M395T5160QZH4 [SAMSUNG]
DDR2 SDRAM Memory; DDR2 SDRAM内存
| 型号： | M395T5160QZH4 |
| 厂家： | 
SAMSUNG |
| 描述： | DDR2 SDRAM Memory |
| 文件： | 总14页 (文件大小：389K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Apr. 2010
DDR2 SDRAM Memory
Product Guide
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
- 1 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
1. DDR2 SDRAM MEMORY ORDERING INFORMATION
1
2
3
4
5
6
7
8
9
10
11
K 4 T X X X X X X X - X X X X
SAMSUNG Memory
DRAM
Speed
Temp & Power
DRAM Type
Density
Package Type
Revision
Bit Organization
Interface (VDD, VDDQ)
# of Internal Banks
8. Revision
M : 1st Gen.
1. SAMSUNG Memory : K
2. DRAM : 4
A : 2nd Gen.
B : 3rd Gen.
C : 4th Gen.
D : 5th Gen.
E : 6th Gen.
F : 7th Gen.
G : 8th Gen.
H : 9th Gen.
3. DRAM Type
T : DDR2 SDRAM
4. Density
I
: 10th Gen.
Q : 17th Gen.
R : 18th Gen.
56 : 256Mb
51 : 512Mb
1G :
2G :
4G :
1Gb
2Gb
4Gb
9. Package Type
Z : FBGA (Lead-free)
J : FBGA DDP (Lead-free)
5. Bit Organization
H : FBGA (Lead-free & Halogen-free)
04 : x 4
M : FBGA DDP (Lead-free & Halogen-free)
T : FBGA DSP (Lead-free & Halogen-free, Thin)
B : FBGA (Lead-free & Halogen-free, Flip Chip)
06 : x 4 Stack
07 : x 8 Stack
08 : x 8
16 : x16
26 : x 4 Stack (JEDEC Standard)
27 : x 8 Stack (JEDEC Standard)
10. Temp & Power
C : Commercial Temp.( 0°C ~ 95°C) & Normal Power
L : Commercial Temp.( 0°C ~ 95°C) & Low Power
Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
7. Interface ( VDD, VDDQ)
11. Speed
CC : DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3)
D5 : DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4)
E6 : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
F7 : DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6)
E7 : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5)
Q : SSTL_18 (1.8V, 1.8V)
- 2 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
2. DDR2 SDRAM Component Product Guide
2.1 SDRAM
Density
Banks
Part Number
K4T51043QI
K4T51083QI
Org.
PKG
Avail.
Package & Power, Temp. (-C/-L) & Speed
HCE7/F7/E6
HCE7/F7/E6
128M x 4
64M x 8
60 ball
FBGA
512Mb I-die
4Banks
Now
84 ball
FBGA
K4T51163QI
HCF8/E7/F7/E6
32M x 16
K4T1G044QQ
K4T1G084QQ
HC(L)E7/F7/E6
HC(L)E7/F7/E6
256M x 4
128M x 8
60 ball
FBGA
1Gb Q-die
1Gb E-die
8Banks
8Banks
Now
84 ball
FBGA
K4T1G164QQ
HC(L)E7/F7/E6
64M x 16
K4T1G044QE
K4T1G084QE
HC(L)E7/F7/E6
HC(L)E7/F7/E6
256M x 4
128M x 8
60 ball
FBGA
Now
Now
84 ball
FBGA
K4T1G164QE
HC(L)E7/F7/E6
64M x 16
K4T1G044QF
K4T1G084QF
BCE7/F7/E6
BCE7/F7/E6
256M x 4
128M x 8
60 ball
FBGA
Jun. ’10
May. ’10
Now
1Gb F-die
2Gb A-die
8Banks
8Banks
84 ball
FBGA
K4T1G164QF
BCE7/F7/E6
64M x 16
K4T2G044QA
K4T2G084QA
HC(L)F7/E6
HC(L)F7/E6
512M x 4
256M x 8
68 ball
FBGA
- 3 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
3. DDR2 SDRAM Module Ordering Information
1
2
3
4
5
6
7
8
9
10
11
12
13
M X X X T X X X X X X X - X X X X
Memory Module
AMB Vendor
Speed
DIMM Type
Data bits
DRAM Component Type
Temp & Power
PCB Revision
Package
Depth
# of Banks in Comp. & Interface
Bit Organization
Component Revision
1. Memory Module : M
2. DIMM Type
8. Component Revision
M
B
D
F
I
: 1st Gen.
: 3rd Gen.
: 5th Gen.
: 7th Gen.
: 10th Gen.
: 18th Gen.
A
C
E
G
Q
: 2nd Gen.
: 4th Gen.
: 6th Gen.
: 8th Gen.
: 17th Gen.
3 : DIMM
4 : SODIMM
R
3. Data Bits
9. Package
78 : x64 240pin Unbuffered DIMM
91 : x72 240pin ECC unbuffered DIMM
92 : x72 240pin VLP Registered DIMM
93 : x72 240pin Registered DIMM
95 : x72 240pin Fully Buffered DIMM
70 : x64 200pin Unbuffered SODIMM
Z
J
: FBGA(Lead-free)
: FBGA DDP (Lead-free)
Q
H
M
E
B
: FBGA QDP (Lead-free)
: FBGA (Lead-free & Halogen-free)
: FBGA DDP (Lead-free & Halogen-free)
: FBGA QDP (Lead-free & Halogen-free)
: FBGA (Lead-free & Halogen-free, Flip Chip)
4. DRAM Component Type
T : DDR2 SDRAM
10. PCB Revision
0 : Mother PCB
2 : 2nd Rev.
5. Depth
1 : 1st Rev.
3 : 3rd Rev.
A : Parity DIMM
S : Reduced PCB
32 : 32M
64 : 64M
28 : 128M
56 : 256M
51 : 512M
1G : 1G
33 : 32M (for 128Mb/512Mb)
65 : 64M (for 128Mb/512Mb)
29 : 128M (for 128Mb/512Mb)
57 : 256M (for 512Mb/2Gb)
52 : 512M (for 512Mb/2Gb)
1K : 1G (for 2Gb)
4 : 4th Rev.
11. Temp & Power
C
L
Y
: Commercial Temp.( 0°C ~ 95°C) & Normal Power
: Commercial Temp.( 0°C ~ 95°C) & Low Power
: Commercial Temp.( 0°C ~ 95°C) & Low Voltage
6. # of Banks in comp. & Interface
5 : 4Banks & SSTL-1.8V
6 : 8Banks & SSTL-1.8V
12. Speed
CC : DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3)
D5 : DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4)
E6 : DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
F7 : DDR2-800 (400MHz @ CL=6, tRCD=6, tRP=6)
E7 : DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5)
7. Bit Organization
0 : x 4
3 : x 8
4 : x16
6 : x 4 Stack (JEDEC Standard)
7 : x 8 Stack (JEDEC Standard)
8 : x 4 Stack
13. AMB Vendor For FBDIMM
5
: Intel
6, 8 : IDT
3, 4 : Montage
9 : x 8 Stack
NOTE : PC2-6400(DDR2-800), PC2-5300(DDR2-667)
PC2-4200(DDR2-533), PC2-3200(DDR2-400)
- 4 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
4. DDR2 SDRAM Module Product Guide
240Pin DDR2 Unbuffered DIMM
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
Composition
Rank
PKG
Height
Avail.
M378T6464QZ(H)3
M378T6464EHS
M378T2863QZ(H)S
M378T2863EHS
M378T2863FBS
M391T2863QZ(H)3
M391T2863EH3
M391T2863FB3
M378T5663QZ(H)3
M378T5663EH3
M378T5663FB3
M391T5663QZ(H)3
M391T5663EH3
M391T5663FB3
M378T5263AZ(H)3
M391T5263AZ(H)3
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CE7/F7/E6
CF7/E6
64M x 16
64M x 16
*
*
4pcs
4pcs
1Gb
Q-die
E-die
Q-die
E-die
F-die
Q-die
E-die
F-die
Q-die
E-die
F-die
Q-die
E-die
F-die
A-die
A-die
1
1
84 ball
FBGA
64Mx 64
512MB
8
30mm
Now
1Gb
1Gb
1Gb
1Gb
1Gb
1Gb
1Gb
1Gb
Now
Jun. ’10
Now
128Mx 64
128Mx 72
256Mx 64
256Mx 72
128M x
128M x
128M x
128M x
8
8
8
8
*
*
*
*
8pcs
9pcs
8
8
1
1
60 ball
FBGA
1GB
30mm
Jun. ’10
Now
16pcs 1Gb
1Gb
Jun. ’10
Now
60 ball
FBGA
2GB
4GB
8
8
2
2
30mm
30mm
1Gb
18pcs 1Gb
1Gb
Jun. ’10
Now
512Mx 64
512Mx 72
256M x
256M x
8
8
*
*
16pcs 2Gb
18pcs 2Gb
68 ball
FBGA
CF7/E6
- 5 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
200Pin DDR2 SODIMM
Composition
Comp.
Version
Internal
Banks
Org.
Density
Part Number
Speed
C(L)E7/F7/E6
Rank
PKG
Height
Avail.
M470T6464QZ(H)3
M470T6464EHS
M470T6554IH3
1Gb
1Gb
Q-die
E-die
I-die
64M x 16
32M x 16
64M x 16
*
*
*
4pcs
8
4
1
2
2
84 ball
FBGA
64Mx 64 512MB
C(L)E7/F7/E6
CE6
30mm
Now
8pcs 512Mb
M470T2864QZ(H)3
M470T2864EH3
M470T2863EH3
M470T2863FB3
M470T5663QZ(H)3
M470T5663EH3
M470T5663FB3
C(L)E7/F7/E6
C(L)E7/F7/E6
C(L)E7/F7/E6
CE7/F7/E6
C(L)E7/F7/E6
C(L)E7/F7/E6
CE7/F7/E6
1Gb
Q-die
84 ball
FBGA
8pcs
Now
128Mx 64
1GB
1Gb
E-die
8
30mm
60 ball
FBGA
128M x
8
*
8pcs
1Gb
1
F-die
Q-die
E-die
F-die
May. ’10
Now
1Gb
60 ball
FBGA
256Mx 64
512Mx 64
2GB
4GB
128M x
8
8
*
*
16pcs
8pcs
1Gb
1Gb
8
8
2
2
30mm
30mm
May. ’10
Now
83 ball
FBGA
M470T5267AZ(H)3
C(L)F7/E6
st.512M x
2Gb
A-die
- 6 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 Registered DIMM
Comp.
Composition
Internal
Banks
Org.
Density
Part Number
Speed
Rank
PKG
Height
Avail.
Version
M393T2863QZ(H)3
M393T2863QZ(H)A
M393T2863FB3
CD5/CC
CE7/F7/E6
CE7/F7/E6
CD5/CC
1Gb
1Gb
Q-die
8
8
1
1
2
Now
60 ball
FBGA
128Mx 72
1GB
128M x 8 * 9pcs
128M x 8 * 18pcs
256M x 4 * 18pcs
30mm
F-die
Jun. ’10
M393T5663QZ3
M393T5663QZ(H)A
M393T5660QZ3
M393T5660QZ(H)A
M393T5660FB3
CE7/F7/E6
CD5/CC
1Gb
Q-die
Now
60 ball
FBGA
256Mx 72
2GB
8
30mm
CE7/F7/E6
CE7/F7/E6
CD5/CC
1
2
1Gb
1Gb
F-die
Q-die
Jun. ’10
Now
M393T5160QZ3
M393T5160QZ(H)A
M393T5160FB3
60 ball
FBGA
CE7/F7/E6
CE7/F7/E6
256M x 4 * 36pcs
512Mx 72
1Gx 72
4GB
8GB
8
8
30mm
30mm
1Gb
2Gb
F-die
A-die
Jun. ’10
Now
68 ball
FBGA
M393T5260AZ(H)A
M393T1G60QJ(M)A
M393T1K66AZ(H)A
CF7/E6
CE6/D5
CF7/E6
512M x 4 * 18pcs
DDP 512M x 4 * 36pcs
st.1G x 4 * 18pcs
1
4
2
63 ball
FBGA
1Gb
2Gb
Q-die
A-die
Now
83 ball
FBGA
- 7 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 VLP Registered DIMM
Comp.
Composition
Internal
Banks
Org.
Density
Part Number
Speed
Rank
PKG
Height
Avail.
Version
60 ball
FBGA
64Mx 72
512MB
M392T6553GZA
CF7/E6
64M x 8 * 9pcs 512Mb G-die
4
8
1
18.3mm
Now
M392T2863QZ(H)A
M392T2863FBA
CF7/E6
CE7/F7/E6
CF7/E6
1Gb
1Gb
1Gb
1Gb
1Gb
1Gb
Q-die
F-die
Q-die
F-die
Q-die
F-die
Now
Jun. ’10
Now
60 ball
FBGA
128Mx 72
256Mx 72
1GB
2GB
128M x 8 * 9pcs
256M x 4 * 18pcs
128M x 8 * 18pcs
1
1
2
18.3mm
18.3mm
M392T5660QZ(H)A
M392T5660FBA
CE7/F7/E6
CF7/E6
Jun. ’10
Now
60 ball
FBGA
8
M392T5663QZ(H)A
M392T5663FBA
CE7/F7/E6
Jun. ’10
63 ball
FBGA
512Mx 72
1Gx 72
4GB
8GB
M392T5160QJ(M)A
M392T1G60QQ(E)A
CF7/E6
CE6/D5
DDP 512M x 4 * 18pcs
QDP 1G x 4 * 18pcs
1Gb
1Gb
Q-die
Q-die
8
8
2
4
18.3mm
18.3mm
Now
Now
65 ball
FBGA
- 8 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 Fully Buffered DIMM(1.8V)
Comp.
Internal
Org.
Density
Part Number
Speed
AMB
Composition
Rank
PKG
Height
Avail.
Version
Banks
CE7/F7/E6
CE6
6 : IDT C1
5 : Intel D1
6 : IDT C1
8: IDT L4
60 ball
FBGA
64Mx 72 512MB
M395T6553GZ4
64M x
8
8
*
*
9pcs 512Mb G-die
4
1
30.35mm
Now
CE7/F7/E6
M395T2863QZ(H)4 CE7/F7/E6
CE6
1Gb
1Gb
Q-die
F-die
Now
60 ball
FBGA
128Mx 72
1GB
2GB
5 : Intel D1
6 : IDT C1
8: IDT L4
128M x
9pcs
8
8
1
2
30.35mm
30.35mm
M395T2863FB4
M395T5663QZ(H)4
M395T5663FB4
CE7/F7/E6
Jun. ’10
CE7/F7/E6
CE7/F7/E6
6 : IDT C1
8: IDT L4
1Gb
1Gb
1Gb
Q-die
F-die
Q-die
Now
Jun. ’10
Now
60 ball
FBGA
5 : Intel D1
3: Montage D3
6 : IDT C1
8: IDT L4
256Mx 72
CE6
128M x
8
*
18pcs
CE7/F7/E6
CE7/F7/E6
CE6
6 : IDT C1
8: IDT L4
M395T5160QZ(H)4
M395T5160FB4
5 : Intel D1
3: Montage D3
6 : IDT C1
8: IDT L4
CE6
256M x
128M x
4
8
*
*
36pcs
36pcs
2
4
60 ball
FBGA
CE7/F7/E6
1Gb
1Gb
1Gb
F-die
Q-die
F-die
Jun. ’10
Now
512Mx 72
4GB
8
30.35mm
M395T5163QZ(H)4 CE7/F7/E6
8: IDT L4
6 : IDT C1
8: IDT L4
M395T5163FB4
CE7/F7/E6
Jun. ’10
CF7/E6
CF7/E6
6 : IDT C1
8: IDT L4
68 ball
M395T5263AZ(H)4
256M x
DDP 512M x
st.1G x
8
4
4
*
*
*
18pcs
36pcs
18pcs
2Gb
1Gb
2Gb
A-die
Q-die
A-die
2
4
2
Now
Now
FBGA
63 ball
M395T1G60QJ(M)4
M395T1K66AZ(H)4
CE6/F7
8: IDT L4
FBGA
83 ball
1Gx 72
8GB
8
30.35mm
CF7/E6/D5
CF7/E6
6 : IDT C1
8: IDT L4
FBGA
- 9 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
240Pin DDR2 Fully Buffered DIMM(1.55V)
Comp.
Version
Internal
Org.
Density
1GB
Part Number
Speed
YE6
AMB
Composition
Rank
PKG
Height
30.35mm
30.35mm
Avail.
Now
Banks
60 ball
FBGA
60 ball
FBGA
60 ball
FBGA
68 ball
FBGA
83 ball
FBGA
128Mx 72
256Mx 72
M395T2863QZ(H)4
M395T5663QZ(H)4
8: IDT L4
8: IDT L4
64M x
8
8
*
*
18pcs
18pcs
1Gb
Q-die
Q-die
Q-die
A-die
A-die
8
1
2
2GB
YE6
128M x
1Gb
1Gb
2Gb
2Gb
8
8
8
Now
M395T5160QZ(H)4
M395T5163QZ(H)4
YE6
YE6
8: IDT L4
8: IDT L4
256M x
128M x
4
8
*
*
36pcs
36pcs
2
4
512Mx 72
1Gx 72
4GB
8GB
30.35mm
30.35mm
Now
Now
M395T5263AZ(H)4
M395T1K66AZ(H)4
YE6
YE6
8: IDT L4
8: IDT L4
256M x
st.1G x
8
4
*
*
18pcs
18pcs
2
2
- 10 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
5. Package Dimension
60Ball FBGA for 1Gb Q-die (x4/x8)
# A1 INDEX MARK
9.00 ± 0.10
A
0.80 x 8 = 6. 40
9.00 ± 0.10
0.80
1.60
4
B
#A1
9
8
7
6
5
3
2
1
A
B
C
D
E
F
G
H
J
K
L
0.35±0.05
1.10±0.10
(0.95)
(1.90)
Bottom
Top
84Ball FBGA for 1Gb Q-die (x16)
# A1 INDEX MARK
9.00 ± 0.10
A
0.80 x 8 = 6. 40
9.00 ± 0.10
0.80
1.60
4
B
#A1
9
8
7
6
5
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
(0.95)
(1.90)
0.35±0.05
1.10±0.10
Bottom
Top
- 11 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
60Ball FBGA for 1Gb E-die (x4/x8)
7.50 ± 0.10
A
0.80 x 8 = 6. 40
3.20
# A1 INDEX MARK
B
7.50 ± 0.10
(Datum A)
(Datum B)
#A1
0.80
7
1.60
4
9
8
6
5
3
2
1
A
B
C
D
E
F
G
H
J
K
L
0.35±0.05
1.10±0.10
(0.95)
MOLDING AREA
(1.90)
60-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M
A B
Bottom
Top
84Ball FBGA for 1Gb E-die (x16)
7.50 ± 0.10
A
0.80 x 8 = 6. 40
3.20
# A1 INDEX MARK
B
7.50 ± 0.10
0.80
7
1.60
4
#A1
9
8
6
5
3
2
1
(Datum A)
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.35±0.05
1.10±0.10
(0.95)
MOLDING AREA
84-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
(1.90)
0.2 M
A B
Bottom
Top
- 12 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
60Ball FBGA for 1Gb F-die (x4/x8)
7.50 ± 0.10
A
0.80 x 8 = 6. 40
# A1 INDEX MARK
B
7.50 ± 0.10
3.20
1.60
(Datum A)
(Datum B)
0.80
7
#A1
9
8
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
0.37±0.05
1.10±0.10
(0.30)
MOLDING AREA
60-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
(0.60)
0.2 M
A B
Bottom
Top
84Ball FBGA for 1Gb F-die (x16)
7.50 ± 0.10
A
0.80 x 8 = 6. 40
3.20
# A1 INDEX MARK
7.50 ± 0.10
0.80
7
1.60
4
B
#A1
9
8
6
5
3
2
1
(Datum A)
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.37±0.05
1.10±0.10
(0.30)
MOLDING AREA
84-∅0.48 Solder ball
(Post reflow 0.50 ± 0.05)
(0.60)
0.2 M
A B
Bottom
Top
- 13 -
Apr. 2010
Product Guide
DDR2 SDRAM Memory
68Ball FBGA for 2Gb A-die (x4/x8)
11.00 ± 0.10
#A1
11.00 ± 0.10
0.80 x 8 = 6.40
3.20
# A1 INDEX MARK
0.80
1.60
6
9
8
7
5
4
3
2
1
0.10MAX
(Datum A)
(Datum B)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
0.35 ± 0.05
1.10 ± 0.10
(0.95)
MOLDING AREA
(1.90)
68-∅0.45 Solder ball
(Post reflow 0.50 ± 0.05)
0.2 M
A B
Bottom
Top
- 14 -
相关型号：
M395T5163FB4-CE68
DDR DRAM, 512MX72, 0.45ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204
SAMSUNG
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