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KAB02D100M-TLGP [SAMSUNG]

Multi-Chip Package MEMORY; 多芯片封装存储器
KAB02D100M-TLGP
型号: KAB02D100M-TLGP
厂家: SAMSUNG    SAMSUNG
描述:

Multi-Chip Package MEMORY
多芯片封装存储器

存储 内存集成电路 静态存储器
文件: 总72页 (文件大小:1366K)
中文:  中文翻译
下载:  下载PDF数据表文档文件

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