K4F661612B-TC50
更新时间:2024-10-29 14:23:50
品牌:SAMSUNG
描述:Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50
K4F661612B-TC50 概述
Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 DRAM
K4F661612B-TC50 规格参数
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP2 | 包装说明: | TSOP2, TSOP50,.46,32 |
针数: | 50 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.02 |
风险等级: | 5.5 | 访问模式: | FAST PAGE |
最长访问时间: | 50 ns | 其他特性: | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型: | COMMON | JESD-30 代码: | R-PDSO-G50 |
JESD-609代码: | e0 | 长度: | 20.95 mm |
内存密度: | 67108864 bit | 内存集成电路类型: | FAST PAGE DRAM |
内存宽度: | 16 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 50 |
字数: | 4194304 words | 字数代码: | 4000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 4MX16 | |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSOP2 | 封装等效代码: | TSOP50,.46,32 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3.3 V |
认证状态: | Not Qualified | 刷新周期: | 8192 |
座面最大高度: | 1.2 mm | 自我刷新: | NO |
最大待机电流: | 0.0005 A | 子类别: | DRAMs |
最大压摆率: | 0.09 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.8 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 10.16 mm | Base Number Matches: | 1 |
K4F661612B-TC50 数据手册
通过下载K4F661612B-TC50数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载K4F661612B,K4F641612B
CMOS DRAM
4M x 16bit CMOS Dynamic RAM with Fast Page Mode
DESCRIPTION
This is a family of 4,194,304 x 16 bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory
cells within the same row. Refresh cycle(4K Ref. or 8K Ref.), access time (-45, -50 or -60), power consumption(Normal or Low power)
are optional features of this family. All of this family have CAS-before-RAS refresh, RAS-only refresh and Hidden refresh capabilities.
Furthermore, Self-refresh operation is available in L-version. This 4Mx16 Fast Page Mode DRAM family is fabricated using Samsung¢s
advanced CMOS process to realize high band-width, low power consumption and high reliability.
• Fast Page Mode operation
FEATURES
• 2CAS Byte/Word Read/Write operation
• Part Identification
• CAS-before-RAS refresh capability
• RAS-only and Hidden refresh capability
• Self-refresh capability (L-ver only)
• Fast parallel test mode capability
• LVTTL(3.3V) compatible inputs and outputs
• Early Write or output enable controlled write
• JEDEC Standard pinout
- K4F661612B-TC/L(3.3V, 8K Ref., TSOP)
- K4F641612B-TC/L(3.3V, 4K Ref., TSOP)
• ActivePowerDissipation
Unit : mW
4K
Speed
-45
8K
• Available in Plastic TSOP(II) packages
• +3.3V±0.3V power supply
360
324
288
468
432
396
-50
-60
• Refresh Cycles
Part
NO.
Refresh
cycle
Refresh time
FUNCTIONAL BLOCK DIAGRAM
Normal
64ms
L-ver
K4F661612B*
K4F641612B
8K
4K
RAS
UCAS
LCAS
W
128ms
Vcc
Vss
Control
Clocks
VBB Generator
* Access mode & RAS only refresh mode
: 8K cycle/64ms(Normal), 8K cycle/128ms(L-ver.)
CAS-before-RAS & Hidden refresh mode
Lower
Data in
Buffer
DQ0
to
Row Decoder
Refresh Timer
DQ7
Lower
Data out
Buffer
: 4K cycle/64ms(Normal), 4K cycle/128ms(L-ver.)
Refresh Control
Memory Array
OE
4,194,304 x 16
Cells
Refresh Counter
Row Address Buffer
Col. Address Buffer
Upper
Data in
Buffer
• Performance Range
DQ8
to
DQ15
Speed
tRAC
45ns
50ns
60ns
tCAC
12ns
13ns
15ns
tRC
tPC
A0~A12
(A0~A11)*1
Upper
Data out
Buffer
-45
-50
-60
80ns
90ns
110ns
31ns
35ns
40ns
A0~A8
(A0~A9)*1
Column Decoder
Note) *1 : 4K Refresh
SAMSUNG ELECTRONICS CO., LTD. reserves the right to
change products and specifications without notice.
K4F661612B,K4F641612B
CMOS DRAM
PIN CONFIGURATION (Top Views)
• K4F661612B-T
• K4F641612B-T
1
2
3
4
5
6
7
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
VCC
DQ0
DQ1
DQ2
DQ3
VCC
DQ4
DQ5
DQ6
DQ7
N.C
VCC
W
RAS
N.C
N.C
N.C
N.C
A0
VSS
DQ15
DQ14
DQ13
DQ12
VSS
DQ11
DQ10
DQ9
DQ8
N.C
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
VSS
LCAS
UCAS
OE
N.C
N.C
A12(N.C)*
A11
A10
A9
A8
A1
A2
A3
A4
A5
VCC
A7
A6
VSS
26
(400mil TSOP(II))
*(N.C) : N.C for 4K Refresh Product
Pin Name
Pin function
A0 - A12
A0 - A11
DQ0 - 15
VSS
Address Inputs(8K Product)
Address Inputs(4K Product)
Data In/Out
Ground
RAS
Row Address Strobe
Upper Column Address Strobe
Lower Column Address Strobe
Read/Write Input
UCAS
LCAS
W
OE
Data Output Enable
Power(+3.3V)
VCC
N.C
No Connection
K4F661612B,K4F641612B
CMOS DRAM
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
VIN,VOUT
VCC
Rating
-0.5 to +6.5
-0.5 to +4.6
-55 to +150
1
Units
V
Voltage on any pin relative to VSS
Voltage on VCC supply relative to VSS
Storage Temperature
V
Tstg
°C
W
Power Dissipation
PD
Short Circuit Output Current
IOS Address
50
mA
* Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to
the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to Vss, TA= 0 to 70°C)
Parameter
Supply Voltage
Symbol
VCC
VSS
Min
3.0
0
Typ
Max
3.6
0
Units
3.3
V
V
V
V
Ground
0
-
*1
Input High Voltage
Input Low Voltage
VIH
2.0
+5.5
0.8
*2
VIL
-
-0.3
*1 : 6.5V at pulse width £15ns which is measured at VCC
*2 : -1.3 at pulse width £15ns which is measured at VSS
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted.)
Parameter
Symbol
Min
Max
Units
Input Leakage Current (Any input 0£VIN£VCC+0.3V,
all other pins not under test=0 Volt)
II(L)
-5
5
uA
Output Leakage Current
(Data out is disabled, 0V£VOUT£VCC)
IO(L)
-5
5
uA
Output High Voltage Level(IOH=-2mA)
Output Low Voltage Level(IOL=2mA)
VOH
VOL
2.4
-
-
V
V
0.4
K4F661612B,K4F641612B
CMOS DRAM
DC AND OPERATING CHARACTERISTICS (Continued)
Max
Symbol
Power
Speed
Units
K4F661612B
K4F641612B
-45
-50
-60
100
90
80
130
120
110
mA
mA
mA
ICC1
Don¢t care
Normal
L
2
2
2
2
mA
mA
ICC2
ICC3
Don¢t care
-45
-50
-60
100
90
80
130
120
110
mA
mA
mA
Don¢t care
Don¢t care
-45
-50
-60
70
60
50
80
70
60
mA
mA
mA
ICC4
ICC5
ICC6
Normal
L
500
300
500
300
uA
uA
Don¢t care
-45
-50
-60
100
90
80
130
120
110
mA
mA
mA
Don¢t care
ICC7
ICCS
L
L
Don¢t care
Don¢t care
400
400
400
400
uA
uA
ICC1* : Operating Current (RAS and UCAS, LCAS, Address cycling @tRC=min.)
ICC2 : Standby Current (RAS=UCAS=LCAS=W=VIH)
ICC3* : RAS-only Refresh Current (UCAS=LCAS=VIH, RAS, Address cycling @tRC=min.)
ICC4* : Fast Page Mode Current (RAS=VIL, UCAS or LCAS, Address cycling @tPC=min.)
ICC5 : Standby Current (RAS=UCAS=LCAS=W=VCC-0.2V)
ICC6* : CAS-Before-RAS Refresh Current (RAS and UCAS or LCAS cycling @tRC=min)
ICC7 : Battery back-up current, Average power supply current, Battery back-up mode
Input high voltage(VIH)=VCC-0.2V, Input low voltage(VIL)=0.2V, UCAS, LCAS=CAS-before-RAS cycling or 0.2V,
W, OE=VIH, Address=Don¢t care DQ=Open, TRC=31.25us
ICCS : Self Refresh Current
RAS=UCAS=LCAS=0.2V, W=OE=A0 ~ A12(A11)=VCC-0.2V or 0.2V, DQ0 ~ DQ15=VCC-0.2V, 0.2V or Open
*Note :
ICC1, ICC3, ICC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.
ICC is specified as an average current. In ICC1, ICC3 and ICC6, address can be changed maximum once while RAS=VIL. In ICC4,
address can be changed maximum once within one fast page mode cycle time, tPC.
K4F661612B,K4F641612B
CMOS DRAM
CAPACITANCE (TA=25°C, VCC=3.3V, f=1MHz)
Parameter
Input capacitance [A0 ~ A12]
Symbol
CIN1
Min
Max
Units
pF
-
-
-
5
7
7
Input capacitance [RAS, UCAS, LCAS, W, OE]
Output capacitance [DQ0 - DQ15]
CIN2
pF
CDQ
pF
AC CHARACTERISTICS (0°C£TA£70°C, See note 1,2)
Test condition : VCC=3.3V±0.3V, Vih/Vil=2.2/0.7V, Voh/Vol=2.0/0.8V
-45
-50
-60
Parameter
Symbol
Units
Note
Min
80
Max
Min
Max
Min
110
153
Max
Random read or write cycle time
Read-modify-write cycle time
Access time from RAS
90
tRC
ns
ns
115
133
tRWC
tRAC
tCAC
tAA
45
12
23
50
13
25
60
15
30
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
3,4,10
3,4,5
3,10
3
Access time from CAS
Access time from column address
CAS to output in Low-Z
0
0
0
0
0
tCLZ
tOFF
tT
Output buffer turn-off delay
Transition time (rise and fall)
RAS precharge time
13
50
0
13
50
13
50
6
1
1
1
2
25
45
12
45
12
18
13
5
30
50
13
50
13
20
15
5
40
60
15
60
15
20
15
5
tRP
RAS pulse width
10K
10K
10K
tRAS
tRSH
tCSH
tCAS
tRCD
tRAD
tCRP
tASR
tRAH
tASC
tCAH
tRAL
tRCS
tRCH
tRRH
tWCH
tWP
RAS hold time
CAS hold time
CAS pulse width
10K
33
10K
37
10K
45
RAS to CAS delay time
4
RAS to column address delay time
CAS to RAS precharge time
Row address set-up time
Row address hold time
22
25
30
10
0
0
0
8
10
0
10
0
Column address set-up time
Column address hold time
Column address to RAS lead time
Read command set-up time
Read command hold time referenced to CAS
Read command hold time referenced to RAS
Write command hold time
Write command pulse width
Write command to RAS lead time
Write command to CAS lead time
Data set-up time
0
13
13
8
10
25
0
10
30
0
23
0
0
0
0
8
8
0
0
0
8
10
10
15
13
0
10
10
15
15
0
8
13
12
0
tRWL
tCWL
tDS
16
9,19
9,19
Data hold time
10
10
10
tDH
K4F661612B,K4F641612B
CMOS DRAM
AC CHARACTERISTICS (Continued)
-45
-50
-60
Parameter
Symbol
Units
Note
Min
Max
64
Min
Max
64
Min
Max
64
Refresh period (Normal)
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
ns
ns
tREF
Refresh period (L-ver)
128
128
128
tREF
Write command set-up time
0
32
67
43
48
5
0
0
7
7,15
7
tWCS
tCWD
tRWD
tAWD
tCPWD
tCSR
tCHR
tRPC
tCPA
tPC
CAS to W delay time
36
73
48
53
5
38
83
53
60
5
RAS to W delay time
Column address to W delay time
CAS precharge W delay time
7
CAS set-up time (CAS -before-RAS refresh)
CAS hold time (CAS -before-RAS refresh)
RAS to CAS precharge time
17
18
10
5
10
5
10
5
Access time from CAS precharge
Fast Page mode cycle time
26
30
35
3
31
70
9
35
76
10
50
30
40
85
10
60
35
Fast Page mode read-modify-write cycle time
CAS precharge time (Fast page cycle)
RAS pulse width (Fast page cycle)
RAS hold time from CAS precharge
OE access time
tPRWC
tCP
14
45
28
200K
12
200K
13
200K
15
tRASP
tRHCP
tOEA
tOED
tOEZ
tOEH
tWTS
tWTH
tWRP
tWRH
tRASS
tRPS
tCHS
OE to data delay
12
0
13
0
13
0
Output buffer turn off delay time from OE
OE command hold time
13
13
13
6
12
10
15
10
10
100
80
-50
13
10
15
10
10
100
90
-50
15
Write command set-up time (Test mode in)
Write command hold time (Test mode in)
W to RAS precharge time (C-B-R refresh)
W to RAS hold time (C-B-R refresh)
RAS pulse width (C-B-R self refresh)
RAS precharge time (C-B-R self refresh)
CAS hold time (C-B-R self refresh)
10
11
11
15
10
10
100
110
-50
20,21,22
20,21,22
20,21,22
K4F661612B,K4F641612B
CMOS DRAM
( Note 11 )
TEST MODE CYCLE
-45
-50
-60
Parameter
Symbol
Units
Note
Min
85
Max
Min
95
Max
Min
115
160
Max
Random read or write cycle time
Read-modify-write cycle time
Access time from RAS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tRC
120
138
tRWC
tRAC
tCAC
tAA
50
17
55
18
65
20
3,4,10,12
3,4,5,12
3,10,12
Access time from CAS
Access time from column address
RAS pulse width
28
30
35
50
17
17
50
28
37
72
48
36
75
50
10K
10K
55
18
18
55
30
41
78
53
40
81
55
10K
10K
65
20
20
65
35
43
88
58
45
90
65
10K
10K
tRAS
tCAS
tRSH
tCSH
tRAL
tCWD
tRWD
tAWD
tPC
CAS pulse width
RAS hold time
CAS hold time
Column Address to RAS lead time
CAS to W delay time
7
7
7
RAS to W delay time
Column Address to W delay time
Fast Page mode cycle time
Fast Page mode read-modify-write cycle time
RAS pulse width (Fast page cycle)
Access time from CAS precharge
OE access time
tPRWC
tRASP
tCPA
tOEA
tOED
tOEH
200K
31
200K
35
200K
40
3
17
18
20
OE to data delay
17
17
18
18
18
20
OE command hold time
K4F661612B,K4F641612B
CMOS DRAM
NOTES
1.
An initial pause of 200us is required after power-up followed by any 8 RAS-only refresh or CAS-before-RAS refresh cycles
before proper device operation is achieved.
2.
VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Transition times are measured between
VIH(min) and VIL(max) and are assumed to be 5ns for all inputs.
3.
4.
Measured with a load equivalent to 1 TTL load and 100pF.
Operation within the tRCD(max) limit insures that tRAC(max) can be met, tRCD(max) is specified as a reference point only.
If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC.
Assumes that tRCD³ tRCD(max).
5.
6.
tOFF(min)and tOEZ(max) define the time at which the output achieves the open circuit condition and are not referenced Voh
or Vol.
7. tWCS, tRWD, tCWD and tAWD are non restrictive operating parameters. They are included in the data sheet as electrical char-
acteristics only. If tWCS³ tWCS(min), the cycle is an early write cycle and the data output will remain high impedance for the
duration of the cycle. If tCWD³ tCWD(min), tRWD³ tRWD(min) and tAWD³ tAWD(min), then the cycle is a read-modify-write cycle
and the data output will contain the data read from the selected address. If neither of the above conditions is satisfied, the
condition of the data out is indeterminate.
Either tRCH or tRRH must be satisfied for a read cycle.
8.
9.
These parameters are referenced to CAS falling edge in early write cycles and to W falling edge in read-modify-write cycles.
Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as a reference point only.
If tRAD is greater than the specified tRAD(max) limit, then access time is controlled by tAA.
These specifications are applied in the test mode.
10.
11.
12.
In test mode read cycle, the value of tRAC, tAA, tCAC is delayed by 2ns to 5ns for the specified values. These parameters
should be specified in test mode cycles by adding the above value to the specified value in this data sheet.
K4F64(6)1612B Truth Table
RAS
H
L
LCAS
UCAS
W
X
X
H
H
H
L
OE
X
DQ0 - DQ7
Hi-Z
DQ8-DQ15
Hi-Z
STATE
Standby
Refresh
X
H
L
X
H
H
L
X
Hi-Z
Hi-Z
L
L
DQ-OUT
Hi-Z
Hi-Z
Byte Read
Byte Read
Word Read
Byte Write
Byte Write
Word Write
-
L
H
L
L
DQ-OUT
DQ-OUT
-
L
L
L
DQ-OUT
DQ-IN
-
L
L
H
L
H
H
H
H
L
H
L
L
DQ-IN
DQ-IN
Hi-Z
L
L
L
DQ-IN
Hi-Z
L
L
L
H
K4F661612B,K4F641612B
CMOS DRAM
tASC, tCAH are referenced to the earlier CAS falling edge.
13.
14.
tCP is specified from the later CAS rising edge in the previous cycle to the earlier CAS falling edge in the next cycle.
15.
tCWD is referenced to the later CAS falling edge at word read-modify-write cycle.
tCWL is specified from W falling edge to the earlier CAS rising edge.
tCSR is referenced to the earlier CAS falling edge before RAS transition low.
tCHR is referenced to the later CAS rising edge after RAS transition low.
16.
17.
18.
RAS
LCAS
UCAS
tCSR
tCHR
tDS is specified for the earlier CAS falling edge and tDH is specified by the later CAS falling edge.
19.
LCAS
UCAS
tDS
tDH
Din
DQ0 ~ DQ15
If tRASS³ 100us, then RAS precharge time must use tRPS instead of tRP.
20.
21. For RAS-only refresh and burst CAS-before-RAS refresh mode, 4096(4K/8K) cycles of burst refresh must be executed within
64ms before and after self refresh, in order to meet refresh specification.
22. For distributed CAS-before-RAS with 15.6us interval CAS-before-RAS should be executed with in 15.6us immediately before
and after self refresh in order to meet refresh specification.
K4F661612B,K4F641612B
CMOS DRAM
WORD READ CYCLE
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCSH
tCRP
tCRP
tCRP
tRCD
tRCD
tRSH
tCAS
VIH -
UCAS
VIL -
tCRP
tRSH
VIH -
LCAS
tCAS
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tRCS
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
W
tRCH
tRRH
VIH -
VIL -
tAA
VIH -
VIL -
OE
tOEA
tOFF
tOFF
tCAC
tCLZ
DQ0 ~ DQ7
VOH -
VOL -
tOEZ
DATA-OUT
tRAC
tRAC
OPEN
tCAC
tCLZ
DQ8 ~ DQ15
tOEZ
DATA-OUT
VOH -
OPEN
VOL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
LOWER BYTE READ CYCLE
NOTE : DIN = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCRP
tRPC
VIH -
UCAS
VIL -
tCSH
tCRP
tRCD
tRSH
tCAS
VIH -
LCAS
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tRCS
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
W
tRCH
tRRH
VIH -
VIL -
tOFF
tOEZ
tAA
VIH -
VIL -
OE
tOEA
tCAC
tCLZ
DQ0 ~ DQ7
VOH -
VOL -
tRAC
DATA-OUT
OPEN
DQ8 ~ DQ15
VOH -
OPEN
VOL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
UPPER BYTE READ CYCLE
NOTE : DIN = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
UCAS
VIL -
tRPC
tCRP
VIH -
LCAS
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tRCS
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
W
tRCH
tRRH
VIH -
VIL -
tOFF
tOEZ
tAA
VIH -
VIL -
OE
tOEA
DQ0 ~ DQ7
VOH -
VOL -
OPEN
tCAC
tCLZ
DQ8 ~ DQ15
tRAC
VOH -
OPEN
DATA-OUT
VOL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
WORD WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCSH
tCRP
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
UCAS
VIL -
tCRP
tRCD
tRSH
VIH -
LCAS
VIL -
tCAS
tRAD
tRAL
tASR
tRAH
tASC
tCAH
VIH -
VIL -
COLUMN
ADDRESS
ROW
ADDRESS
A
W
tWCS
tWCH
VIH -
VIL -
tWP
VIH -
VIL -
OE
tDS
tDS
DQ0 ~ DQ7
VIH -
tDH
DATA-IN
VIL -
tDH
DATA-IN
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
LOWER BYTE WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
VIL -
RAS
UCAS
LCAS
tCRP
tCRP
tRPC
VIH -
VIL -
tCSH
tCRP
tRCD
tRSH
VIH -
VIL -
tCAS
tRAD
tRAL
tASR
tRAH
tASC
tCAH
VIH -
VIL -
ROW
ADDRESS
COLUMN
ADDRESS
A
W
tWCS
tWCH
VIH -
VIL -
tWP
VIH -
VIL -
OE
tDS
DQ0 ~ DQ7
VIH -
tDH
DATA-IN
VIL -
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
UPPER BYTE WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
VIL -
RAS
UCAS
LCAS
tCSH
tCRP
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
VIL -
tRPC
VIH -
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tCAH
VIH -
VIL -
ROW
ADDRESS
COLUMN
ADDRESS
A
tWCS
tWCH
VIH -
VIL -
W
tWP
VIH -
VIL -
OE
DQ0 ~ DQ7
VIH -
VIL -
tDS
tDH
DATA-IN
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
WORD WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : DOUT = OPEN
tRC
tRP
tRAS
VIH -
RAS
VIL -
tCSH
tCRP
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
UCAS
LCAS
VIL -
tCSH
tCRP
tRCD
tRSH
VIH -
VIL -
tCAS
tRAD
tRAL
tASR
tRAH
tASC
tCAH
VIH -
VIL -
COLUMN
ADDRESS
ROW
ADDRESS
A
W
tCWL
tRWL
VIH -
VIL -
tWP
VIH -
VIL -
OE
tOEH
tOED
tDS
tDS
DQ0 ~ DQ7
VIH -
tDH
DATA-IN
VIL -
tDH
DQ8 ~ DQ15
VIH -
DATA-IN
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
LOWER BYTE WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tRPC
tCRP
VIH -
UCAS
VIL -
tCSH
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
VIL -
LCAS
tRAD
tRAL
tASR
tRAH
tASC
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
tCWL
tRWL
VIH -
VIL -
tWP
W
VIH -
VIL -
tOEH
OE
tOED
tDS
tDH
DATA-IN
DQ0 ~ DQ7
VIH -
VIL -
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
UPPER BYTE WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : DOUT = OPEN
tRC
tRAS
tRP
VIH -
RAS
VIL -
tCSH
tCRP
tCRP
tRCD
tRSH
tCAS
VIH -
VIL -
UCAS
LCAS
tCRP
tRPC
VIH -
VIL -
tRAD
tRAL
tASR
tRAH
tASC
tCAH
COLUMN
ADDRESS
VIH -
VIL -
ROW
ADDRESS
A
tCWL
tRWL
VIH -
VIL -
W
tWP
VIH -
VIL -
tOEH
OE
tOED
DQ0 ~ DQ7
VIH -
VIL -
tDS
tDH
DATA-IN
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
WORD READ - MODIFY - WRITE CYCLE
tRWC
tRAS
tRP
VIH -
RAS
VIL -
tCRP
tRCD
tRSH
VIH -
tCAS
tCAS
UCAS
VIL -
tCRP
tRCD
tRSH
tCSH
VIH -
LCAS
VIL -
tRAD
tRAH
tASR
tASC
tCAH
VIH -
VIL -
ROW
ADDR
COLUMN
ADDRESS
A
tRWL
tAWD
tCWL
tWP
tCWD
VIH -
VIL -
W
tRWD
tOEA
VIH -
VIL -
OE
tCLZ
tCAC
tOED
tOEZ
tAA
tDS
tDH
DQ0 ~ DQ7
tRAC
VI/OH -
VI/OL -
VALID
DATA-OUT
VALID
DATA-IN
tCLZ
tCAC
tOED
tOEZ
tAA
tDS
tDH
DQ8 ~ DQ15
tRAC
VI/OH -
VALID
DATA-OUT
VALID
DATA-IN
VI/OL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
LOWER-BYTE READ - MODIFY - WRITE CYCLE
tRWC
tRAS
tRP
VIH -
RAS
VIL -
tRPC
tCRP
VIH -
UCAS
VIL -
tCRP
tRCD
tRSH
VIH -
tCAS
LCAS
VIL -
tRAD
tRAH
tCSH
tASR
tASC
tCAH
VIH -
VIL -
ROW
ADDR
COLUMN
ADDRESS
A
tRWL
tCWL
tWP
tAWD
tCWD
VIH -
VIL -
W
tRWD
tOEA
VIH -
VIL -
OE
tCLZ
tCAC
tOED
tOEZ
tAA
tDS
tDH
DQ0 ~ DQ7
tRAC
VI/OH -
VALID
DATA-OUT
VALID
DATA-IN
VI/OL -
DQ8 ~ DQ15
VI/OH -
OPEN
VI/OL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
UPPER-BYTE READ - MODIFY - WRITE CYCLE
tRWC
tRP
tRAS
VIH -
VIL -
RAS
UCAS
LCAS
tCRP
tCRP
tRCD
tRSH
VIH -
VIL -
tCAS
tRPC
VIH -
VIL -
tRAD
tRAH
tCSH
tASR
tASC
tCAH
VIH -
VIL -
ROW
ADDR
COLUMN
ADDRESS
A
tRWL
tAWD
tCWL
tWP
tCWD
VIH -
VIL -
W
tRWD
tOEA
VIH -
VIL -
OE
DQ0 ~ DQ7
VI/OH -
OPEN
VI/OL -
tCLZ
tCAC
tOED
tAA
tDS
tDH
DQ8 ~ DQ15
tOEZ
tRAC
VI/OH -
VALID
DATA-OUT
VALID
DATA-IN
VI/OL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE WORD READ CYCLE
tRP
tRASP
¡ó
VIH -
RAS
VIL -
tRHCP
tCAS
tCSH
tPC
tPC
tCAS
tPC
tCAS
tCRP
tCP
tCP
tCP
tCP
tRPC
tRPC
tRCD
tCAS
VIH -
VIL -
UCAS
tRAL
tCAS
tCRP
tASR
tCP
tCP
tRCD
tCAS
tCAS
tCAH
tCAS
tCAH
VIH -
VIL -
LCAS
tRAD
tRAH tASC
tCAH tASC
tASC
tASC
tCAH
VIH -
VIL -
COLUMN
ADDRESS
COLUMN
ADDR
COLUMN
ROW
ADDR
COLUMN
ADDRESS
A
ADDRESS
tRCS
tRCH
tRCS
tRCH
tRCS
tRRH
tRCH
tRCS
tRCH
VIH -
VIL -
W
tCAC
tCAC
tCAC
tAA
tAA
tAA
tCPA
tOEA
tAA
tOEA
tCPA
tCPA
tOEA
tOEA
VIH -
VIL -
OE
tCAC
tRAC
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
DQ0 ~ DQ7
VOH -
VALID
VALID
VALID
VALID
DATA-OUT
DATA-OUT
DATA-OUT
DATA-OUT
VOL -
tCLZ
tCAC
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
DQ8 ~ DQ15
VOH -
tRAC
VALID
VALID
VALID
VALID
VOL -
DATA-OUT
DATA-OUT
DATA-OUT
DATA-OUT
tCLZ
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE LOWER BYTE READ CYCLE
tRASP
tRP
VIH -
VIL -
RAS
¡ó
tRHCP
tRAL
tCRP
tRPC
tRPC
VIH -
VIL -
UCAS
tCSH
tPC
tCAS
tPC
tCAS
tPC
tCAS
tCRP
tASR
tCP
tCP
tCP
tRCD
tCAS
tCAH
VIH -
VIL -
LCAS
tRAD
tRAH
tASC tCAH
tASC tCAH
tASC
tCAH
tASC
VIH -
VIL -
COLUMN
COLUMN
ADDR
COLUMN
ROW
ADDR
COLUMN
ADDRESS
A
ADDRESS
ADDRESS
tRCS
tRCS
tRCH
tRCS
tRRH
tRCH
tRCS
tRCH
tRCH
VIH -
VIL -
W
tCAC
tCAC
tCAC
tAA
tCPA
tOEA
tAA
tCPA
tOEA
tAA
tCPA
tOEA
tAA
tOEA
VIH -
VIL -
OE
tCAC
tRAC
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
DQ0 ~ DQ7
VOH -
VALID
VALID
VALID
VALID
DATA-OUT
DATA-OUT
DATA-OUT
DATA-OUT
VOL -
tCLZ
DQ8 ~ DQ15
VOH -
OPEN
VOL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE UPPER BYTE READ CYCLE
tRP
tRASP
VIH -
VIL -
RAS
¡ó
tCSH
tRCD
tRHCP
tCAS
tPC
tCAS
tPC
tCAS
tPC
tCAS
tCRP
tCP
tCP
tCP
tRPC
tRPC
VIH -
VIL -
UCAS
tCRP
tASR
VIH -
VIL -
LCAS
tRAL
tCAH
tRAD
tRAH tASC
tCAH
tASC
tCAH
tASC
tCAH
tASC
VIH -
VIL -
ROW
COLUMN
ADDRESS
COLUMN
ADDRESS
COLUMN
ADDR
COLUMN
ADDRESS
A
ADDR
tRCS
tRCS
tRCH
tRCS
tRRH
tRCH
tRCS
tRCH
tRCH
VIH -
VIL -
W
tCAC
tCAC
tCAC
tAA
tAA
tCPA
tOEA
tAA
tCPA
tOEA
tAA
tOEA
tCPA
tOEA
VIH -
VIL -
OE
DQ0 ~ DQ7
VOH -
OPEN
VOL -
tCAC
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
tOFF
tOEZ
tRAC
DQ8 ~ DQ15
VOH -
VALID
DATA-OUT
VALID
DATA-OUT
VALID
DATA-OUT
VALID
DATA-OUT
VOL -
tCLZ
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE WORD WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRASP
tRP
VIH -
RAS
tRHCP
VIL -
¡ó
tPC
tPC
tPC
tPC
tRSH
tCRP
tCRP
tRCD
tRCD
tCP
tCP
tCP
tCP
tCRP
VIH -
VIL -
tCAS
tCAS
tCAS
¡ó
tCAS
UCAS
LCAS
tRSH
VIH -
VIL -
tCAS
¡ó
tCAS
tRAD
tRAH
tRAL
tCAH
tCSH
tASC
tASR
tCAH
tASC
tCAH
tASC
¡ó
¡ó
VIH -
VIL -
ROW
ADDR
COLUMN
ADDRESS
COLUMN
ADDRESS
COLUMN
ADDRESS
A
tWCS tWCH
tWP
tWCS
tWCH
tWP
tWCS
tWCH
tWP
¡ó
VIH -
VIL -
W
¡ó
¡ó
VIH -
VIL -
OE
tDS
tDS
tDH
tDS
tDH
tDS
tDH
DQ0 ~ DQ7
VIH -
¡ó
¡ó
VALID
DATA-IN
VALID
DATA-IN
VALID
DATA-IN
VIL -
tDH
tDS
tDH
tDS
tDH
DQ8 ~ DQ15
¡ó
¡ó
VIH -
VALID
DATA-IN
VALID
DATA-IN
VALID
DATA-IN
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE LOWER BYTE WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRASP
tRP
VIH -
tRHCP
RAS
VIL -
¡ó
tRPC
tCRP
¡ó
VIH -
UCAS
VIL -
tPC
tPC
tRSH
tCRP
tRCD
tCP
tCP
VIH -
VIL -
tCAS
tCAS
¡ó
tCAS
LCAS
tRAD
tRAH
tRAL
tCAH
tCSH
tASC
tASR
tCAH
tASC
tCAH
tASC
¡ó
¡ó
VIH -
VIL -
ROW
ADDR
COLUMN
COLUMN
ADDRESS
COLUMN
ADDRESS
A
ADDRESS
tWCS
tWP
tWCH
tWCS
tWCH
tWP
tWCS
tWCH
tWP
¡ó
VIH -
VIL -
W
¡ó
¡ó
VIH -
VIL -
OE
tDS
tDH
tDS
tDH
tDS
tDH
DQ0 ~ DQ7
VIH -
VIL -
¡ó
¡ó
VALID
DATA-IN
VALID
DATA-IN
VALID
DATA-IN
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE UPPER BYTE WRITE CYCLE ( EARLY WRITE )
NOTE : DOUT = OPEN
tRASP
tRP
VIH -
tRHCP
RAS
VIL -
¡ó
tPC
tPC
tRSH
tCRP
tCRP
tRCD
tCP
tCP
VIH -
VIL -
tCAS
tCAS
¡ó
tCAS
UCAS
LCAS
tRPC
VIH -
VIL -
tRAD
tRAH
tRAL
tCAH
tCSH
tASC
tASR
tCAH
tASC
tCAH
tASC
¡ó
¡ó
VIH -
VIL -
ROW
ADDR.
COLUMN
ADDRESS
COLUMN
ADDRESS
COLUMN
ADDRESS
A
tWCS tWCH
tWP
tWCS
tWCH
tWP
tWCS
tWCH
tWP
¡ó
VIH -
VIL -
W
¡ó
¡ó
VIH -
VIL -
OE
DQ0 ~ DQ7
VIH -
VIL -
¡ó
¡ó
tDS
tDH
tDS
tDH
tDS
tDH
DQ8 ~ DQ15
¡ó
¡ó
VIH -
VALID
DATA-IN
VALID
DATA-IN
VALID
DATA-IN
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE WORD READ-MODIFY-WRITE CYCLE
tRP
tRASP
VIH -
VIL -
tCSH
RAS
tPRWC
tRSH
tCRP
tCRP
tCRP
tCRP
tRCD
tRCD
tCP
tCP
VIH -
VIL -
tCAS
tCAS
UCAS
LCAS
VIH -
VIL -
tCAS
tRAL
tCAS
tRAD
tRAH
tCAH
tCAH
tASR
tASC
tASC
VIH -
VIL -
ROW
ADDR
COL.
ADDR
COL.
ADDR
A
W
tRWL
tCWL
tRCS
tCWL
tRCS
VIH -
VIL -
tWP
tWP
tCWD
tAWD
tRWD
tCWD
tAWD
tCPWD
VIH -
VIL -
tOEA
tOEA
OE
tOED
tOED
tCAC
tAA
tCAC
tAA
tDH
tDH
tDS
tOEZ
tDS
DQ0 ~ DQ7
tRAC
tOEZ
VI/OH -
VI/OL -
tCLZ
tCLZ
VALID
DATA-OUT
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-IN
tOED
tOED
tCAC
tAA
tCAC
tAA
tDH
tDH
tDS
tOEZ
tDS
DQ8 ~ DQ15
tOEZ
tRAC
VI/OH -
VI/OL -
tCLZ
tCLZ
VALID
DATA-IN
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-OUT
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE LOWER BYTE READ - MODIFY - WRITE CYCLE
tRP
tRASP
VIH -
VIL -
tCSH
RAS
tCRP
tCRP
tRPC
VIH -
VIL -
UCAS
LCAS
tPRWC
tCAS
tRSH
tCAS
tCRP
tRCD
tCP
VIH -
VIL -
tRAD
tRAH
tRAL
tCAH
tCAH
tASR
tASC
tASC
VIH -
VIL -
ROW
ADDR
COL.
ADDR
COL.
A
W
ADDR
tRWL
tCWL
tRCS
tCWL
tRCS
VIH -
VIL -
tWP
tWP
tCWD
tAWD
tRWD
tCWD
tAWD
tCPWD
VIH -
VIL -
tOEA
tOEA
OE
tOED
tOED
tCAC
tAA
tCAC
tAA
tDH
tDH
tDS
tOEZ
tDS
DQ0 ~ DQ7
tRAC
tOEZ
VI/OH -
VI/OL -
tCLZ
tCLZ
VALID
DATA-OUT
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-IN
DQ8 ~ DQ15
VI/OH -
OPEN
VI/OL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
FAST PAGE MODE UPPER BYTE READ - MODIFY - WRITE CYCLE
tRP
tRASP
VIH -
VIL -
tCSH
RAS
tCRP
tCRP
tPRWC
tCAS
tRSH
tCAS
tCRP
tRCD
tCP
VIH -
VIL -
UCAS
LCAS
tRPC
VIH -
VIL -
tRAD
tRAH
tRAL
tCAH
tASR
tCAH
tASC
tASC
VIH -
VIL -
ROW
ADDR
COL.
ADDR
COL.
A
W
ADDR
tRWL
tCWL
tRCS
tCWL
tRCS
VIH -
VIL -
tWP
tWP
tCWD
tAWD
tRWD
tCWD
tAWD
tCPWD
VIH -
VIL -
tOEA
tOEA
OE
DQ0 ~ DQ7
VI/OH -
OPEN
VI/OL -
tOED
tOED
tCAC
tAA
tCAC
tAA
tDH
tDH
tOEZ
tOEZ
tDS
tDS
DQ8 ~ DQ15
VI/OH -
tRAC
VI/OL -
tCLZ
tCLZ
VALID
DATA-OUT
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-IN
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
RAS - ONLY REFRESH CYCLE
NOTE : W, OE , DIN = Don¢t care
DOUT = OPEN
tRC
tRP
VIH -
RAS
tRAS
VIL -
tRPC
tCRP
VIH -
UCAS
VIL -
tCRP
VIH -
LCAS
VIL -
tASR
tRAH
VIH -
VIL -
ROW
ADDR
A
CAS - BEFORE - RAS REFRESH CYCLE
NOTE : OE , A = Don¢t care
tRC
tRP
tRP
tRAS
VIH -
RAS
VIL -
tCRP
tCP
tRPC
tCSR
tCSR
VIH -
VIL -
tCHR
tCHR
UCAS
LCAS
tCP
VIH -
VIL -
DQ0 ~ DQ7
VOH -
VOL -
tOFF
OPEN
DQ8 ~ DQ15
VOH -
OPEN
VOL -
tWRP
tWRH
VIH -
VIL -
W
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
HIDDEN REFRESH CYCLE ( READ )
tRC
tRC
tRAS
tRP
tRP
tRAS
VIH -
RAS
VIL -
tCRP
tRCD
tRSH
tRSH
tCHR
tCHR
VIH -
VIL -
UCAS
LCAS
tCRP
tRCD
VIH -
VIL -
tRAD
tRAL
tCAH
tASR
tRAH
tASC
VIH -
VIL -
ROW
ADDRESS
COLUMN
ADDRESS
A
W
tWRH
tRCS
VIH -
VIL -
tAA
VIH -
VIL -
tOEA
OE
tOFF
tCAC
tCLZ
tRAC
DQ0 ~ DQ7
VOH -
VOL -
tOEZ
DATA-OUT
OPEN
DQ8 ~ DQ15
VOH -
DATA-OUT
OPEN
VOL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
HIDDEN REFRESH CYCLE ( WRITE )
NOTE : DOUT = OPEN
tRC
tRC
tRP
tRP
tRAS
tRAS
VIH -
RAS
VIL -
tCRP
tRCD
tCHR
tRSH
tRSH
VIH -
UCAS
VIL -
tCRP
tRCD
tCHR
VIH -
LCAS
VIL -
tRAD
tRAL
tCAH
COLUMN
ADDRESS
tASR
ROW
tRAH
tASC
VIH -
VIL -
A
W
ADDRESS
tWRH
tWRP
tWCS
tWCH
VIH -
VIL -
tWP
VIH -
VIL -
OE
tDS
tDS
tDH
DATA-IN
DQ0 ~ DQ7
VIH -
VIL -
tDH
DATA-IN
DQ8 ~ DQ15
VIH -
VIL -
Don¢t care
Undefined
K4F661612B,K4F641612B
CMOS DRAM
CAS - BEFORE - RAS SELF REFRESH CYCLE
NOTE : OE , A = Don¢t care
tRP
tRASS
tRPS
VIH -
RAS
VIL -
tRPC
tCP
tRPC
tCHS
tCHS
tCSR
tCSR
VIH -
VIL -
UCAS
LCAS
tCP
VIH -
VIL -
tOFF
DQ0 ~ DQ7
VOH -
OPEN
OPEN
VOL -
DQ8 ~ DQ15
VOH -
VOL -
tWRP
tWRH
VIH -
VIL -
W
TEST MODE IN CYCLE
NOTE : OE , A = Don¢t care
tRC
tRP
tRP
tRAS
VIH -
RAS
VIL -
tCRP
tRPC
tCP
tCSR
tCSR
VIH -
VIL -
tCHR
tCHR
UCAS
LCAS
tCP
VIH -
VIL -
tWTS
VIH -
VIL -
tWTH
W
tOFF
DQ0 ~ DQ15
VOH -
VOL -
OPEN
Don¢t care
Undefined
K4F661612B,K4F641612B
PACKAGE DIMENSION
50 TSOP(II) 400mil
CMOS DRAM
Units : Inches (millimeters)
0.004 (0.10)
0.010 (0.25)
0.841 (21.35)
MAX
0.821 (20.85)
0.829 (21.05)
0.047 (1.20)
MAX
0.010 (0.25)
TYP
O
0~8
0.018 (0.45)
0.030 (0.75)
0.034 (0.875)
0.0315 (0.80)
0.002 (0.05)
MIN
0.010 (0.25)
0.018 (0.45)
K4F661612B-TC50 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
K4F661612B-TC500 | SAMSUNG | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TC60 | SAMSUNG | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TC600 | SAMSUNG | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TL45 | SAMSUNG | Fast Page DRAM, 4MX16, 45ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TL450 | SAMSUNG | Fast Page DRAM, 4MX16, 45ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TL50 | SAMSUNG | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TL500 | SAMSUNG | Fast Page DRAM, 4MX16, 50ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612B-TL600 | SAMSUNG | Fast Page DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | 获取价格 | |
K4F661612C | SAMSUNG | 4M x 16bit CMOS Dynamic RAM with Fast Page Mode | 获取价格 | |
K4F661612C-L | SAMSUNG | 4M x 16bit CMOS Dynamic RAM with Fast Page Mode | 获取价格 |
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