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CIM03J601 [SAMSUNG]

MULTILAYER CHIP COMPONENTS; 多层片式元器件

CIM03J601


元器件型号：	CIM03J601
生产厂家：	SAMSUNG SEMICONDUCTOR
描述和应用：	MULTILAYER CHIP COMPONENTS 多层片式元器件
PDF文件：	总31页 (文件大小：4869K)
下载文档：	下载PDF数据表文档文件
型号参数：CIM03J601参数

CIM03N300

Chip Bead CIB/CIM Series For EMI Suppression

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7 SAMSUNG

CIM03N300

MULTILAYER CHIP COMPONENTS

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4 SAMSUNG

CIM03N300

Chip Bead ; CIB/CIM Series For EMI Suppression

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5 SAMSUNG

CIM03N800

Chip Bead CIB/CIM Series

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24 SAMSUNG

CIM03N800

MULTILAYER CHIP COMPONENTS

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11 SAMSUNG

CIM03N800

Chip Bead CIB/CIM Series For EMI Suppression

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11 SAMSUNG

CIM03U121

Chip Bead CIB/CIM Series For EMI Suppression

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8 SAMSUNG

CIM03U121

Chip Bead CIB/CIM Series For EMI Suppression

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4 SAMSUNG

CIM03U121

MULTILAYER CHIP COMPONENTS

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8 SAMSUNG

CIM03U241

MULTILAYER CHIP COMPONENTS

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7 SAMSUNG

CIM03U241

Chip Bead CIB/CIM Series For EMI Suppression

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5 SAMSUNG

CIM03U241

Chip Bead CIB/CIM Series For EMI Suppression

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6 SAMSUNG

CIM03U471

MULTILAYER CHIP COMPONENTS

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18 SAMSUNG

CIM03U471NE

Passive Filter

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0 SAMSUNG

CIM03U601

MULTILAYER CHIP COMPONENTS

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29 SAMSUNG

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