SPHWH1L3D30ED4UPG3 [SAMSUNG]
Single Color LED,;
| 型号： | SPHWH1L3D30ED4UPG3 |
| 厂家： | 
SAMSUNG |
| 描述： | Single Color LED, 光电 |
| 文件： | 总25页 (文件大小：1792K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Rev: 002
Product Family Data Sheet
LH351B
3535 Ceramic LED 85
＠ ℃
-
Introduction
Features
Package : Ceramic Substrate LED Package
View Angle: 120
˚
Precondition : JEDEC Level 2a
Dimension : 3.5 x 3.5 x 1.93 mm
ESD withstand Voltage : up to ±5KV [HBM]
Reliability Test : IES-LM 80 08 qualified
-
-
Applications
INDOOR LIGHTING : Spot light, Down light
OUTDOOR LIGHTING : Street light, Security light, Tunnel light, Parking lots light
INDUSTRIAL LIGHTING : High-bay light, Low-bay light
CONSUMER LIGHTING : Torch light
SAMSUNG ELECTRONICS
95, Samsung2-Ro, Giheung-Gu,
Yongin City, Gyeonggi Do 446 711, KOREA
-
-
-
http://www.samsungled.com
1 / 25
Contents
1. Luminous Flux Characteristics
2. Characteristics
-----------------------
-----------------------
-----------------------
3
5
6
3. Typical Characteristics Graph
4. Outline Drawing & Dimension
----------------------- 11
5. Reliability Test Items and Conditions ----------------------- 12
6. Solder Conditions
7. Tape & Reel
----------------------- 13
----------------------- 14
----------------------- 15
----------------------- 16
----------------------- 18
----------------------- 20
----------------------- 25
8. Label Structure
9. Packing Structure
10. Precaution For Use
11. Hazard Substance Analysis
12 Revision History
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1. Luminous Flux Characteristics (T = 85 )
℃
j
Sorting condition
BIN
Structur
e
Calculated Minimum Flux3)
Nominal Minimum
Flux2) @350mA
Product Code
CCT
CRI1)
Rank Min Flux2) @700mA @1000mA @1500mA
SPHWH1L3D30ED4W0F3
Whole
F3
90
162
213
283
SPHWH1L3D30ED4WPF3 Quarter
SPHWH1L3D30ED4WMF3 M3
(G3)
(100)
(177)
(233)
(309)
2700K
80
SPHWH1L3D30ED4W0G3 Whole
SPHWH1L3D30ED4WPG3 Quarter
G3
100
180
237
314
(H3)
(110)
(197)
(259)
(343)
SPHWH1L3D30ED4WMG3
SPHWH1L3D30ED4V0G3
M3
Whole
G3
100
180
237
314
3000K
3500K
80
80
SPHWH1L3D30ED4VPG3 Quarter
(H3)
(110)
(197)
(259)
(343)
SPHWH1L3D30ED4VMG3
SPHWH1L3D30ED4U0G3
M3
Whole
G3
100
180
237
314
SPHWH1L3D30ED4UPG3 Quarter
(H3)
(110)
(197)
(259)
(343)
SPHWH1L3D30ED4UMG3
SPHWH1L3D30CD4T0J3
M3
Whole
J3
120
216
284
377
SPHWH1L3D30CD4TPJ3 Quarter
(K3)
(130)
(234)
(308)
(408)
SPHWH1L3D30CD4TMJ3
SPHWH1L3D30CD4T0K3
M3
70
Whole
K3
130
234
308
408
4000K
SPHWH1L3D30CD4TPK3 Quarter
(M3)
(140)
(253)
(333)
(441)
SPHWH1L3D30CD4TMK3
SPHWH1L3D30ED4T0G3
M3
Whole
G3
100
180
237
314
80
SPHWH1L3D30ED4TPG3 Quarter
SPHWH1L3D30ED4TMG3 M3
(H3)
(110)
(197)
(259)
(343)
( )* : Minimum luminous flux @ 25
Notes:
℃
1) SAMSUNG ELECTRONICS maintains a tolerance of ±3.0 on CRI measurements.
2) SAMSUNG ELECTRONICS maintains a tolerance of ±7% on flux measurements.
3) Calculated flux values are for reference only.
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1. Luminous Flux Characteristics (T = 85 )
℃
j
Sorting condition
BIN
Structur
e
Calculated Minimum Flux3)
Nominal Minimum
Flux2) @350mA
Product Code
CCT
CRI1)
Rank Min Flux2) @700mA @1000mA @1500mA
J3
(K3)
K3
120
(130)
130
216
(234)
234
284
(308)
308
377
(408)
408
SPHWH1L3D30CD4RTJ3
SPHWH1L3D30CD4RTK3
SPHWH1L3D30DD4RTJ3
SPHWH1L3D30DD4RTK3
SPHWH1L3D30CD4QTJ3
SPHWH1L3D30CD4QTK3
SPHWH1L3D30DD4QTJ3
SPHWH1L3D30DD4QTK3
half
half
half
half
half
half
half
half
70
(M3)
J3
(140)
120
(253)
216
(333)
284
(441)
377
5000K
(K3)
K3
(130)
130
(234)
234
(308)
308
(408)
408
75
70
(M3)
J3
(140)
120
(253)
216
(333)
284
(441)
377
(K3)
K3
(130)
130
(234)
234
(308)
308
(408)
408
(M3)
J3
(140)
120
(253)
216
(333)
284
(441)
377
5700K
6500K
(K3)
K3
(130)
130
(234)
234
(308)
308
(408)
408
75
70
(M3)
(140)
(253)
(333)
(441)
J3
120
216
284
377
SPHWH1L3D30CD4PTJ3
half
(K3)
(130)
(234)
(308)
(408)
( )* : Minimum luminous flux @ 25
℃
Notes:
1) SAMSUNG ELECTRONICS maintains a tolerance of ±3.0 on CRI measurements.
2) SAMSUNG ELECTRONICS maintains a tolerance of ±7% on flux measurements.
3) Calculated flux values are for reference only.
http://www.samsungled.com
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2. Characteristics
1) Electro-optical Characteristics
Item
Unit
V
Min
Typ
2.85
3.02
3.13
3.29
-
Max
3.00
Forward voltage1) (@350 mA, Tj = 85
Forward voltage1) (@700 mA, Tj = 85
)
)
2.60
℃
V
℃
Forward voltage1) (@1000 mA, Tj = 85
Forward voltage1) (@1500 mA, Tj = 85
)
V
℃
℃
)
)
V
Operation forward current (Tj = 85
mA
1500
6
℃
-
-
-
Thermal resistance, junction to solder point
LED junction temperature Tj
Operating temperature range Topr
Storage temperature range Tstg
Viewing Angle
/W
4
℃
150
85
℃
-
40
40
-
℃
℃
˚
-
-
-
120
-
-
120
Item
Unit
V
3000K
5000K
Forward voltage1) (@350 mA, Tj = 25
Forward voltage1) (@350 mA, Tj = 85
Luminous flux2) (@350 mA, Tj = 25
)
)
2.95
2.85
℃
℃
)
V
lm
lm
lm
lm
lm
118
108
194
256
339
144
133
239
315
418
℃
Luminous flux2) (@350 mA, Tj = 85
Luminous flux2) (@700 mA, Tj = 85
)
℃
)
℃
Luminous flux2) (@1000 mA, Tj = 85
)
℃
℃
Luminous flux2) (@1500 mA, Tj = 85
)
Notes:
1) SAMSUNG ELECTRONICS maintains a tolerance of ±0.1V on forward voltage
measurements.
2) Characteristics @ 25 are for reference only.
℃
2) Vf Rank
Parameter
Symbol
VF
Condition
Rank
D4
Min.
2.60
Typ.
Max.
3.00
Forward
Voltage
-
IF= 350mA
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3. Typical Characteristics Graph
1) Spectrum Distribution
Tj = 85
℃)
2700K(CRI 80) & 3000K(CRI 80)
(
5000K(CRI 70) & 5700K(CRI 70)
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2) Forward Current Characteristics
Tj = 85
℃)
Relative Flux vs. Forward Current
(
Forward Current vs. Forward Voltage
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3) Temperature Characteristics
Relative Flux vs. Tj(Junction temp.)
I = 350mA
(
)
F
I = 350mA
)
F
Forward Voltage vs. Tj(Junction temp.)
(
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4) Color shift Characteristics
Color x,y vs. Forward Current [Cool White]
Color x,y vs. Tj(Junction temp.) [Cool White]
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5) Derating Curve
Rj-a = 25℃/W
Rj-a = 20℃/W
Rj-a = 15℃/W
Rj-a = 10℃/W
6) Viewing angle Characteristics
Viewing angle
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4. Outline Drawing & Dimension
Recommended Land Pattern
unit : mm
Tolerance : ± 0.13
* This LED has built in ESD protection device(s) connected in parallel to LED Chip(s).
-
* The thermal pad is electrically isolated from the anode and cathode contact pads.
Ts Point & Measurement Method
* Measure the nearest point to the thermal pad as shown below. If necessary, remove
PSR of PCB to reach Ts point.
* Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED
can be damaged.
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5. Reliability Test Items and Conditions
1) Test Items and Results
Test
Hours/Cycles
Test Items
Test Conditions
n
22
22
22
22
11
100
11
11
5
Room Temperature
Life Test
25 , DC 1000
℃
1000 Hr
1000 Hr
1000 Hr
1000 Hr
10 Cycles
500 Cycles
1000 Hr
1000 Hr
㎃
High Temperature
humidity Life Test
85 , 85%, DC 1000
℃
㎃
High Temperature
Life Test
85 , DC 1000
℃
㎃
Low Temperature
Life Test
-40 , DC 1000
℃
㎃
Temperature
Humidity Cycle
-10
25 95%RH
℃
85
95%RH
℃
℃ ↔
↔
1000mA, 95%RH, 24hrs/1cycle
-45 /15 min 125 / 15 min.
℃
↔
℃
Thermal Shock
Temp.change within 5min.
High Temperature
Storage
Ta=120
℃
Low Temperature
Storage
Ta=-40
℃
5 Times
(±5kV)
ESD(HBM)
Q1=10M , R2=1.5K , C=100pF, V=±5KV, 5Times
Ω Ω
2) Criteria for Judging the Damage
Limit
Test Condition
[Ta = 25
Item
Symbol
]
℃
Min.
Max.
Forward Voltage
Luminous flux
VF
lm
350 mA
350 mA
L.S.L. * 0.9
L.S.L. * 0.7
U.S.L. * 1.1
U.S.L. * 1.1
* U S L : Upper Standard Level
. . .
L S L : Lower Standard Level
. . .
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6. Solder Conditions
1) Reflow Conditions ( Pb Free )
Reflow Frequency : 2 times max.
2) For Manual Soldering
Not more than 5 seconds @Max. 300 , under soldering iron.
℃
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7. Tape And Reel
Ø180±0.3
Ø13±0.2
2.0±0.2
30°
Ø60±0.1
Ø10
Ø22
Label
(1) Quantity : The quantity/reel to be 1,000 pcs.
(2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2
㎜
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10 angle to be the carrier tape.
°
(4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a
damp proof package.
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8. Label Structure
1) Label Structure
D4V1G1
SPHWH1L3D30ED4V0G3 D4V1G1 XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
Rank Code
/D4/ : VF Rank
/V1/ : Color Rank
/G1/ : Flux Bin
2) LOT Number
The Lot number is composed of the following characters
D4V1G1
SPHWH1L3D30ED4V0G3 D4V1G1 XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
/ I
/ 1000PCS
▲▲▲
●◎◇◆□■△△△
: Production Site (S:SAMSUNG ELECTRONICS, G:Gosin China)
: L (LED)
●
◎
◇
◆
□
■
△
▲
: Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
: Year (S:2008, T:2009, U:2010...)
: Month (1 ~ 9, A, B)
: Day (1 ~ 9, A, B ~ V)
: SAMSUNG ELECTRONICS Product Number (1 ~ 999)
: Reel Number (1 ~ 999)
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9. Packing Structure
1) Packing Process
Reel
D4V1G1
SPHWH1L3D30ED4V0G3 D4V1G1 XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
Aluminum Vinyl Bag
D4V1G1
SPHWH1L3D30ED4V0G3 D4V1G1 XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
Out Box (Max. 7 Aluminum Vinyl Bag)
D4V1G1
SPHWH1L3D30ED4V0G3 D4V1G1 XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
Material :
Paper(DW2A/DW(AB)
SIZE(mm)
TYPE
ⓐ
ⓑ
ⓒ
7inch 250 225
190
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2) Aluminum Packing Bag
D4V1G1
SPHWH1L3D30ED4V0G3 D4V1G1 XXXX
IIIIIIIIIIIIIIIIIIIIIIIIIIII
●◎◇◆□■△△△ / I▲▲▲ / XXXXpcs
IIIIIIIIIIIIIIIIIIIIIIIII
There are Silica Gel and Humidity Indicator Card in the Aluminum Bag
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10. Precaution for use
1) For over current-protection, customers are recommended to apply resistors
connected in series with the LEDs to mitigate sudden change of the forward current
caused by shift of the forward voltage.
ꢀ
2) This device should not be used in any type of fluid such as water, oil, organic
solvent, etc. When cleaning is required, IPA is recommended as cleaning agent.
Solvent-based cleaning agent such as Zestron(R) may damage the silicone resins used in
the device.
ꢀ
3) When the device is in operation, the forward current should be carefully determined
considering the maximum ambient temperature and the corresponding junction
temperature.
ꢀ
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3
months or more after being shipped from SAMSUNG ELECTRONICS, they should be
packed with a nitrogen filled container.
-
(Shelf life of sealed bags: 12 months, temp. 0~40 , 0~90%RH)
℃
ꢀꢀ ꢀꢀ
5) After storage bag is open, device subject to soldering, solder reflow, or other
high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no
more than 30 /60%RH.
℃
b. Stored at <10% RH.
6) Repack unused Products with anti-moisture packing, fold to close any opening and
then store in a dry place.
7) Devices require baking before mounting, if humidity card reading reaches 60%
at 23±5
.
℃ ꢀꢀꢀ
8) Devices must be baked for 1hours at 60±5 , if baking is required.
℃
ꢀ
9) The LEDs are sensitive to the static electricity and surge current. It is recommended to
use a wrist band or anti-electrostatic glove when handling the LEDs.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in leakage
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener or
organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is
permeable to those chemicals and they may lead a discoloration of encapsualnt when
they expose to heat or light. This phenomenon can cause a significant loss of light
emitted(output) from the luminaires(fixtures). This phenomenon can give a significant
loss of light emitted(output) from the luminaires(fixtures). In order to prevent these
problems, we recommend you to know the physical properties of materials used in
luminaires, They must be selected carefully.
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11) Risk of Sulfurization (or Tarnishing)
The LED from Samsung Electronics uses a silver-plated lead frame and its surface
color may change to black(or dark colored) when it is exposed to sulfur (S),
chlorine (Cl) or other halogen compound. Sulfurization of lead frame may cause intensity
degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It
requires caution. Due to possible sulfurization of lead frame, LED should not be used
and stored together with oxidizing substances made of materials in a following list,
: Rubber, plain paper, lead solder cream and so on.
ꢀ
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11. Hazard Substance Analysis
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Revision History
Writer
Approved
Date
Revision History
New version
Drawn
2013.12.03
I.J.PYEON Y.T.KIM
Added New Flux Rank
-
2013.12.19
CRI80) G3 rank
4000K (CRI70) K3 rank
I.J.PYEON Y.T.KIM
2700K (
ㆍ
ㆍ
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