CX2SSM1 [RSG]

9.6 MHz to 250 MHz Low Profile, Miniature Surface Mount AT Quartz Crystal; 9.6 MHz到250 MHz的低调,微型表面贴装AT石英晶体
CX2SSM1
型号: CX2SSM1
厂家: RSG ELECTRONIC COMPONENTS GMBH    RSG ELECTRONIC COMPONENTS GMBH
描述:

9.6 MHz to 250 MHz Low Profile, Miniature Surface Mount AT Quartz Crystal
9.6 MHz到250 MHz的低调,微型表面贴装AT石英晶体

晶体 石英晶体
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CX2SM AT CRYSTAL  
9.6 MHz to 250 MHz  
Low Profile, Miniature Surface Mount AT Quartz Crystal  
Fundamental Mode: 9.6 MHz - 250 MHz  
Third Overtone: 48 MHz - 160 MHz  
actual size  
DESCRIPTION  
X
STATEK’s miniature CX2SM AT crystals in leadless  
ceramic packages are designed for surface mounting on  
printed circuit boards or hybrid substrates. These crystals  
are low profile and have a small footprint. The CX2SM  
crystal is manufactured using the STATEK-developed  
photolithographic process, and was designed utilizing the  
experience acquired by producing millions of crystals for  
industrial, commercial, military and medical applications.  
X
side view  
X
X
S
glass lid  
ceramic lid  
PACKAGE DIMENSIONS  
B
1
FEATURES  
2
A
I
Designed for surface mount applications using infrared,  
vapor phase, or epoxy mount techniques.  
H
G
F
3
Hermetically sealed ceramic package  
Excellent aging characteristics  
Available with glass or ceramic lid  
High shock and vibration resistance  
Custom designs available  
D
E
C
Full military testing available  
TYPICAL  
MAXIMUM  
DIM  
A
inches  
0.260  
0.094  
-
mm  
6.60  
2.39  
-
inches  
0.275  
0.108  
mm  
6.99  
2.74  
Designed and manufactured in the USA  
B
C
D
E
APPLICATIONS  
see below  
Medical  
0.035  
0.059  
0.050  
0.105  
0.155  
0.210  
0.89  
1.50  
1.27  
2.67  
3.94  
5.33  
0.045  
1.14  
1.75  
1.52  
2.92  
4.19  
5.59  
Infusion Pumps  
0.069  
0.060  
0.115  
0.165  
0.220  
Industrial, Computer & Communications  
Engine Control  
F
G
H
I
Down-hole Data Recorder  
Military & Aerospace  
Communications  
Smart Munitions  
THICKNESS (DIM C) MAXIMUM  
Timing Devices (Fuzes)  
Surveillance Devices  
GLASS LID  
CERAMIC LID  
inches  
mm  
1.65  
1.70  
1.78  
inches  
mm  
1.91  
1.96  
2.03  
SM1  
0.065  
0.067  
0.070  
0.075  
0.077  
0.080  
SM2/SM4  
SM3/SM5  
Note: Terminal 1 is electrically connected internally to terminal 3  
10136 - Rev B  
E
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de  
Pb  
TERMINATIONS  
SPECIFICATIONS  
Specifications are typical at 25OC unless otherwise noted.  
Specifications are subject to change without notice.  
Designation Termination  
SM1  
SM2  
SM3  
SM4  
SM5  
Gold Plated (Lead Free)  
Solder Plated  
Solder Dipped  
Solder Plated (Lead Free)  
Solder Dipped (Lead Free)  
Fundamental Frequency  
Motional Resistance (R1)  
Motional Capacitance C1 (fF)  
Quality Factor Q (k)  
10 MHz 32 MHz 155.52 MHz  
60  
2.8  
95  
25  
6.2  
30  
10  
4.0  
30  
Shunt Capacitance C0 (pF)  
1.4  
2.3  
2.3  
Max Process Temperature 260OC for 20 sec.  
Calibration Tolerance1  
Load Capacitance2  
+_ 100 ppm, or tighter as required  
PACKAGING OPTIONS  
20 pF for f 50 MHz  
Tray Pack  
10 pF for f > 50 MHz  
• 16mm tape, 7” or 13” reels  
Per EIA 481 (see Tape and Reel data sheet 10109)  
Drive Level  
500  
200  
µ
µ
W MAX for f 50 MHz  
W MAX for f > 50 MHz  
+
+
_
Frequency-Temperature  
Stability1,3  
_ 50 ppm to 10 ppm (Commercial)  
SUGGESTED LAND PATTERN  
+
+
_
_ 100 ppm to 20 ppm (Industrial)  
+
+
_
0.070 (1.78)  
_ 100 ppm to 30 ppm (Military)  
5 ppm MAX (better than 1 ppm available)  
3,000 g, 0.3 ms, 1/2 sine  
Aging, first year4  
Shock, survival5  
Vibration, survival6  
20 g, 10-2,000 Hz swept sine  
0.114  
(2.90)  
Operating Temp. Range  
-10OC to +70OC (Commercial)  
-40OC to +85OC (Industrial)  
-55OC to +125OC (Military)  
Storage Temp. Range  
-55OC to +125OC  
0.105 (2.67)  
Max Process Temperature 260OC for 20 sec.  
EQUIVALENT CIRCUIT  
1. Other tolerances available. Contact factory.  
2. Unless specified otherwise.  
C0  
3. Does not include calibration tolerance. The characteristics of the frequency stability over  
temperature follow that of the AT thickness-shear mode.  
4. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies  
contact factory.  
1
L1  
C1  
R1  
2
5. Higher shock version available.  
6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.  
R1 Motional Resistance L1 Motional Inductance  
C1 Motional Capacitance C0 Shunt Capacitance  
HOW TO ORDER CX2SM AT CRYSTALS  
CX2  
S
C
SM1  
32.0M  
,
100  
/
100  
/
/
I
O.T. = 3RD O.T. Mode  
Blank = Fundamental  
Mode  
Operating Temp. Range:  
“S” if special or  
custom design.  
Blank if Std.  
C = Ceramic Lid  
Blank = Glass Lid  
Calibration  
Tolerance  
@ 25OC  
Frequency  
M = MHz  
Frequency  
Stability over  
Temp. Range  
(in ppm)  
C
= -10OC to +70OC  
I  = -40OC to +85OC  
M = -55OC to +125OC  
(in ppm)  
SM1 = Gold Plated (Lead Free)  
SM2 = Solder Plated  
S
= Customer Specified  
SM3 = Solder Dipped  
SM4 = Solder Plated (Lead Free)  
SM5 = Solder Dipped (Lead Free)  
OR  
/
/
200  
/
I
Total  
Operating Temp. Range:  
C
= -10OC to +70OC  
Frequency  
Tolerance  
(in ppm)  
I  = -40OC to +85OC  
M = -55OC to +125OC  
S
= Customer Specified  
10136 - Rev B  
E
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de  
Pb  

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