BSW-105-04-G-M [SAMTEC]
BOTTOM MOUNT STRIPS;
SAMTEC 
BOTTOMMOUNT
SOCKETSTRIPS
(2.54 mm) .100" PITCH • BSW SERIES
BSW
NO. PINS
PER ROW
LEAD
PLATING
OPTION
ROW
OTHER
BSW
1
Mates:
-
- -
-
-
STYLE
OPTION
OPTION
TSW, MTSW, HTSW,
MTLW, TSM, EW, ZW,
HW, DW, PHT
02 thru 36
–04
= Standard
Lead
–L
–S
–S
= 10 µ" (0.25 µm)
Gold contact,
Matte Tin on tail
= Single Row
= Standoffs
for single
FEATURES
and double
rows only
–M
–24
= Low
= Single Row
More Plug Space
(–S & –D only)
• Bottom mount socket
strips accept .025" SQ
terminals.
• Ideal for soldering and
plugging from the same
side of the board.
• For low-profile
connections and high
temperature soldering.
–G
Insertion
Force
= 20 µ" (0.51 µm)
Gold contact,
Gold Flash on tail
–D
= Double Row
–T
= Matte Tin
(Not available with
Low Insertion Force)
(No. of Pos. X (2.54) .100) + (0.51) .020
ROW
X
Y
OPTION
SPECIFICATIONS
(2.54)
(5.08)
.200
–S
X
Y
.100
Insulator Material:
Black Thermoplastic
Insulation Resistance:
5000 MW min
(3.81)
.150
(6.35)
.250
–M
—S & —M
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C with Gold
-55 °C to +105 °C with Tin
Withstanding Voltage:
1000 VRMS @ 60 Hz
Insertion Depth:
(3.68 mm) .145" to
(6.35 mm) .250"
ROW
(10.16)
.400
Z
OPTION
–S*
–M
(4.31) .170
(3.43) .135
(4.32) .170
–D*
—D
*Less (0.38 mm) .015" with standoffs
Z
PROCESSING
Lead-Free Solderable:
Wave only
(9.27)
.365
(8.89)
.350
ALSO AVAILABLE
—S & —M
—D
—S
STANDOFF
Other Plating
(MOQ Required)
APPLICATIONS
BSW
(DOUBLE ROW)
BSW
(SINGLE ROW)
COMPONENT
SIDE
EW
(SINGLE ROW)
PC
BOARD
SOLDER
SIDE
PC
BOARD
TSW
(SINGLE ROW)
TSW
(DOUBLE ROW)
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
BSW
(SINGLE ROW)
F-221
samtec.com?BSW
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.
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