K7N323609M-HC20_技术文档

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

Document Title

1Mx36 & 2Mx18-Bit Pipelined NtRAM^TM

Revision History

Draft Date

Rev. No.

History

Remark

May. 10. 2001

0.0

1. Initial document.

Preliminary

The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the

specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-

tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.

- 1 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

32Mb NtRAM(Flow Through / Pipelined)

Ordering Information

Speed

Org.

Part Number

Mode

VDD

FT ; Access Time(ns)

Pipelined ; Cycle Time(MHz)

PKG

Temp

K7M321825M-Q(H)C65/75/85/

K7N321801M-Q(H)C16/15/13

K7N321809M-Q(H)C25/22/20

K7N321845M-Q(H)C16/15/13

K7N321849M-Q(H)C25/22/20

K7M323625M-Q(H)C65/75/85/

K7N323601M-Q(H)C16/15/13

K7N323609M-Q(H)C25/22/20

K7N323645M-Q(H)C16/15/13

K7N323649M-Q(H)C25/22/20

FlowThrough

Pipelined

FlowThrough

Pipelined

3.3

2.5

3.3

2.5

6.5/7.5/8.5/9.0ns

167/150/133MHz

250/225/200MHz

167/150/133MHz

250/225/200MHz

6.5/7.5/8.5/9.0ns

167/150/133MHz

250/225/200MHz

167/150/133MHz

250/225/200MHz

2Mx18

Q : 100TQFP

H : 119BGA

C

1Mx36

(Commercial

Temperature

Range)

Pipelined

(Normal Type)

K7N327245M-HC16/15/13

2.5

1.8

167/150/133MHz

250/225/200MHz

275/250MHz

Pipelined

(Normal Type)

H : 209BGA

512Kx72 K7N327249M-HC25/22/20

K7N327285M-HC27/25

Pipelined

(Sigma Type)

- 2 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

1Mx36 & 2Mx18-Bit Pipelined NtRAM^TM

FEATURES

GENERAL DESCRIPTION

• 3.3V+0.165V/-0.165V Power Supply.

• I/O Supply Voltage 3.3V+0.165V/-0.165V for 3.3V I/O

or 2.5V+0.4V/-0.125V for 2.5V I/O.

• Byte Writable Function.

• Enable clock and suspend operation.

• Single READ/WRITE control pin.

• Self-Timed Write Cycle.

• Three Chip Enable for simple depth expansion with no data-

contention .

• A interleaved burst or a linear burst mode.

• Asynchronous output enable control.

• Power Down mode.

The K7N323609M and K7N321809M are 37,748,736-bits

Synchronous Static SRAMs.

The NtRAM^TM, or No Turnaround Random Access Memory uti-

lizes all the bandwidth in any combination of operating cycles.

Address, data inputs, and all control signals except output

enable and linear burst order are synchronized to input clock.

Burst order control must be tied "High or Low".

Asynchronous inputs include the sleep mode enable(ZZ).

Output Enable controls the outputs at any given time.

Write cycles are internally self-timed and initiated by the rising

edge of the clock input. This feature eliminates complex off-chip

write pulse generation

• 100-TQFP-1420A /119BGA(7x17 Ball Grid Array Package).

and provides increased timing flexibility for incoming signals.

For read cycles, pipelined SRAM output data is temporarily

stored by an edge triggered output register and then released

to the output buffers at the next rising edge of clock.

The K7N323609M and K7N321809M are implemented with

SAMSUNG¢s high performance CMOS technology and is avail-

able in 100pin TQFP and 119BGA packages. Multiple power

and ground pins minimize ground bounce.

FAST ACCESS TIMES

PARAMETER

Symbol

tCYC

tCD

-25

4.0

2.6

-22

4.4

2.8

-20

5.0

3.2

Unit

ns

Cycle Time

Clock Access Time

ns

Output Enable Access Time

tOE

ns

LOGIC BLOCK DIAGRAM

LBO

A0~A1

BURST

ADDRESS

COUNTER

A¢0~A¢1

A [0:19]or

A [0:20]

1Mx36, 2Mx18

MEMORY

ADDRESS

REGISTER

A2~A19 orA2~A20

ARRAY

WRITE

ADDRESS

REGISTER

WRITE

ADDRESS

REGISTER

DATA-IN

REGISTER

CLK

K

CKE

DATA-IN

REGISTER

K

CS1

CS2

ADV

WE

CONTROL

LOGIC

K

OUTPUT

BWx

(x=a,b,c,d or a,b)

REGISTER

BUFFER

OE

ZZ

36 or 18

DQa0 ~ DQd7 or DQa0 ~ DQb8

DQPa ~ DQPd

NtRAM^TMand No Turnaround Random Access Memory are trademarks of Samsung.

- 3 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

(TOP VIEW)

PIN CONFIGURATION

DQPc

1

DQPb

DQb7

DQb6

VDDQ

VSSQ

DQb5

DQb4

DQb3

DQb2

VSSQ

VDDQ

DQb1

DQb0

VSS

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

DQc0

DQc1

3

VDDQ

2

4

VSSQ

5

DQc2

6

DQc3

7

DQc4

8

DQc5

9

VSSQ

10

VDDQ

11

DQc6

12

100 Pin TQFP

(20mm x 14mm)

DQc7

13

VDD

14

VDD

ZZ

15

VDD

16

VSS

17

DQd0

18

DQa7

DQa6

VDDQ

VSSQ

DQa5

DQa4

DQa3

DQa2

VSSQ

VDDQ

DQa1

DQa0

DQPa

DQd1

19

K7N323609M(1Mx36)

VDDQ

20

VSSQ

21

DQd2

22

DQd3

DQd4

DQd5

VSSQ

VDDQ

DQd6

DQd7

DQPd

23

24

25

26

27

28

29

30

PIN NAME

SYMBOL

PIN NAME

TQFP PIN NO.

SYMBOL

PIN NAME

TQFP PIN NO.

A0 - A18

Address Inputs

32,33,34,35,36,37,43, VDD

44,45,46,47,48,49,50, VSS

8182,83,84,99,100

Power Supply(+3.3V) 14,15,16,41,65,66,91

Ground

17,40,67,90

38,39,42,43

ADV

WE

Address Advance/Load

Read/Write Control Input 88

85

No Connect

N.C.

CLK

CKE

CS1

CS2

Clock

89

87

98

97

Data Inputs/Outputs 52,53,56,57,58,59,62,63

Data Inputs/Outputs 68,69,72,73,74,75,78,79

Data Inputs/Outputs 2,3,6,7,8,9,12,13

Data Inputs/Outputs 18,19,22,23,24,25,28,29

Data Inputs/Outputs 51,80,1,30

DQa0~a7

DQb0~b7

DQc0~c7

DQd0~d7

DQPa~Pd

Clock Enable

Chip Select

92

BWx(x=a,b,c,d) Byte Write Inputs

93,94,95,96

OE

ZZ

LBO

Output Enable

Power Sleep Mode

Burst Mode Control

86

64

31

Output Power Supply 4,11,20,27,54,61,70,77

(3.3V or 2.5V)

VDDQ

VSSQ

Output Ground

5,10,21,26,55,60,71,76

Note : 1. A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.

- 4 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

(TOP VIEW)

PIN CONFIGURATION

N.C.

VDDQ

VSSQ

N.C.

1

2

3

4

5

6

7

8

80

79

78

77

76

75

74

73

72

71

70

69

68

67

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

A10

N.C.

VDDQ

VSSQ

N.C.

DQa0

DQa1

DQa2

VSSQ

VDDQ

DQa3

DQa4

VSS

N.C.

DQb8

DQb7

VSSQ

VDDQ

DQb6

DQb5

VDD

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

100 Pin TQFP

VDD

ZZ

(20mm x 14mm)

VDD

VSS

DQb4

DQb3

VDDQ

VSSQ

DQb2

DQb1

DQb0

N.C.

VSSQ

VDDQ

N.C.

DQa5

DQa6

VDDQ

VSSQ

DQa7

DQa8

N.C.

VSSQ

VDDQ

N.C.

K7N321809M(2Mx18)

PIN NAME

SYMBOL

PIN NAME

TQFP PIN NO.

SYMBOL

PIN NAME

TQFP PIN NO.

A0 - A19

Address Inputs

32,33,34,35,36,37,43 VDD

44,45,46,47,48,49,50, VSS

8081,82,83,84,99,100

Power Supply(+3.3V) 14,15,16,41,65,66,91

Ground

17,40,67,90

ADV

WE

Address Advance/Load

Read/Write Control Input 88

Clock

Clock Enable

Chip Select

85

No Connect

1,2,3,6,7,25,28,29,30,

38,39,42,43,51,52,53,

56,57,75,78,79,95,96

N.C.

CLK

CKE

CS1

CS2

89

87

98

97

Data Inputs/Outputs 58,59,62,63,68,69,72,73,74

Data Inputs/Outputs 8,9,12,13,18,19,22,23,24

DQa0~a8

DQb0~b8

92

BWx(x=a,b) Byte Write Inputs

93,94

86

64

OE

ZZ

Output Enable

Power Sleep Mode

Burst Mode Control

Output Power Supply 4,11,20,27,54,61,70,77

(3.3V or 2.5V)

VDDQ

VSSQ

LBO

31

Output Ground

5,10,21,26,55,60,71,76

NOTE : A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.

- 5 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

(TOP VIEW)

119BGA PACKAGE PIN CONFIGURATIONS

K7N323609M(1Mx36)

1

2

3

A

4

5

A

6

A

7

A

B

C

D

E

F

VDDQ

NC

A

VDDQ

NC

CS2

A

ADV

VDD

NC

CS1

OE

A

CS2

A

NC

A

NC

DQc

VDDQ

DQc

VDDQ

DQd

VDDQ

DQd

NC

DQPc

DQc

VDD

DQd

DQPd

A

VSS

BWc

VSS

NC

VSS

BWd

VSS

LBO

A

VSS

BWb

VSS

NC

VSS

BWa

VSS

NC

A

DQPb

DQb

VDD

DQa

DQPa

A

DQb

VDDQ

DQb

VDDQ

DQa

VDDQ

DQa

NC

G

H

J

WE

VDD

CLK

NC

CKE

A1*

A0*

VDD

A

K

L

M

N

P

R

T

NC

A

ZZ

U

VDDQ

TMS

TDI

TCK

TDO

NC

VDDQ

Note : * A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.

PIN NAME

SYMBOL

PIN NAME

SYMBOL

PIN NAME

A

Address Inputs

VDD

VSS

Power Supply

Ground

A0,A1

ADV

WE

CLK

CKE

CS1

CS2

Burst Address Inputs

Address Advance/Load

Read/Write Control Input

Clock

Clock Enable

Chip Select

N.C.

No Connect

DQa

DQb

DQc

DQd

Data Inputs/Outputs

Chip Select

DQPa~Pd

BWx

(x=a,b,c,d)

Byte Write Inputs

VDDQ

Output Power Supply

OE

ZZ

LBO

Output Enable

Power Sleep Mode

Burst Mode Control

TCK

TMS

TDI

JTAG Test Clock

JTAG Test Mode Select

JTAG Test Data Input

JTAG Test Data Output

TDO

- 6 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

(TOP VIEW)

119BGA PACKAGE PIN CONFIGURATIONS

K7N321809M(2Mx18)

1

2

A

3

A

4

5

A

6

A

7

A

B

C

D

E

F

VDDQ

NC

A

VDDQ

NC

CS2

A

ADV

VDD

NC

CS1

OE

A

CS2

A

NC

A

NC

DQb

NC

DQb

NC

DQb

NC

VDD

DQb

NC

DQb

NC

DQPb

A

VSS

BWb

VSS

NC

VSS

LBO

A

VSS

NC

VSS

BWa

VSS

NC

A

DQPa

NC

DQa

NC

DQa

VDD

NC

DQa

NC

DQa

NC

A

NC

DQa

VDDQ

DQa

NC

VDDQ

NC

G

H

J

DQb

VDDQ

NC

WE

VDD

CLK

NC

CKE

A1*

A0*

VDD

A

VDDQ

DQa

NC

K

L

DQb

VDDQ

DQb

NC

M

N

P

R

T

VDDQ

NC

DQa

NC

A

ZZ

U

VDDQ

TMS

TDI

TCK

TDO

NC

VDDQ

Note : * A0 and A1 are the two least significant bits(LSB) of the address field and set the internal burst counter if burst is desired.

PIN NAME

SYMBOL

PIN NAME

SYMBOL

PIN NAME

A

Address Inputs

VDD

VSS

Power Supply

Ground

A0,A1

ADV

WE

CLK

CKE

CS1

Burst Address Inputs

Address Advance/Load

Read/Write Control Input

Clock

Clock Enable

Chip Select

No Connect

N.C.

Data Inputs/Outputs

DQa

DQb

DQPa, Pb

CS2

Chip Select

CS2

Chip Select

BWx

(x=a,b)

Byte Write Inputs

Output Power Supply

VDDQ

OE

ZZ

LBO

Output Enable

Power Sleep Mode

Burst Mode Control

TCK

TMS

TDI

JTAG Test Clock

JTAG Test Mode Select

JTAG Test Data Input

JTAG Test Data Output

TDO

- 7 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

FUNCTION DESCRIPTION

The K7N323609M and K7N321809M are NtRAM^{T M}designed to sustain 100% bus bandwidth by eliminating turnaround cycle when

there is transition from Read to Write, or vice versa.

All inputs (with the exception of OE, LBO and ZZ) are synchronized to rising clock edges.

All read, write and deselect cycles are initiated by the ADV input. Subsequent burst addresses can be internally generated by the

burst advance pin (ADV). ADV should be driven to Low once the device has been deselected in order to load a new address for next

operation.

Clock Enable(CKE) pin allows the operation of the chip to be suspended as long as necessary. When CKE is high, all synchronous

inputs are ignored and the internal device registers will hold their previous values.

T M

NtRAM latches external address and initiates a cycle, when CKE, ADV are driven to low and all three chip enables(CS1, CS2, CS2)

are active .

Output Enable(OE) can be used to disable the output at any given time.

Read operation is initiated when at the rising edge of the clock, the address presented to the address inputs are latched in the

address register, CKE is driven low, all three chip enables(CS1, CS2, CS2) are active, the write enable input signals WE are driven

high, and ADV driven low.The internal array is read between the first rising edge and the second rising edge of the clock and the data

is latched in the output register. At the second clock edge the data is driven out of the SRAM. Also during read operation OE must

be driven low for the device to drive out the requested data.

Write operation occurs when WE is driven low at the rising edge of the clock. BW[d:a] can be used for byte write operation. The pipe-

lined NtRAM^TMuses a late-late write cycle to utilize 100% of the bandwidth.

At the first rising edge of the clock, WE and address are registered, and the data associated with that address is required two cycle

later.

Subsequent addresses are generated by ADV High for the burst access as shown below. The starting point of the burst seguence is

provided by the external address. The burst address counter wraps around to its initial state upon completion.

The burst sequence is determined by the state of the LBO pin. When this pin is low, linear burst sequence is selected.

And when this pin is high, Interleaved burst sequence is selected.

During normal operation, ZZ must be driven low. When ZZ is driven high, the SRAM will enter a Power Sleep Mode after 2 cycles. At

this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM normally operates after 2 cycles of wake up

time.

(Interleaved Burst, LBO=High)

BURST SEQUENCE TABLE

Case 1

Case 2

Case 3

Case 4

LBO PIN

HIGH

First Address

A 1

A 0

A 1

A 0

A 1

A 0

A 1

A 0

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

Fourth Address

(Linear Burst, LBO=Low)

Case 4

BQ TABLE

Case 1

Case 2

Case 3

LBO PIN

LOW

First Address

A 1

0

A 0

0

A 1

0

A 0

1

A 1

1

A 0

0

A 1

1

A 0

1

0

1

0

1

0

1

0

1

0

1

Fourth Address

1

0

1

0

Note : 1. LBO pin must be tied to High or Low, and Floating State must not be allowed.

- 8 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

STATE DIAGRAM FOR NtRAM^TM

WRITE

READ

BEGIN

READ

BEGIN

WRITE

READ

DESELECT

BURST

READ

BURST

WRITE

BURST

COMMAND

ACTION

DS

DESELECT

READ

WRITE

BEGIN READ

BEGIN WRITE

BEGIN READ

BURST

BEGIN WRITE

CONTINUE DESELECT

Notes : 1. An IGNORE CLOCK EDGE cycle is not shown is the above diagram. This is because CKE HIGH only blocks the clock(CLK) input and does

not change the state of the device.

2. States change on the rising edge of the clock(CLK)

- 9 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

TRUTH TABLES

SYNCHRONOUS TRUTH TABLE

CS1

H

X

L

CS2

X

CS2 ADV WE BWx

OE

X

L

CKE CLK

ADDRESS ACCESSED

N/A

Operation

Not Selected

X

H

X

L

X

H

X

H

X

L

X

L

H

•

L

N/A

Not Selected

X

L

N/A

Not Selected

X

H

L

N/A

Not Selected Continue

Begin Burst Read Cycle

Continue Burst Read Cycle

NOP/Dummy Read

Dummy Read

H

X

External Address

Next Address

External Address

Next Address

External Address

Next Address

N/A

X

L

X

L

H

L

H

X

H

X

L

X

L

H

L

H

X

Begin Burst Write Cycle

Continue Burst Write Cycle

NOP/Write Abort

Write Abort

X

L

X

L

H

L

X

L

H

X

H

X

H

X

Next Address

Current Address

X

Ignore Clock

Notes : 1. X means "Don¢t Care".

2. The rising edge of clock is symbolized by (• ).

3. A continue deselect cycle can only be enterd if a deselect cycle is executed first.

4. WRITE = L means Write operation in WRITE TRUTH TABLE.

WRITE = H means Read operation in WRITE TRUTH TABLE.

5. Operation finally depends on status of asynchronous input pins(ZZ and OE).

WRITE TRUTH TABLE(x36/x32)

WE

H

L

BWa

X

BWb

BWc

X

BWd

OPERATION

READ

X

H

L

X

H

L

H

WRITE BYTE a

WRITE BYTE b

WRITE BYTE c

WRITE BYTE d

WRITE ALL BYTEs

WRITE ABORT/NOP

L

H

L

H

L

H

L

H

Notes : 1. X means "Don¢t Care".

2. All inputs in this table must meet setup and hold time around the rising edge of CLK(• ).

WRITE TRUTH TABLE(x18)

WE

BWa

BWb

OPERATION

H

X

L

X

H

L

READ

L

WRITE BYTE a

WRITE BYTE b

WRITE ALL BYTEs

WRITE ABORT/NOP

L

H

L

H

Notes : 1. X means "Don¢t Care".

2. All inputs in this table must meet setup and hold time around the rising edge of CLK(• ).

- 10 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

ASYNCHRONOUS TRUTH TABLE

Notes

OPERATION

ZZ

H

L

OE

I/O STATUS

High-Z

1. X means "Don¢t Care".

2. Sleep Mode means power Sleep Mode of which stand-by current does

not depend on cycle time.

3. Deselected means power Sleep Mode of which stand-by current

depends on cycle time.

Sleep Mode

X

L

DQ

Read

L

H

High-Z

Write

L

X

Din, High-Z

High-Z

Deselected

L

X

ABSOLUTE MAXIMUM RATINGS*

PARAMETER

Voltage on VDD Supply Relative to VSS

Voltage on Any Other Pin Relative to VSS

Power Dissipation

SYMBOL

VDD

RATING

-0.3 to 4.6

-0.3 to VDD+0.3

1.6

UNIT

V

VIN

V

PD

W

Storage Temperature

TSTG

TOPR

TBIAS

-65 to 150

0 to 70

°C

Operating Temperature

Storage Temperature Range Under Bias

-10 to 85

*Note : Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

(0°C £ TA £ 70°C)

OPERATING CONDITIONS at 3.3V I/O

PARAMETER

Supply Voltage

Ground

SYMBOL

MIN

3.135

0

Typ.

3.3

0

MAX

3.465

0

UNIT

VDD

V

VDDQ

VSS

(0°C £ TA £ 70°C)

OPERATING CONDITIONS at 2.5V I/O

PARAMETER

SYMBOL

MIN

3.135

2.375

0

Typ.

3.3

2.5

0

MAX

3.465

2.9

UNIT

VDD

V

Supply Voltage

VDDQ

VSS

Ground

0

(TA=25°C, f=1MHz)

CAPACITANCE*

Parameter

Symbol

CIN

Test Condition

VIN=0V

Min

Max

Unit

pF

Input Capacitance

Output Capacitance

-

5

7

COUT

VOUT=0V

pF

*Notes : Sampled not 100% tested.

- 11 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

(VDD=3.3V+0.165V/-0.165V, TA=0°C to +70°C)

DC ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

TEST CONDITIONS

VDD=Max ; VIN=VSS to VDD

MIN

MAX

+2

UNIT NOTES

Input Leakage Current(except ZZ)

Output Leakage Current

IIL

-2

-

mA

IOL

Output Disabled, Vout=VSS to VDDQ

+2

-25

-22

-20

-25

-22

-20

TBD

Device Selected, IOUT=0mA,

Operating Current

ICC

ISB

-

mA

1,2

ZZ£VIL , Cycle Time ³ tCYC Min

-

Device deselected, IOUT=0mA,

ZZ£VIL, f=Max, All Inputs£ 0.2V or ³

VDD-0.2V

-

Standby Current

Device deselected, IOUT=0mA, ZZ£0.2V,

f=0, All Inputs=fixed (VDD-0.2V or 0.2V)

Device deselected, IOUT=0mA, ZZ³ VDD-0.2V,

f=Max, All Inputs£VIL or ³ VIH

ISB1

ISB2

-

TBD

mA

Output Low Voltage(3.3V I/O)

Output High Voltage(3.3V I/O)

Output Low Voltage(2.5V I/O)

Output High Voltage(2.5V I/O)

Input Low Voltage(3.3V I/O)

Input High Voltage(3.3V I/O)

Input Low Voltage(2.5V I/O)

Input High Voltage(2.5V I/O)

VOL

VOH

VOL

VOH

VIL

IOL=8.0mA

-

0.4

V

IOH=-4.0mA

IOL=1.0mA

IOH=-1.0mA

2.4

-

0.4

-

2.0

-0.3*

2.0

-0.3*

1.7

0.8

VDD+0.3**

0.7

3

VIH

VIL

VIH

VDD+0.3**

Notes : 1. Reference AC Operating Conditions and Characteristics for input and timing.

2. Data states are all zero.

3. In Case of I/O Pins, the Max. VIH=VDDQ+0.3V

VIH

VSS

VSS-1.0V

20% tCYC(MIN)

TEST CONDITIONS

(VDD=3.3V+0.165V/-0.165V,VDDQ=3.3V+0.165/-0.165V or VDD=3.3V+0.165V/-0.165V,VDDQ=2.5V+0.4V/-0.125V, TA=0to70°C)

PARAMETER

VALUE

0 to 3.0V

0 to 2.5V

1.0V/ns

1.5V

Input Pulse Level(for 3.3V I/O)

Input Pulse Level(for 2.5V I/O)

Input Rise and Fall Time(Measured at 20% to 80% for 3.3V I/O)

Input Rise and Fall Time(Measured at 20% to 80% for 2.5V I/O)

Input and Output Timing Reference Levels for 3.3V I/O

Input and Output Timing Reference Levels for 2.5V I/O

Output Load

VDDQ/2

See Fig. 1

- 12 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

Output Load(A)

Output Load(B),

(for tLZC, tLZOE, tHZOE & tHZC)

+3.3V for 3.3V I/O

/+2.5V for 2.5V I/O

RL=50W

Dout

VL=1.5V for 3.3V I/O

VDDQ/2 for 2.5V I/O

319W / 1667W

30pF*

Dout

Zo=50W

353W / 1538W

5pF*

* Including Scope and Jig Capacitance

Fig. 1

(VDD=3.3V+0.165V/-0.165V, TA=0 to 70°C)

AC TIMING CHARACTERISTICS

-25

-22

-20

PARAMETER

SYMBOL

UNIT

MIN

4.0

-

MAX

MIN

4.4

-

MAX

MIN

5.0

-

MAX

Cycle Time

tCYC

tCD

-

ns

Clock Access Time

2.6

2.8

3.2

Output Enable to Data Valid

Clock High to Output Low-Z

Output Hold from Clock High

Output Enable Low to Output Low-Z

Output Enable High to Output High-Z

Clock High to Output High-Z

Clock High Pulse Width

tOE

-

2.6

-

2.8

-

3.2

ns

tLZC

tOH

0.8

0

-

1.0

0

-

1.0

0

-

ns

-

ns

tLZOE

tHZOE

tHZC

tCH

-

ns

-

2.6

-

2.8

-

3.0

ns

-

2.6

-

2.8

-

3.0

-

ns

1.7

1.2

0.3

2

2.0

1.4

0.4

2

2.0

1.4

0.4

2

ns

Clock Low Pulse Width

tCL

-

ns

Address Setup to Clock High

CKE Setup to Clock High

tAS

-

ns

tCES

tDS

-

ns

Data Setup to Clock High

-

ns

Write Setup to Clock High (WE, BWX)

Address Advance Setup to Clock High

Chip Select Setup to Clock High

Address Hold from Clock High

CKE Hold from Clock High

Data Hold from Clock High

Write Hold from Clock High (WE, BWEX)

Address Advance Hold from Clock High

Chip Select Hold from Clock High

ZZ High to Power Down

tWS

-

ns

tADVS

tCSS

tAH

-

ns

-

ns

-

ns

tCEH

tDH

-

ns

-

ns

tWH

tADVH

tCSH

tPDS

tPUS

-

ns

-

ns

-

ns

-

cycle

ZZ Low to Power Up

2

-

2

-

2

-

Notes : 1. All address inputs must meet the specified setup and hold times for all rising clock(CLK) edges when ADV is sampled low and CS is sampled

low. All other synchronous inputs must meet the specified setup and hold times whenever this device is chip selected.

2. Chip selects must be valid at each rising edge of CLK(when ADV is Low) to remain enabled.

3. A write cycle is defined by WE low having been registered into the device at ADV Low, A Read cycle is defined by WE High with ADV Low,

Both cases must meet setup and hold times.

4. To avoid bus contention, At a given voltage and temperature tL Z C is more than tHZC.

The specs as shown do not imply bus contention because tL Z C is a Min. parameter that is worst case at totally different test conditions

(0°C,3.465V) than tHZC , which is a Max. parameter(worst case at 70°C,3.135V)

It is not possible for two SRAMs on the same board to be at such different voltage and temperature.

- 13 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

SLEEP MODE

SLEEP MODE is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of

SLEEP MODE is dictated by the length of time the ZZ is in a High state.

After entering SLEEP MODE, all inputs except ZZ become disabled and all outputs go to High-Z

The ZZ pin is an asynchronous, active high input that causes the device to enter SLEEP MODE.

When the ZZ pin becomes a logic High, ISB2 is guaranteed after the time tZZI is met. Any operation pending when entering SLEEP

MODE is not guaranteed to successful complete. Therefore, SLEEP MODE (READ or WRITE) must not be initiated until valid pend-

ing operations are completed. similarly, when exiting SLEEP MODE during tPUS, only a DESELECT or READ cycle should be given

while the SRAM is transitioning out of SLEEP MODE.

SLEEP MODE ELECTRICAL CHARACTERISTICS

DESCRIPTION

CONDITIONS

SYMBOL

ISB2

MIN

MAX

UNITS

mA

Current during SLEEP MODE

ZZ ³ VIH

10

ZZ active to input ignored

tPDS

2

cycle

tPUS

ZZ inactive to input sampled

ZZ active to SLEEP current

tZZI

2

ZZ inactive to exit SLEEP current

tRZZI

0

SLEEP MODE WAVEFORM

K

tPDS

ZZ setup cycle

tPUS

ZZ recovery cycle

ZZ

tZZI

Isupply

ISB2

tRZZI

All inputs

(except ZZ)

Deselect or Read Only

Normal

operation

cycle

Outputs

(Q)

High-Z

DON¢T CARE

- 14 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

IEEE 1149.1 TEST ACCESS PORT AND BOUNDARY SCAN-JTAG

This part contains an IEEE standard 1149.1 Compatible Teat Access Port(TAP). The package pads are monitored by the Serial Scan

circuitry when in test mode. This is to support connectivity testing during manufacturing and system diagnostics. Internal data is not

driven out of the SRAM under JTAG control. In conformance with IEEE 1149.1, the SRAM contains a TAP controller, Instruction Reg-

ister, Bypass Register and ID register. The TAP controller has a standard 16-state machine that resets internally upon power-up,

therefore, TRST signal is not required. It is possible to use this device without utilizing the TAP. To disable the TAP controller without

interfacing with normal operation of the SRAM, TCK must be tied to VSS to preclude mid level input. TMS and TDI are designed so an

undriven input will produce a response identical to the application of a logic 1, and may be left unconnected. But they may also be

tied to VDD through a resistor. TDO should be left unconnected.

JTAG Instruction Coding

JTAG Block Diagram

IR2 IR1 IR0 Instruction

TDO Output

SAMPLE-Z Boundary Scan Register

IDCODE Identification Register

SAMPLE-Z Boundary Scan Register

Notes

0

1

0

1

0

1

0

1

0

1

0

1

2

1

3

4

3

0

BYPASS

SAMPLE

BYPASS

Bypass Register

Boundary Scan Register

Bypass Register

1

SRAM

CORE

1

PI

NOTE :

1. Places DQs in Hi-Z in order to sample all input data regardless of

other SRAM inputs.

2. TDI is sampled as an input to the first ID register to allow for the serial

shift of the external TDI data.

TDI

BYPASS Reg.

TDO

Identification Reg.

Instruction Reg.

3. Bypass register is initiated to VSS when BYPASS instruction is

invoked. The Bypass Register also holds serially loaded TDI when

exiting the Shift DR states.

4. SAMPLE instruction dose not places DQs in Hi-Z.

Control Signals

TAP Controller

TMS

TCK

TAP Controller State Diagram

1

0

Test Logic Reset

0

1

0

1

0

Run Test Idle

Select DR

Select IR

0

1

Capture DR

Capture IR

0

Shift DR

1

Shift IR

1

Exit1 DR

0

Exit1 IR

0

Pause DR

1

Pause IR

1

Exit2 DR

1

Exit2 IR

1

0

Update DR

0

Update IR

1

- 15 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

BOUNDARY SCAN ORDER INFORMATION

TBD

- 16 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

JTAG DC OPERATING CONDITIONS

Parameter

Symbol

Min

3.135

2.0 / 1.7

-0.3

Typ

Max

3.465

Unit

V

Note

Power Supply Voltage

VDD

VIH

VIL

3.3

Input High Level ( 3.3V I/O / 2.5V I/O )

Input Low Level ( 3.3V I/O / 2.5V I/O )

Output High Voltage( 3.3V I/O / 2.5V I/O )

Output Low Voltage( 3.3V I/O / 2.5V I/O )

-

VDD+0.3

0.8 / 0.7

-

V

VOH

VOL

2.4 / 2.0

-

V

0.4 / 0.4

V

NOTE : The input level of SRAM pin is to follow the SRAM DC specification.

JTAG AC TEST CONDITIONS

Parameter

Symbol

VIH/VIL

TR/TF

Min

Unit

V

Note

Input High/Low Level( 3.3V I/O , 2.5V I/O )

Input Rise/Fall Time( 3.3V I/O , 2.5V I/O )

Input and Output Timing Reference Level

3.0/0 , 2.5/0

1.0/1.0 , 1.0/1.0

VDDQ/2

ns

V

JTAG AC Characteristics

Parameter

Symbol

Min

50

20

5

Max

Unit

Note

TCK Cycle Time

tCHCH

tCHCL

tCLCH

tMVCH

tCHMX

tDVCH

tCHDX

tSVCH

tCHSX

tCLQV

-

ns

TCK High Pulse Width

TCK Low Pulse Width

TMS Input Setup Time

TMS Input Hold Time

TDI Input Setup Time

TDI Input Hold Time

-

5

-

5

-

5

-

SRAM Input Setup Time

SRAM Input Hold Time

Clock Low to Output Valid

5

-

5

-

0

10

JTAG TIMING DIAGRAM

TCK

tCHCH

tCHCL

tCLCH

tMVCH

tCHMX

tCHDX

TMS

TDI

tDVCH

tSVCH

tCHSX

PI

(SRAM)

tCLQV

TDO

- 17 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

- 18 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

- 19 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

- 20 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

- 21 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

- 22 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

PACKAGE DIMENSIONS

100-TQFP-1420A

Units ; millimeters/Inches

22.00 ± 0.30

20.00 ± 0.20

0~8°

0.10

0.05

0.127⁺_-

16.00 ±0.30

0.10 MAX

14.00 ± 0.20

(0.83)

0.50 ±0.10

#1

0.65

(0.58)

0.30 ± 0.10

0.10 MAX

1.40 ±0.10

1.60 MAX

0.05 MIN

0.50 ±0.10

- 23 -

May 2001

Rev 0.0

K7N323609M

K7N321809M

Preliminary

1Mx36 & 2Mx18 Pipelined NtRAM^TM

119BGA PACKAGE DIMENSIONS

1.27

14.00±0.10

22.00±0.10

Indicator of

Ball(1A) Location

20.50±0.10

C0.70

C1.00

0.750±0.15

1.50REF

0.60±0.10

NOTE :

1. All Dimensions are in Millimeters.

2. Solder Ball to PCB Offset : 0.10 MAX.

3. PCB to Cavity Offset : 0.10 MAX.

12.50±0.10

- 24 -

May 2001

Rev 0.0


型号：	K7N323609M-HC20
厂家：	SAMSUNG
描述：	SRAM 静态存储器
文件：	总24页 (文件大小：399K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

K7N323609M-HC20 [SAMSUNG]

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