BSE-020-01-C-D-A [SAMTEC]
Board Stacking Connector, 40 Contact(s), 2 Row(s), Female, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Socket, ROHS COMPLIANT;
| 型号： | BSE-020-01-C-D-A |
| 厂家： | 
SAMTEC |
| 描述： | Board Stacking Connector, 40 Contact(s), 2 Row(s), Female, Straight, 0.031 inch Pitch, Surface Mount Terminal, Locking, Black Insulator, Socket, ROHS COMPLIANT PC 连接器 |
| 文件： | 总1页 (文件大小：700K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F214 (Rev 06MAR14)
BSE–020–01–F–D–A
BTE–060–02–F–D–A
BTE–040–02–L–D–A
(0,80 mm) .0315"
BTE, BSE SERIES
BASIC BLADE & BEAM HEADER & SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTE or
www.samtec.com?BSE
OTHER
NO. OF POSITIONS
PER ROW
PLATING
OPTION
LEAD
BTE
A
D
OPTION
STYLE
Mates with:
BSE
Specify
LEAD
STYLE
from
Insulator Material:
–K
Liquid Crystal Polymer
Contact Material:
= (7,00 mm)
.275" DIA
Polyimide
Film Pick
& Place Pad
–F
Phosphor Bronze
= Gold Flash on contact,
Matte Tin on tail
Plating: Au or Sn over
50µ" (1,27 µm) Ni
–020, –040, –060,
–080, –100, –120
chart
Current Rating: 2 A per pin
(1 pin powered per row)
OperatingTemp Range:
-55°C to +125°C
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
–TR
LEAD
STYLE
A
= Tape & Reel
(60 positions
maximum)
Voltage Rating: 225 VAC with
5 mm Stack Height
No. of positions x (0,80) .0315
+ (4,00) .1575
(4,27)
.168
–C*
Max Cycles: 100
–01
–02
01
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on
Signal Pins in contact area,
Matte Tin over 50µ" (1,27 µm) min
Ni on all solder tails
RoHS Compliant: Yes
(7,21)
.284
(5,97)
.235
(3,94)
.155
Processing:
Lead-Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-080)
(0,15 mm) .006" max (100-120)
Board Stacking:
02
(0,80) .0315
(7,11)
.280
*Note: –C Plating passes
10 year MFG testing
For applications requiring more
than two connectors per board
or 80 positions or higher,
contact ipg@samtec.com
(0,76)
.030
A
(0,20)
.008
(0,89)
.035
DIA
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
• Passes
10 year MFG
OTHER
NO. OF POSITIONS
PER ROW
PLATING
OPTION
BSE
01
A
D
MATED HEIGHT
OPTION
LEAD
STYLE
MATED
HEIGHT*
Mates with:
BTE
(5,00) .197
–01
–02
(8,00) .315
–F
*Processing conditions will
affect mated height.
–TR
= Gold Flash on contact,
Matte Tin on tail
= Tape & Reel
(80 positions
maximum)
–020, –040, –060,
–080, –100, –120
ALSO AVAILABLE
–L
(MOQ Required)
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
• 30µ" (0,76 µm) Gold
• Edge Mount Capability
• Friction Lock option
• 11 mm, 14 mm, 16,10 mm,
19,10 mm, 22 mm,
25 mm and 30 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal Pins in
contact area, MatteTin over
50µ" (1,27 µm) min Ni on all solder tails
No. of positions x (0,80) .0315
+ (5,27) .2075
02
01
(6,22)
.245
(3,81) (7,24)
.150 .285
*Note: –C Plating passes 10 year MFG testing
(0,80) .0315
(3,25)
.128
(7,49)
.295
(0,76)
.030
(1,78)
.070
Contact Samtec.
(0,15)
.006
(0,89)
.035
DIA
Note: Some lengths, styles
and options are non-standard,
non-returnable.
(3,05)
.120
WWW.SAMTEC.COM
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