Control
Cockpit Electronics
Smart Munitions
SM1
0.065
0.067
0.070
SM2/SM4
SM3/SM5
Timing Devices (Fuzes)
10107 - Rev B
E
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
Pb
SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Designation Termination
SM1
SM2
SM3
SM4
SM5
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Fundamental Frequency
10 MHz 32 MHz 155.52 MHz
Motional Resistance R1 (
Ω)
30
25
15
Motional Capacitance C1 (fF)
5.5
6.2
4.0
Quality Factor Q (k)
100
2.2
30
30
Max Process Temperature 260OC for 20 sec.
Shunt Capacitance C0 (pF)
2.3
2.3
Calibration Tolerance1
Load Capacitance2
+_ 100 ppm, or tighter as required
20 pF for f ≤ 50 MHz
SUGGESTED LAND PATTERN
0.070 (1.78)
10 pF for f > 50 MHz
Drive Level
500
µ
W MAX for f ≤ 50 MHz
0.160 (4.06)
200
µ
W MAX for f > 50 MHz
+
+
_
Frequency-Temperature
Stability1,3
_ 50 ppm to 10 ppm (Commercial)
+
+
_
_ 100 ppm to 20 ppm (Industrial)
0.270 (6.86)
inches (mm)
+
+
_
_ 100 ppm to 30 ppm (Military)
5 ppm MAX (better than 1ppm available)
3,000 g, 0.3 ms, 1/2sine
Aging, first year4
Shock, survival5
Vibration, survival6
EQUIVALENT CIRCUIT
20 g, 10-2,000 Hz swept sine
C0
Operating Temp. Range
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
1
L1
C1
R1
2
Storage Temp. Range
-55OC to +125OC
Max Process Temperature 260OC for 20 sec.
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
1. Other tolerances available. Contact factory.
2. Unless specified otherwise.
PACKAGING OPTIONS
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
4. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies
contact factory.
• Tray Pack
• 16mm tape, 7” or 13” reels
Per EIA 481 (see Tape and Reel data sheet 10109)
5. Higher shock version available. Refer to data sheet model CX1HGSM AT (10108).
6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
HOW TO ORDER CX1SM AT CRYSTALS
CX1
S
C
SM1 – 32.0M
,
100
/
100
/
—
/
I
O.T. = 3RD O.T. Mode
Blank = Fundamental
Mode
C = Ceramic Lid
Blank = Glass Lid
Operating Temp. Range:
Frequency
Stability over
Temp. Range
(in ppm)
Calibration
Tolerance
@ 25OC
“S” if special
or custom
design.
Frequency
M = MHz
C
= -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
(in ppm)
Blank if Std.
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
S
= Customer Specified
OR
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
—
/
—
/
200
/
I
Total
Operating Temp. Range:
C
= -10OC to +70OC
Frequency
Tolerance
(in ppm)
I = -40OC to +85OC
M = -55OC to +125OC
S
= Customer Specified
10107 - Rev B
E
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
Pb
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