M391B1G73AH0 [SAMSUNG]
DDR3 SDRAM Memory; DDR3 SDRAM内存
| 型号： | M391B1G73AH0 |
| 厂家： | 
SAMSUNG |
| 描述： | DDR3 SDRAM Memory |
| 文件： | 总23页 (文件大小：717K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
May. 2010
DDR3 SDRAM Memory
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
- 1 -
May. 2010
Product Guide
DDR3 SDRAM Memory
1. DDR3 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 B X X X X X X X - X X X X
Speed
Temp & Power
SAMSUNG Memory
DRAM
Package Type
DRAM Type
Density
Revision
Interface (VDD, VDDQ)
# of Internal Banks
Bit Organization
7. Interface ( VDD, VDDQ)
1. SAMSUNG Memory : K
2. DRAM : 4
6 : SSTL (1.5V, 1.5V)
8. Revision
M : 1st Gen.
A : 2nd Gen.
B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen
G : 8th Gen
H : 9th Gen
3. DRAM Type
B : DDR3 SDRAM
4. Density
51 : 512Mb
1G :
2G :
4G :
1Gb
2Gb
4Gb
9. Package Type
Z
: FBGA (Lead-free)
H : FBGA (Halogen-free & Lead-free)
: FBGA (Lead-free, DDP)
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
J
M : FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
L : Commercial Temp.( 0°C ~ 85°C) & Low Power
Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
11. Speed
F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9 : DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
- 2 -
May. 2010
Product Guide
DDR3 SDRAM Memory
2. DDR3 SDRAM Component Product Guide
Package & Power,
Density
Banks
Part Number
Org.
VDD Voltage
PKG
Avail.
NOTE
Temp. (-C/-L) & Speed
HC(L)F7/F8/H9/K0
K4B1G0446E
K4B1G0846E
256M x 4
128M x 8
78 ball
FBGA
HC(L)F7/F8/H9/K0
1.5V
96 ball
FBGA
1Gb E-die
8Banks
K4B1G1646E
HC(L)F7/F8/H9/K0
64M x 16
Now
K4B1G0446E
K4B1G0846E
K4B1G0446F
K4B1G0846F
K4B1G0446F
K4B1G0846F
K4B2G0446B
K4B2G0846B
HYF7/F8/H9
256M x 4
128M x 8
256M x 4
128M x 8
256M x 4
128M x 8
512M x 4
256M x 8
78 ball
FBGA
1.35V
1.5V
HYF7/F8/H9
HC(L)F8/H9/K0
HC(L)F8/H9/K0
HY(L)F8/H9
78 ball
FBGA
1Gb F-die
2Gb B-die
8Banks
8Banks
Now
Now
1.35V
HY(L)F8/H9
HC(L)F7/F8/H9
HC(L)F7/F8/H9
78 ball
FBGA
1.5V
96 ball
FBGA
K4B2G1646B
HC(L)F7/F8/H9
128M x 16
K4B2G0446B
K4B2G0846B
K4B2G0446C
K4B2G0846C
K4B2G0446C
K4B2G0846C
K4B2G0446E
K4B2G0846E
K4B4G0446A
K4B2G0846A
K4B4G0446A
K4B2G0846A
K4B4G0446B
K4B2G0846B
K4B4G0446C
K4B2G0846C
HYF7/F8/H9
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
512M x 4
256M x 8
1G x 4
78 ball
FBGA
1.35V
1.5V
HYF7/F8/H9
HC(L)F8/H9/K0
HC(L)F8/H9/K0
HY(L)F8/H9
78 ball
FBGA
2Gb C-die
DDP 2Gb E-die
4Gb A-die
8Banks
8Banks
8Banks
Now
Now
Now
1.35V
1.5V
HY(L)F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
HC(L)F8/H9/K0
HC(L)F8/H9/K0
HY(L)F8/H9/K0
HY(L)F8/H9/K0
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
MC(L)F7/F8/H9
78 ball
FBGA
1.5V
78 ball
FBGA
512M x 8
1G x 4
1.35V
1.5V
512M x 8
1G x 4
78 ball
FBGA
DDP 4Gb B-die
DDP 4Gb C-die
8Banks
8Banks
Now
512M x 8
1G x 4
78 ball
FBGA
1.5V
Feb.’10
512M x 8
* NOTE : 1.35V product is 1.5V operatable.
- 3 -
May. 2010
Product Guide
DDR3 SDRAM Memory
3. DDR3 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
M X X X B X X X X X X X - X X X
Memory Module
DIMM Type
Data bits
Speed
Temp & Power
PCB Revision
DRAM Component Type
Depth
Package
# of Banks in Comp. & Interface
Bit Organization
Component Revision
1. Memory Module : M
8. Component Revision
:
:
:
:
:
:
:
M
B
D
1st Gen.
3rd Gen.
5th Gen.
A
C
E
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
2. DIMM Type
F : 7th Gen.
G
3 : DIMM
4 : SODIMM
9. Package
:
:
:
:
Z
H
J
FBGA(Lead-free)
FBGA(Lead-free & Halogen-free)
FBGA(Lead-free, DDP)
3. Data Bits
71 : x64 204pin Unbuffered SODIMM
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
M
FBGA(Lead-free & Halogen-free, DDP)
10. PCB Revision
0 : None
1 : 1st Rev.
2 : 2nd Rev.
4 : 4th Rev.
3 : 3rd Rev.
S : Reduced Layer
4. DRAM Component Type
B : DDR3 SDRAM (1.5V VDD)
11. Temp & Power
5. Depth
C
Y
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
2G : 2G
33 : 32M (for 128Mb/512Mb)
65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
12. Speed
F7 : DDR3-800 (400MHz @ CL=6, tRCD=6, tRP=6)
2K : 2G (for 2Gb)
F8 : DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
K0 : DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
6. # of Banks in comp. & Interface
7 : 8Banks & SSTL-1.5V
NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066),
PC3-10600(DDR3-1333), PC3-12800(DDR3-1600)
7. Bit Organization
0 : x 4
3 : x 8
4 : x16
- 4 -
May. 2010
Product Guide
DDR3 SDRAM Memory
4. DDR3 SDRAM Module Product Guide
4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product)
240Pin DDR3 Unbuffered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail.
NOTE
M378B2873EH1
M378B2873FH0
M391B2873EH1
M391B2873FH0
M378B5673EH1
M378B5673FH0
M378B5773CH0
M391B5673EH1
M391B5673FH0
M391B5773CH0
M378B5273BH1
M378B5273CH0
M391B5273BH1
M391B5273CH0
CF8/H9
CF8/H9/K0*
CF8/H9
128M x 8
128M x 8
128M x 8
128M x 8
*
*
*
*
8 pcs 1Gb E-die
8 pcs 1Gb F-die
9 pcs 1Gb E-die
9 pcs 1Gb F-die
78 ball
FBGA
128Mx 64
1GB
A(1Rx8)
8
8
1
30mm
Now
78 ball
FBGA
128Mx 72
256Mx 64
1GB
2GB
D(1Rx8)
1
30mm
30mm
Now
Now
CF8/H9/K0*
CF8/H9
128M x 8 * 16 pcs 1Gb E-die
128M x 8 * 16 pcs 1Gb F-die
B(2Rx8)
A(1Rx8)
E(2Rx8)
D(1Rx8)
B(2Rx8)
8
8
2
1
2
1
2
78 ball
FBGA
CF8/H9/K0*
CF8/H9/K0*
CF8/H9
256M x 8
* 8 pcs 2Gb C-die
128M x 8 * 18 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb F-die
78 ball
FBGA
256Mx 72
2GB
CF8/H9/K0*
CF8/H9/K0*
CF8/H9
8
30mm
Now
256M x 8
* 9 pcs 2Gb C-die
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 16 pcs 2Gb C-die
256M x 8 * 18 pcs 2Gb B-die
256M x 8 * 18 pcs 2Gb C-die
78 ball
FBGA
512Mx 64
512Mx 72
4GB
4GB
8
8
30mm
30mm
Now
Now
CF8/H9/K0*
CF8/H9
78 ball
FBGA
E(2Rx8)
2
CF8/H9/K0*
78 ball
FBGA
1Gx 64
1Gx 72
8GB
8GB
M378B1G73AH0
M391B1G73AH0
CF8/H9/K0*
CF8/H9/K0*
B(2Rx8)
E(2Rx8)
512M x 8 * 16 pcs 4Gb A-die
512M x 8 * 18 pcs 4Gb A-die
8
8
2
2
30mm
30mm
Now
Now
78 ball
FBGA
* NOTE : K0(1600Mbps) will be available by ES level
4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product)
240Pin DDR3 Unbuffered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail.
NOTE
M391B2873EH1
M391B2873FH0
M391B5673EH1
M391B5673FH0
M391B5773CH0
M391B5273BH1
M391B5273CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
128M x 8
128M x 8
*
*
9 pcs 1Gb E-die
9 pcs 1Gb F-die
78 ball
FBGA
128Mx 72
1GB
D(1Rx8)
8
1
30mm
Now
128M x 8 * 18 pcs 1Gb E-die
128M x 8 * 18 pcs 1Gb F-die
E(2Rx8)
D(1Rx8)
E(2Rx8)
8
8
8
2
1
2
78 ball
FBGA
256Mx 72
2GB
30mm
Now
256M x 8
* 9 pcs 2Gb C-die
256M x 8 * 18 pcs 2Gb B-die
256M x 8 * 18 pcs 2Gb C-die
78 ball
FBGA
512Mx 72
1Gx 72
4GB
8GB
30mm
30mm
Now
Now
78 ball
FBGA
M391B1G73AH0
YF8/H9
E(2Rx8)
512M x 8 * 18 pcs 4Gb A-die
8
2
* NOTE : 1.35V product is 1.5V operatable.
- 5 -
May. 2010
Product Guide
DDR3 SDRAM Memory
4.3 204Pin DDR3 SoDIMM (1.5V Product)
204Pin DDR3 SODIMM
Composition
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Rank
PKG
Height Avail. NOTE
78 ball
FBGA
M471B2873EH1
M471B2874EH1
M471B2873FHS
CF8/H9
CF8/H9
CF8/H9
B(1Rx8)
A(2Rx16)
B(1Rx8)
128M x 8
*
8 pcs 1Gb E-die
8
8
8
1
2
1
128Mx 64
1GB
64M x 16 * 8 pcs 1Gb E-die
64M x 16 * 8 pcs 1Gb F-die
96 ball
30mm
30mm
Now
Now
78 ball
FBGA
M471B5673EH1
M471B5673FH0
M471B5773CHS
M471B5273BH1
M471B5273CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
128M x 8 * 16 pcs 1Gb E-die
128M x 8 * 16 pcs 1Gb F-die
F(2Rx8)
B(1Rx8)
F(2Rx8)
8
8
8
2
1
2
78 ball
FBGA
256Mx 64
2GB
256M x 8
* 8 pcs 2Gb C-die
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 16 pcs 2Gb C-die
78 ball
FBGA
512Mx 64
1Gx 64
4GB
8GB
30mm
30mm
Now
Now
78 ball
FBGA
M471B1G73AH0
CF8/H9
F(2Rx8)
512M x 8 * 16 pcs 4Gb A-die
8
2
4.4 204Pin DDR3 SoDIMM (1.35V Product)
204Pin DDR3 SODIMM
Comp.
Composition
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Rank
PKG
Height
Avail.
NOTE
Version
78 ball
FBGA
128Mx 64
1GB
M471B2873FHS
YF8/H9
B(1Rx8)
128M x 8
*
8 pcs 1Gb F-die
8
1
30mm
30mm
Now
Now
M471B5673FH0
M471B5773CHS
M471B5273BH1
M471B5273CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
F(2Rx8)
B(1Rx8)
128M x 8 * 16 pcs 1Gb F-die
256M x 8 8 pcs 2Gb C-die
8
8
2
1
78 ball
FBGA
256Mx 64
2GB
*
256M x 8 * 16 pcs 2Gb B-die
256M x 8 * 16 pcs 2Gb C-die
78 ball
FBGA
512Mx 64
1Gx 64
4GB
8GB
F(2Rx8)
F(2Rx8)
8
8
2
2
30mm
30mm
Now
Now
78 ball
FBGA
M471B1G73AH0
YF8/H9
512M x 8 * 16 pcs 4Gb A-die
* NOTE : 1.35V product is 1.5V operatable.
- 6 -
May. 2010
Product Guide
DDR3 SDRAM Memory
4.5 240Pin DDR3 Registered DIMM (1.5V Product)
240Pin DDR3 Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height Avail. NOTE
M393B2873EH1
M393B2873FH0
M393B5673EH1
M393B5673FH0
M393B5670EH1
M393B5670FH0
M393B5773CH0
M393B5173EH1
M393B5173FH0
M393B5170EH1
M393B5170FH0
M393B5273BH1
M393B5273CH0
M393B5270BH1
M393B5270CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8
128M x 8
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
9 pcs
9 pcs
1Gb E-die
1Gb F-die
78 ball
FBGA
128Mx 72
1GB
A(1Rx8)
8
8
1
30mm
30mm
Now
Now
128M x 8
128M x 8
128M x 8
256M x 4
256M x 4
256M x 8
128M x 8
128M x 8
256M x 4
256M x 4
256M x 8
256M x 8
512M x 4
512M x 4
18 pcs 1Gb E-die
18 pcs 1Gb F-die
18 pcs 1Gb E-die
18 pcs 1Gb F-die
B(2Rx8)
2
1
78 ball
FBGA
256Mx 72
2GB
C(1Rx4)
A(1Rx8)
H(4Rx8
9 pcs
2Gb C-die
36 pcs 1Gb E-die
36 pcs 1Gb F-die
36 pcs 1Gb E-die
36 pcs 1Gb F-die
18 pcs 2Gb B-die
18 pcs 2Gb C-die
18 pcs 2Gb B-die
18 pcs 2Gb C-die
4
2
2
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
E(2Rx4)
B(2Rx8)
8
78 ball
FBGA
512Mx 72
4GB
30mm
Now
C(1Rx4)
1
4
4
DDP
x 4
M393B1G70EM1
CF8
F(4Rx4)
H(4Rx8)
*
36 pcs 1Gb E-die
512M
M393B1K73BH1
M393B1K73CH0
M393B1K70BH1
M393B1K70CH0
CF8
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
36 pcs 2Gb B-die
36 pcs 2Gb C-die
36 pcs 2Gb B-die
36 pcs 2Gb C-die
78 ball
FBGA
1Gx 72
8GB
8
30mm
Now
CF8/H9
CF8/H9
CF8/H9
E(2Rx4)
F(4Rx4)
2
4
DDP
x 4
M393B2K70BM1
M393B2K70CM0
CF8
*
*
36 pcs 2Gb B-die
36 pcs 2Gb C-die
1G
DDP
x 4
78 ball
FBGA
CF8/H9
2Gx 72
4Gx 72
16GB
32GB
8
8
30mm
30mm
Now
Now
1G
M393B2G70AH0
M393B2G73AH0
CF8/H9
CF8/H9
E(2Rx4)
H(4Rx8)
1G x 4
*
*
36 pcs 4Gb A-die
36 pcs 4Gb A-die
2
4
512M x 8
DDP
x 4
78 ball
FBGA
M393B4G70AH0
CF8/H9
AB(4Rx4)
*
36 pcs 4Gb A-die
4
2G
- 7 -
May. 2010
Product Guide
DDR3 SDRAM Memory
4.6 240Pin DDR3 Registered DIMM (1.35V Product)
240Pin DDR3 Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height Avail.
NOTE
M393B2873EH1
M393B2873FH0
M393B5673EH1
M393B5673FH0
M393B5670EH1
M393B5670FH0
M393B5773CH0
M393B5173EH1
M393B5173FH0
M393B5170EH1
M393B5170FH0
M393B5273BH1
M393B5273CH0
M393B5270BH1
M393B5270CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8
128M x 8
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
9 pcs
9 pcs
1Gb E-die
1Gb F-die
78 ball
FBGA
128Mx 72
1GB
A(1Rx8)
8
1
30mm
30mm
Now
Now
128M x 8
128M x 8
128M x 8
256M x 4
256M x 4
256M x 8
128M x 8
128M x 8
256M x 4
256M x 4
256M x 8
256M x 8
512M x 4
512M x 4
18 pcs 1Gb E-die
18 pcs 1Gb F-die
18 pcs 1Gb E-die
18 pcs 1Gb F-die
B(2Rx8)
8
8
2
1
78 ball
FBGA
256Mx 72
2GB
C(1Rx4)
A(1Rx8)
H(4Rx8)
9 pcs
2Gb C-die
36 pcs 1Gb E-die
36 pcs 1Gb F-die
36 pcs 1Gb E-die
36 pcs 1Gb F-die
18 pcs 2Gb B-die
18 pcs 2Gb C-die
18 pcs 2Gb B-die
18 pcs 2Gb C-die
8
8
8
4
2
2
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
E(2Rx4)
B(2Rx8)
78 ball
FBGA
512Mx 72
4GB
30mm
Now
C(1Rx4)
F(4Rx4)
H(4Rx8)
8
8
8
1
4
4
DDP
x 4
M393B1G70EM1
YF8
*
36 pcs 1Gb E-die
512M
M393B1K73BH1
M393B1K73CH0
M393B1K70BH1
M393B1K70CH0
YF8
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
36 pcs 2Gb B-die
36 pcs 2Gb C-die
36 pcs 2Gb B-die
36 pcs 2Gb C-die
78 ball
FBGA
1Gx 72
8GB
30mm
Now
YF8/H9
YF8/H9
YF8/H9
E(2Rx4)
F(4Rx4)
8
2
DDP
x 4
M393B2K70BM1
M393B2K70CM0
YF8
*
*
36 pcs 2Gb B-die
36 pcs 2Gb C-die
1G
DDP
x 4
78 ball
FBGA
YF8/H9
2Gx 72
4Gx 72
16GB
32GB
8
8
4
4
30mm
30mm
Now
Now
1G
M393B2G70AH0
M393B2G73AH0
YF8/H9
YF8/H9
E(2Rx4)
H(4Rx8)
1G x 4
*
*
36 pcs 4Gb A-die
36 pcs 4Gb A-die
512M x 8
DDP
x 4
78 ball
FBGA
M393B4G70AH0
YF8/H9
AB(4Rx4)
*
36 pcs 4Gb A-die
2G
* NOTE : 1.35V product is 1.5V operatable.
- 8 -
May. 2010
Product Guide
DDR3 SDRAM Memory
4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product)
240Pin DDR3 VLP Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail. NOTE
M392B2873EH1
M392B2873FH0
M392B5673EH1
M392B5673FH0
M392B5670EH1
M392B5670FH0
M392B5773CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
128M x 8
*
*
*
*
*
*
*
9 pcs
1Gb E-die
1Gb F-die
1Gb E-die
1Gb F-die
1Gb E-die
1Gb F-die
1Gb F-die
78 ball
FBGA
128Mx 72
1GB
K(1Rx8)
8
1
18.75mm
Now
128M x 8
128M x 8
128M x 8
256M x 4
256M x 4
128M x 8
9 pcs
18 pcs
18 pcs
18 pcs
18 pcs
9 pcs
L(2Rx8
2
78 ball
FBGA
256Mx 72
2GB
8
18.75mm
Now
M(1Rx4)
K(1Rx8)
1
1
DDP
x 4
M392B5170EM1
M392B5170FM0
CF8/H9
CF8/H9
*
*
18 pcs
18 pcs
1Gb E-die
1Gb F-die
512M
N(2Rx4)
2
DDP
x 4
512M
78 ball
FBGA
512Mx 72
4GB
8
18.75mm
Now
M392B5273BH1
M392B5273CH0
M392B5270BH1
M392B5270CH0
CF8/H9
CF8/H9
CF8/H9
CF8/H9
256M x 8
256M x 8
512M x 4
512M x 4
*
*
*
*
18 pcs
18 pcs
18 pcs
18 pcs
2Gb B-die
2Gb C-die
2Gb B-die
2Gb C-die
L(2Rx8)
M(1Rx4)
2
1
DDP
x 8
M392B1K73BM1
M392B1K73CM0
M392B1K70BM1
M392B1K70CM0
M392B2G70AM0
M392B2G73AM0
CF8
*
*
*
*
*
*
18 pcs
18 pcs
18 pcs
18 pcs
18 pcs
18 pcs
2Gb B-die
2Gb C-die
2Gb B-die
2Gb C-die
4Gb A-die
4Gb A-die
512M
V(4Rx8)
N(2Rx4)
4
2
DDP
x 8
CF8/H9
CF8/H9
CF8/H9
CF8/H9
CF8/H9
512M
78 ball
FBGA
1Gx 72
8GB
8
8
18.75mm
18.75mm
Now
DDP
x 4
1G
DDP
x 4
1G
DDP
x4
N(2Rx4)
V(4Rx8)
2
4
Jun.’10
Jun.’10
2G
78 ball
FBGA
2Gx 72
16GB
DDP
x8
1G
- 9 -
May. 2010
Product Guide
DDR3 SDRAM Memory
4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)
240Pin DDR3 VLP Registered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Raw Card
Composition
Rank
PKG
Height
Avail. NOTE
M392B2873EH1
M392B2873FH0
M392B5673EH1
M392B5673FH0
M392B5670EH1
M392B5670FH0
M392B5773CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
128M x 8
128M x 8
*
*
9 pcs
9 pcs
1Gb
1Gb
E-die
F-die
E-die
F-die
E-die
F-die
C-die
78 ball
FBGA
128Mx 72
1GB
K(1Rx8)
8
8
1
18.75mm
Now
128M x 8 * 18 pcs 1Gb
128M x 8 * 18 pcs 1Gb
256M x 4 * 18 pcs 1Gb
256M x 4 * 18 pcs 1Gb
L(2Rx8)
M(1Rx4)
2
78 ball
FBGA
256Mx 72
2GB
18.75mm
Now
8
8
8
1
2
2
K(1Rx8)
N(2Rx4)
N(2Rx4)
512M x 4
DDP
*
9 pcs
2Gb
M392B5170EM1
YF8/H9
x 4 * 18 pcs 1Gb
E-die
512M
M392B5170FM0
M392B5273BH1
M392B5273CH0
M392B5270BH1
M392B5270CH0
YF8/H9
YF8/H9
YF8/H9
YF8/H9
YF8/H9
512M x 4 * 18 pcs 1Gb
256M x 8 * 18 pcs 2Gb
256M x 8 * 18 pcs 2Gb
512M x 4 * 18 pcs 2Gb
512M x 4 * 18 pcs 2Gb
F-die
B-die
C-die
B-die
C-die
78 ball
FBGA
512Mx 72
4GB
18.75mm
Now
L(2Rx8)
M(1Rx4)
8
8
1
4
DDP
M392B1K73BM1
M392B1K73CM0
M392B1K70BM1
M392B1K70CM0
M392B2G70AM0
M392B2G73AM0
YF8
x 8 * 18 pcs 2Gb
512M
B-die
C-die
B-die
C-die
A-die
A-die
V(4Rx8)
N(2Rx4)
DDP
YF8
x 8 * 18 pcs 2Gb
512M
78 ball
FBGA
1Gx 72
2Gx 72
8GB
18.75mm
18.75mm
Now
DDP
YF8/H9
YF8/H9
YF8/H9
YF8/H9
x 4 * 18 pcs 2Gb
1G
8
8
2
DDP
x 4 * 18 pcs 2Gb
1G
DDP
N(2Rx4)
V(4Rx8)
x4 * 18 pcs 4Gb
2G
2
4
Now
78 ball
FBGA
16GB
DDP
x8 * 18 pcs 4Gb
1G
Jun.’10
* NOTE : 1.35V product is 1.5V operatable.
- 10 -
May. 2010
Product Guide
DDR3 SDRAM Memory
5. RDIMM RCD Information
5.1 5.1 RCD Identification in JEDEC Description in Module Label
5.2 5.2 Label Example
4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P1
0920
M393B5170EH1-CH9
Made in Korea
5.3 RCD Information
- Example
Voltage
Vendor
Inphi
IDT
Revision
Module P/N
JEDEC Description On Label
4GB 2Rx4 PC3-10600R-09-10-E1-P1
4GB 2Rx4 PC3-10600R-09-10-E1-D2
4GB 2Rx4 PC3L-8500R-07-10-E1-P1
4GB 2Rx4 PC3L-8500R-07-10-E1-D2
LV GS02 C0
LV DDR3 B0
LV GS02 C0
LV DDR3 B0
M393B5170EH1-CH9
M393B5170EH1-CH9
M393B5170EH1-YF8
M393B5170EH1-YF8
1.5V
Inphi
IDT
1.35V
- 11 -
May. 2010
Product Guide
DDR3 SDRAM Memory
6. Package Dimension
78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
(Datum A)
(Datum B)
0.80 1.60
3.20
7.50 ± 0.10
#A1
B
9
8
7
6
5
4
3
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
1.10 ± 0.10
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 A B
MOLDING AREA
(1.90)
M
Top
Bottom
96Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
0.80 1.60
3.20
7.50 ± 0.10
#A1
B
9
8
7
6
5
4
3
2 1
A
B
C
D
E
F
(Datum A)
(Datum B)
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05
1.10 ± 0.10
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.05 ± 0.05)
0.2 A B
MOLDING AREA
(1.90)
M
Top
Bottom
- 12 -
May. 2010
Product Guide
DDR3 SDRAM Memory
78Ball FBGA for 2Gb B-die (x4/x8)
9.00 ± 0.10
A
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
3.20
9.00 ± 0.10
#A1
9
8
7
6
5
4
3
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
1.10 ± 0.10
(0.95)
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
MOLDING AREA
(1.90)
M
Top
Bottom
96Ball FBGA for 2Gb B-die (x16)
9.00 ± 0.10
A
#A1 INDEX MARK
0.80 1.60
3.20
9.00 ± 0.10
#A1
B
9
8
7
6
5
4
3
2 1
A
B
C
D
E
F
(Datum A)
(Datum B)
G
H
J
K
L
M
N
P
R
T
0.35 ± 0.05
1.10 ± 0.10
(0.95)
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
MOLDING AREA
(1.90)
M
Top
Bottom
- 13 -
May. 2010
Product Guide
DDR3 SDRAM Memory
78Ball DDP for 1Gb E-die (x4/x8)
9.00 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
3.20
3
9.00 ± 0.10
#A1
9
8
7
6
5
4
2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
1.40 ± 0.10
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
M
Top
Bottom
78Ball DDP for 2Gb B-die (x4/x8)
10.00 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
B
(Datum A)
(Datum B)
0.80 1.60
3.20
10.00 ± 0.10
#A1
9
8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
0.35 ± 0.05
1.40 ± 0.10
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
M
Top
Bottom
- 14 -
May. 2010
Product Guide
DDR3 SDRAM Memory
78Ball DDP for 2Gb C-die (x4/x8)
8.00 ± 0.10
A
0.80 x 8 = 6.40
#A1 INDEX MARK
B
(Datum A)
0.80 1.60
3.20
3
8.00 ± 0.10
#A1
9
8
7
6
5
4
2 1
A
B
C
D
E
F
(Datum B)
G
H
J
K
L
M
N
0.35 ± 0.05
1.40 ± 0.10
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
M
TOP VIEW
BOTTOM VIEW
78Ball for 4Gb A-die (x4/x8)
10.00 ± 0.10
A
0.80 x 8 = 6.40
3.20
#A1 INDEX MARK
B
(Datum A)
0.80
1.60
10.00 ± 0.10
#A1
9
8
7
6
5
4
3 2 1
A
B
C
D
E
F
(Datum B)
G
H
J
K
L
M
N
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 A B
(0.95)
MOLDING AREA
0.35 ± 0.05
1.10 ± 0.10
(1.90)
M
BOTTOM VIEW
TOP VIEW
- 15 -
May. 2010
Product Guide
7. Module Dimension
DDR3 SDRAM Memory
x64/x72 240pin DDR3 SDRAM Unbuffered DIMM
Units : Millimeters
133.35 ± 0.15
128.95
N/A
(for x64)
SPD
ECC
(for x72)
(2)
2.50
54.675
A
B
Max 4.0
47.00
71.00
N/A
(for x64)
ECC
(for x72)
1.270 ± 0.10
5.00
2x 2.10 ± 0.15
0.80 ± 0.05
0.2 ± 0.15
3.80
1.50±0.10
1.00
2.50
Detail A
Detail B
- 16 -
May. 2010
Product Guide
DDR3 SDRAM Memory
x64 204pin DDR3 SDRAM Unbuffered SODIMM
Units : Millimeters
0.10 M C A B
67.60
63.60
Max 3.8
1.00 ± 0.10
24.80
21.00
A
B
39.00
2X 1.80
0.10 M C A B
(OPTIONAL HOLES)
2X 4.00 ± 0.10
0.10 M C A B
0.60
0.45 ± 0.03
1.65
4.00 ± 0.10
2.55
0.25 MAX
1.00 ± 0.10
Detail A
Detail B
- 17 -
May. 2010
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM Registered DIMM
Units : Millimeters
Max 4.0
133.35 ± 0.15
128.95
C
10.9
9.76
18.92
32.40
18.93
9.74
2.50
1.0 max
54.675
47.00
A
B
1.27 ± 0.10
71.00
5.00
0.80 ± 0.05
3.80
0.2 ± 0.15
10.9
0.4
2.50
1.00
1.50±0.10
Detail A
Detail B
Detail C
2x 2.10 ± 0.15
Address, Command and Control lines
- 18 -
May. 2010
Product Guide
DDR3 SDRAM Memory
Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
133.15 ± 0.2
0.65 ± 0.2
130.45 ± 0.15
9.26
29.77
11.9
31.4
0.15
1.3
1
127 ± 0.12
1.3
Inside
Green Line : TIM Attatch Line
Reg. pedestal line
80.78
119.29
128.5
2. BACK PART
Outside
Inside
Green Line : TIM Attatch Line
- 19 -
May. 2010
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
39.3 ± 0.2
Upper Bending
Tilting Gap
29.77
0.1 ~ 0.3
A
B
C
0.5
4. DDR3 RDIMM ASS’Y View
Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness)
132.95 ± 133.45
39.3 ± 0.2
D
K
E (Clip open size)
text mark ’B’ or ’K’
punch press_stamp
- 20 -
May. 2010
Product Guide
DDR3 SDRAM Memory
x72 240pin DDR3 SDRAM VLP Registered DIMM
Units : Millimeters
133.35 ± 0.15
128.95
C
Max 4.0
9.76
20.92
32.40
20.93
9.74
54.675
A
B
1.0 max
47.00
71.00
1.27 ± 0.10
SPD/TS
18.10
5.00
0.80 ± 0.05
9.9
3.80
0.2 ± 0.15
1.50±0.10
1.00
2.50
Detail A
Detail B
Detail C
SPD/TS
Address, Command and Control lines
- 21 -
May. 2010
Product Guide
DDR3 SDRAM Memory
VLP Registered DIMM Heat Spreader Design
1. FRONT PART
Outside
130.45
67
8.69
20.82
17.9
6.4
20.82
8.69
Driver
IC(DP:0.18mm)
DRIVER IC 0.18 -0/+0.1
Inside
Driver
IC(DP:0.18mm)
2. BACK PART
Outside
Driver
IC(DP:0.18mm)
Inside
Driver
IC(DP:0.18mm)
- 22 -
May. 2010
Product Guide
DDR3 SDRAM Memory
3. CLIP PART
35.82
7.4 ± 0.1
7.4 ± 0.1
Clip open size
3.2~4.5
0.1
SIDE-L
FRONT
SIDE-R
4. ASS’Y VIEW
Reference thickness total (Maximum) : 7.71 (With Clip thickness)
TIM Thickness 0.25
* Dimension Index
Mono
Typ.
43.9
6.8
DDP
Typ.
44.4
7.3
6.3
7.3
-
Note
Min.
-
Max.
-
Min.
-
Max.
-
A
B
6.7
-
6.9
-
7.2
-
7.4
-
C
5.8
D
6.7
2.5
6.8
6.9
3.6
7.2
2.6
7.4
3.8
E (Clip open size)
-
- 23 -
相关型号：
M391B1G73AH0-CF8
DDR DRAM Module, 1GX72, 20ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
SAMSUNG
M391B1G73AH0-CH9
DDR DRAM Module, 1GX72, 20ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
SAMSUNG
M391B1G73AH0-CK0
DDR DRAM Module, 1GX72, 20ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
SAMSUNG
M391B1G73AH0-YF8
DDR DRAM Module, 1GX64, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
SAMSUNG
M391B1G73AH0-YH9
DDR DRAM Module, 1GX64, 0.255ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240
SAMSUNG
©2020 ICPDF网 联系我们和版权申明