KM23C4100DET-12 [SAMSUNG]
MASK ROM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44;型号: | KM23C4100DET-12 |
厂家: | SAMSUNG |
描述: | MASK ROM, 256KX16, 120ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 有原始数据的样本ROM 光电二极管 内存集成电路 |
文件: | 总4页 (文件大小:72K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
KM23C4100D(E)T
CMOS MASK ROM
4M-Bit (512Kx8 /256Kx16) CMOS MASK ROM
GENERAL DESCRIPTION
FEATURES
The KM23C4100D(E)T is a fully static mask programmable
ROM fabricated using silicon gate CMOS process technology,
and is organized either as 524,288 x 8 bit(byte mode) or as
262,144 x 16 bit(word mode) depending on BHE voltage
level.(See mode selection table)
· Switchable organization
524,288 x 8(byte mode)
262,144 x 16(word mode)
· Fast access time : 80ns(Max.)
· Supply voltage : single +5V
· Current consumption
Operating : 50mA(Max.)
Standby : 50mA(Max.)
· Fully static operation
· All inputs and outputs TTL compatible
· Three state outputs
This device operates with a 5V single power supply, and all
inputs and outputs are TTL compatible.
Because of its asynchronous operation, it requires no external
clock assuring extremely easy operation.
It is suitable for use in program memory of microprocessor,
and data memory, character generator.
· Package
-. KM23C4100D(E)T : 44-TSOP2-400
The KM23C4100D(E)T is packaged in a 44-TSOP2.
FUNCTIONAL BLOCK DIAGRAM
PRODUCT INFORMATION
Operating
Temp
Vcc
Range
Speed
(ns)
Product
A17
X
MEMORY CELL
MATRIX
BUFFERS
AND
.
.
.
.
.
.
.
.
KM23C4100DT
KM23C4100DET
0°C~70°C
5.0V
80
(262,144x16/
524,288x8)
-20°C~85°C
DECODER
Y
SENSE AMP.
PIN CONFIGURATION
BUFFERS
AND
DATA OUT
BUFFERS
DECODER
A0
A-1
N.C
N.C
N.C
N.C
A8
1
2
44
43
42
41
40
39
. . .
A17
A7
3
4
A9
CE
A6
A5
A4
A3
A2
A1
A0
A10
A11
5
Q0/Q8
Q7/Q15
CONTROL
LOGIC
6
OE
38 A12
37 A13
7
BHE
8
A14
36
9
A15
35
10
11
A16
34
33
32
31
30
Pin Name
A0 - A17
Pin Function
TSOP
BHE
VSS
CE 12
VSS
13
Address Inputs
OE 14
Q15/A-1
Q7
Q0 - Q14
Data Outputs
Q0
Q8
Q1
Q9
15
16
17
18
Output 15(Word mode)/
LSB Address(Byte mode)
29 Q14
Q15 /A-1
Q6
Q13
Q5
28
27
26
25
24
23
BHE
CE
Word/Byte selection
Chip Enable
Q2 19
Q10 20
Q12
Q4
Q3
21
22
OE
Output Enable
Power(+5V)
Q11
VCC
VCC
VSS
N.C
Ground
KM23C4100D(E)T
No Connection
KM23C4100D(E)T
CMOS MASK ROM
ABSOLUTE MAXIMUM RATINGS
Item
Symbol
VIN
Rating
-0.3 to +7.0
-10 to +85
-55 to +150
0 to +70
Unit
Remark
Voltage on Any Pin Relative to VSS
Temperature Under Bias
Storage Temperature
V
-
TBIAS
TSTG
°C
°C
°C
°C
-
-
KM23C4100DT
KM23C4100DET
Operating Temperature
TA
-20 to +85
NOTE : Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted to the
conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum ratin conditions for extended periods may
affect device reliability.
RECOMMENDED OPERATING CONDITIONS(Voltage reference to VSS)
Item
Min
4.5
0
Symbol
Typ
5.0
0
Max
5.5
0
Unit
V
Supply Voltage
VCC
Supply Voltage
VSS
V
DC CHARACTERISTICS
Parameter
Symbol
Test Conditions
Min
Max
Unit
Operating Current
ICC
ISB1
ISB2
ILI
CE=OE=VIL, all outputs open
CE=VIH, all outputs open
CE=VCC, all outputs open
VIN=0 to VCC
-
50
mA
mA
mA
mA
mA
V
Standby Current(TTL)
-
-
1
50
Standby Current(CMOS)
Input Leakage Current
Output Leakage Current
Input High Voltage, All Inputs
Input Low Voltage, All Inputs
Output High Voltage Level
Output Low Voltage Level
-
10
ILO
VOUT=0 to VCC
-
10
VIH
VIL
2.2
-0.3
2.4
-
VCC+0.3
0.8
V
VOH
VOL
IOH=-400mA
-
V
IOL=2.1mA
0.4
V
NOTE : Minimum DC Voltage(VIL) is -0.3V an input pins. During transitions, this level may undershoot to -2.0V for periods <20ns.
Maximum DC voltage on input pins(VIH) is VCC+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
MODE SELECTION
CE
OE
BHE
X
Q15/A-1
Mode
Data
High-Z
Power
H
X
X
X
Standby
Operating
Operating
Standby
Active
L
H
X
High-Z
H
Output
Q0~Q15 : Dout
Active
L
L
Q0~Q7 : Dout
Q8~Q14 : Hi-Z
L
Input
Operating
Active
CAPACITANCE(TA=25°C, f=1.0MHz)
Item
Output Capacitance
Input Capacitance
Symbol
Test Conditions
VOUT=0V
Min8M bit
Max
10
Unit
pF
COUT
CIN
-
-
VIN=0V
10
pF
NOTE : Capacitance is periodically sampled and not 100% tested.
KM23C4100D(E)T
CMOS MASK ROM
AC CHARACTERISTICS(VCC=5V±10%, unless otherwise noted.)
TEST CONDITIONS
Item
Value
Input Pulse Levels
0.6V to 2.4V
10ns
Input Rise and Fall Times
Input and Output timing Levels
0.8V and 2.0V
Output Loads
1 TTL Gate and CL=100pF
READ CYCLE
KM23C4100D(E)T-8 KM23C4100D(E)T-10 KM23C4100D(E)T-12
Item
Symbol
Unit
Min
Max
Min
Max
Min
Max
Read Cycle Time
tRC
tACE
tAA
80
100
120
ns
ns
ns
ns
Chip Enable Access Time
Address Access Time
Output Enable Access Time
80
80
40
100
100
50
120
120
60
tOE
Output or Chip Disable to
Output High-Z
tDF
tOH
20
20
20
ns
ns
Output Hold from Address Change
0
0
0
TIMING DIAGRAM
READ
ADD
ADD1
ADD2
A0~A17
A-1(*1)
tRC
tDF(*3)
tACE
CE
OE
tOE
tAA
tOH
DOUT
D0~D7
VALID DATA
VALID DATA
D8~D15(*2)
NOTES :
*1. Byte Mode only. A-1 is Least Significant Bit Address.(BHE=VIL)
*2. Word Mode only.(BHE = VIH)
*3. tDF is defined as the time at which the outputs achieve the open circuit condition and is not referenced to VOH or VOL level.
KM23C4100D(E)T
CMOS MASK ROM
PACKAGE DIMENSIONS
(Unit : mm/inch)
44-TSOP2-400
0~8°
0.25
0.010
(
)
#44
#23
0.45 ~0.75
0.018 ~ 0.030
11.76±0.20
0.463±0.008
0.50
)
(
0.020
#1
#22
0.15 + 0.10
1.00±0.10
0.039±0.004
1.20
- 0.05
+ 0.004
18.81
0.741
0.006
- 0.002
MAX.
MAX.
0.047
18.41±0.10
0.725±0.004
0.10
0.004
MAX
0.80
0.0315
0.805
0.032
0.35±0.10
0.014±0.004
(
)
相关型号:
©2020 ICPDF网 联系我们和版权申明