SPHWW1HDND27YHV3B3 [SAMSUNG]
LED COB LC033B 3000K SQUARE;型号: | SPHWW1HDND27YHV3B3 |
厂家: | SAMSUNG |
描述: | LED COB LC033B 3000K SQUARE |
文件: | 总20页 (文件大小:1598K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Product Family Data Sheet Rev.1.1 2017.06.19
High Power LED Series
Chip on Board
LC033B-Gen3
High efficacy COB LED package,
well-suited for use in spotlight applications
Features & Benefits
Chip on Board (COB) solution makes it easy to design in
Simple assembly reduces manufacturing cost
Low thermal resistance
InGaN/GaN MQW LED with long time reliability
Completed 6,000 hours of LM-80 Testing
Applications
Spotlight / Downlight
LED Retrofit Bulbs
Outdoor Illumination
2
Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
Characteristics
-----------------------
-----------------------
-----------------------
-----------------------
-----------------------
-----------------------
-----------------------
-----------------------
3
5
Product Code Information
Typical Characteristics Graphs
Outline Drawing & Dimension
10
14
15
16
17
19
Reliability Test Items & Conditions
Label Structure
Packing Structure
Precautions in Handling & Use
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Condition
Ambient / Operating Temperature
Storage Temperature
LED Junction Temperature
Case Temperature
Forward Current
Ta
Tstg
Tj
-40 ~ +105
-40 ~ +120
150
ºC
ºC
ºC
ºC
mA
W
-
-
-
Tc
IF
105
*Note
1620
-
-
-
-
Power Dissipation
ESD (HBM)
PD
-
59.9
±2
kV
kV
ESD (MM)
-
±0.5
b) Electro-optical Characteristics (IF = 900 mA, Tc = 25 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YH
5
32.5
80
90
-
35.5
-
38.5
-
-
-
-
Color Rendering Index (Ra)
-
7
-
Thermal Resistance (junction to chip point)
Beam Angle
ºC/W
0.9
115
32.0
º
W
º
-
Nominal Power
Eye Protection
Risk 1
-
-
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics (IF = 900 mA)
Sorting1) @ Tc = 25 °C (lm)
Calculated Flux2) @ Tc = 85 °C (lm)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin
Min.
4485
4761
4771
5064
4915
5216
4747
5058
4792
5105
4792
5105
3527
3810
4200
3599
3887
4277
3707
4004
4394
3815
4121
4511
Max.
4761
5141
5064
5467
5216
5630
5058
5487
5105
5528
5105
5528
3810
4200
4571
3887
4277
4662
4004
4394
4795
4121
4511
4917
Min.
4081
4332
4342
4608
4472
4746
4320
4602
4361
4645
4361
4645
3210
3467
3822
3276
3538
3892
3374
3644
3998
3472
3750
4105
Max.
4332
4678
4609
4975
4747
5123
4603
4993
4646
5030
4646
5030
3467
3822
4160
3538
3892
4242
3644
3999
4363
3750
4105
4474
42
43
42
43
42
43
41
42
41
42
41
42
33
34
35
33
34
35
33
34
35
33
34
35
2700
3000
3500
4000
5000
5700
3H
3H
3H
3H
3H
3H
80
2700
3000
3500
4000
3Q
3Q
3Q
3Q
90
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 °C)
2) Calculated flux values are for reference only
3) Samsung maintains measurement tolerance of: luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1
2
3
4
5
6
1
7
8
9
10
D
11
2
12
5
13
Y
14
H
15
R
16
T
17
B
18
3
S
P
H
C
W
H
D
N
Digit
PKG Information
Code
Specification
1
2
5
3
SPH
WW
CW
1
Samsung Package High Power
Color
Warm White (T/U/V/W Ranks)
Cool White (Q/R Ranks)
4
6
Product Version
Form Factor
Lens Type
7
8
HD
N
COB
9
No lens
LC033
10
11
D
Internal Code
Chip Type
2
5
Min. 80
25 °C
12
CRI & Sorting Temperature
Forward Voltage (V)
7
Min. 90
13 14
YH
W
V
32.5~38.5
WA,WB
VA, VB
UA, UB
TA, TB
RA
(MacAdam Ellipse)
(MacAdam Ellipse)
(MacAdam Ellipse)
(MacAdam Ellipse)
(MacAdam Ellipse)
2700 K
3000 K
3500 K
4000 K
5000 K
5700 K
VW, VX, VY, VZ (ANSI bin)
U
Bin
Code:
15
CCT (K)
TW, TX, TY, TZ (ANSI bin)
RW, RX, RY, RZ (ANSI bin)
QW, QX, QY, QZ (ANSI bin)
T
R
Q
2
MacAdam 2-step
MacAdam 3-step
ANSI bin
16
3
MacAdam / ANSI
Luminous Flux
T
41, 42, 43 (80 CRI)
33, 34, 35 (90 CRI)
Bin
Code:
17 18
B3
6
a) Binning Structure (IF = 900 mA, Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K)
VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
Product Code
42
43
4485 ~ 4761
4761 ~ 5141
SPHWW1HDND25YHW2B3
YH
YH
W2
W3
WB
B3
B3
2700
42
43
42
43
42
43
42
43
42
43
41
42
41
42
41
42
41
42
41
4485 ~ 4761
4761 ~ 5141
4771 ~ 5064
5064 ~ 5467
4771 ~ 5064
5064 ~ 5467
4915 ~ 5216
5216 ~ 5630
4915 ~ 5216
5216 ~ 5630
4747 ~ 5058
5058 ~ 5487
4747 ~ 5058
5058 ~ 5487
4792 ~ 5105
5105 ~ 5528
4792 ~ 5105
5105 ~ 5528
4792 ~ 5105
SPHWW1HDND25YHW3B3
SPHWW1HDND25YHV2B3
SPHWW1HDND25YHV3B3
SPHWW1HDND25YHU2B3
SPHWW1HDND25YHU3B3
SPHWW1HDND25YHT2B3
SPHWW1HDND25YHT3B3
SPHCW1HDND25YHR3B3
SPHCW1HDND25YHRTB3
WA, WB
YH
YH
YH
YH
YH
YH
YH
YH
V2
V3
U2
U3
T2
T3
R3
RT
VB
VA, VB
UB
B3
B3
B3
B3
B3
B3
B3
B3
3000
3500
UA, UB
TB
80
4000
TA, TB
RA
5000
5700
RW, RX,
RY, RZ
QW, QX
QY, QZ
SPHCW1HDND25YHQTB3
YH
QT
B3
42
5105 ~ 5528
7
a) Binning Structure (IF = 900 mA, Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K)
VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
Product Code
33
34
35
33
34
35
33
34
35
33
34
35
33
34
35
33
34
35
33
34
35
33
34
35
3527 ~ 3810
3810 ~ 4200
4200 ~ 4571
3527 ~ 3810
3810 ~ 4200
4200 ~ 4571
3599 ~ 3887
3887 ~ 4277
4277 ~ 4662
3599 ~ 3887
3887 ~ 4277
4277 ~ 4662
3707 ~ 4004
4004 ~ 4394
4394 ~ 4795
3707 ~ 4004
4004 ~ 4394
4394 ~ 4795
3815 ~ 4121
4121 ~ 4511
4511 ~ 4917
3815 ~ 4121
4121 ~ 4511
4511 ~ 4917
SPHWW1HDND27YHW2B3
YH
YH
YH
YH
YH
YH
YH
YH
W2
W3
V2
V3
U2
U3
T2
T3
WB
WA, WB
VB
B3
B3
B3
B3
B3
B3
B3
B3
2700
3000
3500
4000
SPHWW1HDND27YHW3B3
SPHWW1HDND27YHV2B3
SPHWW1HDND27YHV3B3
SPHWW1HDND27YHU2B3
SPHWW1HDND27YHU3B3
SPHWW1HDND27YHT2B3
SPHWW1HDND27YHT3B3
VA, VB
90
UB
UA, UB
TB
TA, TB
8
b) Chromaticity Region & Coordinates (IF = 900 mA, Tc = 25 ºC)
Region
CIE x
CIE y
Region
CIE x
CIE y
Region
CIE x
CIE y
Region
CIE x
CIE y
V rank (3000 K)
T rank (4000 K)
0.4223
0.4345
0.4431
0.4299
0.4223
0.4147
0.4260
0.4345
0.3990
0.4345
0.4468
0.4562
0.4431
0.4260
0.4373
0.4468
0.4345
0.4033
0.4077
0.4260
0.4213
0.3854
0.3893
0.4077
0.4033
0.3736
0.3871
0.3828
0.3703
0.3703
0.3828
0.3784
0.3670
0.3874
0.3871
0.4006
0.3952
0.3828
0.3828
0.3952
0.3898
0.3784
0.3959
0.4044
0.3880
0.3803
0.3803
0.3880
0.3716
0.3647
0.4033
VY
0.4213
0.3959
TY
0.3803
VW
VX
TW
TX
0.4165
0.3990
0.3726
0.3726
0.3814
VZ
0.3854
0.3803
TZ
0.3647
0.4033
0.3578
R rank (5000 K)
0.3616
Q rank (5700 K)
0.3462
0.3376
0.3463
0.3451
0.3371
0.3371
0.3451
0.3440
0.3366
0.3463
0.3551
0.3533
0.3451
0.3451
0.3533
0.3515
0.3440
0.3687
0.3760
0.3620
0.3554
0.3554
0.3620
0.3487
0.3428
0.3207
0.3290
0.3290
0.3215
0.3215
0.3290
0.3290
0.3222
0.3290
0.3376
0.3371
0.3290
0.3290
0.3371
0.3366
0.3290
0.3538
0.3616
0.3490
0.3417
0.3417
0.3490
0.3369
0.3300
0.3687
RY
0.3554
0.3538
QY
0.3417
RW
RX
QW
QX
0.3490
0.3490
0.3350
0.3350
0.3554
RZ
0.3428
0.3417
QZ
0.3300
0.3369
0.3243
9
b) Chromaticity Region & Coordinates (IF = 900 mA, Tc = 25 ºC)
CIE x,y
MacAdam Ellipse (WA, WB)
MacAdam Ellipse (VA, VB)
Step
CIE x
0.4578
0.4578
CIE y
0.4101
0.4101
a
b
Step
CIE x
0.4338
0.4338
CIE y
0.4030
0.4030
a
b
2-step
3-step
53.70
53.70
0.0054
0.0081
0.0028
0.0042
2-step
3-step
53.22
53.22
0.0056
0.0083
0.0027
0.0041
MacAdam Ellipse (UA, UB)
MacAdam Ellipse (TA, TB)
Step
CIE x
0.4073
0.4073
CIE y
0.3917
0.3917
a
b
Step
CIE x
0.3818
0.3818
CIE y
0.3797
0.3797
a
b
2-step
3-step
54.00
54.00
0.0062
0.0093
0.0028
0.0041
2-step
3-step
53.72
53.72
0.0063
0.0094
0.0027
0.0040
MacAdam Ellipse (RA)
Step
CIE x
CIE y
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
10
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 900 mA, Tc = 25 ºC)
CCT: 2700 K
CCT: 3500 K
CCT: 5000 K
CCT: 3000 K
CCT: 4000 K
CCT: 5700 K
11
CCT: 2700 K (90 CRI)
CCT: 3000 K (90 CRI)
CCT: 3500 K (90 CRI)
CCT: 4000 K (90 CRI)
12
b) Forward Current Characteristics (Tc = 25 ºC)
c) Temperature Characteristics (IF = 900 mA)
d) Color Shift Characteristics
Tc = 25 ºC
IF = 900 mA
13
e) Derating Curve
f) Beam Angle Characteristics (IF = 900 mA, Tc = 25 ºC)
14
4. Outline Drawing & Dimension
1. Unit:
mm
2. Tolerance: ± 0.15 mm
Tc point
Note
1. Unit:
mm
2. Tolerance: ± 0.2 mm
Item
Dimension
Tolerance
Unit
Length
21.50
21.50
1.50
17
±0.15
±0.15
±0.20
±0.15
mm
mm
mm
mm
Width
Height
Light Emitting Surface (LES) Diameter
Note: Denoted product information above is only an example
( 33W8027 : 33W, CRI80+, 2700K )
15
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
Room Temperature
Life Test
25 ºC, IF = max
85 ºC, 85 % RH, DC Derating, IF = max
105 ºC, DC Derating, IF = max
-40 ºC, DC 1620 mA
120 ºC
1000 h
1000 h
High Temperature
Humidity Life Test
High Temperature
Life Test
1000 h
Low Temperature
Life Test
1000 h
High Temperature
Storage
1000 h
Low Temperature
Storage
-40 ºC
1000 h
-45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min
Thermal Shock
200 cycles
100 cycles
100 cycles
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 100 min transfer
power on/off each 5 min, DC 900 mA
Temperature Humidity
Storage Test
-10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH
(24 h / cycle)
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
ESD (HBM)
5 times
R1: 10 MΩ
R2: 0 kΩ
ESD (MM)
5 times
4 times
C: 200 pF
V: ±0.5 kV
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
Vibration Test
min. frequency ↔ max. frequency 4 min transfer
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
Mechanical Shock Test
Salt Spray Test
5 times
35 ºC, 5 % salt water
8 h spray, 16 h dwell
2 cycles
b) Criteria for Judging the Damage
Limit
Test Condition
Item
Symbol
(Tc = 25 ºC)
IF = 900 mA
IF = 900 mA
Min.
Max.
Forward Voltage
Luminous Flux
VF
L.S.L. * 0.9
U.S.L. * 1.1
U.S.L * 1.3
Φv
L.S.L * 0.7
16
6. Label Structure
a) Label Structure
ⓐⓑⓒⓓⓔⓕ
YHVA42
Bin Code
SPHWW1HDND25YHV3B3 YHVA42 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
G4AZC4001 / 1001 / xxxx pcs
Product Code
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Lot Number
Note:
Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ: Forward Voltage bin (refer to page 11)
ⓒⓓ: Chromaticity bin (refer to page 9-10)
ⓔⓕ: Luminous Flux bin (refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
YHVA42
SPHWW1HDND25YHV3B3 YHVA42 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①
③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
:
:
:
:
:
:
:
Production site (S: Giheung, Korea, G: Tianjin, China)
(LED)
②
4
③
Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
Year (Z: 2015, A: 2016, B: 2017…)
Month (1~9, A, B, C)
④
⑤
⑥⑦⑧⑨
ⓐⓑⓒ
Day (1~9, A, B~V)
Product serial number (001 ~ 999)
17
7. Packing Structure
Dimension (mm)
Max. quantity
in pcs of COB
Packing material
Length
Width
Height
Tolerance
Tray
Anti-static Bag
Box
30
260
190
350
200
11.5
1.0
150 (6 trays)
387
270
-
10
10
1,050 (7 anti-static bag)
255
a) Packing Structure
18
b) Tray
C) Anti-static Bag
19
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it
may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) In case of driving the LC033B around the extremely low current level, chips might exhibit different brightness due to the
variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
9) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
10) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
About Samsung Electronics Co., Ltd.
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Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com
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