CIB21J400 [SAMSUNG]

MULTILAYER CHIP COMPONENTS; 多层片式元器件
CIB21J400
元器件型号: CIB21J400
生产厂家: SAMSUNG SEMICONDUCTOR    SAMSUNG SEMICONDUCTOR
描述和应用:

MULTILAYER CHIP COMPONENTS
多层片式元器件

PDF文件: 总31页 (文件大小:4869K)
下载文档:  下载PDF数据表文档文件
型号参数:CIB21J400参数

CIB21P110

MULTILAYER CHIP COMPONENTS

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35 SAMSUNG

CIB21P150

MULTILAYER CHIP COMPONENTS

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23 SAMSUNG

CIB21P260

MULTILAYER CHIP COMPONENTS

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26 SAMSUNG

CIB21P260NE

Chip Bead CIB/CIM Series For EMI Suppression

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20 SAMSUNG

CIB21P330

MULTILAYER CHIP COMPONENTS

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23 SAMSUNG

CIB21P470

MULTILAYER CHIP COMPONENTS

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16 SAMSUNG

CIB32P600NE

Chip Bead CIB/CIM Series For EMI Suppression

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33 SAMSUNG

CIC05J600

Chip Bead CIC/CIS Series For High Current

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17 SAMSUNG

CIC05J600AC

Passive Filter

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0 SAMSUNG

CIC05J600AE

Passive Filter

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0 SAMSUNG

CIC05J600BC

Passive Filter

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0 SAMSUNG

CIC05J600BE

Passive Filter

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0 SAMSUNG

CIC05J600NC

Passive Filter

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0 SAMSUNG

CIC05J600NE

Passive Filter

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0 SAMSUNG

CIC05P121

Chip Bead CIC/CIS Series For High Current

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10 SAMSUNG