RC6432G914AS [SAMSUNG]
RES,SMT,RUTHENIUM OXIDE,910K OHMS,200WV,2% +/-TOL,-200,200PPM TC,2512 CASE;
| 型号： | RC6432G914AS |
| 厂家： | 
SAMSUNG |
| 描述： | RES,SMT,RUTHENIUM OXIDE,910K OHMS,200WV,2% +/-TOL,-200,200PPM TC,2512 CASE 电阻器 |
| 文件： | 总22页 (文件大小：642K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Resistor
- Precision -
Chip Resistor - Precision
■
INTRODUCTION
Chip resistors are general passive component which is useful for derating voltage, current
controlling in circuit and surface mounting is available. Precise chip resistors are the current of
the world more and more, so we develop the precision types of chip resistors in order to
correspond to these user's needs trends. Production is increasing with demand for small size &
light weight of set product. We provide ultra-small, high-reliability, high-stability resistors.
■
FEATURE AND APPLICATION
●
Feature
- Low tolerance. (Under ± 1%)
- Both flow and reflow soldering are applicable.
- Suitable size and packing for surface mount assembly.
- Owing to the reduced lead inductance, the high frequency characteristic is excellent.
●
Application
- Circuit for high precision resistance and reliability.
- For Signal control part.
- For Tunning circuit, etc.
- 1 -
Chip Resistor - Precision
■
STRUCTURE
- 2 -
Chip Resistor - Precision
■
APPEARANCE AND DIMENSION
l1
H
W
l2
L
㎜
[ Unit :
]
Unit
TYPE
inch
Power (W)
L
W
H
I1
I2
Weight
±
±
±
±
±
㎎
0402
0603
0805
1206
1210
2010
2512
1/16
1/10
1/8
1/4
1/4
1/2
1
1.00 0.05 0.50 0.05 0.35 0.05 0.20 0.10 0.25 0.10
0.6
1005
1608
2012
3216
3225
5025
6432
±
±
±
±
±
㎎
1.60 0.10 0.80 0.15 0.45 0.10 0.30 0.20 0.35 0.20
2.1
±
±
±
±
±
㎎
2.00 0.20 1.25 0.15 0.50 0.10 0.40 0.20 0.35 0.20
4.9
±
±
±
±
±
㎎
3.20 0.20 1.60 0.15 0.55 0.10 0.45 0.20 0.40 0.20
9.5
±
±
±
±
±
㎎
3.20 0.20 2.55 0.20 0.55 0.10 0.45 0.20 0.40 0.20
16
±
±
±
±
±
㎎
5.00 0.15 2.50 0.15 0.55 0.15 0.60 0.20 0.60 0.20
26
±
±
±
±
±
㎎
6.30 0.15 3.20 0.15 0.55 0.15 0.60 0.20 0.60 0.20
41
- 3 -
Chip Resistor - Precision
■
PART NUMBERING
RC 2012
F
100 CS
2
●
3
●
5
●
1
●
4
●
1
●
CODE DESIGNATION
RC : This code expresses the Resistor that is produced by Samsung Electro-Mechanics
CO.LTD.
2
●
DIMENSION
The dimension is expressed as 4 digits number by SI unit (mm). <Table 1>
Left 2 digits are length of resistor, and the other 2 digits are width. <Fig 1>
<Fig 1>
l1
H
W
l2
L
<Table 1>
㎜
[ Unit :
]
Dimension
(inch)
1005
1608
2012
3216
3225
5025
6432
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
±
±
±
±
±
±
±
1.00 0.05
1.60
0.10 2.00
0.20 3.20
0.20 3.20
0.15 2.55
0.10 0.55
0.20 0.45
0.20 0.40
0.20 5.00
0.20 2.50
0.10 0.55
0.20 0.60
0.20 0.60
0.15 6.30
0.15
L
W
H
l1
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
0.50 0.05
0.80
0.45
0.30
0.35
0.15 1.25
0.10 0.50
0.20 0.40
0.10 0.35
0.15 1.60
0.10 0.55
0.20 0.45
0.20 0.40
0.15 3.20
0.10 0.55
0.20 0.60
0.20 0.60
0.15
0.10
0.20
0.20
±
0.35 0.05
±
0.20 0.10
±
0.25 0.10
l2
- 4 -
Chip Resistor - Precision
3
●
RESISTANCE TOLERANCE
The Resistance Tolerance is expressed as 1 digit alphabet by EIAJ standard. <Table 2>
<Table 2>
Item
F
±
Tolerance (%)
Producing Series
1
E-24, E-96
4
●
NOMINAL RESISTANCE VALUE
The Nominal Resistance Value is expressed as 3 or 4 digits by EIAJ standard. <Table 3>
<Table 3>
Item
3 Digits Mark
F
4 Digits Mark
F
Resistance
Tolerance
Left 2 digits : Resistance value
Right 1 digit : Exponential number of 10.
Left 3 digits : Resistance value
Right 1 digit : Exponential number of 10.
Only number
Number &
alphabet "R"
Read alphabet "R" as decimal point.
Read alphabet "R" as decimal point.
×
×
Ω
×
×
㏀
1) 101 : 10
101 = 10
10 = 100
1) 1001 : 100
101 = 100
10 = 1
Example
Ω
Ω
2) 7R5 : 7 . 5 = 7.5
2) 9R09 : 9.09 = 9.09
If resistance value in E-96 is same resistance value in E-24, we mark 3 or 4 digits on the
resistor.
In case of JUMPER(0 ohm), '000' is marked on that resistor.
- 5 -
Chip Resistor - Precision
5
●
PACKAGING CODE
The Packaging Code is expressed as 2 digits alphabet. <Table 4>
<Table 4>
Packaging
Description
Dimension
Packaging Q'ty
Code
C S
E S
A S
1005
1608, 2012, 3216, 3225
5025, 6432
1608, 2012, 3216
1005
10,000 PCS
5,000 PCS
4,000 PCS
10,000 PCS
40,000 PCS
20,000 PCS
15,000 PCS
25,000 PCS
10,000 PCS
5,000 PCS
7" REEL PACKAGING
10" REEL PACKAGING
13" REEL PACKAGING
1608, 2012, 3216, 3225
5025, 6432
1608
BULK CASE PACKAGING
2012
G S
3216
- 6 -
Chip Resistor - Precision
■
PACKAGING
●
PACKAGING METHOD
Packaging protects the resistor from damage during the shipping or storage.
There are two types of packaging method ; one is "Reel" type, and the other is "Bulk" type.
●
REEL TYPE PACKAGING SPECIFICATION
The packaging specification is based on the EIAJ RC-1009.
<Fig 2> is tape dimension For 1005 type. <Table 5> is for pocket sizes, A and B.
<Fig 2>
±
4.0 0.1
0.1
±
0
1.5
±
1.75 0.1
1.0
±
3.5 0.05
±
8.0 0.1
B
±
2.0 0.05
A
0.5 Max
Chip Resistor
Top Tape
0.5 Max
Carrier Tape
- 7 -
Chip Resistor - Precision
<Fig 3> is tape dimension For 1608, 2012, 3216, 3225 type. <Table 5> is for pocket sizes,
A and B.
<Fig 3>
±
4.0 0.1
0.1
±
0
1.5
±
1.75 0.1
1.0
±
3.5 0.05
±
8.0 0.1
B
±
2.0 0.05
±
4.0 0.1
A
1.0 Max
Top Tape
Chip Resistor
1.0 Max
Carrier Tape
Bottom Tape
<Fig 4> is tape dimension For 5025, 6432 type. <Table 5> is for pocket sizes, A and B.
<Fig 4>
t MAX = 1.1
<Table 5>
Dimension
1005
1608
2012
3216
3225
5025
6432
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
Symbol
A
±
±
±
±
±
±
±
0.70
0.10 1.10
0.20 1.65
0.20 2.00
0.20 2.90
0.20 2.80
0.10 3.50
0.10
±
±
±
±
±
±
±
1.20
0.10 1.90
0.20 2.40
0.20 3.60
0.20 3.60
0.20 5.30
0.20 6.75
0.10
B
- 8 -
Chip Resistor - Precision
●
TAPING METHOD
There are empty holes at both start part and end part of carrier tape. <Fig 5>
<Fig 5>
Reel
Packed Part
Empty Part
Lead Part
Adhesion Tape
Empty Portion
Chips
Empty Portion
Lead Part
****
**
***
10 Pitches
or more
5,000 Pitches
or
10 Pitches
or more
200~250 mm
20,000 Pitches
Note
①
②
③
④
The resistor should move in the pocket freely.
The resistor should not adhere to the top or bottom tape.
There should be no vacant pocket.
Peeling strength of the top tape should be within 5g and 80g. <Fig 6>
<Fig 6>
Peeling
Top Tape
Chip Resistor
Carrier Tape
°
10
F
Bottom Tape
- 9 -
Chip Resistor - Precision
●
REEL DIMENSION
The Reel dimension is classified by the diameter of Reel. <Fig 7> <Table 6>
<Fig 7>
[ Unit : mm ]
<Table 6>
Packaging Code
C S
Diameter
7"
A
B
C
D
Φ
Φ
Φ
±
±
178
258
330
70
9.5(13.0)
0.1
1.2
2.0
2.0
0.1
0.1
0.1
±
±
±
80
80
9.5
0.1
0.1
E S
10"
±
9.5
F S, A S
13"
●
BULK TYPE PACKAGING
Bulk cassette specification is based on the EIAJ ET-7201. <Fig 8>
The standard packaging quantity depends on the dimension. <Table 7>
±
6.0
0.05
<Fig 8>
±
±
4.4
3.4
0.05
0.05
12
36
110
<Table 7>
Dimension
1608
Inch
0603
0805
1206
Standard packaging quantity
25,000 PCS
Weight (g, avg.)
71
65
67
2012
3216
10,000 PCS
5,000 PCS
- 10 -
Chip Resistor - Precision
●
LABELING
▶
Reel type Label
The reel type label includes following contents as <Fig 9>.
①
②
<Fig 9>
- Following -
Ohm
100
F101
①
Resistance Value
Tolerance, Marking
Part Number
Quantity
③
④
⑤
P/N : RC1608F101CS
QTY : 5000PCS
L/N : RMBA20630
②
③
④
⑤
⑥
⑦
⑦
007
⑥
LOT Number
Bar - Code
V - 2
SAMSUNG ELECTRO-MECHANICS CO.,LTD.
Serial Number
▶
Bulk type Label
The bulk type label includes following contents as <Fig 10>.
<Fig 10>
①
- Following -
RC3216F100GS
④
②
①
Part Number
Resistance Value
LOT Number
Quantity
10 ohm
②
③
④
⑤
⑥
RC3216F100GS
10 ohm
③
⑤
RMBA71025 ,5000pcs
00
V - 2
Bar - Code
7
Serial Number
SAMSUNG ELECTRO-MECHANICS CO.,LTD.
⑥
●
BOX PACKAGING METHOD
①
②
The bulk or reel type packaging is packaged twice by paper box, inner box and outer box.
The packaging should protect the resistor from damaging during shipping by vehicle, ship,
airplane and etc.
③
※
The information of contents is marked on both inner and outer box.
For other packaging methods, please contact us.
- 11 -
Chip Resistor - Precision
●
BOX DIMENSION FOR REEL TYPE
①
×
②
×
Max 25,000 pcs ( 5 EA
7" )
Max 100,000 pcs ( 20 EA
7" )
±
30 1.0
±
185 1.0
±
195 5.0
±
187 5.0
±
66 1.0
±
285 5.0
±
185 1.0
( Unit : mm )
( Unit : mm )
③
×
Max 300,000 pcs ( 60 EA 7" )
④
×
Max 400,000 pcs ( 20 EA 13" )
±
215 5.0
±
348 5.0
±
370 5.0
±
336 5.0
±
410 5.0
±
339 5.0
( Unit : mm )
( Unit : mm )
●
BOX DIMENSION FOR BULK TYPE
①
×
②
×
Inner box ( Cassette
5 EA )
Outer box ( Inner box
20 EA )
215
41
135
65
116
242
( Unit : mm )
( Unit : mm )
- 12 -
Chip Resistor - Precision
■
RELIABILITY TEST DATA
●
ELECTRICAL CHARACTERISTIC
The electrical characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
℃
(temperature 20 , humidity 65%RH, pressure 1023mbar)
Permissible deviation
item
Test method
Resistor
묤
묤
묤
묤
Standard : JIS C 5202 (5.1)
Test voltage : <Table 8>
Applying time : within 5 seconds.
Test board : <Fig 11>
DC resistance value
should be within the
specified resistance
tolerance.
<Table 8>
Ω
DC resistance
Range ( )
Voltage (V)
R < 10
10 ≤ R < 100
100 ≤ R < 1K
1K ≤ R < 10K
10K ≤ R < 100K
100K ≤ R < 1M
1M ≤ R
0.1
0.3
1.0
3.0
10
25
50
묤
묤
Standard : JIS C 5202 (5.2)
℃ →
℃ →
-55
℃ →
20
℃ →
125
1. Tolerance F
Temp. : 20
20
±
℃
℃
100ppm/
묤
묤
2. Tolerance G
<Table 9>
Test board : <Fig 11>
Calculation
Temperature
Coefficient
of
:
R−R
0
1
T−T
×
×106
0
℃
TCR(ppm/ ) =
Ω
℃
Range(
)
ppm/
R0
+300
≤
1
10
R < 10
-200
Resistance
±
℃
T0 : 20
2
≤
≤
±
R < 1M
R < 10M
200
Ω
R0 : Resistance at T0 ( )
1M
±
300
℃
T
: Test temperature ( -55, 125
)
Ω
R
: Resistance at T ( )
묤
묤
Standard : JIS C 5202. (5.5)
1. No mechanical
damage
Short time
overload
(STOL)
Test voltage : 2.5 times of rated voltage Max.
surge current at the Jumper.
Applying time : 5 seconds
Δ
2. R should be
묤
묤
±
Ω
within (1%+0.1 )
Test board : <Fig 11>
묤
묤
Standard : JIS C 5202. (5.8)
Test voltage : 2.5 times of rated voltage Max.
surge current at the Jumper.
Test method : 1 sec ON, 25 sec OFF
10,000+400cycles
1. No mechanical
damage
Intermittent
overload
(IOL)
Δ
묤
묤
2. R should be
±
Ω
within (3%+0.1 )
Test board : <Fig 11>
- 13 -
Chip Resistor - Precision
Permissible deviation
item
Test method
Resistor
묤
Standard : JIS C 5202. (5.7)
Test voltage : 1005 1608 AC 100V,
others AC 500V
Applying time : 60 +10/-0 seconds
Test board : <Fig 13>
묤
No mechanical
묤
Withstanding
damage, short circuit, or
disconnection.
voltage
묤
묤
묤
Standard : JIS C 5202. (5.6)
Test voltage : 1005 1608 DC 100V,
others DC 500V
묤
묤
Insulation
resistance
Should have more
묤
묤
묤
Applying time : 60 seconds
Ω
than 1,000M
±
Test pressure : 1.0 0.2 N
Test board : <Fig 13>
묤
Noise standard
묤
Standard : JIS C 5202. (5.9)
JIS appendix1 "Noise measure in
resistor"
Measure equipment : QUAN-TECH NOISE
METER
<Table 10>
Ω
)
Range (
dB Max.
Noise
≤
1
100
1K
100K
1M
R < 100
R < 1K
R < 100K
R < 1M
R < 10M
-10
0
묤
≤
≤
≤
≤
15
20
30
(MODEL 315C)
●
MECHANICAL CHARACTERISTIC
The mechanical characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
℃
(temperature 20 , humidity 65%RH, pressure 1023mbar)
Permissible deviation
item
Test method
Resistor
묤
묤
묤
묤
New solder
coated more than
95% of termination
Standard : JIS C 5202. (6.5)
±
℃
5
Solderability
Test temperature : 235
±
Test time : 2
0.5 sec (dipping both side)
묤
묤
묤
묤
Standard : JIS C 5202. (6.1)
Test board : <Fig 12>
Test speed : 100mm/min
Test procedure : press until 3mm,
then keep 5 seconds <Fig 14>
1. No mechanical
damage
Bending
strength
<Fig 14>
Δ
2. R should be
20
±
Ω
within (0.5%+0.05 )
R205
3
- 14 -
Chip Resistor - Precision
Permissible deviation
item
Test method
Resistor
묤
Standard : JIS C 5202 (6.1)
Test time : applying pressure for 10 seconds
묤
No mechanical
묤
Termination
strength
damage, or sign of
disconnection
묤
묤
Test tension : 5 N (500g f)
묤
1005, 1608 - 3 N (300g f)
묤
1. No mechanical
Standard : JIS C 5202 (6.4)
묤
±
℃
Withstanding
damage
Temperature : 260
5
Δ
묤
묤
±
soldering heat
2. R should be
Test time : 10
1second (both side dipping)
±
Ω
within (1%+0.05 )
Test procedure : measures after 24 hours
묤
묤
묤
1. No mechanical
damage
Standard : JIS C 5202 (6.3)
Test amplitude : 1.5mm
Test procedure : frequency 10Hz - 55Hz -
10Hz each 2 hours in x, y, z direction.
Vibration
Δ
2. R should be
±
Ω
within (1%+0.05 )
●
ENVIRONMENTAL CHARACTERISTIC
The Environmental characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
℃
(temperature 20 , humidity 65%RH, pressure 1023mbar)
Permissible deviation
item
Test method
Resistor
묤
묤
묤
묤
Standard : JIS C 5202 (7.4)
Test procedure : <Table 11>
Measure : after 5 cycles of procedure
Test board : <Fig 11>
1. No mechanical
damage
Temperature
cycle
Δ
2. R should be
<Table 11>
±
Ω
within (1%+0.1 )
item
1
2
3
4
℃
±
±
temp(
)
-55
2
5~35
15
125
2
5~35
15
time(min)
30
30
1. No mechanical
damage
묤
묤
Standard : JIS C 5202 (7.9)
±
℃
3 , humid 90 ~
Test condition : temp 40
Δ
2. R should be
95%RH
Test voltage : rated voltage
Test time : repeat 90min ON, 30min OFF
during 1000+48 hours
Test board : <Fig 11>
within <Table 12>
Moisture
resistance life
묤
묤
<Table 12>
Ω
Δ
Range(
)
1 ≤ R < 10
R MAX
±
5%
10 ≤ R < 1M ±(3%+0.1Ω)
1M ≤ R < 10M
묤
±
5%
- 15 -
Chip Resistor - Precision
Permissible deviation
item
Test method
Resistor
묤
Standard : JIS C 5202 (7.1)
1. No mechanical
damage
Low
temperature
exposure
묤
±
℃
2
Test temperature : -55
Test time : 1000+48 hours (without load)
Measure : after 1 hour
Test board : <Fig 11>
묤
Δ
2. R should be
묤
±
Ω
within (3%+0.1 )
묤
묤
묤
Standard : JIS C 5202 (7.2)
1. No mechanical
damage
±
Test temperature : 1608,2012,3216 : 155
High
temperatur
exposure
℃
±
℃
2
, others : 125
2
Test time : 1000+48 hours (without load)
Measure : after 1 hour
묤
묤
묤
Δ
2. R should be
±
Ω
within (3%+0.1 )
Test board : <Fig 11>
1. No mechanical
damage
묤
묤
묤
묤
Standard : JIS C 5202 (7.10)
Δ
2. R should be
<Table 13>
±
℃
2
within
Test temperature : 70
Test voltage : rated voltage
Test time : repeat 90min ON, 30min OFF
during 1000+48 hours
Load life
<Table 13>
Ω
Δ
Range(
)
R MAX
≤
±
5%
1
R < 10
≤
≤
±
Ω
10
1M
R < 1M
R < 10M
묤
(3%+0.1
)
Test board : <Fig 11>.
±
5%
●
TEST BOARD AND SPECIFICATION
▶
Soldering
▷
The resistor should be fixed on PCB(printed circuit board) for testing.
- Soldering specification : JIS C 5202 (6.2)
* Soldering method
* Solder
: Flow type(Dipping type), Reflow type
: H63A (JIS Z 3282)
* FLUX
: ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)
- Flow soldering condition
∼
* FLUX dipping time : 5 10 sec
* Pre-treatment
* Soldering temp.
* Soldering time
* Temp. profile
: None
℃± ℃
: 235
5
±
: 5 0.5 sec
: <Fig 15>
- Reflow soldering condition
℃± ℃
* Peak temp.
: 230
5
℃
±
* Duration over 220 : 15 5 sec
* Solder Cream
* Temp. Profile
: Sn-Pb (63-37)
: <Fig 16>
- 16 -
Chip Resistor - Precision
▶
Test board
▷
Test board
<Table 14>
<Fig 11>
φ
10 - 1.0
c
item
Dimension
Dimension (mm)
3
3.5
f
a
Power
1/16W
1/10W
1/8W
1/4W
1/4W
1/2W
1W
a
b
c
f
1005
1608
2012
3216
3225
5025
6432
0.6
1.0
1.2
2.2
2.2
3.6
5.2
1.9
3.0
4.0
5.0
5.0
7.0
8.0
0.7
1.2
1.65
2.0
2.9
3.0
3.5
4.9
4.5
4.3
3.3
3.3
3.0
2.5
b
25
5.5
7.5
5.08
3
Connector
58.5
: COPPER PATTERN
<Table 14>, <Fig 11> are dimensions of test board.
* Board material : epoxy JIS C 6484
: SOLDER - RESISTOR
* pattern material : pure copper 99.5% or above JIS C 6484
▷
Bending Test Board
<Table 15>
<Fig 12>
a
f
d=4.
5
item
Dimension
1005
Dimension (mm)
Power
1/16W
1/10W
1/8W
1/4W
1/4W
1/2W
1W
a
b
c
f
0.6
1.0
1.2
2.2
2.2
3.6
5.2
1.9
3.0
4.0
5.0
5.0
7.0
8.0
0.7
1.2
1.65
2.0
2.9
3.0
3.5
4.9
4.5
4.3
3.3
3.3
3.0
2.5
40
c
1608
2012
b
3216
3225
100
5025
: COPPER PATTERN
6432
: SOLDER - RESISTOR
<Table 15>, <Fig 12> are dimensions of bending test board.
* Board material : epoxy JIS C 6484
* pattern material : pure copper 99.5% or above JIS C 6484
▶
Sketch of Withstanding voltage and Insulation resistance
<Fig 13>
Cu
Cu
Cu
P2
P1
P1
Substrate
V
- 17 -
Chip Resistor - Precision
■
CHARACTERISTIC GRAPH
●
RESISTANCE RANGE
The Resistance Range that we produce depends on the Dimension and the Resistance
Tolerance of the resistor. <Table 16>
<Table 16>
Dimension
1005
1608
2012
3216
3225
5025
6432
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
Tolerance
F, G
Ω∼
Ω
Ω∼
Ω
Ω∼
Ω
Ω∼
Ω
Ω∼
Ω
Ω∼
Ω
Ω∼
Ω
10
1M
10
1M
10
1M
10
1M
10
1M
10
1M
10
1M
●
RATED POWER
The Rated Power is classified by the dimension of the resistor. <Table 17>
<Table 17>
Dimension
1005
1608
2012
3216
3225
5025
6432
(0402)
(0603)
(0805)
(1206)
(1210)
(2010)
(2512)
item
Rated Power
1/16 W
1/10 W
1/8 W
1/4 W
1/4 W
1/2 W
(0.5W)
1.0 W
(0.063 W) (0.100 W) (0.125 W) (0.25 W)
(0.25 W)
Working Volt.(Max.)
50 V
50 V
150 V
300 V
200 V
400 V
200 V
400 V
200 V
400 V
200 V
400 V
STOL, IOL Volt.(Max.)
100 V
100 V
※
The rated power is specified as continuous full loading power at the ambient temperature of 70
± ℃ ± ℃
2
. In case of the temperature exceeding 70 2 , the power should be derated in
accordance to <Fig 17>.
<Fig 17>
[1005, 3225, 5025, 6432]
[1608, 2012, 3216]
Rated load percent (%)
Rated load percent (%)
100
80
100
80
60
40
20
0
℃
℃
Ambient temperature (
)
Ambient temperature (
)
60
40
20
0
-55
-55
125
120
155
150
70
70
-40
0
40
80
-30
0
30
60
90
120
▶
Working Temperature
℃ ∼
℃
- 55
- 55
+ 125
+ 155
: 1005, 3225, 5025, 6432
: 1608, 2012, 3216
℃ ∼
℃
- 18 -
Chip Resistor - Precision
■
APPLICATION MANUAL
●
Applications
Chip resistors are designed for general electronic devices such as home appliances, computer,
mobile communications, digital circuit, etc.
If you require our products with high reliability-performing at more than 125C or below -55C- for
medical equipments, aircraft, high speed machines, military usage, and items that can affect
human life or if you need to use in specific conditions (corrosive gas atmosphere), please contact
us beforehand.
▶
℃
Normal Operation temperature ranges( ) as follows.
- 1608, 2012, 3216(general, precision) : -55℃ ~ + 155℃
- Others (rectangular, array, trimmable) : -55℃ ~ + 125℃
▶
Although resistor body is coated, sharp excessive impact should be avoided to prevent
damages and adverse effects on characteristics(resistor value, open circuited, T.C.R.).
●
Storage
To maintain proper quality of chip components, the following precautions are required for storage
environment, method and period.
▶
Storage Environment
- Chip components may be deformed, if the temperature of packaged components exceeds
40C.
- Do not store where the soldering properties can be deteriorated by harmful gas such as
sulphurous gas, chlorine gas, etc.
- Bulk packed chip components should be used as soon as the seal is opened, thus
preventing the solderability from deteriorating.
- The remaining unused chips should be put in the original bag and sealed again or store in
a desiccator containing a desiccating agent.
▶
Storage Time Period
- Stored chip components should be used within 12 months after receiving the components.
If 12 months or more have elapsed, please check the solderability before actually using.
●
Mounting
Please give more attention not to press the chip owing to the nozzle's improper height when it
is mounted on PCB.
(Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.)
- 19 -
Chip Resistor - Precision
●
Soldering
Our products have Ag electrodes protected by double layer.
▶
1st Ni Coating
- This prevents Ag electrode from leaching and enhance the bonding with Sn-Pb.
▶
2nd Sn-Pb Coating
- This is made of Sn 90% and Pb 10% with melting point 213℃ to prevent it from melting
when solder cream melts, and to enhance the bonding.
- Commercial solder creams are made of Sn 63% and Pb 37% with melting point 183℃.
●
Cleaning
After Soldering Cleaning, soldering flux & Ionic cleaning liquid should be avoided on product.
If any possibility on product, please take a test before usage.
●
Caution for chip resistor separation from PCB
Chip resistor installation on PCB is similar phenomenon on chocolate chip on top of cake.
PCB has enough flexibility on outer force but Chip resistor can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separate from Chip resistor on PCB, be ware of any crack of chip
●
Others
▶
Manual work
- Whenever separate chip resistor from PCB, do not re-use the chip resistor for circuit safety.
Chip resistor can be electrical specification change by soldering Iron after separation.
Re-use of separated chip resistor should be prohibited.
▶
Do not use more than rated voltage.(check the contents on the file)
- 20 -
Chip Resistor - Precision
■
NOTICE
●
Usage of the resistor
▶
Flow Soldering
After sticking the resistor to PCB with paste, dip the PCB into solder bath. <Fig 15>
<Fig 15>
Temp.
± ℃
5
235
Δ ≤
T 150
℃
Pre-heating
Soldering
Cooling
within 5 sec
Time
▶
Reflow Soldering
After printing solder creams on PCB, place the resistor on the solder cream.
Then heat the PCB. <Fig 16>
Temp.
<Fig 16>
Peak temp.
within 10 sec
± ℃
5
230
℃
℃
200
160
℃
130
Pre-heating
Soldering
Cooling
within 120 sec
within 20 sec
Time
●
Caution
▶
▶
▶
Storage condition
Please make sure that keep the storage conditions.
℃∼
℃
∼
* Temperature : 5
35 , * Humidity : 45%RH
85%RH
Damage control
Please handle with care, to prevent damaging the resistor.
Specially, the excessive nozzles' height of SMD or the extreme touch with tweezers.
Leaching prevention
It is important to keep the soldering conditions for prevent Ag leaching in Flow soldering.
- 21 -
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