K3N7C4000M-DC [SAMSUNG]

MASK ROM;
K3N7C4000M-DC
型号: K3N7C4000M-DC
厂家: SAMSUNG    SAMSUNG
描述:

MASK ROM

有原始数据的样本ROM
文件: 总4页 (文件大小:72K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
K3N7C4000M-DC  
64M-Bit (4Mx16) CMOS MASK ROM  
FEATURES  
CMOS MASK ROM  
GENERAL DESCRIPTION  
· 4,194,304 x 16 bit organization  
· Fast access time : 120ns(Max.)  
· Supply voltage : single +5V  
· Current consumption  
Operating : 70mA(Max.)  
· Fully static operation  
· All inputs and outputs TTL compatible  
· Three state outputs  
· Package  
The K3N7C4000M-DC is a fully static mask programmable  
ROM organized 4,194,304 x 16 bit. It is fabricated using sili-  
con-gate CMOS process technology.  
This device operates with a 5V single power supply, and all  
inputs and outputs are TTL compatible.  
Because of its asynchronous operation, it requires no external  
clock assuring extremely easy operation.  
It is suitable for use in program memory of microprocessor and  
data memory, character generator.  
-. K3N7C4000M-DC : 42-DIP-600  
The K3N7C4000M-DC is packaged in a 42-DIP.  
FUNCTIONAL BLOCK DIAGRAM  
PIN CONFIGURATION  
X
A21  
A18  
1
2
42  
41  
40  
A19  
A8  
MEMORY CELL  
MATRIX  
(4,194,304x16)  
BUFFERS  
AND  
DECODER  
.
.
.
.
.
.
.
.
A17  
A7  
3
A9  
A6  
A5  
A4  
A3  
4
39 A10  
38 A11  
5
6
A12  
37  
36  
35  
34  
33  
Y
SENSE AMP.  
BUFFERS  
7
A13  
A14  
A15  
BUFFERS  
AND  
DECODER  
A2  
A1  
8
A0  
9
A0  
10  
11  
12  
A16  
DIP  
A21  
VSS  
32 A20  
.
. .  
VSS  
Q15  
Q7  
31  
30  
29  
28  
27  
13  
14  
15  
16  
17  
18  
19  
20  
OE  
Q0  
Q0  
Q15  
CONTROL  
LOGIC  
OE  
Q8  
Q1  
Q9  
Q14  
Q6  
26 Q13  
Q2  
Q10  
Q3  
Q5  
25  
24  
23  
Q12  
Q4  
Pin Name  
A0 - A21  
Q0 - Q15  
OE  
Pin Function  
Address Inputs  
Q11  
21  
22 VCC  
Data Outputs  
Output Enable  
Power (+5V)  
Ground  
K3N7C4000M-DC  
VCC  
VSS  
K3N7C4000M-DC  
CMOS MASK ROM  
ABSOLUTE MAXIMUM RATINGS  
Item  
Symbol  
VIN  
Rating  
Unit  
Voltage on Any Pin Relative to VSS  
Temperature Under Bias  
Storage Temperature  
-0.3 to +7.0  
-10 to +85  
-55 to +150  
V
TBIAS  
TSTG  
°C  
°C  
NOTE : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to the  
conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may  
affect device reliability.  
RECOMMENDED OPERATING CONDITIONS(Voltage reference to VSS, TA=0 to 70°C)  
Item  
Min  
4.5  
0
Symbol  
VCC  
Typ  
5.0  
0
Max  
5.5  
0
Unit  
V
Supply Voltage  
Supply Voltage  
VSS  
V
DC CHARACTERISTICS  
Parameter  
Symbol  
Test Conditions  
Min  
Max  
70  
Unit  
Operating Current  
ICC  
ILI  
OE=VIL, all outputs open  
VIN=0 to VCC  
-
-
mA  
mA  
mA  
V
Input Leakage Current  
10  
Output Leakage Current  
Input High Voltage, All Inputs  
Input Low Voltage, All Inputs  
Output High Voltage Level  
Output Low Voltage Level  
ILO  
VOUT=0 to VCC  
-
10  
VIH  
VIL  
VOH  
VOL  
2.2  
-0.3  
2.4  
-
VCC+0.3  
0.8  
V
IOH=-400mA  
-
V
IOL=2.1mA  
0.4  
V
NOTE : Minimum DC Voltage(VIL) is -0.3V an input pins. During transitions, this level may undershoot to -2.0V for periods <20ns.  
Maximum DC voltage on input pins(VIH) is VCC+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.  
MODE SELECTION  
OE  
H
Mode  
Data  
High-Z  
Dout  
Power  
Active  
Active  
Operating  
Operating  
L
CAPACITANCE(TA=25°C, f=1.0MHz)  
Item  
Output Capacitance  
Input Capacitance  
Symbol  
Test Conditions  
VOUT=0V  
Min  
Max  
12  
Unit  
COUT  
CIN  
-
-
pF  
pF  
VIN=0V  
12  
NOTE : Capacitance is periodically sampled and not 100% tested.  
K3N7C4000M-DC  
CMOS MASK ROM  
AC CHARACTERISTICS(TA=0°C to +70°C, VCC=5V±10%, unless otherwise noted.)  
TEST CONDITIONS  
Item  
Value  
0.6V to 2.4V  
Input Pulse Levels  
Input Rise and Fall Times  
Input and Output timing Levels  
Output Loads  
10ns  
0.8V and 2.0V  
1 TTL Gate and CL=100pF  
READ CYCLE  
Item  
K3N7C4000M-DC12  
K3N7C4000M-DC15  
Symbol  
Unit  
Min  
Max  
Min  
Max  
Read Cycle Time  
tRC  
tAA  
tOE  
tDF  
tOH  
120  
150  
ns  
ns  
ns  
ns  
ns  
Address Access Time  
120  
60  
150  
70  
Output Enable Access Time  
Output Disable to Output High-Z  
Output Hold from Address Change  
20  
30  
0
0
TIMING DIAGRAM  
READ  
ADD  
ADD1  
ADD2  
A0~A21  
tRC  
tDF(Note)  
tAA  
tOE  
OE  
tOH  
DOUT  
D0~D15  
VALID DATA  
VALID DATA  
NOTE : tDF is defined as the time at which the outputs achieve the open circuit condition and is not referenced to VOH or VOL level.  
K3N7C4000M-DC  
CMOS MASK ROM  
PACKAGE DIMENSIONS  
(Unit : mm/inch)  
42-DIP-600  
+0.10  
0.25  
-0.05  
+0.004  
-0.002  
0.010  
#42  
#22  
13.80±0.20  
0.543±0.008  
#1  
#21  
0~15°  
3.91±0.20  
0.154±0.008  
52.82  
2.080  
MAX  
5.08  
MAX  
0.200  
52.42±0.20  
2.064±0.008  
3.1±0.30  
0.122±0.012  
0.46±0.10  
0.018±0.004  
1.27±.10  
0.38  
0.015  
2.54  
0.100  
0.81  
0.032  
MIN  
(
)
0.050±0.004  

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